DE1809206A1 - Hot dip tinning of conductor plates having - drilled holes - Google Patents

Hot dip tinning of conductor plates having - drilled holes

Info

Publication number
DE1809206A1
DE1809206A1 DE19681809206 DE1809206A DE1809206A1 DE 1809206 A1 DE1809206 A1 DE 1809206A1 DE 19681809206 DE19681809206 DE 19681809206 DE 1809206 A DE1809206 A DE 1809206A DE 1809206 A1 DE1809206 A1 DE 1809206A1
Authority
DE
Germany
Prior art keywords
compressed air
solder
jet
nozzle
conductor plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19681809206
Other languages
German (de)
Other versions
DE1809206C3 (en
DE1809206B2 (en
Inventor
Dipl-Phys Hans- Merkenschlager
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19681809206 priority Critical patent/DE1809206C3/en
Priority claimed from DE19681809206 external-priority patent/DE1809206C3/en
Publication of DE1809206A1 publication Critical patent/DE1809206A1/en
Publication of DE1809206B2 publication Critical patent/DE1809206B2/en
Application granted granted Critical
Publication of DE1809206C3 publication Critical patent/DE1809206C3/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08—Tin or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A jet of heated, compressed air is directed onto the reverse side of the conductor plate whose conductor faces on the front side are still covered with the layer of solder which is still wet. Apparatus comprises a surge bath soldering device, where a compressed air nozzle is arranged behind the soldering nozzle in the direction of movement of the conductor plates.

Description

Verfahren und Vorrichtung zum Feuerverzinnen der elektrischen Leiterbahnen von Leiterplatten Die vorliegende Erfindung betrifft ein Verfahren zum Beuerverzinnen der elektrischen Leiterbahnen von durchgehende Bohrungen aufweisenden Leiterplatten im Schwallbad und eine Vorrichtung zur Durchführung dieses Verfahrens.Method and device for hot-dip tinning of the electrical conductor tracks of printed circuit boards The present invention relates to a method for tin-plating the electrical conductor tracks of through-hole printed circuit boards in the surge bath and a device for carrying out this process.

Verfahren der eingangs genannten Art sind bereits bekannt.Processes of the type mentioned are already known.

Weisen dic hiernach behandelten Leiterplatten jedoch durchgehnde Bohrungen auf, so ist es notwendig, um dic Lothäute an den Bohrungen zu entfernen, dic verzinnten Platten entweder, solangc das Lot noch flüssig ist, abzuschütteln oder mit Hilfe einer Spachtel das überschüssige Lot zu entfernen. Hiernach verbleiben auf den Leiterbahnen jedoch nur relativ dünnc Lotschichten. Dic Lötbarkeit der Leiterbahnen wird hierdurch beeinträchtigt.However, the printed circuit boards treated below have through holes on, so it is necessary to remove the solder skins from the holes, the tinned Either shake off the plates as long as the solder is still liquid or with help a spatula to remove the excess solder. After that, they remain on the conductor tracks but only relatively thin layers of solder. This makes the conductor tracks easier to solder impaired.

Der vorliegenden Erfindung liegt dic Äufgabe: zugrunde, ein Verfahren zum Feuerverzinnen von Leiterbahnen von durchgehende Borungen aufweisenden Leiterplatten zu finden, durch das einerseits das Entstehen von Lothäuten auf den durchgehenden Bohrungen vermieden wird, andererseits einc gute Iötbarkeit gewährleistende ausreichende Letsdichtdicke erzielt wird.The present invention is based on the task: a method for hot-dip tinning of conductor tracks on printed circuit boards with continuous bores to find, by the one hand the formation of solder skins on the continuous Boring is avoided, on the other hand sufficient ensuring good solderability Lets Dichtdicke is achieved.

Diese Aufgabe wird ausgehend von einem Verfahren der eingangs genannten Art dadurch gelöst, daß erfindungsgemäß auf die Rückseite der Leiterplatten, deren auf der Vorderseite befindlichen Leiterbahnen mit der noch flüssigen Lotschicht bedeckt sind, ein Strahlf vorzugsweiser erwärmter, Preßluft gerichtet wird.This task is based on a method of the aforementioned Kind of solved that according to the invention on the back of the circuit boards, their conductor tracks on the front with the still liquid solder layer are covered, a jet of preferably heated, compressed air is directed.

Durch diesen Preßluftstrahl werden die Bohrungen durchgeblasen und damit Lothäutc ohnc Verminderung der sonstigen Lotschichtdicke entfernt.The bores are blown through by this compressed air jet and This removes solder skin without reducing the other solder layer thickness.

Zur Durchführung des erfindungsgemäßen Verfahrens eie net sich einc Vorrichtung bestehend aus einer Schwallbadlötvorrichtung, bei der in Fortbewegungsrichtung der Leiterplatten hinter der Lötdüse eine Preßluftdüse angeordnet ist, die auf die Rückseite der Platte einen Preßluftstrahl richtet.To carry out the method according to the invention eie net is one Device consisting of a wave soldering device in the direction of movement the circuit boards behind the soldering nozzle a compressed air nozzle is arranged, which on the Rear side of the plate directs a jet of compressed air.

Zur weiteren Erläuterung der Erfindung ist in der Figur ein Ausführungsbeispiel einer erfindungsgemäßen Vorrichtung dargestellt. Die dargestellte Schwallbadlötvorrichtung besteht aus einem doppelwandigen Behälter 1, in dem sich nicht dargestellte Heizelemente zur Erhitzung des in dem Gehäusc 1 vorhandenen Lotmetalls 2 befinden.To further explain the invention, the figure shows an exemplary embodiment a device according to the invention shown. The wave soldering device shown consists of a double-walled container 1 in which there are heating elements, not shown for heating the solder metal 2 present in the housing 1.

Im Bereich der Oberflächc des Lotmetalls ist ein Druckkasten 3 angebracht, in den mittels einer Bördereinrichtung 4 das Lot eingesaugt und durch einen Schlitz 5 herausgedrückt wird. Die Fördereinrichtung wird von einem Elektromotor 6 über/einen Riemenantrieb 7 angetrieben. Der Ansaugstutzen 8 der Fördereinrichtung liegt vorzugsweise etwa in der Mitte des Lotmetallbadcs 2. Die zu verlötenden Platten 9 werden über ein verstellbares Leitblech 10 schräg aufwärts gegen den Fluß des Lotmetalis durch die Oberflache der aus dem Schlitz 5 austretenden Lotmetallwelle geführt. Um das Austreten von Lotmetall auf dic Oberseite der Platten 9 zu vermeiden, weisen die Platten an ihren zuerst das Lotmetall berührenden Vorderkanten einen schräg nach oben gerichteten Ansatzstcg 11 auf, der vorzugsweise abnehmbar ist. In Fortbewegungsrichtung der Platte 9 hinter der Lotduse 5 ist eine Preßluftdüse 12 angeordnet, die einen Strahl heißer Preßluft auf dic Rückseite der eben verlöteten Leiterplatte 9 richtet und hierdurch die sich eventuell bildenden Lothäute entfernt.A pressure box 3 is attached in the area of the surface of the solder metal, into which the solder is sucked in by means of a conveyor device 4 and through a slot 5 is pushed out. The conveyor is of an electric motor 6 over / a Belt drive 7 driven. The suction port 8 of the conveyor is preferably located approximately in the middle of the Soldermetallbadcs 2. The plates 9 to be soldered are over an adjustable baffle 10 obliquely upwards against the flow of solder metal through the surface of the emerging from the slot 5 solder metal wave out. To that To avoid leakage of solder metal on the top of the plates 9, the Plates at an angle at their front edges, which first touch the solder metal above-directed approach piece 11, which is preferably removable. In the direction of movement of the plate 9 behind the solder nozzle 5 is a compressed air nozzle 12 arranged, which soldered a jet of hot compressed air on the back of the just Printed circuit board 9 aligns and thereby removes any solder skins that may be formed.

2 Patentansprüche 1 Figur2 claims 1 figure

Claims (2)

P a t e n t a n s p r ü c h e 1. Verfahren zun Feuerverzinnen der elektrischen Leiterbahnen von durchgehende Bohrungen aufweisenden leiterplatten im Schwallbad, dadurch g e k e n n -z e i c h n e t , daß auf die Rückseite der @diterplatte deren auf der Yorderseite befindliche Leiterbahnen mit der noch flüssigen Lotschicht bedeckt sind, ein Strahl, vorzugsweise erwärmter, Preßluft gerichtet wird. P a t e n t a n s p r ü c h e 1. Process for hot-dip tinning of the electrical conductor tracks of circuit boards with through holes in the splash pool, thereby g e k e n n n -z e i c h n e t that on the back of the @diterplatte whose conductor tracks on the Yorder side with the still liquid Solder layer are covered, directed a jet, preferably heated, compressed air will. 2. Vorrichtung zur Durchführung des Verfahrens nach Anspruch 1 bestehend aus einer Schwallbadlötvorrichtung g e k e n n z e i c h n e t durch eine in Bortbewegungsrichtung der Leiterplatten hinter der Lotdüse (5) angeordneten Preßluftdüse (12), die einen erwärmten Preßluftstrahl auf die Rückseite der Platte (9) richtet.2. Apparatus for performing the method according to claim 1 consisting from a wave soldering device, it is shown by one in the direction of movement of the edge of the circuit boards behind the solder nozzle (5) arranged compressed air nozzle (12), the one heated jet of compressed air directed to the back of the plate (9).
DE19681809206 1968-11-15 Method and device for hot-dip tinning of the electrical conductor tracks of printed circuit boards Expired DE1809206C3 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19681809206 DE1809206C3 (en) 1968-11-15 Method and device for hot-dip tinning of the electrical conductor tracks of printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681809206 DE1809206C3 (en) 1968-11-15 Method and device for hot-dip tinning of the electrical conductor tracks of printed circuit boards

Publications (3)

Publication Number Publication Date
DE1809206A1 true DE1809206A1 (en) 1970-06-11
DE1809206B2 DE1809206B2 (en) 1975-07-03
DE1809206C3 DE1809206C3 (en) 1976-09-30

Family

ID=

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4277518A (en) * 1979-11-13 1981-07-07 Gyrex Corp. Solder-coating method
DE3644249A1 (en) * 1986-12-23 1988-07-07 Siemens Ag Method for protecting electrical contact surfaces during soldering processes

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4277518A (en) * 1979-11-13 1981-07-07 Gyrex Corp. Solder-coating method
DE3644249A1 (en) * 1986-12-23 1988-07-07 Siemens Ag Method for protecting electrical contact surfaces during soldering processes

Also Published As

Publication number Publication date
DE1809206B2 (en) 1975-07-03

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
E77 Valid patent as to the heymanns-index 1977
8339 Ceased/non-payment of the annual fee