DE112018003539A5 - Einpressstift und Verfahren zu dessen Herstellung - Google Patents

Einpressstift und Verfahren zu dessen Herstellung Download PDF

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Publication number
DE112018003539A5
DE112018003539A5 DE112018003539.5T DE112018003539T DE112018003539A5 DE 112018003539 A5 DE112018003539 A5 DE 112018003539A5 DE 112018003539 T DE112018003539 T DE 112018003539T DE 112018003539 A5 DE112018003539 A5 DE 112018003539A5
Authority
DE
Germany
Prior art keywords
press
pin
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112018003539.5T
Other languages
English (en)
Inventor
Hermann Eicher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ept Holding & Co KG GmbH
Original Assignee
Ept Holding & Co KG GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ept Holding & Co KG GmbH filed Critical Ept Holding & Co KG GmbH
Publication of DE112018003539A5 publication Critical patent/DE112018003539A5/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Multi-Conductor Connections (AREA)
DE112018003539.5T 2017-07-12 2018-07-12 Einpressstift und Verfahren zu dessen Herstellung Pending DE112018003539A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102017115697.6 2017-07-12
DE102017115697 2017-07-12
PCT/EP2018/068966 WO2019012050A1 (de) 2017-07-12 2018-07-12 Einpressstift und verfahren zu dessen herstellung

Publications (1)

Publication Number Publication Date
DE112018003539A5 true DE112018003539A5 (de) 2020-03-26

Family

ID=62916673

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112018003539.5T Pending DE112018003539A5 (de) 2017-07-12 2018-07-12 Einpressstift und Verfahren zu dessen Herstellung

Country Status (4)

Country Link
US (1) US11183779B2 (de)
CN (1) CN111095680B (de)
DE (1) DE112018003539A5 (de)
WO (1) WO2019012050A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11641071B2 (en) * 2020-01-13 2023-05-02 Te Connectivity Solutions Gmbh Connection assembly and pin with a welding section

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4302545B2 (ja) * 2004-02-10 2009-07-29 株式会社オートネットワーク技術研究所 プレスフィット端子
WO2006077827A1 (ja) 2005-01-18 2006-07-27 Autonetworks Technologies, Ltd. プレスフィット端子とその製造方法及びプレスフィット端子－回路基板間の接続構造
DE102007047007A1 (de) * 2007-10-01 2009-04-09 Tyco Electronics Amp Gmbh Elektrisches Kontaktelement und ein Verfahren zum Herstellen desselben
DE102009008118B4 (de) 2008-02-08 2020-01-30 Ept Automotive Gmbh & Co. Kg Verfahren zum Herstellen eines elektrischen Kontakts auf einer Leiterplatte, sowie Einpressstift für das Herstellen eines elektrischen Kontakts auf einer Leiterplatte
US20090239398A1 (en) * 2008-03-20 2009-09-24 Interplex Nas, Inc. Press fit (compliant) terminal and other connectors with tin-silver compound
DE102009047043A1 (de) 2009-10-19 2011-04-21 Robert Bosch Gmbh Lötfreie elektrische Verbindung
CN102055099A (zh) * 2009-11-05 2011-05-11 富士康(昆山)电脑接插件有限公司 电连接器端子及其电镀方法
DE102011077915A1 (de) * 2011-06-21 2012-12-27 Robert Bosch Gmbh Einpresspin für eine elektrische Einpressverbindung zwischen einer elektronischen Komponente und einer Substratplatte
DE102011078546A1 (de) * 2011-07-01 2013-01-03 Tyco Electronics Amp Gmbh Elektrische Kontaktbeschichtung
TWI493798B (zh) 2012-02-03 2015-07-21 Jx Nippon Mining & Metals Corp Push-in terminals and electronic parts for their use
FR2993579B1 (fr) * 2012-07-20 2015-09-25 Tyco Electronics France Sas Procede de revetement et revetement pour contact a insertion a force
US9627790B2 (en) * 2012-10-04 2017-04-18 Fci Americas Technology Llc Electrical contact including corrosion-resistant coating
DE102014005941A1 (de) * 2014-04-24 2015-11-12 Te Connectivity Germany Gmbh Verfahren zum Herstellen eines elektrischen Kontaktelements zur Vermeidung von Zinnwhiskerbildung, und Kontaktelement
US9985372B2 (en) * 2015-03-20 2018-05-29 BIOTRONIK SE Co. KG Terminal pin and feedthrough
US20170183783A1 (en) * 2015-12-29 2017-06-29 Rohm And Haas Electronic Materials Llc Method for forming organic coating on copper surface

Also Published As

Publication number Publication date
US20210036442A1 (en) 2021-02-04
CN111095680A (zh) 2020-05-01
CN111095680B (zh) 2021-11-09
US11183779B2 (en) 2021-11-23
WO2019012050A1 (de) 2019-01-17

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