DE10390761D2 - Verfahren und Vorrichtungen zur elektrolytischen Metallisierung von Lochwänden und Strukturen - Google Patents

Verfahren und Vorrichtungen zur elektrolytischen Metallisierung von Lochwänden und Strukturen

Info

Publication number
DE10390761D2
DE10390761D2 DE10390761T DE10390761T DE10390761D2 DE 10390761 D2 DE10390761 D2 DE 10390761D2 DE 10390761 T DE10390761 T DE 10390761T DE 10390761 T DE10390761 T DE 10390761T DE 10390761 D2 DE10390761 D2 DE 10390761D2
Authority
DE
Germany
Prior art keywords
structures
methods
devices
hole walls
electrolytic metallization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE10390761T
Other languages
English (en)
Inventor
Egon Huebel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE10390761T priority Critical patent/DE10390761D2/de
Application granted granted Critical
Publication of DE10390761D2 publication Critical patent/DE10390761D2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1492—Periodical treatments, e.g. pulse plating of through-holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
DE10390761T 2002-02-24 2003-01-21 Verfahren und Vorrichtungen zur elektrolytischen Metallisierung von Lochwänden und Strukturen Expired - Fee Related DE10390761D2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE10390761T DE10390761D2 (de) 2002-02-24 2003-01-21 Verfahren und Vorrichtungen zur elektrolytischen Metallisierung von Lochwänden und Strukturen

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10209365A DE10209365C1 (de) 2002-02-24 2002-02-24 Verfahren und Vorrichtung zur elektrolytischen Metallisierung von Lochwänden und Strukturen
PCT/DE2003/000153 WO2003072855A1 (de) 2002-02-24 2003-01-21 Verfahren und vorrichtungen zur elektrolytischen metallisierung von lochwänden und strukturen
DE10390761T DE10390761D2 (de) 2002-02-24 2003-01-21 Verfahren und Vorrichtungen zur elektrolytischen Metallisierung von Lochwänden und Strukturen

Publications (1)

Publication Number Publication Date
DE10390761D2 true DE10390761D2 (de) 2005-01-05

Family

ID=7714008

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10209365A Expired - Fee Related DE10209365C1 (de) 2002-02-24 2002-02-24 Verfahren und Vorrichtung zur elektrolytischen Metallisierung von Lochwänden und Strukturen
DE10390761T Expired - Fee Related DE10390761D2 (de) 2002-02-24 2003-01-21 Verfahren und Vorrichtungen zur elektrolytischen Metallisierung von Lochwänden und Strukturen

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10209365A Expired - Fee Related DE10209365C1 (de) 2002-02-24 2002-02-24 Verfahren und Vorrichtung zur elektrolytischen Metallisierung von Lochwänden und Strukturen

Country Status (4)

Country Link
AU (1) AU2003208267A1 (de)
DE (2) DE10209365C1 (de)
TW (1) TW200304508A (de)
WO (1) WO2003072855A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005005095A1 (de) * 2005-02-04 2006-08-10 Höllmüller Maschinenbau GmbH Verfahren und Vorrichtung zur elektrochemischen Behandlung von Bauteilen in Durchlaufanlagen
ATE484943T1 (de) 2006-03-30 2010-10-15 Atotech Deutschland Gmbh Elektrolytisches verfahren zum füllen von löchern und vertiefungen mit metallen
MD3970C2 (ro) * 2008-12-23 2010-05-31 Институт Прикладной Физики Академии Наук Молдовы Procedeu de identificare a obiectului electroconductor
MD327Z (ro) * 2010-03-23 2011-08-31 Институт Прикладной Физики Академии Наук Молдовы Procedeu de identificare a obiectului electroconductor cilindric cav şi electrod-sculă pentru aplicarea imaginii individuale prin metoda electrochimică
CN104562108B (zh) * 2014-12-01 2017-06-06 广西大学 齿轮轮齿电刷镀实验平台

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE429765B (sv) * 1982-02-09 1983-09-26 Jouko Korpi Sett vid elektropletering
DE4134632C1 (de) * 1991-10-19 1993-04-01 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De

Also Published As

Publication number Publication date
WO2003072855A1 (de) 2003-09-04
TW200304508A (en) 2003-10-01
AU2003208267A1 (en) 2003-09-09
DE10209365C1 (de) 2003-02-20

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee