DE19980562T1 - Glättmaschine - Google Patents

Glättmaschine

Info

Publication number
DE19980562T1
DE19980562T1 DE19980562T DE19980562T DE19980562T1 DE 19980562 T1 DE19980562 T1 DE 19980562T1 DE 19980562 T DE19980562 T DE 19980562T DE 19980562 T DE19980562 T DE 19980562T DE 19980562 T1 DE19980562 T1 DE 19980562T1
Authority
DE
Germany
Prior art keywords
smoothing machine
smoothing
machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19980562T
Other languages
English (en)
Other versions
DE19980562B4 (de
Inventor
Kohzo Abe
Yutaka Koma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Super Silicon Crystal Research Institute Corp
Original Assignee
Disco Corp
Super Silicon Crystal Research Institute Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp, Super Silicon Crystal Research Institute Corp filed Critical Disco Corp
Publication of DE19980562T1 publication Critical patent/DE19980562T1/de
Application granted granted Critical
Publication of DE19980562B4 publication Critical patent/DE19980562B4/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Machine Tool Units (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE19980562T 1998-03-03 1999-02-05 Glättmaschine Expired - Lifetime DE19980562B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10/51042 1998-03-03
JP10051042A JP2928218B1 (ja) 1998-03-03 1998-03-03 平面加工装置
PCT/JP1999/000491 WO1999044787A1 (fr) 1998-03-03 1999-02-05 Raboteuse

Publications (2)

Publication Number Publication Date
DE19980562T1 true DE19980562T1 (de) 2000-06-15
DE19980562B4 DE19980562B4 (de) 2007-03-29

Family

ID=12875754

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19980562T Expired - Lifetime DE19980562B4 (de) 1998-03-03 1999-02-05 Glättmaschine

Country Status (5)

Country Link
US (1) US6343980B1 (de)
JP (1) JP2928218B1 (de)
DE (1) DE19980562B4 (de)
GB (1) GB2339400B (de)
WO (1) WO1999044787A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2928218B1 (ja) 1998-03-03 1999-08-03 株式会社スーパーシリコン研究所 平面加工装置
US6561881B2 (en) * 2001-03-15 2003-05-13 Oriol Inc. System and method for chemical mechanical polishing using multiple small polishing pads
JP4145750B2 (ja) * 2003-07-15 2008-09-03 日本電波工業株式会社 平面加工装置
JP4464779B2 (ja) * 2004-09-22 2010-05-19 株式会社ダイヘン 溶射装置
DE102005014588A1 (de) * 2005-03-24 2006-09-28 Knöll, Herbert Arbeitsstation
JP5117030B2 (ja) * 2006-10-19 2013-01-09 新日本工機株式会社 工作機械
JP5342253B2 (ja) * 2009-01-28 2013-11-13 株式会社ディスコ 加工装置
JP2012076198A (ja) * 2010-10-05 2012-04-19 Disco Corp 加工装置
JP5619559B2 (ja) * 2010-10-12 2014-11-05 株式会社ディスコ 加工装置
TW201323149A (zh) * 2011-10-21 2013-06-16 Strasbaugh 晶圓研磨之系統與方法
US9393669B2 (en) 2011-10-21 2016-07-19 Strasbaugh Systems and methods of processing substrates
US9610669B2 (en) 2012-10-01 2017-04-04 Strasbaugh Methods and systems for use in grind spindle alignment
US9457446B2 (en) 2012-10-01 2016-10-04 Strasbaugh Methods and systems for use in grind shape control adaptation
JP6335596B2 (ja) * 2014-04-07 2018-05-30 株式会社ディスコ 研削装置
US10421172B2 (en) * 2015-12-01 2019-09-24 Tokyo Seimitsu Co. Ltd. Processing device
JP6754272B2 (ja) * 2016-10-24 2020-09-09 株式会社ディスコ 研削装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60155257A (ja) * 1984-09-14 1985-08-15 住友ノ−ガタツク株式会社 メツキ製品
US5205082A (en) * 1991-12-20 1993-04-27 Cybeq Systems, Inc. Wafer polisher head having floating retainer ring
JPH0818205B2 (ja) 1992-05-07 1996-02-28 敏益 江口 工作機械
JPH06155257A (ja) * 1992-11-11 1994-06-03 Takahiro Imahashi 立軸ロータリ平面研磨機及びその構成方法
JPH08276358A (ja) * 1995-04-05 1996-10-22 Nippon Steel Corp 研削装置
US5784932A (en) * 1996-06-20 1998-07-28 Gilberti; Joseph J. Rotary indexing table
US5718619A (en) * 1996-10-09 1998-02-17 Cmi International, Inc. Abrasive machining assembly
US5950503A (en) * 1997-05-30 1999-09-14 Amendolea; Richard Michael Open center turntable assembly
JP2928218B1 (ja) 1998-03-03 1999-08-03 株式会社スーパーシリコン研究所 平面加工装置

Also Published As

Publication number Publication date
WO1999044787A1 (fr) 1999-09-10
GB2339400A (en) 2000-01-26
JP2928218B1 (ja) 1999-08-03
GB9925621D0 (en) 1999-12-29
US6343980B1 (en) 2002-02-05
GB2339400B (en) 2002-10-30
DE19980562B4 (de) 2007-03-29
JPH11245147A (ja) 1999-09-14
GB2339400A9 (en) 2000-03-15

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8364 No opposition during term of opposition
R071 Expiry of right