DE112014003859A5 - Laserbauelementeverbund und Verfahren zum Herstellen eines Laserbauelements - Google Patents

Laserbauelementeverbund und Verfahren zum Herstellen eines Laserbauelements Download PDF

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Publication number
DE112014003859A5
DE112014003859A5 DE112014003859.8T DE112014003859T DE112014003859A5 DE 112014003859 A5 DE112014003859 A5 DE 112014003859A5 DE 112014003859 T DE112014003859 T DE 112014003859T DE 112014003859 A5 DE112014003859 A5 DE 112014003859A5
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DE
Germany
Prior art keywords
laser component
producing
interconnection
laser
component interconnection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE112014003859.8T
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English (en)
Other versions
DE112014003859B4 (de
Inventor
Tilman Eckert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112014003859A5 publication Critical patent/DE112014003859A5/de
Application granted granted Critical
Publication of DE112014003859B4 publication Critical patent/DE112014003859B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses
    • G02B27/0966—Cylindrical lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Lasers (AREA)
DE112014003859.8T 2013-08-21 2014-08-14 Laserbauelementeverbund und Verfahren zum Herstellen eines Laserbauelements Active DE112014003859B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013216525.0 2013-08-21
DE102013216525.0A DE102013216525A1 (de) 2013-08-21 2013-08-21 Laserbauelement und Verfahren zum Herstellen eines Laserbauelements
PCT/EP2014/067438 WO2015024861A1 (de) 2013-08-21 2014-08-14 Laserbauelementeverbund und verfahren zum herstellen eines laserbauelements

Publications (2)

Publication Number Publication Date
DE112014003859A5 true DE112014003859A5 (de) 2016-05-25
DE112014003859B4 DE112014003859B4 (de) 2021-12-09

Family

ID=51352509

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102013216525.0A Withdrawn DE102013216525A1 (de) 2013-08-21 2013-08-21 Laserbauelement und Verfahren zum Herstellen eines Laserbauelements
DE112014003859.8T Active DE112014003859B4 (de) 2013-08-21 2014-08-14 Laserbauelementeverbund und Verfahren zum Herstellen eines Laserbauelements

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102013216525.0A Withdrawn DE102013216525A1 (de) 2013-08-21 2013-08-21 Laserbauelement und Verfahren zum Herstellen eines Laserbauelements

Country Status (3)

Country Link
US (1) US9608409B2 (de)
DE (2) DE102013216525A1 (de)
WO (1) WO2015024861A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015114292A1 (de) * 2015-08-27 2017-03-02 Osram Opto Semiconductors Gmbh Laserbauelement und Verfahren zu seiner Herstellung
DE102016101942B4 (de) 2016-02-04 2022-07-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen einer optoelektronischen Leuchtvorrichtung

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5206878A (en) * 1991-10-11 1993-04-27 At&T Bell Laboratories Wide strip diode laser employing a lens
JPH06196816A (ja) * 1992-12-22 1994-07-15 Mitsubishi Electric Corp レンズ付きレーザダイオードおよびその製造方法
JPH06334262A (ja) * 1993-03-23 1994-12-02 Mitsubishi Electric Corp 半導体レーザアレイ装置，半導体レーザ装置，及びそれらの製造方法
US5888841A (en) 1996-10-01 1999-03-30 Blue Sky Research Method of making an electro-optical device with integral lens
DE19706276B4 (de) * 1997-02-18 2011-01-13 Siemens Ag Halbleiterlaser-Vorrichtung und Verfahren zum Herstellen einer Halbleiterlaser-Vorrichtung
US5963577A (en) * 1997-04-11 1999-10-05 Blue Sky Research Multiple element laser diode assembly incorporating a cylindrical microlens
DE19839902C1 (de) 1998-09-02 2000-05-25 Laserline Ges Fuer Entwicklung Optische Anordnung zur Verwendung bei einer Laserdiodenanordnung sowie Diodenlaser
US6078437A (en) 1998-09-28 2000-06-20 Blue Sky Research Micro-optic lens with integral alignment member
US6975659B2 (en) * 2001-09-10 2005-12-13 Fuji Photo Film Co., Ltd. Laser diode array, laser device, wave-coupling laser source, and exposure device
JP2004179607A (ja) * 2002-09-30 2004-06-24 Fuji Photo Film Co Ltd レーザー装置
US7686224B2 (en) * 2006-08-30 2010-03-30 Coherent, Inc. Lensed dual diode-laser bar package
DE102008061309A1 (de) * 2008-12-11 2010-06-24 Trumpf Laser Gmbh + Co. Kg Diodenlaserbauelement
DE102012215684A1 (de) 2012-09-04 2014-03-06 Osram Opto Semiconductors Gmbh Laserbauelement und Verfahren zu dessen Herstellung

Also Published As

Publication number Publication date
DE102013216525A1 (de) 2015-02-26
WO2015024861A1 (de) 2015-02-26
DE112014003859B4 (de) 2021-12-09
US9608409B2 (en) 2017-03-28
US20160190770A1 (en) 2016-06-30

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R409 Internal rectification of the legal status completed
R409 Internal rectification of the legal status completed
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R018 Grant decision by examination section/examining division
R020 Patent grant now final