DE191801C - - Google Patents
Info
- Publication number
- DE191801C DE191801C DENDAT191801D DE191801DA DE191801C DE 191801 C DE191801 C DE 191801C DE NDAT191801 D DENDAT191801 D DE NDAT191801D DE 191801D A DE191801D A DE 191801DA DE 191801 C DE191801 C DE 191801C
- Authority
- DE
- Germany
- Prior art keywords
- precious
- soldering
- metal
- alloys
- platinum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N Boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims 1
- 239000000654 additive Substances 0.000 claims 1
- 230000001070 adhesive Effects 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 239000004327 boric acid Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 239000010970 precious metal Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Description
BERLIN. GEDRUCKT IN DER REICHSDRÜCKEREt.BERLIN. PRINTED IN THE REICHSDRÜCKEREt.
Claims (1)
Publications (1)
Publication Number | Publication Date |
---|---|
DE191801C true DE191801C (en) |
Family
ID=455176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DENDAT191801D Active DE191801C (en) |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE191801C (en) |
-
0
- DE DENDAT191801D patent/DE191801C/de active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE194533T1 (en) | TIN-BISMUTH SOLDERING PASTE AND ITS USE | |
JP3492554B2 (en) | Functional alloy plating of bonding material in place of Pb and electronic component material to be mounted on which functional alloy plating is applied | |
DE191801C (en) | ||
KR20020002263A (en) | Pb-free Soldering Alloy | |
US6127205A (en) | Process for manufacturing a molded electronic component having pre-plated lead terminals | |
US6893512B2 (en) | Solder alloy and soldered bond | |
GB866467A (en) | Improvements in or relating to semiconductor devices | |
DE2550275A1 (en) | PROCESS FOR CREATING BARRIERS FOR LOETZINN ON LADDER | |
DE2528000A1 (en) | Large area solder application - involves application of solder repellant grid over silvering paste and dip or flow soldering | |
GB573176A (en) | Improvements relating to soldering and brazing | |
DE2650348A1 (en) | Electric component soldered on printed circuit board - using layer of nickel covered by gold to ensure strong soldered joint | |
JPS62199791A (en) | Cobalt and cobalt alloy plating solutions | |
DE1204500B (en) | Use of tin-lead alloys as soft solder for automatic dip soldering | |
Savolainen et al. | Electrical properties of solder filled anisotropically conductive adhesives | |
DE2365450B2 (en) | Solderable silver-metal oxide electrical contact composite - has backing layer of silver-copper alloy | |
GB1368960A (en) | Soldering electrical components to thick film circuits | |
DE1564069B1 (en) | Composites for electrical contacts | |
DE2314235C2 (en) | Silver brazing alloy | |
GB927380A (en) | Improvements in or relating to solders | |
GB909314A (en) | Improvements in and relating to the brazing and soldering of nickel and nickel-base alloys | |
GB1258856A (en) | ||
DE204945C (en) | ||
DE1243274C2 (en) | Process for the production of semiconductor arrangements with a semiconductor body made of silicon | |
DE239805C (en) | ||
DE899774C (en) | Process for the vacuum-tight connection of ceramic bodies with metallic or ceramic bodies |