DE112019004670A5 - Strahlungsemittierendes bauelement - Google Patents
Strahlungsemittierendes bauelement Download PDFInfo
- Publication number
- DE112019004670A5 DE112019004670A5 DE112019004670.5T DE112019004670T DE112019004670A5 DE 112019004670 A5 DE112019004670 A5 DE 112019004670A5 DE 112019004670 T DE112019004670 T DE 112019004670T DE 112019004670 A5 DE112019004670 A5 DE 112019004670A5
- Authority
- DE
- Germany
- Prior art keywords
- radiation
- emitting component
- emitting
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102018123010.9 | 2018-09-19 | ||
| DE102018123010.9A DE102018123010A1 (de) | 2018-09-19 | 2018-09-19 | Strahlungsemittierendes bauelement |
| PCT/EP2019/074842 WO2020058258A1 (de) | 2018-09-19 | 2019-09-17 | Strahlungsemittierendes bauelement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE112019004670A5 true DE112019004670A5 (de) | 2021-06-02 |
Family
ID=68069728
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102018123010.9A Withdrawn DE102018123010A1 (de) | 2018-09-19 | 2018-09-19 | Strahlungsemittierendes bauelement |
| DE112019004670.5T Pending DE112019004670A5 (de) | 2018-09-19 | 2019-09-17 | Strahlungsemittierendes bauelement |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102018123010.9A Withdrawn DE102018123010A1 (de) | 2018-09-19 | 2018-09-19 | Strahlungsemittierendes bauelement |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20210351329A1 (de) |
| JP (1) | JP7254906B2 (de) |
| CN (1) | CN112771668A (de) |
| DE (2) | DE102018123010A1 (de) |
| WO (1) | WO2020058258A1 (de) |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006054224A (ja) | 2004-08-10 | 2006-02-23 | Sanyo Electric Co Ltd | 発光装置 |
| US8125137B2 (en) | 2005-01-10 | 2012-02-28 | Cree, Inc. | Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same |
| JP2007109837A (ja) | 2005-10-13 | 2007-04-26 | Hitachi Ltd | 照明装置 |
| JP2007287385A (ja) | 2006-04-13 | 2007-11-01 | Epson Imaging Devices Corp | 照明装置、液晶装置、及び電子機器 |
| DE102009037732A1 (de) | 2009-08-17 | 2011-02-24 | Osram Gesellschaft mit beschränkter Haftung | Konversions-LED mit hoher Effizienz |
| DE102009037730A1 (de) | 2009-08-17 | 2011-02-24 | Osram Gesellschaft mit beschränkter Haftung | Konversions-LED mit hoher Farbwiedergabe |
| US8198803B2 (en) * | 2010-07-30 | 2012-06-12 | Everlight Electronics Co., Ltd. | Color-temperature-tunable device |
| DE102011116229A1 (de) | 2011-10-17 | 2013-04-18 | Osram Opto Semiconductors Gmbh | Keramisches Konversionselement, optoelektronisches Bauelement mit einem keramischen Konversionselement und Verfahren zur Herstellung eines keramischen Konversionselements |
| JP2013191385A (ja) | 2012-03-13 | 2013-09-26 | Toshiba Lighting & Technology Corp | 照明装置 |
| CN105324859B (zh) * | 2013-06-18 | 2019-06-04 | 夏普株式会社 | 光源装置以及发光装置 |
| CN108822835B (zh) * | 2013-10-08 | 2022-07-29 | 欧司朗光电半导体有限公司 | 发光材料、用于制造发光材料的方法和发光材料的应用 |
| CN106030833B (zh) * | 2014-04-08 | 2018-08-28 | 夏普株式会社 | Led驱动电路 |
| US9219201B1 (en) * | 2014-10-31 | 2015-12-22 | Cree, Inc. | Blue light emitting devices that include phosphor-converted blue light emitting diodes |
| DE102014117892A1 (de) * | 2014-12-04 | 2016-06-09 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement sowie optoelektronisches Bauteil |
| JP6712768B2 (ja) | 2015-09-28 | 2020-06-24 | パナソニックＩｐマネジメント株式会社 | 発光装置及び照明装置 |
| KR102419890B1 (ko) * | 2015-11-05 | 2022-07-13 | 삼성전자주식회사 | 발광 장치 및 그 제조 방법 |
| EP3419062A4 (de) | 2016-07-21 | 2019-06-12 | Sanken Electric Co., Ltd. | Lichtemittierende vorrichtung |
| US10446722B2 (en) * | 2017-09-29 | 2019-10-15 | Samsung Electronics Co., Ltd. | White light emitting device |
-
2018
- 2018-09-19 DE DE102018123010.9A patent/DE102018123010A1/de not_active Withdrawn
-
2019
- 2019-09-17 CN CN201980060795.6A patent/CN112771668A/zh active Pending
- 2019-09-17 US US17/277,732 patent/US20210351329A1/en active Pending
- 2019-09-17 JP JP2021508291A patent/JP7254906B2/ja active Active
- 2019-09-17 DE DE112019004670.5T patent/DE112019004670A5/de active Pending
- 2019-09-17 WO PCT/EP2019/074842 patent/WO2020058258A1/de active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN112771668A (zh) | 2021-05-07 |
| WO2020058258A1 (de) | 2020-03-26 |
| JP7254906B2 (ja) | 2023-04-10 |
| US20210351329A1 (en) | 2021-11-11 |
| DE102018123010A1 (de) | 2020-03-19 |
| JP2022500841A (ja) | 2022-01-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R012 | Request for examination validly filed | ||
| R016 | Response to examination communication | ||
| R016 | Response to examination communication | ||
| R016 | Response to examination communication |