DE1246220B - Process for producing copper-clad laminates or laminates - Google Patents

Process for producing copper-clad laminates or laminates

Info

Publication number
DE1246220B
DE1246220B DE1965L0051886 DEL0051886A DE1246220B DE 1246220 B DE1246220 B DE 1246220B DE 1965L0051886 DE1965L0051886 DE 1965L0051886 DE L0051886 A DEL0051886 A DE L0051886A DE 1246220 B DE1246220 B DE 1246220B
Authority
DE
Germany
Prior art keywords
laminates
copper
foil
clad
producing copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE1965L0051886
Other languages
German (de)
Inventor
Dr Phil Willi Schroeder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE1965L0051886 priority Critical patent/DE1246220B/en
Publication of DE1246220B publication Critical patent/DE1246220B/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Description

Verfahren zur Herstellung von kupferkaschierten Schichtstoffen bzw. Schichtpreßstoffen Die vorliegende Erfindung bezieht sich auf ein Verfahren zur Herstellung von kupferkaschierten Schichtstoffen, die für die Herstellung von gedruckten Schaltungen Anwendung finden.Process for the production of copper-clad laminates or Laminates The present invention relates to a method for Manufacture of copper-clad laminates used for the manufacture of printed Circuits find application.

Die Schwierigkeiten in der Herstellung kupferkaschierter Schichtstoffe liegen zum Teil in der Einhaltung einer hohen Oberflächengüte der Kupferfolie nach deren Durchlaufen des Fertigungsverfahrens. Während der Herstellung des Schichtpreßstoffes, insbesondere beim Beschicken der Presse werden Staub und Harzpartikeln aus der umgebenden Atmosphäre auf die Kupferfolie bzw. das Preßblech aufgebracht. Diese hinterlassen nach dem Preßvorgang Eindrücke, teilweise mit Einschlüssen von harzhaltigen Bestandteilen. Mit dem vorliegenden Verfahren werden diese Nachteile weitgehend behoben, so daß eine einwandfreie Fertigung von kupferkaschierten Schichtstoffen ohne Verunreinigungen der Kupferfolien-Oberfläche ermöglicht wird.The difficulties in producing copper-clad laminates are in part inferior in maintaining a high surface quality for the copper foil their passage through the manufacturing process. During the manufacture of the laminate, especially when loading the press, dust and resin particles are removed from the surrounding area Atmosphere applied to the copper foil or the press plate. Leave this behind impressions after the pressing process, some with inclusions of resinous components. With the present method, these disadvantages are largely eliminated, so that flawless production of copper-clad laminates without contamination the copper foil surface is made possible.

Gegenstand der vorliegenden Erfindung ist ein Verfahren zum Herstellen von kupferkaschierten Schichtstoffen bzw. Schichtpreßstoffen, welches dadurch gekennzeichnet ist, daß eine Kupferfolie mit einer Metallfolie, vorzugsweise einer Aluminiumfolie, abgedeckt und am Rand mit dieser mindestens teilweise dicht verbunden wird und daß anschließend die nicht abgedeckte Kupferfolienseite mit den Schichtstoffen in an sich bekannter Weise verpreßt wird, wonach die Metallfolie durch Abschneiden der Ränder entfernt wird.The present invention relates to a method of production of copper-clad laminates or laminates, which is characterized is that a copper foil with a metal foil, preferably an aluminum foil, is covered and at least partially tightly connected at the edge with this and that then the uncovered copper foil side with the laminates in is pressed in a known manner, after which the metal foil by cutting off the Margins is removed.

Die Verbindung der beiden Folien an ihren Randseiten kann auf mechanischem Weg, z. B. durch Rändelung, Falzung oder ähnliche Verfahren erfolgen. Es -ist auch möglich, die Ränder vorübergehend durch Verklebung, z. B. mit einem Klebestreifen, dicht miteinander zu verbinden. Es hat sich als zweckmäßig erwiesen, an mehreren Stellen des Randes eine öffnung frei zu lassen, damit beim Preßvorgang zwischen den beiden Metallfolien vorhandene Luft entweichen kann.The connection of the two foils at their edges can be done mechanically Way, z. B. by knurling, folding or similar processes. It is also possible, the edges temporarily by gluing, z. B. with an adhesive strip, to connect tightly together. It has been found to be useful on several Make the edge to leave an opening free so that during the pressing process between the air present in the two metal foils can escape.

Zur Herstellung des kupferkaschierten - Schichtstoffes werden als Trägerkörper für die kupferkaschierte Folie Phenol- oder Kresolharz-Papiere bzw. solche mit Polyester- oder Epoxydharz mit anorganischen Trägerstoffen (Glasfäsermaterial, z. B. Gewebe oder Vlies) verwendet. Eine einseitig oxydierte Kupferfolie wird mit ihrer nicht oxydierten Seite mit einer Aluminiumfolie von etwa 500 m,u Dicke an den Rändern teilweise dicht verbunden. Anschließend wird in an sich bekannter Weise die oxydierte Kupferfolienseite auf den Trägerkörper aufgebracht und mit diesem unter Druck-und Wärme zu kupferkaschierten Schichtpreßstoffen verarbeitet. Beim Besäumen der gepreßten Schichtstoffplatten kann der Rand mit der Verbindungsnaht weggeschnitten werden; dadurch kann in einfacher Weise die für die Fertigung vorübergehend aufgebrachte Abdeckfolie wieder entfernt werden. Man erhält eine einwandfrei saubere Kupferoberfläche auf dem Schichtstoff:For the production of the copper-clad laminate, as Carrier body for the copper-clad film, phenolic or cresol resin papers or those with polyester or epoxy resin with inorganic carrier materials (glass fiber material, z. B. fabric or fleece) is used. A copper foil oxidized on one side is with on their non-oxidized side with an aluminum foil about 500 m thick the edges partially tightly connected. Then in a manner known per se the oxidized copper foil side is applied to the carrier body and with this processed under pressure and heat into copper-clad laminates. At the The edge with the joint seam can be trimmed to the pressed laminate panels be cut away; this can be used temporarily for manufacturing in a simple manner applied cover film can be removed again. A perfectly clean one is obtained Copper surface on the laminate:

Claims (1)

Patentanspruch: Verfahren zum Herstellen -von kupferkaschierten Schichtstoffen bzw. Schichtpreßstoffen, d adurch gekennzeichnet, daß eine Kupferfolie mit einer Metallfolie, vorzugsweise einer Aluminiumfolie, abgedeckt und am Rand mit dieser mindestens teilweise dicht verbunden wird und daß anschließend die nicht abgedeckte Kupferfolienseite mit den Schichtstoffen in an sich bekannter Weise verpreßt wird, wonach die Metallfolie durch Abschneiden der Ränder entfernt wird. In Betracht gezogene Druckschriften: P. E i s 1 e r ; Gedruckte Schaltungen, Technologie der Folienätztechnik, 1961, S. 57.Claim: Process for the production of copper-clad laminates or laminates, characterized in that a copper foil with a Metal foil, preferably an aluminum foil, covered and at the edge with this is at least partially tightly connected and that then the uncovered The copper foil side is pressed with the laminates in a manner known per se, after which the metal foil is removed by cutting off the edges. Considered Publications: P. E i s 1 e r; Printed circuits, technology of foil etching technology, 1961, p. 57.
DE1965L0051886 1965-10-15 1965-10-15 Process for producing copper-clad laminates or laminates Pending DE1246220B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE1965L0051886 DE1246220B (en) 1965-10-15 1965-10-15 Process for producing copper-clad laminates or laminates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1965L0051886 DE1246220B (en) 1965-10-15 1965-10-15 Process for producing copper-clad laminates or laminates

Publications (1)

Publication Number Publication Date
DE1246220B true DE1246220B (en) 1967-08-03

Family

ID=7274343

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1965L0051886 Pending DE1246220B (en) 1965-10-15 1965-10-15 Process for producing copper-clad laminates or laminates

Country Status (1)

Country Link
DE (1) DE1246220B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0395871A2 (en) * 1989-05-05 1990-11-07 Gould Electronics Inc. Protected conductive foil and procedure for protecting an electrodeposited metallic foil during further processing

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0395871A2 (en) * 1989-05-05 1990-11-07 Gould Electronics Inc. Protected conductive foil and procedure for protecting an electrodeposited metallic foil during further processing
EP0395871A3 (en) * 1989-05-05 1991-09-18 Gould Electronics Inc. Protected conductive foil and procedure for protecting an electrodeposited metallic foil during further processing

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