DE112022002568A5 - Optoelektronische leuchtvorrichtung - Google Patents

Optoelektronische leuchtvorrichtung Download PDF

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Publication number
DE112022002568A5
DE112022002568A5 DE112022002568.9T DE112022002568T DE112022002568A5 DE 112022002568 A5 DE112022002568 A5 DE 112022002568A5 DE 112022002568 T DE112022002568 T DE 112022002568T DE 112022002568 A5 DE112022002568 A5 DE 112022002568A5
Authority
DE
Germany
Prior art keywords
lighting device
optoelectronic lighting
optoelectronic
lighting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112022002568.9T
Other languages
English (en)
Inventor
Daniel Richter
Gunnar Petersen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Ams Osram International GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ams Osram International GmbH filed Critical Ams Osram International GmbH
Publication of DE112022002568A5 publication Critical patent/DE112022002568A5/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H01S5/0087—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for illuminating phosphorescent or fluorescent materials, e.g. using optical arrangements specifically adapted for guiding or shaping laser beams illuminating these materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
DE112022002568.9T 2021-05-12 2022-05-10 Optoelektronische leuchtvorrichtung Pending DE112022002568A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102021112359.3A DE102021112359A1 (de) 2021-05-12 2021-05-12 Optoelektronische leuchtvorrichtung
DE102021112359.3 2021-05-12
PCT/EP2022/062692 WO2022238434A2 (de) 2021-05-12 2022-05-10 Optoelektronische leuchtvorrichtung

Publications (1)

Publication Number Publication Date
DE112022002568A5 true DE112022002568A5 (de) 2024-03-14

Family

ID=81975245

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102021112359.3A Withdrawn DE102021112359A1 (de) 2021-05-12 2021-05-12 Optoelektronische leuchtvorrichtung
DE112022002568.9T Pending DE112022002568A5 (de) 2021-05-12 2022-05-10 Optoelektronische leuchtvorrichtung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102021112359.3A Withdrawn DE102021112359A1 (de) 2021-05-12 2021-05-12 Optoelektronische leuchtvorrichtung

Country Status (3)

Country Link
CN (1) CN117441237A (de)
DE (2) DE102021112359A1 (de)
WO (1) WO2022238434A2 (de)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2346101A4 (de) 2008-10-15 2015-11-25 Koito Mfg Co Ltd Lichtemittierendes modul, herstellungsverfahren für ein lichtemittierendes moduk und beleuchtungskörper
JP5050045B2 (ja) 2009-12-22 2012-10-17 株式会社東芝 発光装置
DE102011080458A1 (de) * 2011-08-04 2013-02-07 Osram Opto Semiconductors Gmbh Optoelektronische anordnung und verfahren zur herstellung einer optoelektronischen anordnung
US9685594B2 (en) * 2012-05-31 2017-06-20 Panasonic Intellectual Property Management Co., Ltd. LED module and method of preparing the LED module, lighting device
JP6062431B2 (ja) 2012-06-18 2017-01-18 シャープ株式会社 半導体発光装置
JP2015028997A (ja) * 2013-07-30 2015-02-12 日亜化学工業株式会社 発光装置及びその製造方法
WO2016120400A1 (en) * 2015-01-30 2016-08-04 Osram Opto Semiconductors Gmbh Method for producing a semiconductor component and semiconductor component
DE102015117936A1 (de) 2015-10-21 2017-04-27 Osram Opto Semiconductors Gmbh Optoelektronische Leuchtvorrichtung
JP6817599B2 (ja) * 2016-03-10 2021-01-20 パナソニックＩｐマネジメント株式会社 Ｌｅｄモジュール
DE102016113470A1 (de) 2016-07-21 2018-01-25 Osram Opto Semiconductors Gmbh Laserbauelement
DE102017109485A1 (de) 2017-05-03 2018-11-08 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
US10808893B2 (en) * 2019-03-04 2020-10-20 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor light source and Bragg mirror

Also Published As

Publication number Publication date
CN117441237A (zh) 2024-01-23
WO2022238434A2 (de) 2022-11-17
DE102021112359A1 (de) 2022-11-17
WO2022238434A3 (de) 2023-01-05

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: F21V0029502000

Ipc: H01L0033500000