DE112013000669A5 - Leuchte und Verfahren zur Herstellung einer Leuchte - Google Patents

Leuchte und Verfahren zur Herstellung einer Leuchte Download PDF

Info

Publication number
DE112013000669A5
DE112013000669A5 DE112013000669.3T DE112013000669T DE112013000669A5 DE 112013000669 A5 DE112013000669 A5 DE 112013000669A5 DE 112013000669 T DE112013000669 T DE 112013000669T DE 112013000669 A5 DE112013000669 A5 DE 112013000669A5
Authority
DE
Germany
Prior art keywords
luminaire
lamp
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE112013000669.3T
Other languages
English (en)
Inventor
Wolfgang Mönch
Thomas Bleicher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112013000669A5 publication Critical patent/DE112013000669A5/de
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
DE112013000669.3T 2012-01-24 2013-01-17 Leuchte und Verfahren zur Herstellung einer Leuchte Ceased DE112013000669A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012200973A DE102012200973A1 (de) 2012-01-24 2012-01-24 Leuchte und verfahren zur herstellung einer leuchte
DE102012200973.6 2012-01-24
PCT/EP2013/050823 WO2013110540A1 (de) 2012-01-24 2013-01-17 Leuchte und verfahren zur herstellung einer leuchte

Publications (1)

Publication Number Publication Date
DE112013000669A5 true DE112013000669A5 (de) 2014-10-23

Family

ID=47632992

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102012200973A Withdrawn DE102012200973A1 (de) 2012-01-24 2012-01-24 Leuchte und verfahren zur herstellung einer leuchte
DE112013000669.3T Ceased DE112013000669A5 (de) 2012-01-24 2013-01-17 Leuchte und Verfahren zur Herstellung einer Leuchte

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102012200973A Withdrawn DE102012200973A1 (de) 2012-01-24 2012-01-24 Leuchte und verfahren zur herstellung einer leuchte

Country Status (3)

Country Link
US (1) US9777894B2 (de)
DE (2) DE102012200973A1 (de)
WO (1) WO2013110540A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014102828A1 (de) * 2014-03-04 2015-09-10 Osram Opto Semiconductors Gmbh Anordnung mit einer lichtemittierenden Diode
GB2545155B (en) * 2015-09-02 2020-04-01 Facebook Tech Llc Assembly of semiconductor devices
WO2017045938A1 (en) * 2015-09-15 2017-03-23 Philips Lighting Holding B.V. Light emitting device.
TWI583028B (zh) * 2016-02-05 2017-05-11 行家光電股份有限公司 具有光形調整結構之發光裝置及其製造方法
KR20180014401A (ko) * 2016-07-29 2018-02-08 엘지디스플레이 주식회사 광원 모듈 및 이를 포함하는 백라이트 유닛
DE102016114341A1 (de) * 2016-08-03 2018-02-08 HELLA GmbH & Co. KGaA Lichtmodul mit wenigstens einer Halbleiterlichtquelle und mit wenigstens einem Optikkörper
DE102018110389A1 (de) * 2018-04-30 2019-10-31 FLASHAAR LEDLight GmbH & Co. KG Verfahren zur Herstellung einer Leuchte und Leuchte dazu
TWI698994B (zh) * 2019-09-16 2020-07-11 錼創顯示科技股份有限公司 微型半導體晶片、微型半導體元件結構、以及轉移裝置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10245946C1 (de) * 2002-09-30 2003-10-23 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Lichtquellenmoduls
US8835937B2 (en) 2004-02-20 2014-09-16 Osram Opto Semiconductors Gmbh Optoelectronic component, device comprising a plurality of optoelectronic components, and method for the production of an optoelectronic component
WO2006059828A1 (en) * 2004-09-10 2006-06-08 Seoul Semiconductor Co., Ltd. Light emitting diode package having multiple molding resins
US8163580B2 (en) * 2005-08-10 2012-04-24 Philips Lumileds Lighting Company Llc Multiple die LED and lens optical system
DE102007032280A1 (de) * 2007-06-08 2008-12-11 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
US20090225566A1 (en) * 2008-03-05 2009-09-10 Micha Zimmermann Illumination apparatus and methods of forming the same
DE102008025923B4 (de) * 2008-05-30 2020-06-18 Osram Opto Semiconductors Gmbh Strahlungsemittierende Vorrichtung
DE102009005907A1 (de) * 2009-01-23 2010-07-29 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil
JP5613475B2 (ja) 2010-06-25 2014-10-22 パナソニック株式会社 発光素子パッケージ及びそれを備えた発光素子パッケージ群

Also Published As

Publication number Publication date
US20150247608A1 (en) 2015-09-03
WO2013110540A1 (de) 2013-08-01
DE102012200973A1 (de) 2013-07-25
US9777894B2 (en) 2017-10-03

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0033540000

Ipc: H01L0033480000

R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final