DE1779157A1 - Process for the production of laminates - Google Patents

Process for the production of laminates

Info

Publication number
DE1779157A1
DE1779157A1 DE19681779157 DE1779157A DE1779157A1 DE 1779157 A1 DE1779157 A1 DE 1779157A1 DE 19681779157 DE19681779157 DE 19681779157 DE 1779157 A DE1779157 A DE 1779157A DE 1779157 A1 DE1779157 A1 DE 1779157A1
Authority
DE
Germany
Prior art keywords
laminates
production
copper
tightly
foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19681779157
Other languages
German (de)
Inventor
Willi Dr Schroeder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE19681779157 priority Critical patent/DE1779157A1/en
Publication of DE1779157A1 publication Critical patent/DE1779157A1/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Description

Verfahren zur Herstellun von Schichtnreßstoffen Die vorliegende Erfindung bezieht sich auf ein Verfahren zur Herstellung von Schichtpreßstoften und betrifft Insbesondere die Herstellung von kupferkaschierten Schichtpreßstoffen für die Herstellung von gedruckten Schalturigen. Es ist bereits bekannt, bei der Herstellung von kupterkaschier*n Bchichtpreßstoffen alleine Kupferfolie zunächst mit einer Abdecktolie abzudecken und am Rand diese mindestens teilweise dicht miteinander zu verbinden und anschließend die nicht abgedeckte Hupferiolienseite mit den Schichtstoffen in an eich bekannter Weise zu vsrpreeeen. Nach dem PreBdorgang wird dann die Metallabdecklolle durch Abschneiden der Ränder wieder entternt.Durch dieses. Verfahren gelingt ®es, die Oberfläche-der Rupterlaminate beim Freßvorgang von Staub- und Harzpartikelchen aus der umgebenden Atmosphäre weitgehend freizuhalten.Process for the production of laminates The present invention relates to a process for the production of laminates and relates in particular to the production of copper-clad laminates for the production of printed circuit boards. It is already known to first cover copper foil alone with a covering foil in the production of copper laminated laminated laminates and to connect these at least partially tightly to one another at the edge and then to precompose the uncovered hupferiolia side with the laminates in a manner known in the art. After the pre- process , the metal cover roll is removed again by cutting off the edges. The process succeeds in keeping the surface of the Rupter laminate largely free of dust and resin particles from the surrounding atmosphere during the process of eating.

Es wurde nun gefunden, daß es nicht notwendig ist, bei der Herstellung von kupferkaschierten Schichtpreßstoffen, die aus mehreren Iaminaten zu einem Preßpaket zusammengefügt Werden, jede einzelne Kupferoberfläche mit einer besonderen Abdeckfolie zu versehen.It has now been found that it is not necessary in manufacture of copper-clad laminates made up of several laminates to form a pressed package Be joined together, each individual copper surface with a special cover foil to provide.

Gemäß der Erfindung wird vor dem Preßvorgang des gesamte Preßpaket mit. einer dichtschließenden Umhüllung aus metallischer oder thermoplastischer Folie versehen, welche nach. dem Preßvorgang wieder entfernt wird.According to the invention, the entire press package is before the pressing process with. a tightly closing envelope made of metallic or thermoplastic film provided which after. the pressing process is removed again.

Die Erfindung wird anhand der beigefügten Abbildung, in welcher als Ausführungsbeispiel ein Aufbau eines Preßpaketes schematisch dargestellt worden ist, erläutert: Das Preßpaket für die Herstellung von kupferkaschierten I.aminaten besteht aus mehreren kupferkaschierten haminaten 1, welche -durch PreBbleche 2 voneinander ge=trennt sind. Das gesamte Preßpaket ist mit einer wärmebeständigen Umhüllung 3 au® einer Kunststoff- oder Metallfolie dicht umgeben. Mit 4 und 5 sind an sich bekannte Polsterpapiere und Abdeckbleche, wie sie in einer Etagenpresse Anwendung finden, bezeichnet.The invention is explained with reference to the attached figure, in which a structure of a press pack is shown schematically as an exemplary embodiment: The press pack for the production of copper-clad laminates consists of several copper-clad laminates 1, which are separated from one another by pressing plates 2 . The entire press pack is tightly surrounded by a heat-resistant envelope 3 au® of a plastic or metal foil. With 4 and 5 are known upholstery papers and cover plates, as they are used in a multi-stage press , called.

Zur Erhöhung der Sauberkeit des in der Pollenumhüllung eingeschlossenen.Prsüpakatea kann diesem vor dem endgültigen dichten Verschließen :roch -tefilwef-se u>«te@e, Unterdruck gesetzt worden, so daß sich die Polie eng an das Peßpaket einlegt und deses dicht umschließt. Das Verschließ-en der Umhüllungsfolie kann in an sich bekannter Weise durch Verschweißen oder Verrändelh erfolgen.To increase the cleanliness of the Presupakatea enclosed in the pollen envelope, before the final, tight seal: smell -tefilwef-se u> «te @ e, negative pressure can be placed on it, so that the polie fits tightly to the pollen package and encloses it tightly. The occlusive s the wrapping foil can be performed in a conventional manner by welding or Verrändelh.

Obwohl das erfindungsgemäße Verfahren besondere Vorteile für die Herstellung von kupferkaschierten Schichtpreßstaffen ermöglicht, kann es auch für die Herstellung von fichichtpreßsto,ff-Iiaminaten Anwendung finden, welche keine Kupferkeschierung aufweisen. Although the method according to the invention enables particular advantages for the production of copper-clad laminated stiffeners, it can also be used for the production of laminated laminates which do not have copper cladding.

Das weitgehend staubfreie und dichte Einschließen der Preßpakete vor dem freßvorgang verhindert nicht nur eine Verunreinigung des Schichtstoff-Laminatea mit unerwünschten Fremdkörpern sondern verhindert auch, daß flüchtige Bestandteile den -Herzsysteme entweichen: und die Zusammensetzung- der Harzmischeng sieh ungünstig verändert.The substantially dust-free and dense enclosing the Preßpakete before freßvorgang not only prevents contamination of the laminate Laminatea with unwanted foreign bodies but also prevents volatile components escape the -Herzsysteme: and the Zusammensetzung- the Harzmischeng check unfavorably changed.

Claims (1)

p a t e n t a n e p r u c h 1. Verfahren zur Herstellung von SchichtpreJ9stoffen, insbesondere von kupferkaschierten Schichtpreüetoffen, welche mit einer Abdeckfolie vor dem Preßvorgang versehen werden, dadurch gekennzeichnet, daß vor dem PreBvorgang das gesamte PreBpaket mit einer dichtschließenden Umhüllung aus metallischer oder thermoplastischer Folie versehen wird, welche'nach dem FreBvorgang wieder entfernt wird.patent a nepruch 1. Process for the production of laminates, in particular copper-clad laminates, which are provided with a cover film before the pressing process, characterized in that before the pressing process, the entire prepackage is provided with a tight-fitting cover made of metallic or thermoplastic film, which ' is removed again after the frying process.
DE19681779157 1968-07-12 1968-07-12 Process for the production of laminates Pending DE1779157A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19681779157 DE1779157A1 (en) 1968-07-12 1968-07-12 Process for the production of laminates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681779157 DE1779157A1 (en) 1968-07-12 1968-07-12 Process for the production of laminates

Publications (1)

Publication Number Publication Date
DE1779157A1 true DE1779157A1 (en) 1971-09-02

Family

ID=5703761

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19681779157 Pending DE1779157A1 (en) 1968-07-12 1968-07-12 Process for the production of laminates

Country Status (1)

Country Link
DE (1) DE1779157A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1009206A2 (en) * 1998-12-02 2000-06-14 Ajinomoto Co., Inc. Method of vacuum-laminating adhesive film

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1009206A2 (en) * 1998-12-02 2000-06-14 Ajinomoto Co., Inc. Method of vacuum-laminating adhesive film
EP1009206A3 (en) * 1998-12-02 2003-01-15 Ajinomoto Co., Inc. Method of vacuum-laminating adhesive film
US7166180B2 (en) 1998-12-02 2007-01-23 Ajinomoto Co., Inc. Method of vacuum-laminating adhesive film

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