DE112017005220T5 - Laserbearbeitungsvorrichtung und Betriebsprüfverfahren - Google Patents
Laserbearbeitungsvorrichtung und Betriebsprüfverfahren Download PDFInfo
- Publication number
- DE112017005220T5 DE112017005220T5 DE112017005220.3T DE112017005220T DE112017005220T5 DE 112017005220 T5 DE112017005220 T5 DE 112017005220T5 DE 112017005220 T DE112017005220 T DE 112017005220T DE 112017005220 T5 DE112017005220 T5 DE 112017005220T5
- Authority
- DE
- Germany
- Prior art keywords
- laser light
- laser
- light modulator
- spatial light
- intensity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012545 processing Methods 0.000 title claims abstract description 118
- 238000010998 test method Methods 0.000 title claims description 5
- 230000008859 change Effects 0.000 claims abstract description 18
- 230000003287 optical effect Effects 0.000 claims description 66
- 238000000034 method Methods 0.000 claims description 18
- 210000001747 pupil Anatomy 0.000 claims description 18
- 238000003384 imaging method Methods 0.000 claims description 13
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 241000219739 Lens Species 0.000 description 156
- 239000004973 liquid crystal related substance Substances 0.000 description 35
- 238000005520 cutting process Methods 0.000 description 30
- 230000007246 mechanism Effects 0.000 description 25
- 239000000758 substrate Substances 0.000 description 24
- 238000005259 measurement Methods 0.000 description 13
- 238000009826 distribution Methods 0.000 description 11
- 230000010287 polarization Effects 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 238000003754 machining Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 6
- 230000004075 alteration Effects 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 5
- 238000012937 correction Methods 0.000 description 5
- 238000012544 monitoring process Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000001154 acute effect Effects 0.000 description 3
- 239000002178 crystalline material Substances 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 230000002996 emotional effect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 240000004322 Lens culinaris Species 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000013507 mapping Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 201000009310 astigmatism Diseases 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- ZINJLDJMHCUBIP-UHFFFAOYSA-N ethametsulfuron-methyl Chemical compound CCOC1=NC(NC)=NC(NC(=O)NS(=O)(=O)C=2C(=CC=CC=2)C(=O)OC)=N1 ZINJLDJMHCUBIP-UHFFFAOYSA-N 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/707—Auxiliary equipment for monitoring laser beam transmission optics
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/93—Detection standards; Calibrating baseline adjustment, drift correction
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2203/00—Function characteristic
- G02F2203/12—Function characteristic spatial light modulator
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2203/00—Function characteristic
- G02F2203/69—Arrangements or methods for testing or calibrating a device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/0014—Monitoring arrangements not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
- H01S3/0085—Modulating the output, i.e. the laser beam is modulated outside the laser cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/106—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity
- H01S3/1065—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity using liquid crystals
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Analytical Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016-202601 | 2016-10-14 | ||
JP2016202601A JP6768444B2 (ja) | 2016-10-14 | 2016-10-14 | レーザ加工装置、及び、動作確認方法 |
PCT/JP2017/036872 WO2018070445A1 (ja) | 2016-10-14 | 2017-10-11 | レーザ加工装置、及び、動作確認方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE112017005220T5 true DE112017005220T5 (de) | 2019-07-11 |
Family
ID=61906170
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE112017005220.3T Pending DE112017005220T5 (de) | 2016-10-14 | 2017-10-11 | Laserbearbeitungsvorrichtung und Betriebsprüfverfahren |
Country Status (7)
Country | Link |
---|---|
US (1) | US11131871B2 (ja) |
JP (1) | JP6768444B2 (ja) |
KR (1) | KR102343564B1 (ja) |
CN (1) | CN109843497B (ja) |
DE (1) | DE112017005220T5 (ja) |
TW (1) | TWI736689B (ja) |
WO (1) | WO2018070445A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110977188A (zh) * | 2019-11-03 | 2020-04-10 | 武汉光谷航天三江激光产业技术研究有限公司 | 一种基于空间光调制器的多焦点晶圆内部切割装置 |
CN112548321A (zh) * | 2020-12-04 | 2021-03-26 | 哈尔滨工业大学 | 一种基于同轴监测的真空激光焊接焊缝缺陷识别方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3878758B2 (ja) | 1998-12-04 | 2007-02-07 | 浜松ホトニクス株式会社 | 空間光変調装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE602005015295D1 (de) | 2004-03-02 | 2009-08-20 | Univ Michigan State | Lasersystem mit ultrakurzen laserimpulsen |
JP4353219B2 (ja) * | 2006-08-14 | 2009-10-28 | 日産自動車株式会社 | レーザ加工装置、レーザ加工装置の制御方法 |
GB2445957B (en) * | 2007-01-29 | 2009-08-19 | Tera View Ltd | A method and apparatus for analysing an LCD |
JP4402708B2 (ja) * | 2007-08-03 | 2010-01-20 | 浜松ホトニクス株式会社 | レーザ加工方法、レーザ加工装置及びその製造方法 |
JP5090121B2 (ja) * | 2007-10-01 | 2012-12-05 | オリンパス株式会社 | 調整装置、レーザ加工装置、調整方法、および調整プログラム |
WO2009063670A1 (ja) | 2007-11-14 | 2009-05-22 | Hamamatsu Photonics K.K. | レーザ加工装置およびレーザ加工方法 |
US8165838B2 (en) * | 2008-06-02 | 2012-04-24 | Lumenis Ltd. | Laser system calibration |
JP5108661B2 (ja) | 2008-07-03 | 2012-12-26 | 浜松ホトニクス株式会社 | レーザ加工装置およびレーザ加工方法 |
JP5775265B2 (ja) * | 2009-08-03 | 2015-09-09 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体装置の製造方法 |
JP5802109B2 (ja) * | 2011-10-26 | 2015-10-28 | 浜松ホトニクス株式会社 | 光変調制御方法、制御プログラム、制御装置、及びレーザ光照射装置 |
GB2501117A (en) * | 2012-04-13 | 2013-10-16 | Isis Innovation | Laser focusing method and apparatus |
KR102102010B1 (ko) | 2012-09-13 | 2020-04-17 | 하마마츠 포토닉스 가부시키가이샤 | 광변조 제어 방법, 제어 프로그램, 제어 장치, 및 레이저광 조사 장치 |
DE112014002683B4 (de) * | 2013-06-06 | 2024-04-18 | Hamamatsu Photonics K.K. | Justierverfahren für adaptives Optiksystem, adaptives Optiksystem und Speichermedium, das ein Programm für ein adaptives Optiksystem speichert |
WO2015159687A1 (ja) * | 2014-04-14 | 2015-10-22 | 三菱電機株式会社 | 制御装置およびレーザ加工装置 |
US9533375B2 (en) | 2014-10-02 | 2017-01-03 | Industrial Technology Research Institute | Temperature sensing apparatus, laser processing system, and temperature measuring method |
EP3206829B1 (en) | 2014-10-13 | 2019-01-09 | Evana Technologies, UAB | Method of laser processing for substrate cleaving or dicing through forming "spike-like" shaped damage structures |
-
2016
- 2016-10-14 JP JP2016202601A patent/JP6768444B2/ja active Active
-
2017
- 2017-10-11 DE DE112017005220.3T patent/DE112017005220T5/de active Pending
- 2017-10-11 WO PCT/JP2017/036872 patent/WO2018070445A1/ja active Application Filing
- 2017-10-11 KR KR1020197012338A patent/KR102343564B1/ko active IP Right Grant
- 2017-10-11 US US16/341,605 patent/US11131871B2/en active Active
- 2017-10-11 CN CN201780062905.3A patent/CN109843497B/zh active Active
- 2017-10-13 TW TW106135100A patent/TWI736689B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3878758B2 (ja) | 1998-12-04 | 2007-02-07 | 浜松ホトニクス株式会社 | 空間光変調装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2018061994A (ja) | 2018-04-19 |
KR102343564B1 (ko) | 2021-12-28 |
CN109843497A (zh) | 2019-06-04 |
US20200047283A1 (en) | 2020-02-13 |
TW201817528A (zh) | 2018-05-16 |
US11131871B2 (en) | 2021-09-28 |
JP6768444B2 (ja) | 2020-10-14 |
KR20190071729A (ko) | 2019-06-24 |
WO2018070445A1 (ja) | 2018-04-19 |
TWI736689B (zh) | 2021-08-21 |
CN109843497B (zh) | 2021-07-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE112017001222T5 (de) | Laserlicht-Bestrahlungsvorrichtung und Laserlicht-Bestrahlungsverfahren | |
DE112017001209T5 (de) | Laserlicht-Bestrahlungsvorrichtung und Laserlicht-Bestrahlungsverfahren | |
DE112017000543T5 (de) | Laserstrahl-bestrahlungsvorrichtung | |
DE112017001752T5 (de) | Laserbearbeitungsvorrichtung | |
DE112018003808T5 (de) | Laserbearbeitungsvorrichtung | |
DE3873570T2 (de) | Konfokales Laserabtastmikroskop. | |
EP0168643B1 (de) | Gerät zur Wafer-Inspektion | |
EP0168351B1 (de) | Laser-Pattern-Generator und Verfahren zu dessen Betrieb | |
DE102005019358B4 (de) | Laserstrahl-Bearbeitungsmaschine | |
DE69534972T2 (de) | Mehrfachwellenlängen-laseroptiksystem für eine prüfstation und laserschneiden | |
DE69827608T2 (de) | Ausrichtungsvorrichtung und lithographischer apparat mit einer solchen vorrichtung | |
DE69026780T2 (de) | Rastermikroskop und Rastermechanismus dafür | |
DE112017000576T5 (de) | Laserbearbeitungsvorrichtung und laserausgabevorrichtung | |
DE112017005333T5 (de) | Laserlichtbestrahlungsvorrichtung | |
DE102017206178A1 (de) | Waferherstellungsverfahren und Erfassungsverfahren für eine Bearbeitungszuführrichtung | |
DE102009028792A1 (de) | Laserbearbeitungseinrichtung und Laserbearbeitungsverfahren | |
DE112017000978T5 (de) | Laserlichtstrahlungsvorrichtung und laserlichtstrahlungsverfahren | |
DE112019005451T5 (de) | Laserbearbeitungsvorrichtung und Laserbearbeitungsverfahren | |
DE10257766A1 (de) | Verfahren zur Einstellung einer gewünschten optischen Eigenschaft eines Projektionsobjektivs sowie mikrolithografische Projektionsbelichtungsanlage | |
DE102013211395A1 (de) | Laserbearbeitungsvorrichtung | |
DE102012201779A1 (de) | Laserstrahlanwendungsmechanismus und Laserbearbeitungsvorrichtung | |
DE102008031937A1 (de) | Mehrstrahl-Laservorrichtung | |
DE102019008304B3 (de) | Fluoreszenzmikroskop mit stabilisierter Justage und Verwendung einer Baugruppe zur Aufrüstung eines Fluoreszenzmikroskops | |
EP3756214A1 (de) | Verfahren zum erzeugen von kurzen unterkritischen rissen in festkörpern | |
DE112017005220T5 (de) | Laserbearbeitungsvorrichtung und Betriebsprüfverfahren |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R012 | Request for examination validly filed |