DE19983412T1 - Werkstückspannvorrichtung - Google Patents

Werkstückspannvorrichtung

Info

Publication number
DE19983412T1
DE19983412T1 DE19983412T DE19983412T DE19983412T1 DE 19983412 T1 DE19983412 T1 DE 19983412T1 DE 19983412 T DE19983412 T DE 19983412T DE 19983412 T DE19983412 T DE 19983412T DE 19983412 T1 DE19983412 T1 DE 19983412T1
Authority
DE
Germany
Prior art keywords
clamping device
workpiece clamping
workpiece
clamping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19983412T
Other languages
English (en)
Inventor
Paul A Getchel
Kenneth M Cole Sr
Henry A Lyden
William M Stone
Robert Lopez
Thomas Schey
Dana G Butcher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Temptronic Corp
Original Assignee
Temptronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Temptronic Corp filed Critical Temptronic Corp
Publication of DE19983412T1 publication Critical patent/DE19983412T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/903—Work holder for electrical circuit assemblages or wiring systems
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/11—Vacuum

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE19983412T 1998-07-14 1999-06-29 Werkstückspannvorrichtung Withdrawn DE19983412T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/115,206 US6019164A (en) 1997-12-31 1998-07-14 Workpiece chuck
PCT/US1999/014652 WO2000004570A2 (en) 1998-07-14 1999-06-29 Workpiece chuck

Publications (1)

Publication Number Publication Date
DE19983412T1 true DE19983412T1 (de) 2001-08-02

Family

ID=22359897

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19983412T Withdrawn DE19983412T1 (de) 1998-07-14 1999-06-29 Werkstückspannvorrichtung

Country Status (4)

Country Link
US (2) US6019164A (de)
JP (1) JP2003508893A (de)
DE (1) DE19983412T1 (de)
WO (1) WO2000004570A2 (de)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6328096B1 (en) * 1997-12-31 2001-12-11 Temptronic Corporation Workpiece chuck
US6019164A (en) * 1997-12-31 2000-02-01 Temptronic Corporation Workpiece chuck
US6305677B1 (en) * 1999-03-30 2001-10-23 Lam Research Corporation Perimeter wafer lifting
US6241825B1 (en) * 1999-04-16 2001-06-05 Cutek Research Inc. Compliant wafer chuck
US6920915B1 (en) * 1999-10-02 2005-07-26 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus and method for cooling a semiconductor substrate
JP3567855B2 (ja) * 2000-01-20 2004-09-22 住友電気工業株式会社 半導体製造装置用ウェハ保持体
US6503368B1 (en) * 2000-06-29 2003-01-07 Applied Materials Inc. Substrate support having bonded sections and method
US6965226B2 (en) * 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
US6552560B2 (en) 2001-03-20 2003-04-22 Despatch Industries, L.L.P. Wafer-level burn-in oven
JP4945031B2 (ja) * 2001-05-02 2012-06-06 アプライド マテリアルズ インコーポレイテッド 基板加熱装置および半導体製造装置
US7160105B2 (en) * 2001-06-01 2007-01-09 Litrex Corporation Temperature controlled vacuum chuck
AU2002314894A1 (en) * 2001-06-01 2002-12-16 Oleg Gratchev Temperature controlled vacuum chuck
US20040021475A1 (en) * 2001-06-06 2004-02-05 Atsushi Ito Wafer prober
JP2002373929A (ja) * 2001-06-14 2002-12-26 Tokyo Electron Ltd ウエハ支持体
JP3837736B2 (ja) * 2001-07-02 2006-10-25 ウシオ電機株式会社 レジスト硬化装置のワークステージ
DE10235482B3 (de) * 2002-08-02 2004-01-22 Süss Microtec Lithography Gmbh Vorrichtung zum Fixieren dünner und flexibler Substrate
US6764258B1 (en) * 2002-10-25 2004-07-20 Brian Akre Positionable vacuum clamp system
WO2005055291A1 (en) * 2003-11-26 2005-06-16 Temptronic Corporation Apparatus and method for reducing electrical noise in a thermally controlled chuck
US7106416B2 (en) * 2003-12-10 2006-09-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7786607B2 (en) 2004-02-19 2010-08-31 Asml Holding N.V. Overlay correction by reducing wafer slipping after alignment
WO2006060134A2 (en) * 2004-11-15 2006-06-08 Cree, Inc. Restricted radiated heating assembly for high temperature processing
US7731798B2 (en) * 2004-12-01 2010-06-08 Ultratech, Inc. Heated chuck for laser thermal processing
US7220175B2 (en) * 2005-04-28 2007-05-22 Win Semiconductors Corp. Device for carrying thin wafers and method of carrying the thin wafers
US7462934B2 (en) * 2006-06-20 2008-12-09 Microsoft Corporation Integrated heat sink
JP4657193B2 (ja) * 2006-11-08 2011-03-23 株式会社アロン社 吸着盤
WO2008075340A1 (en) * 2006-12-18 2008-06-26 Camtek Ltd. A chuck and a method for supporting an object
US8760621B2 (en) * 2007-03-12 2014-06-24 Asml Netherlands B.V. Lithographic apparatus and method
US7992877B2 (en) * 2007-09-06 2011-08-09 Kla-Tencor Corporation Non contact substrate chuck
US8198567B2 (en) 2008-01-15 2012-06-12 Applied Materials, Inc. High temperature vacuum chuck assembly
US9091491B2 (en) * 2008-02-22 2015-07-28 Applied Materials, Inc. Cooling plates and semiconductor apparatus thereof
JP5484315B2 (ja) * 2008-02-29 2014-05-07 Ｔｈｋ株式会社 冷却構造を備える回転テーブル装置
JP5459829B2 (ja) * 2009-03-26 2014-04-02 株式会社アロン社 吸着盤
US8698099B2 (en) * 2009-09-30 2014-04-15 Kyocera Corporation Attraction member, and attraction device and charged particle beam apparatus using the same
JP2011138877A (ja) * 2009-12-28 2011-07-14 Seiko Epson Corp 非接触保持体及び非接触保持ハンド
US8519729B2 (en) 2010-02-10 2013-08-27 Sunpower Corporation Chucks for supporting solar cell in hot spot testing
US20120000426A1 (en) * 2010-06-30 2012-01-05 Primestar Solar, Inc. Integrated gearbox and rotary feedthrough system for a vacuum chamber structure
US8669540B2 (en) * 2011-01-03 2014-03-11 Varian Semiconductor Equipment Associates, Inc. System and method for gas leak control in a substrate holder
CN102651331A (zh) * 2011-06-14 2012-08-29 京东方科技集团股份有限公司 基板托盘及柔性电子器件制造方法
US9335080B2 (en) 2011-10-17 2016-05-10 Temptronic Corporation Temperature system having an impurity filter
US9244107B2 (en) * 2012-11-12 2016-01-26 Marvell World Trade Ltd. Heat sink blade pack for device under test testing
US9227261B2 (en) * 2013-08-06 2016-01-05 Globalfoundries Inc. Vacuum carriers for substrate bonding
JP2016021544A (ja) * 2014-07-11 2016-02-04 株式会社東芝 インプリント装置およびインプリント方法
US10008404B2 (en) 2014-10-17 2018-06-26 Applied Materials, Inc. Electrostatic chuck assembly for high temperature processes
US9887478B2 (en) * 2015-04-21 2018-02-06 Varian Semiconductor Equipment Associates, Inc. Thermally insulating electrical contact probe
JP6497248B2 (ja) * 2015-07-13 2019-04-10 住友電気工業株式会社 ウェハ保持体
JP6794193B2 (ja) 2016-09-02 2020-12-02 株式会社小松製作所 作業機械の画像表示システム
US9899193B1 (en) 2016-11-02 2018-02-20 Varian Semiconductor Equipment Associates, Inc. RF ion source with dynamic volume control
JP7162500B2 (ja) * 2018-11-09 2022-10-28 株式会社Kelk 温調装置

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US3744560A (en) * 1971-10-01 1973-07-10 Isotopes Inc Thermal block
US4205835A (en) * 1977-05-13 1980-06-03 Gerber Garment Technology, Inc. Bristle bed for vacuum table
DD142406A1 (de) * 1979-03-14 1980-06-18 Lutz Volland Vakuumhalterung fuer halbleiterscheiben
US4403567A (en) * 1980-08-21 1983-09-13 Commonwealth Scientific Corporation Workpiece holder
US4462462A (en) * 1981-11-17 1984-07-31 International Business Machines Corporation Thermal conduction piston for semiconductor packages
US4607220A (en) * 1984-05-07 1986-08-19 The Micromanipulator Co., Inc. Method and apparatus for low temperature testing of electronic components
JPS61152499A (ja) * 1984-12-27 1986-07-11 大日本スクリ−ン製造株式会社 硬質板の吸着、保持方法及びその方法の実施に使用する軟質シ−ト
US4682857A (en) * 1985-04-02 1987-07-28 Peng Tan Liquid crystal hot spot detection with infinitesimal temperature control
US4734872A (en) * 1985-04-30 1988-03-29 Temptronic Corporation Temperature control for device under test
US4884026A (en) * 1987-06-24 1989-11-28 Tokyo Electron Limited Electrical characteristic measuring apparatus
US4893914A (en) * 1988-10-12 1990-01-16 The Micromanipulator Company, Inc. Test station
JPH036848A (ja) * 1989-06-03 1991-01-14 Hitachi Ltd 半導体冷却モジュール
US5281794A (en) * 1990-05-25 1994-01-25 Kabushiki Kaisha Shinkawa Heater block for use in a bonder utilizing vacuum suction attachment means
JPH05285763A (ja) * 1992-04-10 1993-11-02 Nippon Steel Corp 真空チャック
US5316276A (en) * 1992-12-18 1994-05-31 Konrad Heinle Thickness compensation actuator system
US5738165A (en) * 1993-05-07 1998-04-14 Nikon Corporation Substrate holding apparatus
DE69432383D1 (de) * 1993-05-27 2003-05-08 Applied Materials Inc Verbesserungen betreffend Substrathalter geeignet für den Gebrauch in Vorrichtungen für die chemische Abscheidung aus der Dampfphase
US5423558A (en) * 1994-03-24 1995-06-13 Ipec/Westech Systems, Inc. Semiconductor wafer carrier and method
US5610529A (en) * 1995-04-28 1997-03-11 Cascade Microtech, Inc. Probe station having conductive coating added to thermal chuck insulator
US6104203A (en) * 1995-05-16 2000-08-15 Trio-Tech International Test apparatus for electronic components
US5810933A (en) * 1996-02-16 1998-09-22 Novellus Systems, Inc. Wafer cooling device
US6019164A (en) * 1997-12-31 2000-02-01 Temptronic Corporation Workpiece chuck

Also Published As

Publication number Publication date
US6375176B1 (en) 2002-04-23
WO2000004570A2 (en) 2000-01-27
WO2000004570A3 (en) 2000-04-20
JP2003508893A (ja) 2003-03-04
US6019164A (en) 2000-02-01

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8125 Change of the main classification

Ipc: B25B 11/00 AFI20051017BHDE

8139 Disposal/non-payment of the annual fee