DE19980532T1 - Verbindung eines Punktes einer elektronischen Karte mit gedruckter Schaltung auf einem diese Karte tragenden metallischen Substrat - Google Patents

Verbindung eines Punktes einer elektronischen Karte mit gedruckter Schaltung auf einem diese Karte tragenden metallischen Substrat

Info

Publication number
DE19980532T1
DE19980532T1 DE19980532T DE19980532T DE19980532T1 DE 19980532 T1 DE19980532 T1 DE 19980532T1 DE 19980532 T DE19980532 T DE 19980532T DE 19980532 T DE19980532 T DE 19980532T DE 19980532 T1 DE19980532 T1 DE 19980532T1
Authority
DE
Germany
Prior art keywords
card
point
connection
printed circuit
metallic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19980532T
Other languages
English (en)
Other versions
DE19980532B4 (de
Inventor
Jean-Marc Nicolai
Marc Duarte
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Vision SAS
Original Assignee
Valeo Vision SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Vision SAS filed Critical Valeo Vision SAS
Publication of DE19980532T1 publication Critical patent/DE19980532T1/de
Application granted granted Critical
Publication of DE19980532B4 publication Critical patent/DE19980532B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/16—Fastening of connecting parts to base or case; Insulating connecting parts from base or case
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Credit Cards Or The Like (AREA)
  • Multi-Conductor Connections (AREA)
DE19980532T 1998-03-02 1999-03-02 Verbindung eines Punktes einer elektronischen Karte mit gedruckter Schaltung auf einem diese Karte tragenden metallischen Substrat Expired - Fee Related DE19980532B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR98/02477 1998-03-02
FR9802477A FR2775553B1 (fr) 1998-03-02 1998-03-02 Raccordement d'un point d'une carte electronique a circuit imprime sur un substrat metallique qui porte ladite carte
PCT/FR1999/000461 WO1999045754A1 (fr) 1998-03-02 1999-03-02 Raccordement d'un point d'une carte electronique a circuit imprime sur un substrat metallique qui porte ladite carte

Publications (2)

Publication Number Publication Date
DE19980532T1 true DE19980532T1 (de) 2000-06-15
DE19980532B4 DE19980532B4 (de) 2007-11-29

Family

ID=9523515

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19980532T Expired - Fee Related DE19980532B4 (de) 1998-03-02 1999-03-02 Verbindung eines Punktes einer elektronischen Karte mit gedruckter Schaltung auf einem diese Karte tragenden metallischen Substrat

Country Status (5)

Country Link
US (1) US6225572B1 (de)
JP (1) JP4101890B2 (de)
DE (1) DE19980532B4 (de)
FR (1) FR2775553B1 (de)
WO (1) WO1999045754A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6925708B1 (en) * 1998-03-02 2005-08-09 Valeo Vision Method of shielding a printed circuit electronics card mounted on a metal substrate

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2958926A (en) * 1956-10-22 1960-11-08 Lenkurt Electric Co Inc Electrical circuit structure and method for manufacturing same
US3537176A (en) * 1969-04-01 1970-11-03 Lockheed Aircraft Corp Interconnection of flexible electrical circuits
CA1166325A (en) * 1981-04-27 1984-04-24 Arthur J. Danko Preassembled coated terminal assembly
JPS60109362U (ja) * 1983-12-28 1985-07-25 アルプス電気株式会社 多層プリント基板のア−ス構造
JP2597885B2 (ja) * 1988-06-03 1997-04-09 東洋通信機株式会社 メタルコア配線板のハンダ接続部の構造
US5006073A (en) * 1989-05-30 1991-04-09 Motorola, Inc. Snap fit contact assembly
US5189261A (en) * 1990-10-09 1993-02-23 Ibm Corporation Electrical and/or thermal interconnections and methods for obtaining such
FR2670987B1 (fr) * 1990-12-21 1993-04-16 Telecommunications Sa Procede de realisation d'au moins une traversee conductrice a travers un trou traversant d'un substrat isolant.
US5416278A (en) * 1993-03-01 1995-05-16 Motorola, Inc. Feedthrough via connection
DE4326506A1 (de) * 1993-08-06 1995-02-09 Bosch Gmbh Robert Elektrisches Gerät, insbesondere Schalt- oder Steuergerät für Kraftfahrzeuge
DE19532992A1 (de) * 1995-09-07 1997-03-13 Telefunken Microelectron Leiterplatte

Also Published As

Publication number Publication date
FR2775553B1 (fr) 2000-05-19
JP4101890B2 (ja) 2008-06-18
US6225572B1 (en) 2001-05-01
WO1999045754A1 (fr) 1999-09-10
DE19980532B4 (de) 2007-11-29
FR2775553A1 (fr) 1999-09-03
JP2001523398A (ja) 2001-11-20

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8364 No opposition during term of opposition
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20131001