DE19714385B4 - Method for fixing components in COB design - Google Patents
Method for fixing components in COB design Download PDFInfo
- Publication number
- DE19714385B4 DE19714385B4 DE1997114385 DE19714385A DE19714385B4 DE 19714385 B4 DE19714385 B4 DE 19714385B4 DE 1997114385 DE1997114385 DE 1997114385 DE 19714385 A DE19714385 A DE 19714385A DE 19714385 B4 DE19714385 B4 DE 19714385B4
- Authority
- DE
- Germany
- Prior art keywords
- barrier
- application
- adhesive
- obstacle
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Abstract
Verfahren zur Befestigung von Bauelementen in COB-Bauweise, dadurch gekennzeichnet, dass die Ausbreitung der Harzphase des Klebers durch gezieltes Aufbringen eines Hindernisses begrenzt wird, wobei das Aufbringen des Hindernisses in den Fertigungsprozess des Bauelementeträgers bei der Strukturierung der Lötstoppmaske integriert wird.method for mounting components in COB construction, characterized in that the spread of the resin phase of the adhesive by targeted application an obstacle is limited, with the application of the obstacle in the manufacturing process of the component carrier in structuring the solder mask is integrated.
Description
Die Erfindung betrifft ein Verfahren zur Befestigung von Bauelementen in COB-Bauweise.The The invention relates to a method for fixing components in COB construction.
Aus
der
Die
Auch
in der
Die
Nachteilig bei der bekannten Klebetechnik ist das sogenannte Ausbluten des Klebers (Outbleeding). Darunter ist der Effekt zu subsumieren, dass die Harzphase auf der Oberfläche des Bauelementeträgers in der Chipumgebung sich unkontrolliert ausbreitet. Bei Erreichen des Bondpads kriecht dieses Harz auch auf die Oberfläche des Pads. Damit ist die Bondbarkeit des durch das Harz verunreinigten Anschlusses stark beeinträchtigt.adversely in the known adhesive technique is the so-called bleeding of the Glue (Outbleeding). Underneath is the effect to subsume that the Resin phase on the surface of the component carrier in the chip environment spreads uncontrollably. Upon reaching the Bond pads also creep this resin on the surface of the pad. This is the bondability of the contaminated by the resin connection strongly affected.
Der Erfindung liegt die Aufgabe zugrunde, Maßnahmen vorzusehen, die bei Anwendung der Klebetechnik eine begrenzte Ausbreitung der Harzphase, insbesondere auf der Oberfläche des Bauelementeträgers, ermöglichen.Of the Invention is based on the object to provide measures at Application of the adhesive technique a limited spread of the resin phase, especially on the surface of the component carrier, enable.
Diese Aufgabe wird im wesentlichen dadurch erfüllt, dass die Ausbreitung der Harzphase durch verfahrensseitiges Aufbringen eines Hindernisses begrenzt wird. Durch diese Maßnahme wird erreicht, dass die Ausbreitung der Harzphase auf Bauelemente bzw. auf hohe Reinheit fordernde Verbindungselemente verhindert wird. Als mögliche Form des Hindernisses ist die Bildung einer in sich geschlossenen Barriere vorgesehen. Mit dieser in sich geschlossenen Barriere wird verhindert, dass die Harzphase sich unkontrolliert ausbreitet. Mit dem Begriff geschlossen wird die Schließung eines Ringes angedeutet. Dabei kann diese Barriere auch jedes andere geometrische Gebilde aufweisen. Diese Barriere ist zweckmäßigerweise dort aufzubringen, wo eine weitere unkontrollierte Ausbreitung der Harzphase zu Funktionsbeeinträchtigungen eines Bauteiles bzw. eines Verbindungsteiles führen kann.These Task is essentially fulfilled by the fact that the spread of Resin phase bounded by procedural application of an obstacle becomes. By this measure is achieved that the propagation of the resin phase on building elements or on high purity demanding fasteners prevented becomes. As possible The form of the obstacle is the formation of a self-contained barrier intended. This self-contained barrier prevents that the resin phase spreads uncontrollably. With the term closed is the closure a ring indicated. This barrier can also be any other geometric Have structures. This barrier is expediently applied there, where a further uncontrolled spread of the resin phase to functional impairments a component or a connecting part can lead.
Diese Barriere kann beispielsweise dadurch gebildet werden, daß unter Verwendung von geeigneten Lacken, z. B. von Lötstopplack, ein Ring als äußere Begrenzung für die Ausbreitung der Harzphase gelegt wird. Die geometrische Form (Kreis oder dgl.) der beispielsweise als Ring ausgebildeten Barriere richtet sich ausschließlich nach der zu schützenden Fläche. Die Höhe und Breite derselben ist grundsätzlich variierbar, sie richtet sich vor allem nach den zu schützenden Objekten und nach den Abmessungen dieser Objekte.These Barrier can be formed, for example, that under Use of suitable paints, eg. B. of Lötstopplack, a ring as an outer boundary for the Spread the resin phase is placed. The geometric shape (circle or the like), for example, designed as a ring barrier exclusively after the area to be protected. The Height and Width of the same is basically variable, it depends mainly on the protected Objects and the dimensions of these objects.
Bei einem Bauelementeträger für Speichermodule, z. B. für Chips in COB-Bauweise ist diese Barriere in dem Zwischenraum zwischen der Montagefläche des Nacktchips (die's) und den Bondpads aufzubringen.at a component carrier for memory modules, z. For example Chips in COB construction is this barrier in the space between the mounting surface the naked chip (s) and apply the bondpads.
Es ist hierbei unerheblich, ob in diesem Zwischenraum nur Basismaterial oder auch Leiterzüge zur Anbindung dieser Pads aus der Montagefläche des Chips (die's) kommen. Wichtig ist, dass die Barriere auf jeden Fall geschlossen ist, um damit einen vollständigen Schutz zu erzielen. Mit dieser beispielsweise als Ring ausgebildeten Barriere wird schließlich erreicht, dass die Harzphase maximal bis zur Innenkante des Ringes wandert, diesen Ring aber nicht überwindet. In diesem Zusammenhang muss bei der Chipmontage sichergestellt sein, dass die Menge des Klebers zur Befestigung der Chips so bemessen ist, dass der hervorquellende Klebstoff den Ring nicht überwindet.It is irrelevant in this case, whether in this space only base material or ladder trains to Connection of these pads from the mounting surface of the chip (s) come. Important is that the barrier is definitely closed to it a complete one To achieve protection. Designed with this example as a ring Barrier is finally reached that the resin phase migrates maximally to the inner edge of the ring, but does not overcome this ring. In this context, chip assembly must ensure that that the amount of adhesive for attaching the chips so dimensioned is that the bulging adhesive does not overcome the ring.
Durch die so gebildete Barriere ist eine Beeinträchtigung der Bondbarkeit der Bondpadoberflächen ausgeschlossen. Damit wird über diese Maßnahme die Montageausbeute und die Zuverlässigkeit der Bauelemente auf hohem Niveau gesichert.By The barrier thus formed is a deterioration of the bondability of the Bondpadoberflächen locked out. This is about This measure the mounting yield and the reliability of the components secured high level.
Die Lösung zeichnet sich ferner auch dadurch aus, dass das Aufbringen der Barriere in Form des Ringes in den Fertigungsprozeß des Bauelementeträgers bei der Strukturierung der Lötstoppmaske integriert wird.The solution is also characterized by the fact that the application of the barrier in the form of the ring is integrated into the manufacturing process of the device carrier in structuring the solder mask.
Schließlich zeichnet sich die Lösung auch dadurch aus, daß Leiterzüge, die in dem Zwischenraum zwischen Montagefläche und den Bondpadreihen angeordnet sind, im Ringbereich durch den Lötstopplack abgedeckt und damit geschützt sind.Finally draws the solution also by the fact that conductor cables, the arranged in the space between the mounting surface and the Bondpadreihen are in the ring area through the solder mask covered and thus protected are.
Die Erfindung wird nachstehend anhand der Zeichnung im Prinzip beispielshalber noch näher erläutert.The Invention will be described below with reference to the drawing in principle by way of example even closer explained.
Die
zugehörige
Zeichnung zeigt in schematischer Darstellung einen Bauelementeträger mit
einem Chip
Es
hat sich als günstig
erwiesen, die Montagefläche
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1997114385 DE19714385B4 (en) | 1997-03-27 | 1997-03-27 | Method for fixing components in COB design |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1997114385 DE19714385B4 (en) | 1997-03-27 | 1997-03-27 | Method for fixing components in COB design |
Publications (2)
Publication Number | Publication Date |
---|---|
DE19714385A1 DE19714385A1 (en) | 1998-10-01 |
DE19714385B4 true DE19714385B4 (en) | 2009-04-23 |
Family
ID=7825734
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1997114385 Expired - Fee Related DE19714385B4 (en) | 1997-03-27 | 1997-03-27 | Method for fixing components in COB design |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE19714385B4 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE554642T1 (en) | 2009-09-22 | 2012-05-15 | Micronas Gmbh | INTEGRATION OF SMD COMPONENTS INTO AN IC HOUSING |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3919452A (en) * | 1973-10-23 | 1975-11-11 | Vitta Corp | Precision bonding system |
DE3641363A1 (en) * | 1986-12-05 | 1988-06-09 | Frese Metallwerk | Mirror and process for adhesively bonding mirror glass to a carrier plate |
DE3730344A1 (en) * | 1987-09-10 | 1989-03-30 | Ver Glaswerke Gmbh | CAR GLASS PANEL FOR DIRECT GLUE |
DE3826314C1 (en) * | 1988-08-03 | 1990-03-29 | Schott Glaswerke, 6500 Mainz, De |
-
1997
- 1997-03-27 DE DE1997114385 patent/DE19714385B4/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3919452A (en) * | 1973-10-23 | 1975-11-11 | Vitta Corp | Precision bonding system |
DE3641363A1 (en) * | 1986-12-05 | 1988-06-09 | Frese Metallwerk | Mirror and process for adhesively bonding mirror glass to a carrier plate |
DE3730344A1 (en) * | 1987-09-10 | 1989-03-30 | Ver Glaswerke Gmbh | CAR GLASS PANEL FOR DIRECT GLUE |
DE3826314C1 (en) * | 1988-08-03 | 1990-03-29 | Schott Glaswerke, 6500 Mainz, De |
Also Published As
Publication number | Publication date |
---|---|
DE19714385A1 (en) | 1998-10-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8127 | New person/name/address of the applicant |
Owner name: SWISSBIT GERMANY GMBH, 12681 BERLIN, DE |
|
8110 | Request for examination paragraph 44 | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |