DE112009001140T5 - Zweiachsen-Magnetfeldsensor mit mehreren Pinning-Richtungen sowie Verfahren zum Herstellen des Sensors - Google Patents
Zweiachsen-Magnetfeldsensor mit mehreren Pinning-Richtungen sowie Verfahren zum Herstellen des Sensors Download PDFInfo
- Publication number
- DE112009001140T5 DE112009001140T5 DE112009001140T DE112009001140T DE112009001140T5 DE 112009001140 T5 DE112009001140 T5 DE 112009001140T5 DE 112009001140 T DE112009001140 T DE 112009001140T DE 112009001140 T DE112009001140 T DE 112009001140T DE 112009001140 T5 DE112009001140 T5 DE 112009001140T5
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- Germany
- Prior art keywords
- layer
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- magnetization
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
- G01R33/093—Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3268—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn
- H01F10/3272—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn by use of anti-parallel coupled [APC] ferromagnetic layers, e.g. artificial ferrimagnets [AFI], artificial [AAF] or synthetic [SAF] anti-ferromagnets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/30—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE]
- H01F41/302—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F41/308—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices lift-off processes, e.g. ion milling, for trimming or patterning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N59/00—Integrated devices, or assemblies of multiple devices, comprising at least one galvanomagnetic or Hall-effect element covered by groups H10N50/00 - H10N52/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/30—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE]
- H01F41/302—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F41/303—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices with exchange coupling adjustment of magnetic film pairs, e.g. interface modifications by reduction, oxidation
- H01F41/304—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices with exchange coupling adjustment of magnetic film pairs, e.g. interface modifications by reduction, oxidation using temporary decoupling, e.g. involving blocking, Néel or Curie temperature transitions by heat treatment in presence/absence of a magnetic field
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Hall/Mr Elements (AREA)
- Measuring Magnetic Variables (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/117,396 | 2008-05-08 | ||
| US12/117,396 US7965077B2 (en) | 2008-05-08 | 2008-05-08 | Two-axis magnetic field sensor with multiple pinning directions |
| PCT/US2009/043354 WO2009137802A1 (en) | 2008-05-08 | 2009-05-08 | Two-axis magnetic field sensor with multiple pinning directions and method to produce the sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE112009001140T5 true DE112009001140T5 (de) | 2011-06-09 |
Family
ID=40852562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE112009001140T Ceased DE112009001140T5 (de) | 2008-05-08 | 2009-05-08 | Zweiachsen-Magnetfeldsensor mit mehreren Pinning-Richtungen sowie Verfahren zum Herstellen des Sensors |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US7965077B2 (https=) |
| JP (1) | JP2011523506A (https=) |
| CN (1) | CN102057487B (https=) |
| DE (1) | DE112009001140T5 (https=) |
| WO (1) | WO2009137802A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014116953A1 (de) | 2014-11-19 | 2016-05-19 | Sensitec Gmbh | Verfahren und Vorrichtung zur Herstellung einer Magnetfeldsensorvorrichtung sowie diesbezüglicheMagnetfeldsensorvorrichtung |
Families Citing this family (59)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8242776B2 (en) * | 2008-03-26 | 2012-08-14 | Everspin Technologies, Inc. | Magnetic sensor design for suppression of barkhausen noise |
| US8269486B2 (en) | 2008-11-12 | 2012-09-18 | Infineon Technologies Ag | Magnetic sensor system and method |
| US8257596B2 (en) * | 2009-04-30 | 2012-09-04 | Everspin Technologies, Inc. | Two-axis magnetic field sensor with substantially orthogonal pinning directions |
| WO2010143718A1 (ja) | 2009-06-12 | 2010-12-16 | アルプス・グリーンデバイス株式会社 | 磁気平衡式電流センサ |
| US8779764B2 (en) * | 2009-07-13 | 2014-07-15 | Hitachi Metals, Ltd. | Method for producing magnetoresistive effect element, magnetic sensor, rotation-angle detection device |
| US8284594B2 (en) * | 2009-09-03 | 2012-10-09 | International Business Machines Corporation | Magnetic devices and structures |
| US8390283B2 (en) | 2009-09-25 | 2013-03-05 | Everspin Technologies, Inc. | Three axis magnetic field sensor |
| FR2954512B1 (fr) * | 2009-12-21 | 2012-05-25 | Commissariat Energie Atomique | Realisation d'un dispositif a structures magnetiques formees sur un meme substrat et ayant des orientations d'aimantation respectives differentes |
| JP5594915B2 (ja) * | 2010-03-12 | 2014-09-24 | アルプス・グリーンデバイス株式会社 | 電流センサ |
| JP5572208B2 (ja) | 2010-03-12 | 2014-08-13 | アルプス電気株式会社 | 磁気センサ及びそれを用いた磁気平衡式電流センサ |
| US8518734B2 (en) | 2010-03-31 | 2013-08-27 | Everspin Technologies, Inc. | Process integration of a single chip three axis magnetic field sensor |
| CN103069282B (zh) | 2010-08-23 | 2015-06-03 | 阿尔卑斯绿色器件株式会社 | 磁平衡式电流传感器 |
| US8508221B2 (en) | 2010-08-30 | 2013-08-13 | Everspin Technologies, Inc. | Two-axis magnetic field sensor having reduced compensation angle for zero offset |
| DE102010055754A1 (de) * | 2010-12-22 | 2012-06-28 | Sensitec Gmbh | Magnetoresistives Sensorelement |
| CN102280574B (zh) * | 2011-01-07 | 2014-04-16 | 江苏多维科技有限公司 | 薄膜磁电阻传感元件、多个传感元件的组合及与该组合耦合的电子装置 |
| US8890266B2 (en) | 2011-01-31 | 2014-11-18 | Everspin Technologies, Inc. | Fabrication process and layout for magnetic sensor arrays |
| CN102226835A (zh) | 2011-04-06 | 2011-10-26 | 江苏多维科技有限公司 | 单一芯片双轴磁场传感器及其制备方法 |
| CN102226836A (zh) * | 2011-04-06 | 2011-10-26 | 江苏多维科技有限公司 | 单一芯片桥式磁场传感器及其制备方法 |
| CN102621504B (zh) * | 2011-04-21 | 2013-09-04 | 江苏多维科技有限公司 | 单片参考全桥磁场传感器 |
| US9024632B2 (en) | 2011-05-30 | 2015-05-05 | Denso Corporation | Magnetic sensor with a plurality of heater portions to fix the direction of magnetization of a pinned magnetic layer |
| CN102385043B (zh) * | 2011-08-30 | 2013-08-21 | 江苏多维科技有限公司 | Mtj三轴磁场传感器及其封装方法 |
| CN102426344B (zh) | 2011-08-30 | 2013-08-21 | 江苏多维科技有限公司 | 三轴磁场传感器 |
| US8975891B2 (en) | 2011-11-04 | 2015-03-10 | Honeywell International Inc. | Apparatus and method for determining in-plane magnetic field components of a magnetic field using a single magnetoresistive sensor |
| TWI431301B (zh) * | 2012-03-05 | 2014-03-21 | Ind Tech Res Inst | 應用穿隧式磁電阻器之磁場感測方法及磁場感測裝置 |
| US20130241542A1 (en) | 2012-03-14 | 2013-09-19 | Wolfgang Raberg | Xmr monocell sensors, systems and methods |
| US8786987B2 (en) * | 2012-04-27 | 2014-07-22 | Seagate Technology Llc | Biased two dimensional magnetic sensor |
| CN102722932A (zh) * | 2012-06-19 | 2012-10-10 | 兰州大学 | 一种验钞机磁头 |
| US20140028307A1 (en) * | 2012-07-26 | 2014-01-30 | Udo Ausserlechner | Magnetoresistive sensor systems and methods having a yaw angle between premagnetization and magnetic field directions |
| US20150069555A1 (en) * | 2013-09-09 | 2015-03-12 | Shintaro SAKAI | Magnetic memory |
| JP6304989B2 (ja) * | 2013-09-24 | 2018-04-04 | 株式会社東芝 | 圧力センサ、マイクロフォン、血圧センサ、タッチパネル、圧力センサの製造方法、および圧力センサの製造装置 |
| US9618589B2 (en) * | 2013-10-18 | 2017-04-11 | Infineon Technologies Ag | First and second magneto-resistive sensors formed by first and second sections of a layer stack |
| CN103592608B (zh) * | 2013-10-21 | 2015-12-23 | 江苏多维科技有限公司 | 一种用于高强度磁场的推挽桥式磁传感器 |
| US8953284B1 (en) * | 2013-11-20 | 2015-02-10 | HGST Netherlands B.V. | Multi-read sensor having a narrow read gap structure |
| FR3020497B1 (fr) | 2014-04-28 | 2016-05-13 | Commissariat Energie Atomique | Aimant permanent comportant un empilement de couches ferromagnetiques et antiferromagnetiques |
| US9418683B2 (en) | 2014-10-29 | 2016-08-16 | International Business Machines Corporation | Mass production of multichannel current perpendicular to plane head modules via preferred milling |
| US9299369B1 (en) | 2014-10-29 | 2016-03-29 | International Business Machines Corporation | Multichannel data storage apparatus having abrasion resistant barrier |
| US9449622B2 (en) * | 2014-10-29 | 2016-09-20 | International Business Machines Corporation | Differing magnetic read sensors on a magnetic head |
| CN104677266B (zh) * | 2015-01-20 | 2017-11-10 | 江苏多维科技有限公司 | 强磁场误差校准的磁电阻角度传感器及其校准方法 |
| EP3104187A1 (en) * | 2015-06-09 | 2016-12-14 | International Iberian Nanotechnology Laboratory | Magnetoresistive sensor |
| US9739842B2 (en) | 2016-01-26 | 2017-08-22 | Nxp Usa, Inc. | Magnetic field sensor with skewed sense magnetization of sense layer |
| US9897667B2 (en) | 2016-01-26 | 2018-02-20 | Nxp Usa, Inc. | Magnetic field sensor with permanent magnet biasing |
| US9841469B2 (en) | 2016-01-26 | 2017-12-12 | Nxp Usa, Inc. | Magnetic field sensor with multiple sense layer magnetization orientations |
| US10545196B2 (en) * | 2016-03-24 | 2020-01-28 | Nxp Usa, Inc. | Multiple axis magnetic sensor |
| FR3050068B1 (fr) | 2016-04-06 | 2018-05-18 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Aimant permanent comprenant un empilement de n motifs |
| US10145907B2 (en) | 2016-04-07 | 2018-12-04 | Nxp Usa, Inc. | Magnetic field sensor with permanent magnet biasing |
| US9933496B2 (en) | 2016-04-21 | 2018-04-03 | Nxp Usa, Inc. | Magnetic field sensor with multiple axis sense capability |
| CN110050355B (zh) * | 2016-12-06 | 2023-06-23 | 艾沃思宾技术公司 | 磁阻设备及其方法 |
| US10663537B2 (en) * | 2017-04-07 | 2020-05-26 | Crocus Technology Sa | Magnetic sensor cell for measuring one- and two-dimensional magnetic fields and method for measuring said magnetic fields using the magnetic sensor cell |
| JP6510100B2 (ja) * | 2018-02-28 | 2019-05-08 | 株式会社東芝 | 圧力センサ、マイクロフォン、血圧センサ、タッチパネル |
| US11579209B2 (en) * | 2018-06-22 | 2023-02-14 | Zhenghong Qian | Three-axis magnetic sensor |
| JP7106103B2 (ja) * | 2018-07-02 | 2022-07-26 | 国立大学法人東北大学 | 磁気センサ装置およびその製造方法 |
| JP6881413B2 (ja) * | 2018-10-15 | 2021-06-02 | Tdk株式会社 | 磁気センサ |
| US11415645B2 (en) * | 2019-08-23 | 2022-08-16 | Western Digital Technologies, Inc. | Magnetic sensor array with one TMR stack having two free layers |
| US11513175B2 (en) * | 2020-02-11 | 2022-11-29 | Globalfoundries Singapore Pte. Ltd. | Tunnel magnetoresistance sensor devices and methods of forming the same |
| DE102021202924A1 (de) | 2021-03-25 | 2022-09-29 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren für ein lokales Modifizieren einer Schichteigenschaft, Verfahren zum Herstellen einer magnetoresistiven Sensoreinrichtung und magnetoresistive Sensoreinrichtung |
| JP7735068B2 (ja) * | 2021-03-31 | 2025-09-08 | 本田技研工業株式会社 | 薄膜センサ |
| CN116106801B (zh) * | 2023-04-14 | 2023-06-20 | 珠海多创科技有限公司 | 磁阻传感器、磁传感装置及其制备方法 |
| CN116930833B (zh) * | 2023-09-18 | 2024-01-12 | 江苏多维科技有限公司 | 磁传感器及其制备方法 |
| US12517197B2 (en) | 2024-01-18 | 2026-01-06 | Allegro Microsystems, Llc | Analog magnetic sensor device for measuring the orientation of an external magnetic field |
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| JPH1041132A (ja) * | 1996-07-18 | 1998-02-13 | Sanyo Electric Co Ltd | 磁気抵抗効果膜 |
| JPH10233146A (ja) * | 1997-02-19 | 1998-09-02 | Nec Corp | 強磁性物体通過センサ |
| EP0877228B1 (fr) * | 1997-05-09 | 2003-08-06 | Tesa Sa | Capteur de type magnétorésistif pour mesure de dimension |
| US5919580A (en) * | 1997-05-22 | 1999-07-06 | University Of Alabama | Spin valve device containing a Cr-rich antiferromagnetic pinning layer |
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| JP4016857B2 (ja) | 2002-10-18 | 2007-12-05 | ヤマハ株式会社 | 磁気センサ及びその製造方法 |
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| US7961440B2 (en) * | 2007-09-27 | 2011-06-14 | Hitachi Global Storage Technologies Netherlands B.V. | Current perpendicular to plane magnetoresistive sensor with reduced read gap |
-
2008
- 2008-05-08 US US12/117,396 patent/US7965077B2/en active Active
-
2009
- 2009-05-08 CN CN200980121423.6A patent/CN102057487B/zh active Active
- 2009-05-08 JP JP2011508715A patent/JP2011523506A/ja active Pending
- 2009-05-08 DE DE112009001140T patent/DE112009001140T5/de not_active Ceased
- 2009-05-08 WO PCT/US2009/043354 patent/WO2009137802A1/en not_active Ceased
-
2011
- 2011-02-08 US US13/023,260 patent/US8237437B2/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014116953A1 (de) | 2014-11-19 | 2016-05-19 | Sensitec Gmbh | Verfahren und Vorrichtung zur Herstellung einer Magnetfeldsensorvorrichtung sowie diesbezüglicheMagnetfeldsensorvorrichtung |
| US10151806B2 (en) | 2014-11-19 | 2018-12-11 | Sensitec Gmbh | Method and apparatus for manufacturing a magnetic sensor device, and corresponding magnetic sensor device |
| DE102014116953B4 (de) | 2014-11-19 | 2022-06-30 | Sensitec Gmbh | Verfahren und Vorrichtung zur Herstellung einer Magnetfeldsensorvorrichtung, sowie diesbezüglicheMagnetfeldsensorvorrichtung |
Also Published As
| Publication number | Publication date |
|---|---|
| US7965077B2 (en) | 2011-06-21 |
| US8237437B2 (en) | 2012-08-07 |
| CN102057487A (zh) | 2011-05-11 |
| US20110121826A1 (en) | 2011-05-26 |
| US20090279212A1 (en) | 2009-11-12 |
| JP2011523506A (ja) | 2011-08-11 |
| CN102057487B (zh) | 2012-12-05 |
| WO2009137802A1 (en) | 2009-11-12 |
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