DE1809206B2 - Method and device for hot-dip tinning of the electrical conductor tracks of printed circuit boards - Google Patents
Method and device for hot-dip tinning of the electrical conductor tracks of printed circuit boardsInfo
- Publication number
- DE1809206B2 DE1809206B2 DE1809206A DE1809206A DE1809206B2 DE 1809206 B2 DE1809206 B2 DE 1809206B2 DE 1809206 A DE1809206 A DE 1809206A DE 1809206 A DE1809206 A DE 1809206A DE 1809206 B2 DE1809206 B2 DE 1809206B2
- Authority
- DE
- Germany
- Prior art keywords
- printed circuit
- circuit boards
- solder
- conductor tracks
- hot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 9
- 239000004020 conductor Substances 0.000 title claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 22
- 239000007788 liquid Substances 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
Die vorliegende Erfindung betrifft ein Verfahren ium Feuerverzinnen der elektrischen Leiterbahnen von (durchgehende Bohrungen aufweisenden Leiterplatten im Schwallbad und eine Vorrichtung zur Durchführung dieses Verfahrens.The present invention relates to a method ium hot-dip tinning the electrical conductor tracks of (Printed circuit boards with through holes in the surge bath and a device for implementation this procedure.
Verfahren der eingangs genannten Art sind bereits bekannt. Weisen die hiernach behandelten Leiterplatten jedoch durchgehende Bohrungen auf, so ist es notwendig, um die Lothäute an den Bohrungen zu entfernen, die verzinnten Platten entweder, solange das Lot noch flüssig ist, abzuschütteln oder mit Hilfe einer Spachtel das überschüssige Lot zu entfernen. Hiernach verbleiben auf den Leiterbahnen jedoch nur relativ dünne Lotschichten. Die Lötbarkeit der Leiterbahnen wird hierdurch beeinträchtig!.Processes of the type mentioned are already known. Assign the printed circuit boards discussed below however, through holes, it is necessary to remove the solder skins from the holes, either shake off the tinned plates while the solder is still liquid or with the help of a Spatula to remove the excess solder. After this, however, only relatively remain on the conductor tracks thin layers of solder. This affects the solderability of the conductor tracks.
Aus der deutschen Patentschrift 3 28 775 ist es bekannt, zur Vermeidung der Bildung von Hartzink und Zinkasche beim Verzinken von Eisen Druckluft in feinem Strahl gegen die Wandungen der aus dem Beizbad kommenden Eisengestänge zu blasen, so daß im Beizbade losgelöste Eisenieilchen und Verunreinigungen nicht in das Zinkbad gelangen.From the German patent 3 28 775 it is known to avoid the formation of hard zinc and Zinc ash when galvanizing iron Compressed air in a fine jet against the walls of the pickling bath to blow coming iron rods, so that detached iron particles and impurities in the pickling bath do not get into the zinc bath.
Der vorliegenden Erfindung liegt die Aufgabe zugrunde, ein Verfahren zum Feuerverzinnen von Leiterbahnen von durchgehende Bohrungen aufweisenden Leiterplatten zu finden, durch das einerseits das Entstehen von Lothäuten auf den durchgehenden Bohrungen vermieden wird, andererseits eine gute Lötbarkeit gewährleistende ausreichende Lotschichtdicke erzieh wird.The present invention is based on the object of a method for hot-dip tinning of conductor tracks to find through-hole printed circuit boards, through which on the one hand the emergence of solder skins on the through holes is avoided, on the other hand ensuring good solderability sufficient solder layer thickness is educated.
S Diese Aufgabe wird ausgehend von einem Verfahren der eingangs genannten Art dadurch gelöst, daß erfindungsgemäß auf die Rückseite der Leiterplatten, deren auf der Vorderseite befindlichen Leiterbahnen mit der noch flüssigen Lotschicht bedeckt sind, ein Strahl vorzugsweiser erwärmter Druckluft gerichtet wird.S This object is achieved on the basis of a method of the type mentioned in that according to the invention on the back of the printed circuit boards, whose conductor tracks on the front face with the liquid solder layer are still covered, a jet of preferably heated compressed air is directed.
Durch diesen Druckluftsirahl werden die Bohrungen durchgeblasen und damit Lothäute ohne Verminderung
der sonstigen Lotschichtdicke entfernt
Zur Durchführung des erfindungsgemäßen Verfah-This compressed air sirahl blows through the bores and thus removes solder skins without reducing the other solder layer thickness
To carry out the method according to the invention
IS rens eignet sich eine Vorrichtung, bestehend aus einem Scwallbad, bei der in Fortbewegungsrichtung der Leiterplatten hinter der Lotdüse eine Druckluftdüse angeordnet ist, die auf die Rückseite der Platte einen Druckluftstrahl richtet.IS rens is a device consisting of a Wall bath, in which a compressed air nozzle is arranged behind the solder nozzle in the direction of movement of the circuit boards which directs a jet of compressed air onto the back of the plate.
»ο Zur weiteren Erläuterung der Erfindung ist in der Figur ein Ausführungsbeispiel einer erfindungsgemäßen Vorrichtung dargestellt. Die dargestellte Schwallbadlotvorrichtung besteht aus einem doppelwandigen Behälter 1, in dem sich nicht dargestellte HeizelementeTo further explain the invention, the figure shows an exemplary embodiment of one according to the invention Device shown. The illustrated Schwallbadlotvorrichtung consists of a double-walled one Container 1, in which there are heating elements, not shown
»5 zur Erhitzung des in dem Gehäuse 1 vorhandenen Lotmetalls 2 befinden. Im Bereich der Oberfläche des Lotmetalls ist ein Druckkasten 3 angebracht, in den mittels einer Fördereinrichtung 4 das Lot eingesaugt und durch einen Schlitz 5 herausgedrückt wird. Die Fördereinrichtung wird von einem Elektromotor 6 über einen Riemenantrieb 7 angetrieben. Der Ansaugstutzen 8 der Fördereinrichtung liegt vorzugsweise etwa in der Mitte des Lotmetallbades 2. Die zu beschichtenden Platten 9 werden über ein verstellbares Leitblech 10 schräg aufwärts gegen den Fluß des Lotmetalls durch die Oberfläche der aus dem Schlitz 5 austretenden Lotmetallwelle geführt. Um das Austreten von Lotmetall auf die Oberseite der Platten 9 zu vermeiden, weisen die Platten an ihren zuerst das Lotmetall berührenden Vorderkanten einen schräg nach oben gerichteten Ansatzsteg 11 auf, der vorzugsweise abnehmbar ist. In Fortbewegungsrichtung der Platte 9 hinter der Lotdüse 5 ist eine Druckluftdüse 12 angeordnet, die einen Strahl heißer Druckluft auf die Rückseite der vorher beschichteten Leiterplatte 9 richtet und hierdurch die sich eventuell bildenden Lothäute entfernt.»5 for heating the solder metal present in the housing 1 2 are located. In the area of the surface of the solder metal, a pressure box 3 is attached, in the means a conveying device 4, the solder is sucked in and pushed out through a slot 5. The conveyor is driven by an electric motor 6 via a belt drive 7. The intake port 8 of the The conveying device is preferably located approximately in the middle of the solder metal bath 2. The plates 9 to be coated are via an adjustable baffle 10 obliquely upwards against the flow of solder through the surface out of the emerging from the slot 5 solder metal wave. To prevent solder metal from leaking onto the To avoid the upper side of the plates 9, the plates have their leading edges which first come into contact with the solder metal an obliquely upwardly directed attachment web 11, which is preferably removable. In the direction of travel the plate 9 behind the solder nozzle 5, a compressed air nozzle 12 is arranged, which a jet hotter Compressed air is directed at the back of the previously coated printed circuit board 9 and thereby the possibly forming solder skins removed.
Hierzu 1 Blatt Zeichnungen1 sheet of drawings
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19681809206 DE1809206C3 (en) | 1968-11-15 | Method and device for hot-dip tinning of the electrical conductor tracks of printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19681809206 DE1809206C3 (en) | 1968-11-15 | Method and device for hot-dip tinning of the electrical conductor tracks of printed circuit boards |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE1809206A1 DE1809206A1 (en) | 1970-06-11 |
| DE1809206B2 true DE1809206B2 (en) | 1975-07-03 |
| DE1809206C3 DE1809206C3 (en) | 1976-09-30 |
Family
ID=
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3047979A1 (en) * | 1980-12-19 | 1982-07-15 | Sack Bandanlagentechnik Gmbh, 5860 Iserlohn | Single sided coating of metal strip with molten metal or alloy - esp. zinc coating of steel strip which travels over convex guide rolls partly immersed in zinc bath |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3047979A1 (en) * | 1980-12-19 | 1982-07-15 | Sack Bandanlagentechnik Gmbh, 5860 Iserlohn | Single sided coating of metal strip with molten metal or alloy - esp. zinc coating of steel strip which travels over convex guide rolls partly immersed in zinc bath |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1809206A1 (en) | 1970-06-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C3 | Grant after two publication steps (3rd publication) | ||
| E77 | Valid patent as to the heymanns-index 1977 | ||
| 8339 | Ceased/non-payment of the annual fee |