DE191801C - - Google Patents

Info

Publication number
DE191801C
DE191801C DENDAT191801D DE191801DA DE191801C DE 191801 C DE191801 C DE 191801C DE NDAT191801 D DENDAT191801 D DE NDAT191801D DE 191801D A DE191801D A DE 191801DA DE 191801 C DE191801 C DE 191801C
Authority
DE
Germany
Prior art keywords
precious
soldering
metal
alloys
platinum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DENDAT191801D
Other languages
German (de)
Publication of DE191801C publication Critical patent/DE191801C/de
Active legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006Ag as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Description

BERLIN. GEDRUCKT IN DER REICHSDRÜCKEREt.BERLIN. PRINTED IN THE REICHSDRÜCKEREt.

Claims (1)

Patent-Anspruch :Patent claim: Lötpaste zum Löten von Edelmetall, dadurch gekennzeichnet, daß fein gepulvertes Lötedelmetall, z. B. Gold, Silber, Platin oder deren Legierungen, außer mit bekannten Zusätzen, wie Borsäure und einem Klebmittel, mit Schwefelsäure angerührt wird.Soldering paste for soldering precious metal, characterized in that finely powdered Precious solder metal, e.g. B. gold, silver, platinum or their alloys, except with known additives such as boric acid and an adhesive, is mixed with sulfuric acid.
DENDAT191801D Active DE191801C (en)

Publications (1)

Publication Number Publication Date
DE191801C true DE191801C (en)

Family

ID=455176

Family Applications (1)

Application Number Title Priority Date Filing Date
DENDAT191801D Active DE191801C (en)

Country Status (1)

Country Link
DE (1) DE191801C (en)

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