DE1910021B1 - Verfahren zur Herstellung von elektrischen Leiterplatten - Google Patents

Verfahren zur Herstellung von elektrischen Leiterplatten

Info

Publication number
DE1910021B1
DE1910021B1 DE19691910021D DE1910021DA DE1910021B1 DE 1910021 B1 DE1910021 B1 DE 1910021B1 DE 19691910021 D DE19691910021 D DE 19691910021D DE 1910021D A DE1910021D A DE 1910021DA DE 1910021 B1 DE1910021 B1 DE 1910021B1
Authority
DE
Germany
Prior art keywords
circuit boards
exposed
carrier plate
production
electrical circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19691910021D
Other languages
German (de)
English (en)
Inventor
Hans Hadersbeck
Martha Thiermann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Priority claimed from DE19691910021 external-priority patent/DE1910021C/de
Publication of DE1910021B1 publication Critical patent/DE1910021B1/de
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03CPHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C1/00Photosensitive materials
    • G03C1/52Compositions containing diazo compounds as photosensitive substances
    • G03C1/62Metal compounds reducible to metal
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03CPHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00Photographic processes or agents therefor; Regeneration of such processing agents
    • G03C5/58Processes for obtaining metallic images by vapour deposition or physical development
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE19691910021D 1969-02-27 1969-02-27 Verfahren zur Herstellung von elektrischen Leiterplatten Pending DE1910021B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691910021 DE1910021C (de) 1969-02-27 Verfahren zur Herstellung von elek tnschen Leiterplatten

Publications (1)

Publication Number Publication Date
DE1910021B1 true DE1910021B1 (de) 1970-10-01

Family

ID=5726573

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19691910021D Pending DE1910021B1 (de) 1969-02-27 1969-02-27 Verfahren zur Herstellung von elektrischen Leiterplatten

Country Status (5)

Country Link
BE (1) BE746670A (enrdf_load_stackoverflow)
DE (1) DE1910021B1 (enrdf_load_stackoverflow)
FR (1) FR2033408B1 (enrdf_load_stackoverflow)
GB (1) GB1304625A (enrdf_load_stackoverflow)
NL (1) NL7002155A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7806773A (nl) * 1978-06-23 1979-12-28 Philips Nv Additieve werkwijze voor het vervaardigen van metaal- patronen op kunststofsubstraten.
FR2531302A1 (fr) * 1982-07-30 1984-02-03 Xerox Corp Procedes de formation d'un circuit electrique a haute densite et d'elements d'interconnexion pour le circuit

Also Published As

Publication number Publication date
BE746670A (fr) 1970-08-27
FR2033408B1 (enrdf_load_stackoverflow) 1975-12-26
FR2033408A1 (enrdf_load_stackoverflow) 1970-12-04
GB1304625A (enrdf_load_stackoverflow) 1973-01-24
NL7002155A (enrdf_load_stackoverflow) 1970-08-31

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