DE112017005220T5 - Laserbearbeitungsvorrichtung und Betriebsprüfverfahren - Google Patents

Laserbearbeitungsvorrichtung und Betriebsprüfverfahren Download PDF

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Publication number
DE112017005220T5
DE112017005220T5 DE112017005220.3T DE112017005220T DE112017005220T5 DE 112017005220 T5 DE112017005220 T5 DE 112017005220T5 DE 112017005220 T DE112017005220 T DE 112017005220T DE 112017005220 T5 DE112017005220 T5 DE 112017005220T5
Authority
DE
Germany
Prior art keywords
laser light
laser
light modulator
spatial light
intensity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112017005220.3T
Other languages
German (de)
English (en)
Inventor
Yasunori Igasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Publication of DE112017005220T5 publication Critical patent/DE112017005220T5/de
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306Details
    • G02F1/1309Repairing; Testing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • B23K26/707Auxiliary equipment for monitoring laser beam transmission optics
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/02Testing optical properties
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/93Detection standards; Calibrating baseline adjustment, drift correction
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2203/00Function characteristic
    • G02F2203/12Function characteristic spatial light modulator
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2203/00Function characteristic
    • G02F2203/69Arrangements or methods for testing or calibrating a device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/0014Monitoring arrangements not otherwise provided for
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • H01S3/0085Modulating the output, i.e. the laser beam is modulated outside the laser cavity
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/106Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity
    • H01S3/1065Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity using liquid crystals

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Analytical Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Laser Beam Processing (AREA)
DE112017005220.3T 2016-10-14 2017-10-11 Laserbearbeitungsvorrichtung und Betriebsprüfverfahren Pending DE112017005220T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016-202601 2016-10-14
JP2016202601A JP6768444B2 (ja) 2016-10-14 2016-10-14 レーザ加工装置、及び、動作確認方法
PCT/JP2017/036872 WO2018070445A1 (ja) 2016-10-14 2017-10-11 レーザ加工装置、及び、動作確認方法

Publications (1)

Publication Number Publication Date
DE112017005220T5 true DE112017005220T5 (de) 2019-07-11

Family

ID=61906170

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112017005220.3T Pending DE112017005220T5 (de) 2016-10-14 2017-10-11 Laserbearbeitungsvorrichtung und Betriebsprüfverfahren

Country Status (7)

Country Link
US (1) US11131871B2 (ja)
JP (1) JP6768444B2 (ja)
KR (1) KR102343564B1 (ja)
CN (1) CN109843497B (ja)
DE (1) DE112017005220T5 (ja)
TW (1) TWI736689B (ja)
WO (1) WO2018070445A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110977188A (zh) * 2019-11-03 2020-04-10 武汉光谷航天三江激光产业技术研究有限公司 一种基于空间光调制器的多焦点晶圆内部切割装置
CN112548321A (zh) * 2020-12-04 2021-03-26 哈尔滨工业大学 一种基于同轴监测的真空激光焊接焊缝缺陷识别方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3878758B2 (ja) 1998-12-04 2007-02-07 浜松ホトニクス株式会社 空間光変調装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602005015295D1 (de) 2004-03-02 2009-08-20 Univ Michigan State Lasersystem mit ultrakurzen laserimpulsen
JP4353219B2 (ja) * 2006-08-14 2009-10-28 日産自動車株式会社 レーザ加工装置、レーザ加工装置の制御方法
GB2445957B (en) * 2007-01-29 2009-08-19 Tera View Ltd A method and apparatus for analysing an LCD
JP4402708B2 (ja) * 2007-08-03 2010-01-20 浜松ホトニクス株式会社 レーザ加工方法、レーザ加工装置及びその製造方法
JP5090121B2 (ja) * 2007-10-01 2012-12-05 オリンパス株式会社 調整装置、レーザ加工装置、調整方法、および調整プログラム
WO2009063670A1 (ja) 2007-11-14 2009-05-22 Hamamatsu Photonics K.K. レーザ加工装置およびレーザ加工方法
US8165838B2 (en) * 2008-06-02 2012-04-24 Lumenis Ltd. Laser system calibration
JP5108661B2 (ja) 2008-07-03 2012-12-26 浜松ホトニクス株式会社 レーザ加工装置およびレーザ加工方法
JP5775265B2 (ja) * 2009-08-03 2015-09-09 浜松ホトニクス株式会社 レーザ加工方法及び半導体装置の製造方法
JP5802109B2 (ja) * 2011-10-26 2015-10-28 浜松ホトニクス株式会社 光変調制御方法、制御プログラム、制御装置、及びレーザ光照射装置
GB2501117A (en) * 2012-04-13 2013-10-16 Isis Innovation Laser focusing method and apparatus
KR102102010B1 (ko) 2012-09-13 2020-04-17 하마마츠 포토닉스 가부시키가이샤 광변조 제어 방법, 제어 프로그램, 제어 장치, 및 레이저광 조사 장치
DE112014002683B4 (de) * 2013-06-06 2024-04-18 Hamamatsu Photonics K.K. Justierverfahren für adaptives Optiksystem, adaptives Optiksystem und Speichermedium, das ein Programm für ein adaptives Optiksystem speichert
WO2015159687A1 (ja) * 2014-04-14 2015-10-22 三菱電機株式会社 制御装置およびレーザ加工装置
US9533375B2 (en) 2014-10-02 2017-01-03 Industrial Technology Research Institute Temperature sensing apparatus, laser processing system, and temperature measuring method
EP3206829B1 (en) 2014-10-13 2019-01-09 Evana Technologies, UAB Method of laser processing for substrate cleaving or dicing through forming "spike-like" shaped damage structures

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3878758B2 (ja) 1998-12-04 2007-02-07 浜松ホトニクス株式会社 空間光変調装置

Also Published As

Publication number Publication date
JP2018061994A (ja) 2018-04-19
KR102343564B1 (ko) 2021-12-28
CN109843497A (zh) 2019-06-04
US20200047283A1 (en) 2020-02-13
TW201817528A (zh) 2018-05-16
US11131871B2 (en) 2021-09-28
JP6768444B2 (ja) 2020-10-14
KR20190071729A (ko) 2019-06-24
WO2018070445A1 (ja) 2018-04-19
TWI736689B (zh) 2021-08-21
CN109843497B (zh) 2021-07-30

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