DE19610554A1 - Inertial sensor assembly, such as planar array silicon chips - Google Patents
Inertial sensor assembly, such as planar array silicon chipsInfo
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- DE19610554A1 DE19610554A1 DE19610554A DE19610554A DE19610554A1 DE 19610554 A1 DE19610554 A1 DE 19610554A1 DE 19610554 A DE19610554 A DE 19610554A DE 19610554 A DE19610554 A DE 19610554A DE 19610554 A1 DE19610554 A1 DE 19610554A1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0074—3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C21/00—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00
- G01C21/10—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration
- G01C21/12—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning
- G01C21/16—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration executed aboard the object being navigated; Dead reckoning by integrating acceleration or speed, i.e. inertial navigation
- G01C21/166—Mechanical, construction or arrangement details of inertial navigation systems
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
- G01C19/5628—Manufacturing; Trimming; Mounting; Housings
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0888—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values for indicating angular acceleration
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/097—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by vibratory elements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0242—Gyroscopes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
- G01P2015/0828—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type being suspended at one of its longitudinal ends
Abstract
Description
Die Erfindung betrifft eine Beschleunigungssensorbaugruppe nach dem Oberbegriff des Anspruches 1.The invention relates to an acceleration sensor assembly according to the preamble of claim 1.
Es ist bekannt, aus monolithischen Blöcken wie beispielsweise Siliciumscheiben Be schleunigungssensorbauteile als Festkörper durch mikromechanische Bearbeitung herzustellen. Hierbei dienen oszillierende Stimmgabeln dem Erfassen von Reso nanzen, wenn sie Rotationsbeschleunigungen ausgesetzt sind. Zum Erfassen von Linearbeschleunigungen dienen Zungen, an deren freien Enden Massen angeordnet sind. Diese Sensoren sind hierbei einstückig zu dem Blockmaterial, aus dem sie her ausgearbeitet wurden. Es ist auch bekannt, in das Blockmaterial analoge und/oder digitale elektrische Schaltungen zu integrieren, wie beispielsweise Treiberschaltun gen, Sensorschaltungen, Verarbeitungsschaltungen und Signalschaltungen, womit sich aktive Festkörperbauteile oder Chips ergeben.It is known to be made of monolithic blocks such as Be acceleration sensor components as solid bodies through micromechanical processing to manufacture. Here, oscillating tuning forks are used to record resonance when they are subjected to rotational accelerations. For capturing Linear accelerations serve tongues with masses arranged at their free ends are. These sensors are integral to the block material from which they are made were worked out. It is also known to analog and / or in the block material Integrate digital electrical circuits, such as driver circuits gene, sensor circuits, processing circuits and signal circuits, with what active solid-state components or chips result.
Diese bekannten Vorrichtungen werden durch mikromechanische Bearbeitung von im wesentlichen zweidimensionalen ebenen Blöcken oder Scheiben hergestellt, so daß die Stimmgabeln und die Linearsensoren in der Ebene des Materials liegen. Hierbei erfassen die Stimmgabeln Drehungen um ihre Symmetrieachse, während die Linearsensoren Linearbeschleunigungen erfassen, welche rechtwinklig zu ihrer Symmetrieebene verlaufen. Bei einem ebenen mikromechanisch bearbeiteten Block können Stimmgabeln rechtwinklig zueinander angeordnet werden, so daß Drehbe schleunigungen in zwei Achsen erfaßt werden, während eine Linearbeschleunigung rechtwinklig zur Ebene des ebenen Blocks erfaßbar ist.These known devices are made by micromechanical processing of manufactured essentially two-dimensional flat blocks or disks, so that the tuning forks and the linear sensors lie in the plane of the material. Here, the tuning forks record rotations around their axis of symmetry, while the linear sensors detect linear accelerations that are perpendicular to their Plane of symmetry. For a flat micromechanically machined block tuning forks can be arranged at right angles to each other, so that Drehbe accelerations in two axes are recorded during a linear acceleration perpendicular to the plane of the flat block is detectable.
Um Drehungen um drei rechtwinklig zueinander verlaufende Achsen zu erfassen, ist es bekannt, zwei der vorgenannten Bauteile in einer dreidimensionalen Form mitein ander rechtwinklig zu verbinden. Um Linearbeschleunigungen in drei rechtwinklig zueinander verlaufenden Achsen zu erfassen, müssen drei Bauteile miteinander ver bunden werden. Sollen die Beschleunigungseffekte genau gemessen werden, müssen die zwei bzw. drei Bauteile bzw. Chips genau rechtwinklig zueinander ausgerichtet werden. Da die ebenen Vorrichtungen klein sind, ist es schwierig und kostspielig, bei der Montage die Chips genau rechtwinklig zueinander auszurichten.In order to record rotations around three axes running at right angles to one another, it is known to include two of the aforementioned components in a three-dimensional shape other to connect at right angles. To linear accelerations in three right angles To detect mutually extending axes, three components must ver be bound. If the acceleration effects are to be measured precisely, the two or three components or chips are aligned exactly at right angles to one another will. Because the flat devices are small, it is difficult and expensive to Align the chips exactly at right angles to each other during assembly.
Es besteht die Aufgabe, zwei oder mehr Beschleunigungssensorchips so auszubilden, daß bei ihrem Zusammenbau eine einwandfreie rechtwinklige Ausrichtung sich ergibt.The task is to design two or more acceleration sensor chips in such a way that that when assembled, there is a perfect right-angled alignment.
Gelöst wird diese Aufgabe mit den Merkmalen des Anspruches 1. Vorteilhafte Aus gestaltungen sind den Unteransprüchen entnehmbar.This problem is solved with the features of claim 1. Advantageous designs can be found in the subclaims.
Ausführungsbeispiele werden nachfolgend an Hand der Zeichnungen näher erläutert. Es zeigen:Exemplary embodiments are explained in more detail below with reference to the drawings. Show it:
Fig. 1 eine Draufsicht auf einen Sensorchip mit randseitigen Verzahnungen; FIG. 1 is a plan view of a sensor chip having peripheral gear teeth;
Fig. 2 eine Draufsicht auf einen Sensorchip mit im Bereich seiner Ränder liegenden Verzapfungsbohrungen und randseitigen Verzapfungszungen; Figure 2 is a plan view of a sensor chip having in the region of its edges lying Verzapfungsbohrungen and peripheral Verzapfungszungen.
Fig. 3 eine perspektivische Ansicht einer aus drei Sensorchips nach Fig. 1 beste henden Baugruppe; FIG. 3 is a perspective view of a module consisting of three sensor chips according to FIG. 1;
Fig. 4 eine Explosionsdarstellung einer aus drei Sensorchips nach Fig. 2 bestehen den Baugruppe; FIG. 4 is an exploded view of the assembly consisting of three sensor chips according to FIG. 2;
Fig. 5a eine perspektivische Ansicht einer aus sechs Sensorchips nach Fig. 2 be stehenden Baugruppe; . Fig. 5a is a perspective view of a sensor chip be of six of Figure 2 stationary assembly;
Fig. 5b eine perspektivische Ansicht eines Trägerchips zur Montage mit einer Bau gruppe nach Fig. 5a; Fig. 5b is a perspective view of a carrier chip for assembly with a construction group according to Fig. 5a;
Fig. 5c eine perspektivische Ansicht einer Baugruppe, bestehend aus der Bau gruppe nach Fig. 5a und dem Trägerchip nach Fig. 5b; Fig. 5c is a perspective view of an assembly consisting of the construction group of Figure 5a and the carrier chip according to Fig. 5b.
Fig. 6 eine perspektivische Teilansicht der Verbindung in Form einer Verzahnung zwischen zwei Sensorchips nach Figur 1; Fig. 6 is a partial perspective view of the connection in the form of a toothing between the two sensor chip of Figure 1;
Fig. 7 eine Draufsicht auf eine elektrische Verbindung zwischen zwei Sensorchips; Figure 7 is a plan view of an electrical connection between two sensor chips.
Fig. 8 eine Draufsicht auf eine weitere elektrische Verbindungsart zwischen zwei Sensorchips; Fig. 8 is a plan view of a further electrical connection between two sensor chips;
Fig. 9a eine perspektivische Ansicht der Zapfverbindungsteile zweier Sensorchips nach Fig. 2; 9a is a perspective view of the male connection parts of two sensor chip of FIG. 2.
Fig. 9b eine perspektivische Ansicht der Zapfverbindung zweier Sensorchips nach Fig. 9a; 9b is a perspective view of the pivot connection of two sensor chips according to Fig. 9a.
Fig. 10a eine perspektivische Ansicht einer weiteren Ausführungsform eines Ver bindungsteil mit elektrischen Anschlüssen bei einem Chip nach Fig. 1 vor der Montage; 10a is a perspective view of another embodiment of a Ver connecting part having electrical connections for a chip of Figure 1 prior to assembly..;
Fig. 10b eine perspektivische Ansicht der Verbindung eines Chips nach Fig. 1 mit einem Chip nach Fig. 10a; Figure 10b is a perspective view of the connection of a chip of Figure 1 with a chip of Figure 10a...;
Fig. 11a eine perspektivische Ansicht zweier randseitig ineinandergreifender Sen sorchips nach Fig. 1; Fig. 11a is a perspective view of two interlocking Sen sorchips according to Fig. 1;
Fig. 11b eine perspektivische Ansicht einer elektrischen Verbindungskomponente zur Verbindung der ineinandergreifenden Sensorchips nach Fig. 11a; und Figure 11b is a perspective view of an electrical connector component for connecting the interlocking sensor chip according to Fig. 11a. and
Fig. 11c eine perspektivische Ansicht der zwei randseitig ineinandergreifenden Sen sorchips nach Fig. 11 a mit einer daran anmontierten Komponente nach Fig. 11b. Fig. 11c is a perspective view of the two edges interlocking Sen sorchips of FIG. 11 a having a component mounted thereon according to Fig. 11b.
Die Fig. 1 zeigt einen ebenen Siliciumchip 1, in dessen Mittenbereich ein zum Chip einstückiger Drehbeschleunigungssensor 2 angeordnet ist, der die Form einer Stimmgabel aufweist und durch mikromechanische Bearbeitung hergestellt wurde. Der Sensor 2 ist empfindlich auf Drehbeschleunigungen um eine X-Achse, welche parallel zu den Armen der Stimmgabel verläuft und in der Schwingungsebene liegt. Fig. 1 shows a planar silicon chip 1 is disposed in the central region an integral to the chip rotational acceleration sensor 2, which has the shape of a tuning fork and was produced by micromechanical processing. The sensor 2 is sensitive to rotational accelerations about an X axis, which runs parallel to the arms of the tuning fork and lies in the plane of vibration.
Der Sensor 2 steht mit Anregungstreibern 3 und mit Resonanzsensoren 4 in Wirk verbindung, welche über elektrische Leiterbahnen 5 an einen integralen Prozessor 6 angeschlossen sind, der seinerseits verbunden ist mit flachen elektrischen Leiterbah nen 7 am Rand des Chips. Die Ränder des Chips sind unter Verwendung der gleichen Technik mikromechanisch bearbeitet, wie dies bei der Bildung der Stimmgabel 2 der Fall ist, um während des gleichen Bearbeitungsvorgangs genaue kantenüberlappende Verbindungsformstücke 8 zu erhalten. Die Formstücke 8 bestehen aus einer Reihe von rechteckigen Vorsprüngen und Vertiefungen längs der Ränder des Chips 1. Hier bei stehen den Vorsprüngen an einer Seite Vertiefungen an der gegenüberliegenden Seite gegenüber und an die Vorsprünge der einen Seite schließen sich Vertiefungen an der dazu rechtwinklig verlaufenden Seite an.The sensor 2 is in active connection with excitation drivers 3 and with resonance sensors 4 , which are connected via electrical conductor tracks 5 to an integral processor 6 , which in turn is connected to flat electrical conductor tracks 7 at the edge of the chip. The edges of the chip are micromechanically processed using the same technique as is the case with the formation of the tuning fork 2 , in order to obtain precise connection-overlapping shaped pieces 8 during the same processing operation. The shaped pieces 8 consist of a series of rectangular projections and depressions along the edges of the chip 1 . Here at the projections on one side there are recesses on the opposite side and on the projections on one side there are recesses on the side which is perpendicular to it.
Die Fig. 2 zeigt eine alternative Ausführungsform eines ebenen Siliciumchips 1′, welcher dazu einstückig eine Anordnung von Beschleunigungssensoren umfaßt, be stehend aus zwei integralen mikromechanisch bearbeiteten Drehsensoren 2′ in Form von Stimmgabeln, welche rechtwinklig zueinander angeordnet sind, um Drehbe schleunigungen um rechtwinklig zueinander verlaufenden Achsen X und Y zu erfas sen. Einstückig zum Chip 1′ ist weiterhin ein mikromechanisch bearbeiteter Linear beschleunigungssensor 9 in der Form einer Zunge vorgesehen, der Beschleunigungen in einer Z-Achse erfaßt, welche rechtwinklig zur Ebene des Sensors und rechtwinklig zu den X- und Y-Achsen verläuft. Die Zunge ist an ihrem freien Ende verdickt. In der Nähe seiner Ränder weist der Chip 1′ innerhalb seines Körpers angeordnete Zapflöcher 10 und an seinen Rändern dazu entsprechende vorspringende Zapfzun gen 11 auf, wobei die Löcher und die Zungen durch mikromechanische Bearbeitung während des gleichen Prozesses hergestellt wurden wie die Stimmgabeln 2′ und der Sensor 9. Die Löcher 10 und die Zungen 11 weisen jeweils elektrische Leiterbahnen 7 auf (siehe Fig. 7). Die Zapfzungen 11 sind jeweils um eine halbe Teilung zu den Zapflöchern 10 angeordnet. Fig. 2 shows an alternative embodiment of a flat silicon chip 1 ', which for this purpose integrally comprises an arrangement of acceleration sensors, be standing from two integral micromechanically machined rotation sensors 2 ' in the form of tuning forks, which are arranged at right angles to each other, to rotational accelerations at right angles to each other X and Y axes to be detected. In one piece with the chip 1 ', a micromechanically machined linear acceleration sensor 9 is also provided in the form of a tongue, which detects accelerations in a Z axis, which is perpendicular to the plane of the sensor and perpendicular to the X and Y axes. The tongue is thickened at its free end. Near its edges, the chip 1 'arranged within its body tap holes 10 and on its edges corresponding projecting Zapfzun gene 11 , the holes and tongues were made by micromechanical processing during the same process as the tuning forks 2 ' and Sensor 9 . The holes 10 and the tongues 11 each have electrical conductor tracks 7 (see FIG. 7). The tap tongues 11 are each arranged by half a pitch to the tap holes 10 .
Die Fig. 3 zeigt einen Zusammenbau von drei identischen ebenen Siliciumchips 1 der Fig. 1, aus der verdeutlicht wird, wie die Vorsprünge und Vertiefungen an den Rändern, welche die Verbindungsformstücke 8 bilden, randseitig verzahnend ineinandergreifen, um eine dreidimensionale Sensorvorrichtung zu schaffen, die in der Lage ist, Drehbewegungen um die rechtwinklig zueinander verlaufenden Achsen X, Y und Z zu erfassen. FIG. 3 shows an assembly of three identical flat silicon chips 1 from FIG. 1, from which it is clarified how the projections and depressions on the edges, which form the connection shaped pieces 8 , mesh with one another at the edges in order to create a three-dimensional sensor device which is able to detect rotary movements around the axes X, Y and Z, which run at right angles to one another.
Die Fig. 4 verdeutlicht den Zusammenbau von drei ebenen Siliciumchips 1′ der Fig. 2. Nach dem Zusammenbau greifen die Zapfzungen 11 in die Zapflöcher 10 ein, so daß eine dreidimensionale Sensorvorrichtung entsteht, bei der jeweils zwei Sensoren zur Drehbeschleunigungsmessung in jeder der drei Achsen X, Y und Z vorgesehen sind, bestehend aus unterschiedlich ausgerichteten stimmgabelförmigen Sensoren 2′. Für Beschleunigungsmessungen in jeder der drei Achsen X, Y und Z ist jeweils ein einziger Beschleunigungssensor 9 vorgesehen. Hierbei ist anzumerken, daß weitere Sensoren zum Chip einstückig vorgesehen sein können, welche miteinan der fluchten oder unterschiedlich orientiert sind, um die Redundanz der Vorrichtung zu erhöhen und die Meßmöglichkeit in jeder der Achsen zu vergrößern. Fig. 4 illustrates the assembly of three flat silicon chips 1 'of Fig. 2. After assembly, the tap tongues 11 engage in the tap holes 10 , so that a three-dimensional sensor device is formed, each with two sensors for measuring the rotational acceleration in each of the three axes X, Y and Z are provided, consisting of differently aligned tuning fork sensors 2 '. A single acceleration sensor 9 is provided for acceleration measurements in each of the three axes X, Y and Z. It should be noted here that further sensors can be provided in one piece with the chip, which are aligned with one another or are oriented differently in order to increase the redundancy of the device and to increase the measurement possibility in each of the axes.
Die Fig. 5a zeigt eine geschlossene Baugruppe 12 aus sechs Siliciumchips 1′ der Fig. 2, wobei für jede der drei Achsen vier Drehsensoren und zwei Linearbeschleu nigungssensoren vorgesehen sind. Einen Sockelchip 13 zeigt die Figur Sb zur Auf nahme der Baueinheit 12, der in einer rechteckigen Erhebung Ausnehmungen 14 aufweist, in welche Zapfzungen 11 der Baugruppe 12 passen, so daß eine Bauein heit nach Fig. 5c entsteht. Der Sockelchip 13 weist Leiterbahnen 15 auf, welche in Kontakt treten mit den entsprechenden Leiterbahnen der Baugruppe 12, wobei diese Leiterbahnen 15 über weitere Leiterbahnen 16 in elektrischer Verbindung stehen mit den flachen Leiterbahnen 17 am Rand des Sockelchips 13. Fig. 5a shows a closed assembly 12 made of six silicon chips 1 'of Fig. 2, four rotation sensors and two linear acceleration sensors are provided for each of the three axes. A base chip 13 shows the figure Sb to take on the assembly 12 , which has recesses 14 in a rectangular elevation in which tap tongues 11 of the assembly 12 fit, so that a Bauein unit according to FIG. 5c is formed. The base chip 13 has conductor tracks 15 which come into contact with the corresponding conductor tracks of the assembly 12 , these conductor tracks 15 being in electrical connection with the flat conductor tracks 17 at the edge of the base chip 13 via further conductor tracks 16 .
Die Fig. 6 zeigt die ineinandergreifende Eckverbindung zweier Siliciumchips 1 nach Fig. 1, wobei die flachen elektrischen Verbindungsleiterbahnen 7 der Verbindungs formstücke 8 jedes Chips nahe beieinander verlaufen. Die Leiterbahnen 7 der beiden Chips können elektrisch miteinander verbunden werden durch jeweils eine Lötverbin dung 18 wie in Fig. 7 gezeigt oder durch jeweils eine Drahtverbindung 19 gemäß Fig. 8. Fig. 6 shows the interlocking corner connection of two silicon chips 1 according to Fig. 1, wherein the flat electrical connection tracks 7 of the connecting pieces 8 of each chip run close together. The conductor tracks 7 of the two chips can be electrically connected to one another by a solder connection 18 as shown in FIG. 7 or by a wire connection 19 according to FIG. 8.
Die Fig. 9a zeigt ein Zapfloch 10 und eine Zapfzunge 11 zweier Sensorchips 1′ nach Fig. 2. Wird die Zapfzunge 11 in das Zapfloch 10 eingesteckt, wird eine elektriche Verbindung zwischen den beiden Chips hergestellt. Hierbei sind am Zapfloch 10 die Leiterbahnen 7 über Eck in das Loch 10 geführt. Außerdem verjüngen sich Zapfloch 10 und Zunge 11 keilförmig zur gegenüberliegenden Seite, so daß, wenn nach Fig. 9b ineinandergesteckt, die flachen Leiterbahnen 7 gegeneinandergedrückt werden. Fig. 9a shows a mortise 10 and a tenon tab 11 of two sensor chip 1 'according to Fig. 2. If the tenon tab inserted into the mortise 10 11, a elektriche connection between the two chips is prepared. Here, the traces are routed around corners 7 in the hole 10 at the mortise 10th In addition, the tapping hole 10 and tongue 11 taper in a wedge shape to the opposite side, so that when plugged into one another according to FIG. 9b, the flat conductor tracks 7 are pressed against one another.
Gemäß Fig. 10a stehen die Enden der Leiterbahnen 7′ zungenförmig über den Rand des Vorsprungs des Chips 1 in die Vertiefung über, was durch Photoätzen des Chips bewirkt wird. Werden zwei Chips ineinandergesteckt, werden die überstehenden Enden der Leiterbahnen gebogen und treten in Kontakt mit den Leiterbahnen 7 des anderen Chips, wie in Fig. 10b dargestellt.Referring to FIG. 10 are the ends of the conductor tracks 7 'tongue-shaped over the edge of the protrusion of the chip 1 in the recess on, which is caused by photo-etching of the chip. If two chips are inserted into one another, the protruding ends of the conductor tracks are bent and come into contact with the conductor tracks 7 of the other chip, as shown in FIG. 10b.
Bei der in Fig. 11a gezeigten Ausführungsform sind die Vorsprünge und Vertie fungen zweier randseitig ineinandergesteckter Chips mit ihren Leiterbahnen 7, 5 dargestellt. Die randseitigen flachen Leiterbahnen 7 der beiden Chips werden durch eine zusätzliche elektrische Baukomponente 20 miteinander verbunden, die aus ei nem nichtleitenden Trägermaterial besteht, auf welcher Leiterbahnen mit Zungen 7′′ angeordnet sind, die elektrisch durch Leiterbahnen 5′′ miteinander verbunden sind. Die Zungen verlaufen rechtwinklig zueinander, so daß, wenn die Komponente 20 aufgesetzt wird, die Zungen die Leiterbahnen 7 der beiden rechtwinklig zueinander verlaufenden Chips 1 miteinander verbinden, wie dies in Fig. 11c dargestellt ist.In the embodiment shown in Fig. 11a, the projections and recesses of two chips inserted into each other at the edges are shown with their conductor tracks 7 , 5 . The edge-side flat conductor tracks 7 of the two chips are connected to each other by an additional electrical component 20 , which consists of egg nem non-conductive carrier material, on which conductor tracks with tongues 7 '' are arranged, which are electrically connected by conductor tracks 5 ''. The tongues run at right angles to one another, so that when the component 20 is put on, the tongues connect the conductor tracks 7 of the two chips 1 running at right angles to one another, as is shown in FIG. 11c.
Andere Verbindungsformen können ebenfalls verwendet werden. Es ist nicht we sentlich für die ebenen Chips rechtwinklig zueinander angeordnet zu werden. Sie können auch unter anderen Winkeln zusammengefügt werden. Obwohl bevorzugt Beschleunigungssensoren aus dem gleichen Material wie die Chips bestehen, ist es auch möglich, sie separat herzustellen, um sie sodann an Montageplatten zu befe stigen, die die vorerwähnten randseitigen Verbindungsformstücke aufweisen. Other forms of connection can also be used. It is not we essential for the flat chips to be arranged at right angles to one another. she can also be joined at different angles. Although preferred Accelerometers are made of the same material as the chips, it is it is also possible to manufacture them separately so that they can then be attached to mounting plates Rigen, which have the aforementioned edge-side connecting fittings.
Die Steifigkeit der Baueinheiten hängt ab von der Geometrie der Verbindungsstücke und der Art der elektrischen Verbindungen. Konventionelle Schweiß- und Vergußtech niken können zur Verbesserung der Steifigkeit der Struktur verwendet werden.The rigidity of the structural units depends on the geometry of the connecting pieces and the type of electrical connections. Conventional welding and casting technology Techniques can be used to improve the rigidity of the structure.
Die Geometrie der Sensoren in den ebenen Bauteilen kann entweder während oder nach deren Herstellung und vor dem Zusammenbau verändert werden, um Schwin gungsresonanzen oder andere Kreuzkopplungseffekte zwischen den Sensoren zu ver meiden.The geometry of the sensors in the flat components can either during or after their manufacture and before assembly they are changed to Schwin to resonance or other cross-coupling effects between the sensors avoid.
Claims (12)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB9507930.7A GB9507930D0 (en) | 1995-04-19 | 1995-04-19 | Inertial sensor assemblies |
GB9507930 | 1995-04-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE19610554A1 true DE19610554A1 (en) | 1996-10-24 |
DE19610554B4 DE19610554B4 (en) | 2006-09-21 |
Family
ID=10773183
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19610554A Expired - Fee Related DE19610554B4 (en) | 1995-04-19 | 1996-03-18 | Acceleration sensor assembly |
Country Status (4)
Country | Link |
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JP (1) | JPH08304081A (en) |
DE (1) | DE19610554B4 (en) |
FR (1) | FR2733321A1 (en) |
GB (1) | GB9507930D0 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
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WO1998053496A1 (en) * | 1997-05-19 | 1998-11-26 | Itt Manufacturing Enterprises, Inc. | A method for manufacturing encapsulated semiconductor devices |
US6895819B1 (en) | 1998-09-18 | 2005-05-24 | Fujitsu Limited | Acceleration sensor |
WO2006122780A2 (en) * | 2005-05-18 | 2006-11-23 | Hl-Planar Technik Gmbh | Field measuring device, measurement module for a field measuring device and method of producing a plurality of measurement modules |
DE102005047873A1 (en) * | 2005-10-06 | 2007-04-19 | Günthner, Wolfgang, Dipl.-Ing. | Miniaturized inertial measuring system, for detecting acceleration and/or revolutions, comprises a circuit board arrangement made from a single rigid circuit board having a flexible region formed by a recess corresponding to a bent pattern |
EP1780175A2 (en) * | 2005-10-27 | 2007-05-02 | Honeywell International Inc. | Method for assembling MEMS parts |
EP1802941A1 (en) * | 2004-10-20 | 2007-07-04 | Imego AB | Sensor device |
CN102334009A (en) * | 2009-02-27 | 2012-01-25 | 感应动力股份公司 | Electromechanic microsensor |
WO2015162014A1 (en) * | 2014-04-24 | 2015-10-29 | Continental Teves Ag & Co. Ohg | Monitoring a triaxial inertial sensor by means of a biaxial inertial sensor |
DE102016122042A1 (en) | 2015-11-20 | 2017-05-24 | Jena Optronik Gmbh | Sensor module for determining the position of an object |
WO2019143838A1 (en) * | 2018-01-17 | 2019-07-25 | Cubic Corporation | Cuboid inertial measurement unit |
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US6065339A (en) * | 1996-03-29 | 2000-05-23 | Ngk Insulators, Ltd. | Vibration gyro sensor, combined sensor and method for producing vibration gyro sensor |
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KR101724332B1 (en) * | 2015-12-16 | 2017-04-07 | 국방과학연구소 | Inertial measurement unit |
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US5012316A (en) * | 1989-03-28 | 1991-04-30 | Cardiac Pacemakers, Inc. | Multiaxial transducer interconnection apparatus |
DE9113744U1 (en) * | 1991-11-05 | 1992-01-16 | Smt & Hybrid Gmbh, O-8012 Dresden, De |
-
1995
- 1995-04-19 GB GBGB9507930.7A patent/GB9507930D0/en active Pending
-
1996
- 1996-03-18 DE DE19610554A patent/DE19610554B4/en not_active Expired - Fee Related
- 1996-04-02 FR FR9604294A patent/FR2733321A1/en not_active Withdrawn
- 1996-04-18 JP JP8096940A patent/JPH08304081A/en not_active Ceased
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
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WO1998053496A1 (en) * | 1997-05-19 | 1998-11-26 | Itt Manufacturing Enterprises, Inc. | A method for manufacturing encapsulated semiconductor devices |
US6895819B1 (en) | 1998-09-18 | 2005-05-24 | Fujitsu Limited | Acceleration sensor |
DE19942573B4 (en) * | 1998-09-18 | 2006-01-05 | Fujitsu Ltd., Kawasaki | accelerometer |
EP1802941A4 (en) * | 2004-10-20 | 2009-12-23 | Imego Ab | Sensor device |
US7814791B2 (en) | 2004-10-20 | 2010-10-19 | Imego Ab | Sensor device |
EP1802941A1 (en) * | 2004-10-20 | 2007-07-04 | Imego AB | Sensor device |
WO2006122780A2 (en) * | 2005-05-18 | 2006-11-23 | Hl-Planar Technik Gmbh | Field measuring device, measurement module for a field measuring device and method of producing a plurality of measurement modules |
WO2006122780A3 (en) * | 2005-05-18 | 2007-03-01 | Hl Planar Technik Gmbh | Field measuring device, measurement module for a field measuring device and method of producing a plurality of measurement modules |
DE102005047873B4 (en) * | 2005-10-06 | 2010-10-14 | Günthner, Wolfgang, Dipl.-Ing. | Miniaturized inertial measuring system |
DE102005047873A1 (en) * | 2005-10-06 | 2007-04-19 | Günthner, Wolfgang, Dipl.-Ing. | Miniaturized inertial measuring system, for detecting acceleration and/or revolutions, comprises a circuit board arrangement made from a single rigid circuit board having a flexible region formed by a recess corresponding to a bent pattern |
EP1780175A3 (en) * | 2005-10-27 | 2008-05-07 | Honeywell International Inc. | Method for assembling MEMS parts |
EP1780175A2 (en) * | 2005-10-27 | 2007-05-02 | Honeywell International Inc. | Method for assembling MEMS parts |
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WO2015162014A1 (en) * | 2014-04-24 | 2015-10-29 | Continental Teves Ag & Co. Ohg | Monitoring a triaxial inertial sensor by means of a biaxial inertial sensor |
DE102016122042A1 (en) | 2015-11-20 | 2017-05-24 | Jena Optronik Gmbh | Sensor module for determining the position of an object |
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WO2019143838A1 (en) * | 2018-01-17 | 2019-07-25 | Cubic Corporation | Cuboid inertial measurement unit |
US10473464B2 (en) | 2018-01-17 | 2019-11-12 | Cubic Corporation | Cuboid inertial measurement unit |
Also Published As
Publication number | Publication date |
---|---|
DE19610554B4 (en) | 2006-09-21 |
JPH08304081A (en) | 1996-11-22 |
GB9507930D0 (en) | 1995-06-14 |
FR2733321A1 (en) | 1996-10-25 |
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