DE112017001009A5 - Optoelektronisches bauteil mit einem leiterrahmenabschnitt - Google Patents

Optoelektronisches bauteil mit einem leiterrahmenabschnitt Download PDF

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Publication number
DE112017001009A5
DE112017001009A5 DE112017001009.8T DE112017001009T DE112017001009A5 DE 112017001009 A5 DE112017001009 A5 DE 112017001009A5 DE 112017001009 T DE112017001009 T DE 112017001009T DE 112017001009 A5 DE112017001009 A5 DE 112017001009A5
Authority
DE
Germany
Prior art keywords
frame section
optoelectronic component
ladder frame
ladder
optoelectronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112017001009.8T
Other languages
English (en)
Inventor
Michael Wittmann
Martin Brandl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112017001009A5 publication Critical patent/DE112017001009A5/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0025—Processes relating to coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE112017001009.8T 2016-02-25 2017-02-24 Optoelektronisches bauteil mit einem leiterrahmenabschnitt Pending DE112017001009A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102016103354.5A DE102016103354A1 (de) 2016-02-25 2016-02-25 Optoelektronisches bauteil mit einem leiterrahmen
DE102016103354.5 2016-02-25
PCT/EP2017/054382 WO2017144691A1 (de) 2016-02-25 2017-02-24 Optoelektronisches bauteil mit einem leiterrahmenabschnitt

Publications (1)

Publication Number Publication Date
DE112017001009A5 true DE112017001009A5 (de) 2018-11-08

Family

ID=58191418

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102016103354.5A Withdrawn DE102016103354A1 (de) 2016-02-25 2016-02-25 Optoelektronisches bauteil mit einem leiterrahmen
DE112017001009.8T Pending DE112017001009A5 (de) 2016-02-25 2017-02-24 Optoelektronisches bauteil mit einem leiterrahmenabschnitt

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102016103354.5A Withdrawn DE102016103354A1 (de) 2016-02-25 2016-02-25 Optoelektronisches bauteil mit einem leiterrahmen

Country Status (4)

Country Link
US (1) US10756245B2 (de)
JP (1) JP6814813B2 (de)
DE (2) DE102016103354A1 (de)
WO (1) WO2017144691A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102335216B1 (ko) * 2017-04-26 2021-12-03 삼성전자 주식회사 발광소자 패키지
US11677059B2 (en) 2017-04-26 2023-06-13 Samsung Electronics Co., Ltd. Light-emitting device package including a lead frame
CN113285003B (zh) * 2021-04-30 2023-07-25 深圳市得润光学有限公司 一种制造led支架的方法以及led支架

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3540770B2 (ja) * 2000-06-09 2004-07-07 三洋電機株式会社 光照射装置の製造方法
KR101867106B1 (ko) * 2010-03-30 2018-06-12 다이니폰 인사츠 가부시키가이샤 Led용 수지 부착 리드 프레임, 반도체 장치, 반도체 장치의 제조 방법 및 led용 수지 부착 리드 프레임의 제조 방법
US20110269269A1 (en) * 2010-05-03 2011-11-03 National Semiconductor Corporation Laser ablation alternative to low cost leadframe process
JP5834467B2 (ja) 2011-04-27 2015-12-24 日亜化学工業株式会社 発光装置
JP5938912B2 (ja) * 2012-01-13 2016-06-22 日亜化学工業株式会社 発光装置及び照明装置
JP2013179271A (ja) 2012-01-31 2013-09-09 Rohm Co Ltd 発光装置および発光装置の製造方法
JP2014049594A (ja) * 2012-08-31 2014-03-17 Dainippon Printing Co Ltd 光半導体装置用リードフレーム及びそれを用いた光半導体装置
JP2015015265A (ja) * 2013-07-03 2015-01-22 スタンレー電気株式会社 発光装置およびその製造方法
JP6256026B2 (ja) * 2014-01-17 2018-01-10 日亜化学工業株式会社 発光装置及び発光装置の製造方法
JP2015188081A (ja) * 2014-03-12 2015-10-29 大日本印刷株式会社 樹脂付リードフレームおよびその製造方法、ならびにｌｅｄパッケージおよびその製造方法
JP2015188039A (ja) * 2014-03-27 2015-10-29 株式会社東芝 半導体発光装置およびその製造方法
DE102014111483A1 (de) * 2014-08-12 2016-02-18 Osram Opto Semiconductors Gmbh Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement

Also Published As

Publication number Publication date
US20190074418A1 (en) 2019-03-07
JP6814813B2 (ja) 2021-01-20
JP2019512167A (ja) 2019-05-09
WO2017144691A1 (de) 2017-08-31
DE102016103354A1 (de) 2017-08-31
US10756245B2 (en) 2020-08-25

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R083 Amendment of/additions to inventor(s)
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0033440000

Ipc: H01L0033620000

R016 Response to examination communication