DE19881556T1 - Optikmodul und Leiterrahmen für dieses - Google Patents

Optikmodul und Leiterrahmen für dieses

Info

Publication number
DE19881556T1
DE19881556T1 DE19881556T DE19881556T DE19881556T1 DE 19881556 T1 DE19881556 T1 DE 19881556T1 DE 19881556 T DE19881556 T DE 19881556T DE 19881556 T DE19881556 T DE 19881556T DE 19881556 T1 DE19881556 T1 DE 19881556T1
Authority
DE
Germany
Prior art keywords
lead frame
optics module
optics
module
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19881556T
Other languages
English (en)
Inventor
Takashi Fukuoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of DE19881556T1 publication Critical patent/DE19881556T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
DE19881556T 1997-09-25 1998-09-25 Optikmodul und Leiterrahmen für dieses Withdrawn DE19881556T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP26019297A JP3416942B2 (ja) 1997-09-25 1997-09-25 光モジュールおよび光モジュール用リードフレーム
PCT/JP1998/004310 WO1999016133A1 (fr) 1997-09-25 1998-09-25 Module optique et reseau de conducteurs pour module optique

Publications (1)

Publication Number Publication Date
DE19881556T1 true DE19881556T1 (de) 1999-10-14

Family

ID=17344616

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19881556T Withdrawn DE19881556T1 (de) 1997-09-25 1998-09-25 Optikmodul und Leiterrahmen für dieses

Country Status (6)

Country Link
US (1) US6157050A (de)
JP (1) JP3416942B2 (de)
CA (1) CA2272615A1 (de)
DE (1) DE19881556T1 (de)
GB (1) GB2334819B (de)
WO (1) WO1999016133A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10234778A1 (de) * 2002-05-06 2003-11-27 Samsung Electro Mech Chip-Leiterplatten-Anordnung für optische Mäuse und zugehöriger Linsendeckel

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19946101A1 (de) 1999-09-22 2001-05-03 Infineon Technologies Ag Elektrooptisches Modul mit einem Gehäuse
US6443631B1 (en) 2001-02-20 2002-09-03 Avanti Optics Corporation Optical module with solder bond
US6956999B2 (en) 2001-02-20 2005-10-18 Cyberoptics Corporation Optical device
US20020168147A1 (en) * 2001-02-20 2002-11-14 Case Steven K. Optical circuit pick and place machine
US6546172B2 (en) 2001-02-20 2003-04-08 Avanti Optics Corporation Optical device
US6546173B2 (en) 2001-02-20 2003-04-08 Avanti Optics Corporation Optical module
US20040212802A1 (en) * 2001-02-20 2004-10-28 Case Steven K. Optical device with alignment compensation
JP3890999B2 (ja) * 2002-02-14 2007-03-07 住友電気工業株式会社 光送信モジュール
KR20030087824A (ko) * 2002-05-10 2003-11-15 주식회사일진 소형 형상 요소형 광모듈
JP2004281682A (ja) 2003-03-14 2004-10-07 Sumitomo Electric Ind Ltd 光送信装置
US7384817B2 (en) * 2005-05-13 2008-06-10 Sandisk Corporation Method of assembling semiconductor devices with LEDs
US7602054B2 (en) * 2005-10-05 2009-10-13 Semiconductor Components Industries, L.L.C. Method of forming a molded array package device having an exposed tab and structure
US11538740B2 (en) * 2019-07-15 2022-12-27 Texas Instruments Incorporated Leads for semiconductor package

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01257361A (ja) * 1988-04-07 1989-10-13 Nec Corp 樹脂封止型半導体装置
JPH0343743U (de) * 1989-09-06 1991-04-24
JPH04225271A (ja) * 1990-12-26 1992-08-14 J T:Kk 集積回路
EP0654866A3 (de) * 1993-11-23 1997-08-20 Motorola Inc Träger zur Verbindung eines Halbleiterwürfels und Herstellungsverfahren.
DE4440088A1 (de) * 1994-11-10 1996-05-15 Telefunken Microelectron Halbleiterbaugruppe für die bidirektionale, leitungsungebundene, optische Datenübertragung

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10234778A1 (de) * 2002-05-06 2003-11-27 Samsung Electro Mech Chip-Leiterplatten-Anordnung für optische Mäuse und zugehöriger Linsendeckel
DE10234778B4 (de) * 2002-05-06 2004-03-11 Samsung Electro-Mechanics Co., Ltd., Suwon Chip-Leiterplatten-Anordnung für optische Mäuse (Computer-Mäuse) und zugehöriger Linsendeckel

Also Published As

Publication number Publication date
WO1999016133A1 (fr) 1999-04-01
GB9912206D0 (en) 1999-07-28
CA2272615A1 (en) 1999-04-01
GB2334819B (en) 2002-07-10
US6157050A (en) 2000-12-05
JP3416942B2 (ja) 2003-06-16
GB2334819A (en) 1999-09-01
JPH11103004A (ja) 1999-04-13

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8607 Notification of search results after publication
8130 Withdrawal