DE102023208854A1 - COOLING DEVICE FOR COOLING A POSITION-SENSITIVE COMPONENT OF A LITHOGRAPHY SYSTEM - Google Patents

Abstract

Cooling device (102) for cooling a position-sensitive component (114) of a lithography system (1), comprising: a cooling line (130) for transporting a cooling liquid (128) to or from the position-sensitive component (114), a carrier element (138) on which the cooling line (130) is attached, and decoupling means (200, 300, 400, 500, 800) for vibration decoupling of the cooling line (130) from the support element (138).

Description

The present invention relates to a cooling device for cooling a position-sensitive component of a lithography system, a decoupling system and a lithography system with such a cooling device and a method for operating a cooling device of a lithography system.

Microlithography is used to produce microstructured components, such as integrated circuits. The microlithography process is carried out using a lithography system which has an illumination system and a projection system. The image of a mask (reticle) illuminated by the illumination system is projected by means of the projection system onto a substrate, for example a silicon wafer, which is coated with a light-sensitive layer (photoresist) and arranged in the image plane of the projection system, in order to project the mask structure onto the light-sensitive coating of the substrate transferred to.

Driven by the pursuit of ever smaller structures in the production of integrated circuits, EUV lithography systems are currently being developed which use light with a wavelength in the range from 0.1 nm to 30 nm, in particular 13.5 nm. Since most materials absorb light of this wavelength, reflective optics, i.e. mirrors, must be used in such EUV lithography systems instead of - as before - refracting optics, i.e. lenses.

The demands on the accuracy and precision of the imaging properties of lithography systems are constantly increasing. From a dynamic perspective, it is important to minimize the influence of interference on the movement of various position-sensitive components of the lithography system.

For example, very precise positioning of optical components, in particular mirrors, of the lithography system is required. Dynamic interference from optical components can be generated, for example, by the movement of other components of the lithography system or by acoustic interference. Acoustic disturbances are transmitted, for example, as pressure fluctuations of cooling liquids in cooling lines of a cooling device in the lithography system.

As the complexity of lithography systems continues to increase, further dynamic interference excitations inside and outside the system are to be expected, so that additional mechanisms for their suppression or compensation are desirable and necessary.

Against this background, an object of the present invention is to provide an improved cooling device for a lithography system, a corresponding lithography system and a method for operating a cooling device of a lithography system.

• eine Kühlleitung zum Transportieren einer Kühlflüssigkeit zu oder von der positionssensitiven Komponente,
• ein Trägerelement, an welchem die Kühlleitung befestigt ist, und
• Entkopplungsmittel zur Schwingungsentkopplung der Kühlleitung von dem Trägerelement.

According to a first aspect, a cooling device for cooling a position-sensitive component of a lithography system is proposed. The cooling device has:

• a cooling line for transporting a cooling liquid to or from the position-sensitive component,
• a support element to which the cooling line is attached, and
• Decoupling means for vibration decoupling of the cooling line from the carrier element.

With the help of the decoupling means, a transmission of mechanical vibrations between the cooling line and the carrier element is reduced or prevented. Thus, in the event of a mechanical vibration of the carrier element, this vibration is not or hardly transmitted to the cooling line. Furthermore, even in the event of a mechanical vibration of the cooling line, this vibration is not or hardly transmitted to the carrier element.

For example, the introduction of mechanical vibrations from the carrier element onto the cooling line can be avoided, particularly with the help of the decoupling means. In addition, the generation of acoustic disturbances, i.e. H. Pressure fluctuations in the coolant can be avoided due to mechanical vibrations of the carrier element. Since the cooling line leads to or away from the position-sensitive component, the proposed decoupling means can prevent mechanical or acoustic vibrations from being transmitted to the position-sensitive component via the cooling line or via the cooling liquid. In particular, the transmission of mechanical vibrations through the cooling line or the transmission of acoustic vibrations through the cooling liquid to the position-sensitive component can be reduced or prevented.

The position-sensitive component of the lithography system can be an optical or a mechanical component of the lithography system, e.g. B. a projection optics of the lithography system. The position-sensitive component is in particular a component that is used during operation of the lithography system must be held in an exact position with only small tolerances.

The position-sensitive component of the lithography system is, for example, a mirror of the lithography system, e.g. B. a mirror of the projection optics of the lithography system. The mirrors of a projection optics of an EUV lithography system are usually movably attached to a support frame by means of actuators in order to be able to precisely adjust the position of the respective mirror.

The position-sensitive component of the lithography system can also be a frame structure that serves as a (e.g. optical) reference. The position-sensitive component can be, for example, a sensor frame of the lithography system, e.g. B. the projection optics of the lithography system. A sensor frame usually has a sensor device for measuring a current position of one or more optical components of the lithography system relative to the sensor frame. The sensor frame is, for example, mounted in a vibration-decoupled manner with respect to a support frame of the optical component(s). The sensor device includes e.g. B. one or more sensors, such as interferometers and / or other measuring devices for detecting a position of the optical component (s). The optical component(s) can, for example, have reflector elements for reflecting light emitted by the sensors (e.g. laser light). For example, the one or more sensors are used to detect a position of the optical component(s) in six degrees of freedom. The six degrees of freedom include in particular three translational degrees of freedom (e.g. in three mutually perpendicular spatial directions) and three rotational degrees of freedom (e.g. with respect to a rotation about the three mutually perpendicular spatial directions).

The proposed decoupling means can achieve greater precession of the optical properties or the reference properties of the position-sensitive component and thus better imaging properties of the lithography system. In addition, interference excitation can be better compensated for in increasingly complex lithography systems with an increasing number of interference sources.

The lithography system is, for example, an EUV or a DUV lithography system. EUV stands for “extreme ultraviolet” (EUV) and refers to a wavelength of work light in the range from 0.1 nm to 30 nm, in particular 13.5 nm. Furthermore, DUV stands for “deep ultraviolet” (Engl .: deep ultraviolet, DUV) and refers to a wavelength of work light between 30 nm and 250 nm.

The EUV or DUV lithography system includes an illumination system and a projection system. In particular, with the EUV or DUV lithography system, the image of a mask (reticle) illuminated by the lighting system is projected by means of the projection system onto a substrate, for example a silicon wafer, which is coated with a light-sensitive layer (photoresist) and arranged in the image plane of the projection system to transfer the mask structure to the photosensitive coating of the substrate.

The cooling line is, for example, a pipeline for passing the cooling liquid through. The coolant is or includes, for example, water. The cooling line is used, for example, to transport the cooling liquid to and/or from the position-sensitive component. The cooling line serves, for example, to transport the coolant from a cooling unit of the cooling device to the position-sensitive component and/or from the position-sensitive component (back) to the cooling unit. The cooling device can also have more than one cooling line.

The cooling device serves in particular to avoid high temperatures and temperature fluctuations of the position-sensitive component.

In particular, mirrors of an EUV lithography system (as an example of position-sensitive components) heat up as a result of absorption of the high-energy EUV radiation. The resulting high temperatures and temperature fluctuations in the mirror and the associated thermal deformations of the mirror can lead to wavefront aberrations and thus impair the imaging properties of the mirror. To avoid thermally induced deformations, mirrors of the lithography system can be actively cooled.

The cooling device can also serve (in addition or instead) to cool, for example, a sensor frame (as an example of a position-sensitive component). This can prevent the sensor frame from heating up due to thermal radiation. Heat radiation is caused in particular by working light from the lithography system that is absorbed by mirror surfaces or structural elements. Other heat sources can be, for example, actuators and heating heads. The cooling device can be used to create a stable temperature environment for the sensor frame. As a result, a position measurement of the mirror or the multiple mirrors can be carried out with greater accuracy using the sensor device held by the sensor frame.

Mechanical vibrations transmitted through the carrier element can lead to dynamic disturbances, ie pressure fluctuations, in the coolant. These are transmitted through the entire cooling circuit via coolant sound (water sound, longitudinal water sound wave). This type of dynamic disturbance excitation is also called flow-induced vibrations (FIV). The interference excitation is passed on to the cooled position-sensitive component through water sound. This causes the position of the position-sensitive component to deviate from a target position.

The support element can be any support structure of the entire cooling circuit to which the cooling line is attached. The carrier element is, for example, a section of a frame structure and/or carrier structure of the lithography system to which the cooling line is attached.

The carrier element is, for example, a disturbance exciter of a mechanical vibration, which is not or hardly transmitted to the cooling line by the decoupling means. In other examples, the cooling line can also be a disruptive exciter of a mechanical vibration that is not or hardly transmitted to the carrier element by the decoupling means.

In embodiments, the decoupling means are designed to transmit mechanical vibrations between the position-sensitive component and the carrier element in a frequency range of 1 to 2 kHz, 1 to 1 kHz, 1 to 800 Hz, 1 to 500 Hz, 1 to 400 Hz, 1 to 200 Hz, 1 to 100 Hz and/or 50 to 150 Hz to attenuate and/or suppress.

According to one embodiment, the decoupling means have at least one decoupling element, in particular at least one elastic element, for vibration decoupling of the cooling line from the carrier element.

The at least one decoupling element serves in particular for vibration isolation between the position-sensitive component and the carrier element.

The at least one elastic element is in particular designed to deform elastically (reversibly) when force is applied (e.g. tensile or compressive load). As a result, a force acting on the elastic element is at least partially converted into a restoring force instead of being transmitted through the elastic element. When the force is removed, the elastic element returns to its original, undeformed shape.

According to a further embodiment, the at least one elastic element has a spring element and/or an elastomer material.

The spring element includes, for example, a coil spring, a leaf spring or another type of spring. One advantage of leaf springs is that they have a low design.

The elastomer material is in particular an elastically deformable plastic that has a vibration-damping property. The elastomeric material includes, for example, rubber, caoutchouc, natural rubber, silicone rubber, fluororubber (FKM), perfluororubber (FFKM), polytetrafluoroethylene (PTFE), fluorothermoplastic polymer (THV) e.g. B. from tetrafluoroethylene, hexafluoropropylene and vinylidene fluoride) and / or another elastomer material. Fluororubber is particularly suitable for use in vacuum due to its low outgassing.

According to a further embodiment, the cooling line is attached to the support element in a vibration-decoupled manner using the decoupling means.

For example, the cooling line is attached to the support element in a vibration-decoupled manner exclusively using one or more decoupling elements of the decoupling means.

For example, the cooling device comprises fastening means for fastening the cooling line to the support element. The fastening means in particular have at least one decoupling element, e.g. B. the at least one elastic element.

According to a further embodiment, the decoupling means are set up to actively decouple vibrations of the cooling line from the carrier element.

As a result, beyond the passive vibration decoupling by an elastic element, such as a spring element or elastomeric material, an active adaptation to the occurring dynamic disturbance and/or an active damping in the frequency range of a natural frequency of the elastic element can be achieved. The active vibration decoupling is carried out, for example, by an actuator device with one or more actuators for moving the cooling line and/or the carrier element.

According to a further embodiment, the decoupling means have at least one decoupling element with a natural frequency and are the decoupling means for active damping a vibration of the cooling line and / or the carrier element in a frequency range which includes the natural frequency.

This allows a decoupling property of the at least one decoupling element to be improved at its natural frequency (resonance frequency). In particular, the typically present resonance of the at least one decoupling element can be actively suppressed. As a result, undesirably high transmission in the resonance frequency range is significantly reduced. This enables strong suppression of higher frequencies in particular.

The natural frequency of the decoupling element is, for example, between 1 Hz and 20 Hz and/or between 1 Hz and 30 Hz. The decoupling means are, for example, for actively damping a vibration of the cooling line and/or the carrier element in a frequency range of 1 Hz to 800 Hz and/or 1 Hz and 150 Hz set up.

According to a further embodiment, the decoupling means have an actuator device for moving the cooling line and/or the carrier element in order to actively decouple the vibrations of the cooling line from the carrier element.

For example, the cooling line is movably attached (e.g. to the support element) using the actuator device in order to be able to adjust the position of the cooling line. The actuator device includes in particular one or more actuators (actuators) for changing the position of the cooling line. For example, the actuator device serves to change the position of the cooling line relative to the carrier element (e.g. to change a distance between the cooling line and the carrier element).

For example, the actuator device has one or more piezoelectric actuators, e.g. B. in the form of thin plates, films or layers. The vibrations cause electrical voltages to be generated in the piezoelectric elements due to changes in length, which are fed, for example, via control lines to a computing and/or evaluation unit (e.g. a detection device). Depending on the size and shape of the vibrations, voltage pulses are fed to one or more piezoelectric actuators of the actuator device via the computing and/or evaluation unit (e.g. the determination device), for example via control lines. When voltage is applied, length changes occur in the piezoelectric elements as actuators. In particular, the piezoelectric elements are excited by the pulses introduced (e.g. via the control line) in such a way that “counter-vibrations” occur, which, due to their size and shape, compensate for or at least significantly dampen the vibrations caused by the disturbance.

The cooling device can, for example, have a control device for controlling the actuator device. The actuator device is controlled in particular by transmitting a control signal to the actuator device. In embodiments, the actuator device can represent an actuator system of a control circuit of the cooling device. The actuator device can also be used, for example, to implement a pilot control.

According to a further embodiment, the decoupling means have a sensor device for detecting a movement, in particular acceleration, and/or a position of the cooling line and/or the carrier element.

In embodiments, the sensor device can represent a sensor system of a control circuit of the cooling device. The sensor device can, for example (in addition or instead) also be used to detect a disturbance variable (e.g. a mechanical vibration of the carrier element and/or the cooling line) in order to implement a pilot control.

The sensor device includes, for example, one or more sensors. The sensor device includes, for example, one or more acceleration sensors. However, the sensor device can also, for example, additionally or instead have one or more other sensors, such as piezoelectric sensors, capacitive sensors and/or optical sensors.

The sensor device can in particular have one or more piezoelectric sensors for detecting mechanical vibrations via changes in length, which can be output as an electrical signal.

The movement and/or position of the cooling line is, for example, a movement and/or position of the cooling line relative to the carrier element. The movement and/or position of the carrier element is, for example, a movement and/or position of the carrier element relative to the cooling line.

According to a further embodiment, the decoupling means are set up to regulate a movement, in particular acceleration, and/or position of the cooling line and/or the carrier element.

• eine Ermittlungseinrichtung zum Ermitteln einer Stellgröße basierend auf einer Abweichung eines Istwerts von einem Sollwert einer Bewegung, insbesondere Beschleunigung, und/oder Position der Kühlleitung und/oder des Trägerelements, und
• eine Ansteuereinrichtung zum Ansteuern einer Aktoreinrichtung zum Bewegen der Kühlleitung und/oder des Trägerelements basierend auf der ermittelten Stellgröße.

Alternatively or additionally, the decoupling means in this embodiment include:

• a determination device for determining a manipulated variable based on a deviation of an actual value from a setpoint of a movement, in particular acceleration, and/or position of the cooling line and/or the carrier element, and
• a control device for controlling an actuator device for moving the cooling line and/or the carrier element based on the determined manipulated variable.

Alternatively or additionally, the decoupling means in this embodiment are for pre-controlling a movement, in particular acceleration, and/or position of one of the cooling line and the carrier element based on a detected movement, in particular acceleration, and/or position of the other of the cooling line and the Support element set up.

For example, the decoupling means are set up either to regulate a movement and/or position of the cooling line or to regulate a movement and/or position of the carrier element.

For example, a reference variable of the control method (setpoint of the movement and/or position) corresponds to a rest position of the cooling line (if the carrier element is the interference exciter) or a rest position of the support element (if the cooling line is the interference exciter). A rest position corresponds to zero acceleration or a constant position of the corresponding element.

For example, the determination device (controller device) is set up to determine a manipulated variable in such a way that, based on the determined manipulated variable, a countermovement to the disturbance excitation is caused using an actuator device. In particular, a countermovement of the cooling line is caused if the carrier element is the interference exciter. Furthermore, a countermovement of the carrier element is caused if the cooling line is the source of interference.

In the case in which the decoupling means (in addition to regulating or instead of regulating) are used for pre-control, either the carrier element can be the interference exciter and the cooling line can be the element to be calmed, or vice versa. In the following, the support element is considered as a disturbance exciter merely as an example. If the decoupling means are set up to pre-control a movement and/or position of the cooling line as the element to be calmed, a counter-movement of the cooling line can be caused via an actuator device before a deviation of the movement and/or position of the cooling line from a target position becomes noticeable . For example, the decoupling means include a sensor device for detecting a movement and/or position of the carrier element as a disturbance exciter. For example, the decoupling means include a control device for determining a manipulated variable for pre-controlling the position of the cooling line based on the detected movement and/or position of the carrier element.

According to a further embodiment, the cooling device has a vibration absorber arranged on the cooling line.

In this embodiment, the decoupling means serve to decouple the cooling line as an element to be calmed from the carrier element as a disturbance exciter. Despite the vibration decoupling by the decoupling means, a residual vibration can be transmitted from the carrier element to the cooling line. By additionally arranging a tuned mass damper on the cooling line, mechanical vibration of the cooling line can be further reduced. This means that interference excitations from the position-sensitive component via the cooling line or the cooling liquid can be prevented even better.

The vibration absorber includes in particular at least one absorber mass element (absorber mass) and one absorber spring element (absorber spring). In particular, the at least one absorber mass element is attached to the cooling line by means of the at least one absorber spring element. The vibration absorber can, for example, cancel out a vibration in the cooling line in a narrow-band frequency range. In particular, a frequency range in which the vibration absorber can dampen a vibration of the cooling line is specified by a natural frequency (response frequency) of the vibration absorber. The natural frequency of the vibration absorber depends in particular on the mass of the at least one absorber mass element and the design of the at least one absorber spring element.

The vibration absorber is set up, for example, for damping in a narrow-band frequency range between 1 Hz and 800 Hz. The vibration absorber is, for example, for damping the natural frequencies of the components involved (e.g. the pipeline or the frame structures) and for very narrow-band excitations (e.g. from a pump and/or turbopump with an excitation frequency between 390 Hz and 400 Hz and harmonics of which) set up.

In embodiments, the cooling device can also have more than one vibration absorber arranged on the cooling line. The several vibration absorbers arranged on the cooling line can also be vibration absorbers that are different from one another and are designed to dampen a mechanical vibration in correspondingly different frequency ranges.

The vibration absorber or one, several or all of the several vibration absorbers can be passive vibration absorbers. The advantage of passive vibration absorbers is that they do not consume any energy and/or electricity. This has the advantage that no cables to the components are required. In addition, no heat output is introduced via such lines.

The vibration absorber or one, several or all of the several vibration absorbers can also be active vibration absorbers. With active vibration absorbers, for example with electromagnetic or electrodynamic actuators, counterforces are specifically introduced into the cooling line in order to dampen vibration of the cooling line. Active vibration absorbers can be set up to apply a counterforce depending on acting excitation forces (e.g. depending on a detected movement, in particular acceleration, and/or position of the cooling line). For example, a counterforce to be applied can be determined in relation to a direction, a frequency or a frequency range, a phase and/or an amplitude of a detected vibration of the cooling line.

In embodiments, the cooling device can also have a so-called “robust mass damper”, which enables broadband damping.

• eine Kühlleitung zum Transportieren einer Kühlflüssigkeit zu oder von der positionssensitiven Komponente,
• ein Trägerelement, an welchem die Kühlleitung befestigt ist, und
• einen Schwingungstilger, welcher an der Kühlleitung angeordnet ist und zum Tilgen einer von dem Trägerelement auf die Kühlleitung übertragenen Schwingung eingerichtet ist,
• wobei insbesondere der Schwingungstilger ein Tilgermassenelement und ein Tilgerfederelement umfasst.

According to a second aspect, a further cooling device for cooling a position-sensitive component of a lithography system is proposed. The cooling device has:

• a cooling line for transporting a cooling liquid to or from the position-sensitive component,
• a support element to which the cooling line is attached, and
• a vibration absorber which is arranged on the cooling line and is set up to cancel a vibration transmitted from the carrier element to the cooling line,
• wherein in particular the vibration absorber comprises an absorber mass element and an absorber spring element.

• eine positionssensitive Komponente, und
• eine wie vorstehend beschriebene Kühlvorrichtung.

According to a third aspect, a decoupling system for a lithography system is proposed. The decoupling system has:

• a position-sensitive component, and
• a cooling device as described above.

The decoupling system can, for example, also have a control device for regulating a movement, in particular acceleration, and/or position of the cooling line and/or the carrier element. The control device can, for example, include a determination device (controller device) for determining a manipulated variable. The control device can, for example, further comprise a control device for controlling an actuator device based on the manipulated variable.

To implement a pilot control, the decoupling system can, for example (in addition to or instead of a control device), also have a control device for controlling a movement, in particular acceleration, and/or position of the cooling line and/or the carrier element. The control device can, for example, comprise a determination device (control device) for determining a manipulated variable. The control device can, for example, further comprise a control device for controlling an actuator device based on the manipulated variable.

The respective device described above or below, such as the control device, the determination device and the control device, can be implemented in terms of hardware and/or software. In the case of a hardware implementation, the respective device can be designed, for example, as a computer or as a microprocessor. In the case of a software implementation, the respective device can be designed as a computer program product, as a function, as a routine, as an algorithm, as part of a program code or as an executable object. Furthermore, the corresponding device can also be designed as part of a higher-level control system of the lithography system.

According to a fourth aspect, a lithography system, in particular an EUV lithography system, is proposed. The lithography system comprises a cooling device as described above and/or a decoupling system as described above.

The position-sensitive component is preferably a position-sensitive component of a projection optics of the lithography system (projection exposure system). However, the position-sensitive component can also be a position-sensitive component of a lighting system of the lithography system.

• Schwingungsentkoppeln der Kühlleitung von dem Trägerelement.

According to a fifth aspect, a method for operating a cooling device is proposed. The cooling device is set up to cool a position-sensitive component of a lithography system. The procedure has the step:

• Vibration decoupling of the cooling line from the support element.

According to an embodiment of the fifth aspect
the vibration decoupling has active vibration decoupling, and/or
The vibration decoupling involves regulating and/or pre-controlling a movement, in particular acceleration, and/or position of the cooling line and/or the carrier element.

• Erfassen eines Istwerts einer Bewegung, insbesondere Beschleunigung, und/oder einer Position der Kühlleitung und/oder des Trägerelements,
• Ermitteln einer Stellgröße basierend auf einer Abweichung des erfassten Istwerts von einem vorbestimmten Sollwert, und
• Ansteuern einer Aktoreinrichtung zum Bewegen der Kühlleitung und/oder des Trägerelements basierend auf der ermittelten Stellgröße.

In embodiments, regulating the movement, in particular acceleration, and/or position of the cooling line and/or the carrier element includes:

• Detecting an actual value of a movement, in particular acceleration, and/or a position of the cooling line and/or the carrier element,
• Determining a manipulated variable based on a deviation of the recorded actual value from a predetermined setpoint, and
• Controlling an actuator device for moving the cooling line and/or the carrier element based on the determined manipulated variable.

In the present case, “on” is not necessarily to be understood as limiting it to exactly one element. Rather, several elements, such as two, three or more, can also be provided. Any other counting word used here should not be understood to mean that there is a limitation to exactly the number of elements mentioned. Rather, numerical deviations upwards and downwards are possible, unless otherwise stated.

The embodiments and features described for the cooling device (first aspect) apply accordingly to the other aspects (second to fifth aspect) and vice versa.

Further possible implementations of the invention also include combinations of features or embodiments described above or below with regard to the exemplary embodiments that are not explicitly mentioned. The person skilled in the art will also add individual aspects as improvements or additions to the respective basic form of the invention.

• 1 zeigt einen schematischen Meridionalschnitt einer Projektionsbelichtungsanlage für die EUV-Projektionslithographie gemäß einer Ausführungsform;
• 2 zeigt eine Projektionsoptikvorrichtung und eine Kühlvorrichtung der Projektionsbelichtungsanlage aus 1 gemäß einer Ausführungsform;
• 3 zeigt eine an einem Trägerelement befestigte Kühlleitung der Kühlvorrichtung aus 2 mit Entkopplungsmitteln zum Schwingungsentkoppeln der Kühlleitung und des Trägerelements gemäß einer ersten Ausführungsform;
• 4 zeigt eine Draufsicht eines Befestigungsmittels aus 3;
• 5 zeigt eine an einem Trägerelement befestigte Kühlleitung der Kühlvorrichtung aus 2 mit Entkopplungsmitteln zum Schwingungsentkoppeln der Kühlleitung und des Trägerelements gemäß einer zweiten Ausführungsform;
• 6 zeigt eine an einem Trägerelement befestigte Kühlleitung der Kühlvorrichtung aus 2 mit Entkopplungsmitteln zum Schwingungsentkoppeln der Kühlleitung und des Trägerelements gemäß einer dritten Ausführungsform;
• 7 zeigt eine an einem Trägerelement befestigte Kühlleitung der Kühlvorrichtung aus 2 mit Entkopplungsmitteln zum Schwingungsentkoppeln der Kühlleitung und des Trägerelements gemäß einer vierten Ausführungsform;
• 8 zeigt ein Blockschaltbild eines Regelkreises zum Regeln einer Bewegung und/oder Position der Kühlleitung oder des Trägerelements aus 6 oder 7;
• 9 zeigt schematisch funktionelle Komponenten eines Entkopplungssystems der Projektionsbelichtungsanlage aus 1 gemäß einer Ausführungsform;
• 10 zeigt eine an einem Trägerelement befestigte Kühlleitung der Kühlvorrichtung aus 2 mit Entkopplungsmitteln zum Schwingungsentkoppeln der Kühlleitung und des Trägerelements gemäß einer fünften Ausführungsform;
• 11 zeigt eine an einem Trägerelement befestigte Kühlleitung der Kühlvorrichtung aus 2 mit einem an der Kühlleitung befestigten Schwingungstilgers gemäß einer Ausführungsform; und
• 12 zeigt ein Flussablaufdiagramm eines Verfahrens zum Betreiben einer Kühlvorrichtung einer Projektionsbelichtungsanlage gemäß einer Ausführungsform.

Further advantageous refinements and aspects of the invention are the subject of the subclaims and the exemplary embodiments of the invention described below. The invention is further explained in more detail using preferred embodiments with reference to the accompanying figures.

• 1 shows a schematic meridional section of a projection exposure system for EUV projection lithography according to one embodiment;
• 2 shows a projection optics device and a cooling device of the projection exposure system 1 according to one embodiment;
• 3 shows a cooling line of the cooling device attached to a support element 2 with decoupling means for vibration decoupling of the cooling line and the support element according to a first embodiment;
• 4 shows a top view of a fastener 3 ;
• 5 shows a cooling line of the cooling device attached to a support element 2 with decoupling means for vibration decoupling of the cooling line and the support element according to a second embodiment;
• 6 shows a cooling line of the cooling device attached to a support element 2 with decoupling means for vibration decoupling of the cooling line and the support element according to a third embodiment;
• 7 shows a cooling line of the cooling device attached to a support element 2 with decoupling means for vibration decoupling of the cooling line and the support element according to a fourth embodiment;
• 8th shows a block diagram of a control circuit for controlling a movement and/or position of the cooling line or the carrier element 6 or 7 ;
• 9 shows schematically functional components of a decoupling system of the projection exposure system 1 according to one embodiment;
• 10 shows a cooling line of the cooling device attached to a support element 2 with decoupling means for vibration decoupling of the cooling line and the support element according to a fifth embodiment;
• 11 shows a cooling line of the cooling device attached to a support element 2 with a vibration absorber attached to the cooling line according to one embodiment; and
• 12 shows a flowchart of a method for operating a cooling device of a projection exposure system according to an embodiment.

In the figures, identical or functionally identical elements have been given the same reference numerals, unless otherwise stated. Furthermore, it should be noted that the representations in the figures are not necessarily to scale.

1 shows an embodiment of a projection exposure system 1 (lithography system), in particular an EUV lithography system. One embodiment of a lighting system 2 of the projection exposure system 1 has, in addition to a light or radiation source 3, lighting optics 4 for illuminating an object field 5 in an object plane 6. In an alternative embodiment, the light source 3 can also be provided as a module separate from the other lighting system 2. In this case, the lighting system 2 does not include the light source 3.

A reticle 7 arranged in the object field 5 is exposed. The reticle 7 is held by a reticle holder 8. The reticle holder 8 can be displaced via a reticle displacement drive 9, in particular in a scanning direction.

In the 1 For explanation purposes, a Cartesian coordinate system with an X direction X, a Y direction Y and a Z direction Z is shown. The X direction X runs vertically into the drawing plane. The Y direction Y is horizontal and the Z direction Z is vertical. The scanning direction is in the 1 along the Y direction Y. The Z direction Z runs perpendicular to the object plane 6.

The projection exposure system 1 includes projection optics 10. The projection optics 10 is used to image the object field 5 into an image field 11 in an image plane 12. The image plane 12 runs parallel to the object plane 6. Alternatively, an angle other than 0 ° is also between the object plane 6 and the Image level 12 possible.

A structure on the reticle 7 is imaged on a light-sensitive layer of a wafer 13 arranged in the area of the image field 11 in the image plane 12. The wafer 13 is held by a wafer holder 14. The wafer holder 14 can be displaced in particular along the Y direction Y via a wafer displacement drive 15. The displacement, on the one hand, of the reticle 7 via the reticle displacement drive 9 and, on the other hand, of the wafer 13 via the wafer displacement drive 15 can take place in synchronization with one another.

The light source 3 is an EUV radiation source. The light source 3 emits in particular EUV radiation 16, which is also referred to below as useful radiation, illumination radiation or illumination light. The useful radiation 16 in particular has a wavelength in the range between 5 nm and 30 nm. The light source 3 can be a plasma source, for example an LPP source (Laser Produced Plasma, plasma generated with the help of a laser) or a DPP source (Gas Discharged Produced Plasma). It can also be a synchrotron-based radiation source. The light source 3 can be a free electron laser (FEL).

The illumination radiation 16, which emanates from the light source 3, is focused by a collector 17. The collector 17 can be a collector with one or more ellipsoidal and/or hyperboloid reflection surfaces. The at least one reflection surface of the collector 17 can be in grazing incidence (GI), i.e. with angles of incidence greater than 45 °, or in normal incidence (English: Normal Incidence, NI), i.e. with angles of incidence smaller than 45 ° , with the lighting radiation 16 are applied. The collector 17 can be structured and/or coated on the one hand to optimize its reflectivity for the useful radiation and on the other hand to suppress false light.

After the collector 17, the illumination radiation 16 propagates through an intermediate focus in an intermediate focus plane 18. The intermediate focus plane 18 can represent a separation between a radiation source module, having the light source 3 and the collector 17, and the illumination optics 4.

The illumination optics 4 comprises a deflection mirror 19 and, downstream of this in the beam path, a first facet mirror 20. The deflection mirror 19 can be a flat deflection mirror or alternatively a mirror with an effect that goes beyond the pure deflection effect have a bundle-influencing effect. Alternatively or additionally, the deflection mirror 19 can be designed as a spectral filter which separates a useful light wavelength of the illumination radiation 16 from false light of a wavelength that deviates from this. If the first facet mirror 20 is arranged in a plane of the illumination optics 4, which is optically conjugate to the object plane 6 as a field plane, it is also referred to as a field facet mirror. The first facet mirror 20 includes a large number of individual first facets 21, which can also be referred to as field facets. Of these first facets 21 are in the 1 just a few are shown as examples.

The first facets 21 can be designed as macroscopic facets, in particular as rectangular facets or as facets with an arcuate or part-circular edge contour. The first facets 21 can be designed as flat facets or alternatively as convex or concave curved facets.

Like, for example, from the DE 10 2008 009 600 A1 is known, the first facets 21 themselves can also each be composed of a large number of individual mirrors, in particular a large number of micromirrors. The first facet mirror 20 can in particular be designed as a microelectromechanical system (MEMS system). For details see the DE 10 2008 009 600 A1 referred.

The illumination radiation 16 runs horizontally between the collector 17 and the deflection mirror 19, i.e. along the Y direction Y.

A second facet mirror 22 is located downstream of the first facet mirror 20 in the beam path of the illumination optics 4. If the second facet mirror 22 is arranged in a pupil plane of the illumination optics 4, it is also referred to as a pupil facet mirror. The second facet mirror 22 can also be arranged at a distance from a pupil plane of the lighting optics 4. In this case, the combination of the first facet mirror 20 and the second facet mirror 22 is also referred to as a specular reflector. Specular reflectors are known from US 2006/0132747 A1 , the EP 1 614 008 B1 and the US 6,573,978 .

The second facet mirror 22 comprises a plurality of second facets 23. In the case of a pupil facet mirror, the second facets 23 are also referred to as pupil facets.

The second facets 23 can also be macroscopic facets, which can have, for example, round, rectangular or even hexagonal edges, or alternatively they can be facets composed of micromirrors. In this regard, reference is also made to the DE 10 2008 009 600 A1 referred.

The second facets 23 can have flat or alternatively convex or concave curved reflection surfaces.

The lighting optics 4 thus forms a double faceted system. This basic principle is also known as the honeycomb condenser (Fly's Eye Integrator).

It may be advantageous not to arrange the second facet mirror 22 exactly in a plane that is optically conjugate to a pupil plane of the projection optics 10. In particular, the second facet mirror 22 can be arranged tilted relative to a pupil plane of the projection optics 10, as is the case, for example, in FIG DE 10 2017 220 586 A1 is described.

With the help of the second facet mirror 22, the individual first facets 21 are imaged into the object field 5. The second facet mirror 22 is the last beam-forming mirror or actually the last mirror for the illumination radiation 16 in the beam path in front of the object field 5.

In a further embodiment of the illumination optics 4, not shown, transmission optics can be arranged in the beam path between the second facet mirror 22 and the object field 5, which contributes in particular to the imaging of the first facets 21 into the object field 5. The transmission optics can have exactly one mirror, but alternatively also two or more mirrors, which are arranged one behind the other in the beam path of the lighting optics 4. The transmission optics can in particular include one or two mirrors for perpendicular incidence (NI mirror, normal incidence mirror) and/or one or two mirrors for grazing incidence (GI mirror, grazing incidence mirror).

The lighting optics 4 has the version in the 1 is shown, after the collector 17 exactly three mirrors, namely the deflection mirror 19, the first facet mirror 20 and the second facet mirror 22.

In a further embodiment of the lighting optics 4, the deflection mirror 19 can also be omitted, so that the lighting optics 4 can then have exactly two mirrors after the collector 17, namely the first facet mirror 20 and the second facet mirror 22.

The imaging of the first facets 21 into the object plane 6 by means of the second facets 23 or with the second facets 23 and a transmission optics is generally only an approximate image.

The projection optics 10 comprises a plurality of mirrors Mi, which are numbered consecutively according to their arrangement in the beam path of the projection exposure system 1.

At the one in the 1 In the example shown, the projection optics 10 includes six mirrors M1 to M6. Alternatives with four, eight, ten, twelve or another number of mirrors Mi are also possible. The projection optics 10 is a double obscured optics. The penultimate mirror M5 and the last mirror M6 each have a passage opening for the illumination radiation 16. The projection optics 10 has an image-side numerical aperture which is, for example, larger than 0.3 and/or 0.5 and which can also be larger than 0, 6 and which can be, for example, 0.7 or 0.75.

Reflection surfaces of the mirrors Mi can be designed as free-form surfaces without an axis of rotational symmetry. Alternatively, the reflection surfaces of the mirrors Mi can be designed as aspherical surfaces with exactly one axis of rotational symmetry of the reflection surface shape. The mirrors Mi, like the mirrors of the lighting optics 4, can have highly reflective coatings for the lighting radiation 16. These coatings can be designed as multilayer coatings, in particular with alternating layers of molybdenum and silicon.

The projection optics 10 has a large object image offset in the Y direction Y between a Y coordinate of a center of the object field 5 and a Y coordinate of the center of the image field 11. This object image offset in the Y direction Y can be in be approximately as large as a Z distance between the object plane 6 and the image plane 12.

The projection optics 10 can in particular be anamorphic. In particular, it has different imaging scales βx, βy in the X and Y directions X, Y. The two imaging scales βx, βy of the projection optics 10 are preferably (βx, βy) = (+/- 0.25, +/- 0.125). A positive magnification 8 means an image without image reversal. A negative sign for the image scale β means an image with image reversal.

The projection optics 10 thus leads to a reduction in size in the X direction X, that is to say in the direction perpendicular to the scanning direction, in a ratio of 4:1. However, the projection optics 10 can also lead to a reduction in the ratio of 8:1 in the X direction

The projection optics 10 leads to a reduction of 8:1 in the Y direction Y, that is to say in the scanning direction.

Other image scales are also possible. Image scales of the same sign and absolutely the same in the X and Y directions X, Y, for example with absolute values of 0.125 or 0.25, are also possible.

The number of intermediate image planes in the X and Y directions Examples of projection optics with different numbers of such intermediate images in the X and Y directions X, Y are known from US 2018/0074303 A1 .

One of the second facets 23 is assigned to exactly one of the first facets 21 to form an illumination channel for illuminating the object field 5. This can in particular result in lighting based on Köhler's principle. The far field is broken down into a large number of object fields 5 using the first facets 21. The first facets 21 generate a plurality of images of the intermediate focus on the second facets 23 assigned to them.

The first facets 21 are each imaged onto the reticle 7 by an assigned second facet 23, superimposed on one another, in order to illuminate the object field 5. The illumination of the object field 5 is in particular as homogeneous as possible. It preferably has a uniformity error of less than 2%. Field uniformity can be achieved by overlaying different lighting channels.

By arranging the second facets 23, the illumination of the entrance pupil of the projection optics 10 can be geometrically defined. By selecting the illumination channels, in particular the subset of the second facets 23 that guide light, the intensity distribution in the entrance pupil of the projection optics 10 can be adjusted. This intensity distribution is also referred to as the lighting setting or lighting pupil filling.

A likewise preferred pupil uniformity in the area of defined illuminated sections of an illumination pupil of the illumination optics 4 can be achieved by redistributing the lighting channels.

Further aspects and details of the illumination of the object field 5 and in particular the entrance pupil of the projection optics 10 are described below.

The projection optics 10 can in particular have a homocentric entrance pupil. This can be accessible. It can also be inaccessible.

The entrance pupil of the projection optics 10 cannot regularly be illuminated precisely with the second facet mirror 22. When imaging the projection optics 10, which images the center of the second facet mirror 22 telecentrically onto the wafer 13, the aperture rays often do not intersect at a single point. However, an area can be found in which the pairwise distance of the aperture beams becomes minimal. This surface represents the entrance pupil or a surface conjugate to it in local space. In particular, this surface shows a finite curvature.

It may be that the projection optics have 10 different positions of the entrance pupil for the tangential and sagittal beam paths. In this case, an imaging element, in particular an optical component of the transmission optics, should be provided between the second facet mirror 22 and the reticle 7. With the help of this optical element, the different positions of the tangential entrance pupil and the sagittal entrance pupil can be taken into account.

At the in the 1 As shown in the arrangement of the components of the illumination optics 4, the second facet mirror 22 is arranged in a surface conjugate to the entrance pupil of the projection optics 10. The first facet mirror 20 is tilted relative to the object plane 6. The first facet mirror 20 is arranged tilted to an arrangement plane that is defined by the deflection mirror 19. The first facet mirror 20 is arranged tilted to an arrangement plane that is defined by the second facet mirror 22.

2 shows a projection optics device 100 (e.g. with projection optics 10, 1 ) of the projection exposure system 1 according to one embodiment. Furthermore, in 2 a cooling device 102 for cooling various components of the projection optics device 100 is shown.

In 2 several frame structures (support structures) 104, 106, 108, 110 and 112 as well as several mirrors 114, 116 of the projection optical device 100 are schematically illustrated. For example, the mirrors 114, 116 are the mirrors M1, M2 1 . For example, a sensor frame of the projection optics device 100 is identified by reference number 110. For example, a sensor device (not shown) is arranged on the sensor frame 110 for measuring a current position of the mirrors 114, 116 (e.g. M1, M2) relative to the sensor frame 110. Furthermore, reference number 106, for example, denotes a support frame (Engl. “force frame”) of the mirrors 114, 116. The sensor frame 110 is, for example, mounted in a vibration-decoupled manner with respect to the support frame 106. The support frame 106 of the mirrors 114, 116 is, for example, mounted in a vibration-decoupled manner with respect to a floor.

The cooling device 102 serves to cool various components of the projection optics device 100. The cooling device 102 serves in particular to cool position-sensitive components of the projection optics device 100, such as one or more of the mirrors 114, 116 and/or the sensor frame 110.

The cooling device 102 includes a cooling unit 126 for cooling a cooling liquid 128. The cooling device 102 also includes one or more cooling lines 130 for transporting the cooling liquid 128 from the cooling unit 126 to the component to be cooled (e.g., the mirror 114 as an example of one to be cooled position-sensitive component) and back to the cooling unit 126. The cooling device 102 also includes one or more pumps 132 for generating a required coolant flow rate of the cooling liquid 128 through a cooling circuit 134 formed by the cooling device 102. The cooling device 102 further includes one or more valves (not shown) to control the cooling flow.

In the in 2 In the example shown and the following description, the cooling device 102 serves as an example for cooling the mirror 114 (e.g. M1). However, in other examples, the cooling device 102 may also serve to cool other mirrors (e.g., 116, M2 to M6), the sensor frame 110, or other components of the projection optics device 100.

The cooling line 130 is attached to a frame structure (support structure) 104, 106, 108, 110 and 112 of the projection optical device 100 at various points throughout the entire cooling circuit 134. In 2 For example, the reference number 136 denotes an attachment of the cooling line 130 to a section 138 of the frame structure 108. The section 138 of the frame structure 108 to which the cooling line 130 is fastened with the fastening means 136, is also referred to below as the carrier element 138. The support element 138 may also be a portion of another frame structure 104, 106, 110 and 112 of the projection optics device 100 and/or another portion of the frame structure 108.

If mechanical vibrations are transmitted from the support element 138 (e.g. the frame structure 108 or another frame structure 104-112) to the cooling line 130, this can lead to interference excitation of the cooling line 130 and/or the cooling liquid 128 in the cooling line 130. Such interference excitation can lead to a positional deviation of a cooled component, such as the mirror 114 (e.g. M1), from a target position. This allows imaging properties of the projection optical device 100 ( 2 ) and the projection exposure system 1 ( 1 ) become worse.

To avoid a transmission of mechanical vibrations from the support element 138 (e.g. the frame structure 108 or another frame structure 104-112) to the cooling line 130, the cooling device 102 comprises decoupling means 200, 300, 400, 500, 800 ( 3, 5 to 7 and 10 ) for vibration decoupling of the cooling line 130 from the carrier element 138.

3 shows a first embodiment of the decoupling means 200. In 3 is a section of the cooling line 130 of the cooling circuit 134 ( 2 ) to see. Furthermore, in 3 to see the support element 138, which is formed by a portion of a frame structure (e.g. the frame structure 108) of the projection optical device 100. The cooling line 130 is attached to the carrier element 138 in a vibration-decoupled manner using the decoupling means 200. The decoupling means 200 in particular include a fastening means 202 such as a pipe clamp 204 or the like. The decoupling means 200 also include at least one elastic element 206 which has an elastomeric material 208. The elastic element 206 is arranged in particular between the fastening means 202 and the cooling line 130. The elastic element 206 is, for example, an O-ring made of the elastomeric material 208. 4 shows a top view of the elastic element 206. The elastic element 206 with the elastomeric material 208 provides vibration decoupling between the cooling line 130 and the carrier element 138, so that mechanical vibrations are not transmitted from the carrier element 138 to the cooling line 130, or at least only in a reduced form become or vice versa.

4 shows a second embodiment of the decoupling means 300. In 3 are, similar to 3 , also a section of the cooling line 130 and the support element 138 can be seen to which the cooling line 130 is attached. The cooling line 130 is attached to the carrier element 138 in a vibration-decoupled manner using the decoupling means 300. The decoupling means 300 in particular include a fastening means 302 such as a pipe clamp 304 or the like. The decoupling means 300 also include at least one spring element 306, which is connected to the fastening means 302 and the carrier element 138. The spring element 306 provides vibration decoupling between the cooling line 130 and the carrier element 138, so that mechanical vibrations are not transmitted from the carrier element 138 to the cooling line 130 or at least only in a reduced form, or vice versa. Vibration damping 308 can also be provided between the carrier element 138 and the cooling line 130.

In the 6 and 7 decoupling means 400 and 500 are shown according to a third and fourth embodiment, respectively. The decoupling means 400 and 500 are set up for active vibration decoupling between the cooling line 130 and the carrier element 138.

The decoupling means 400 according to the third embodiment include similar as in 5 Fastening means 402 such as a pipe clamp 404 and at least one spring element 406. The spring element 406 provides vibration decoupling between the cooling line 130 and the support element 138. To improve this vibration decoupling, the decoupling means 400 also include a sensor device 408 for detecting a movement, in particular acceleration, and/or a position of the cooling line 130. In other words, the sensor device 408 serves to detect a movement from the carrier element 138 despite the at least one spring element 406 to detect the portion of a mechanical vibration transmitted by the cooling line 130.

The sensor device 408 in particular includes one or more sensors for detecting the movement and/or position of the cooling line 130. For example, the sensor device 408 includes one or more acceleration sensors for detecting an acceleration of the cooling line 130.

In addition, the decoupling means 400 include an actuator device 410 for moving the cooling line 130. The actuator device 410 in particular includes one or more actuators for exerting a force F on the cooling line 130. The actuator ren of the actuator device 410 can be implemented, for example, as piezo elements or as electromagnetic actuators.

For example, the at least one spring element 406 has a natural frequency f _R (resonance frequency) at which vibration decoupling is insufficient.

Furthermore, the decoupling means 400 are set up, for example, to actively dampen a vibration of the cooling line 130 in a frequency range which includes the natural frequency f _R of the spring element 406.

The decoupling means 500 according to the fourth embodiment ( 7 ) differ from the decoupling means 400 according to the third embodiment ( 6 ) by a different type of sensor device 508 and optionally by a different type of actuator device 510. However, other features of the decoupling means 500 according to the fourth embodiment, such as fastening means 502 (e.g. pipe clamp 504) and spring element(s) 506 are the same or similar to the corresponding features of the decoupling means 400 according to the third embodiment.

The sensor device 508 of the decoupling means 500 according to the fourth embodiment comprises one or more piezo elements 512, which are arranged between the cooling line 130 and the carrier element 138. For example, by changing the length L of a piezo element 512, a movement (e.g. vibration) of the cooling line 130 can be detected via a change in voltage at contacts (not shown) of the piezo element 510. Furthermore, actuators of the actuator device 510 can also be implemented as piezo elements 514, for example. Optionally, one and the same piezo element(s) 512, 514 (e.g. one after the other in time) can also be used both as a sensor and as an actuator.

The decoupling means 400, 500 according to the third and fourth embodiments ( 6 and 7 ) are set up for active vibration decoupling between the cooling line 130 and the carrier element 138. For example, active vibration decoupling is carried out using a control process.

8th shows a block diagram of a control circuit 600 for controlling a movement, in particular acceleration, and/or position of the cooling line 130.

In the following, the control circuit 600 is used as an example for controlling the acceleration y(t) of the cooling line 130 ( 6 , 7 ). In other examples, the control circuit 600 can also be used to control a position of the cooling line 130. In addition, in other other examples, namely when the cooling line 130 is the disturbance exciter, the control circuit 600 can also be set up to regulate a movement, in particular acceleration, and/or position of the carrier element 138.

The control circuit 600 is based on a feedback control, which is implemented by a controller device 602 and a controlled system 604. The controlled system 604 includes an actuator 606 for manipulating the acceleration y(t) of the cooling line 130. The actuator 606 is in particular through the actuator device 410, 510 ( 6 , 7 ) realized. The controlled system 604 also includes a sensor system 608 for measuring the acceleration y(t) of the cooling line 130. The sensor system 608 is in particular through the sensor device 408, 508 ( 6 , 7 ) realized. Furthermore, the controlled system 604 includes the cooling line 130.

The controller device 602, together with the controlled system 604, forms the feedback control and ensures that a deviation e(t) of an actual value y(t) of the acceleration from a setpoint r(t) of the acceleration of the cooling line 130 is kept to the smallest possible value, ideally kept at zero. The setpoint r(t) can in particular be a static value (r(t) = const.).

In 9 functional components of a decoupling system 700 are shown, which includes the cooling device 102 ( 2 ) with the decoupling means 400, 500 and the position-sensitive component, such as the mirror 114 (M1).

The decoupling means 400, 500 include one or more decoupling elements, such as spring elements 406, 506 ( 6 , 7 ). The decoupling means 400, 500 also include a control device 702. The control device 702 includes a determination device 704 (controller device 602 in 8th ) for determining the manipulated variable u(t) based on the deviation e(t) of the actual value y(t) from the setpoint r(t) of the acceleration of the cooling line 130. The control device 702 comprises a control device 706 for controlling the actuator device 410, 510 ( 6 , 7 ) based on the determined manipulated variable u(t). For example, the control device 706 sends a corresponding control signal A to the actuator device 410, 510.

In addition or as an alternative to the in 8th The feedback control shown can also be decoupling means 800 ( 10 ) may be provided, which are used to pre-control a movement and/or position of the cooling line 130. In 8th is in the control circuit 600 of the feedback control A pilot control 610 is shown in dashed lines. Although in 8th However, not shown, the pre-control 610 can also be carried out instead of the feedback control, in which the manipulated variable u(t) is determined, so that no control at all, but only a control, is used.

The decoupling means 800 include, for example, similar to the decoupling means 500 ( 7 ), fastening means 802 (e.g. pipe clamp 804), one or more spring elements 806, a sensor device 808 and an actuator device 810.

For precontrol, the decoupling means 800 (instead of or in addition to the sensor device 808) include a further sensor device 812 for detecting a movement, in particular acceleration, and/or position of the carrier element 138 as a disturbance exciter. In addition, the decoupling means 800 include a control device 612 ( 8th ) for determining a pilot control variable u _v (t) for a pilot control based on the detected movement and/or position of the carrier element 138. Using the actuator device 810, a countermovement of the cooling line 130 can then be carried out based on the pilot control variable u _v (t). caused. This countermovement can be caused in particular before a deviation e(t) of the movement and/or position of the cooling line 130 from the target position r(t) becomes noticeable.

11 shows a section of a cooling device 900 according to a further embodiment. In this embodiment, the cooling device 900 has one or more vibration absorbers 902 arranged on the cooling line 130.

The vibration absorber 902 in particular comprises at least one absorber mass element 904 and one absorber spring element 906. In particular, the at least one absorber mass element 904 is attached to the cooling line 130 by means of the at least one absorber spring element 906. The vibration absorber 902 can, for example, dampen a vibration of the cooling line 130 in a narrow-band frequency range.

The cooling device 900 can, for example, only have the one or more vibration absorbers 902 and no decoupling means. In this case, the cooling device only serves to cancel a vibration on site, but not for vibration decoupling between the carrier element 138 and the cooling line 130. Alternatively, the cooling device 900 can also have decoupling means 200, 300, 400 in addition to the one or more vibration absorbers 902 , 500 and/or 800. In this case, the cooling device serves to decouple vibrations between the carrier element 138 and the cooling line 130 and in addition to cancel out vibrations in the cooling line 130. The reference number 908 in 11 indicates vibration damping between the support element 138 and the cooling line 130.

The following describes a method for operating a cooling device 102 ( 2 ). The cooling device 102 is for cooling a position-sensitive component, such as the mirror 114 (M1), of a lithography system 1 ( 1 ) furnished. In the method, the cooling line 130 is vibration-decoupled from the carrier element 138.

The vibration decoupling can include, for example, active vibration decoupling. The vibration decoupling can, for example, regulate a movement, in particular acceleration, and/or position of the cooling line 130 and/or the carrier element 138 based on the in 8th have control circuit 600 shown.

In the following, reference will be made to 12 a method for controlling a movement and/or position of the cooling line 130 and/or the carrier element 138 is described.

In a first step S1 of the method, an actual value y(t) of a movement, in particular acceleration, and/or a position of the cooling line 130 and/or the carrier element 138 is detected.

In a second step S2 of the method, a manipulated variable u(t) is determined based on a deviation e(t) of the recorded actual value y(t) from a predetermined target value r(t) ( 8th ).

In a third step S3 of the method, an actuator device 410, 510, 810 ( 6 , 7 , 10 ) for moving the cooling line 130 and/or the carrier element 138 based on the determined manipulated variable u(t) (e.g. control signal A in 9 ).

Although the present invention has been described using exemplary embodiments, it can be modified in many ways.

REFERENCE SYMBOL LIST

1

Projection exposure system

2

Lighting system

3

light source

4

Illumination optics

5

Object field

6

Object level

7

Reticule

8th

Reticle holder

9

Reticle displacement drive

10

Projection optics

11

Image field

12

Image plane

13

wafers

14

wafer holder

15

Wafer displacement drive

16

Illumination radiation

17

collector

18

Intermediate focal plane

19

Deflecting mirror

20

first facet mirror

21

first facet

22

second facet mirror

23

second facet

100

Projection optics device

102

Cooling device

104

frame structure

106

frame structure

108

frame structure

110

Frame structure (sensor frame)

112

Frame structure (support frame)

114

Mirror

116

Mirror

126

Cooling unit

128

coolant

130

Cooling line

132

pump

134

Cooling circuit

136

Fastening

138

Section (support element)

200

decoupling agent

202

Fasteners

204

pipe clamp

206

elastic element

208

Elastomeric material

300

decoupling agent

302

Fasteners

304

pipe clamp

306

Spring element

308

damping

400

decoupling agent

402

Fasteners

404

pipe clamp

406

Spring element

408

Sensor device

410

Actuator device

500

decoupling agent

502

Fasteners

504

pipe clamp

506

Spring element

508

Sensor device

510

Actuator device

512

Piezo element

514

Piezo element

600

control loop

602

Regulator setup

604

Controlled system

606

Actuators

608

Sensor technology

610

Pilot control

612

Control device

700

Decoupling system

702

Control device

704

Investigation facility

706

Control device

800

decoupling agent

802

Fasteners

804

pipe clamp

806

Spring element

808

Sensor device

810

Actuator device

812

Sensor device

900

Cooling device

902

Vibration absorber

904

Absorber mass element

906

absorber spring element

908

damping

A

signal

e(t)

deviation

F

Power

M1-M6

Mirror

r(t)

Setpoint

S1-S3

Procedural steps

u(t)

manipulated variable

uv(t)

manipulated variable

X

Direction

y(t)

actual value

Y

Direction

Z

Direction

QUOTES INCLUDED IN THE DESCRIPTION

This list of documents listed by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 102008009600 A1 [0088, 0092]
• US 20060132747 A1 [0090]
• EP 1614008 B1 [0090]
• US 6573978 [0090]
• DE 102017220586 A1 [0095]
• US 20180074303 A1 [0109]

Claims (15)

Cooling device (102) for cooling a position-sensitive component (114) of a lithography system (1), comprising: a cooling line (130) for transporting a cooling liquid (128) to or from the position-sensitive component (114), a support element (138) to which the cooling line (130) is attached, and Decoupling means (200, 300, 400, 500, 800) for vibration decoupling of the cooling line (130) from the support element (138). cooling device Claim 1 , wherein the decoupling means (200, 300, 400, 500, 800) have at least one decoupling element (206, 306, 406, 506, 806), in particular at least one elastic element (206, 306, 406, 506, 806), for vibration decoupling Have cooling line (130) from the carrier element (138). cooling device Claim 2 , wherein the at least one elastic element (206, 306, 406, 506, 806) has a spring element (306, 406, 506, 806) and / or an elastomeric material (208). Cooling device according to one of the Claims 1 until 3 , wherein the cooling line (130) is attached to the support element (138) in a vibration-decoupled manner using the decoupling means (200, 300, 400, 500, 800). Cooling device according to one of the Claims 1 until 4 , wherein the decoupling means (400, 500, 800) are set up for active vibration decoupling of the cooling line (130) from the support element (138). cooling device Claim 5 , wherein the decoupling means (400, 500, 800) have at least one decoupling element (406, 506, 806) with a natural frequency (f _R ), and the decoupling means (400, 500, 800) for actively damping a vibration of the cooling line (130) and/or the carrier element (138) are set up in a frequency range which includes the natural frequency (f _R ). Cooling device according to one of the Claims 1 until 6 , wherein the decoupling means (400, 500, 800) have an actuator device (410, 510, 810) for moving the cooling line (130) and / or the carrier element (138) for active vibration decoupling of the cooling line (130) from the carrier element (138) . Cooling device according to one of the Claims 1 until 7 , wherein the decoupling means (400, 500, 800) have a sensor device (408, 508, 808, 812) for detecting a movement, in particular acceleration, and / or a position of the cooling line (130) and / or the carrier element (138). Cooling device according to one of the Claims 1 until 8th , wherein: - the decoupling means (400, 500, 800) are set up to regulate a movement, in particular acceleration, and / or position of the cooling line (130) and / or the carrier element (138), - the decoupling means (400, 500, 800 ) include: a determination device (602, 704) for determining a manipulated variable (u) based on a deviation (e) of an actual value (y) from a setpoint (r) of a movement, in particular acceleration, and/or position of the cooling line (130) and/or the carrier element (138), and a control device (706) for controlling an actuator device (410, 510, 810) for moving the cooling line (130) and/or the carrier element (138) based on the determined manipulated variable (u), and/or - the decoupling means (800) for pre-controlling (610) a movement, in particular acceleration, and/or position of one of the cooling line (130) and the carrier element (138) based on a detected movement, in particular acceleration, and/or Position from the other of the cooling line (130) and the support element (138) are set up. Cooling device according to one of the Claims 1 until 9 , having a vibration absorber (902) arranged on the cooling line (130). Cooling device (900) for cooling a position-sensitive component (114) of a lithography system (1), comprising: a cooling line (130) for transporting a cooling liquid (128) to or from the position-sensitive component (114), a support element (138) to which the cooling line (130) is attached, and a vibration absorber (902), which is arranged on the cooling line (130) and is set up to cancel a vibration transmitted from the carrier element (138) to the cooling line (130), wherein in particular the vibration absorber (902) comprises an absorber mass element (904) and an absorber spring element (906). Decoupling system (700) for a lithography system (1), comprising: a position-sensitive component (114), and a cooling device (102, 900) according to one of Claims 1 until 11 . Lithography system (1), in particular EUV lithography system, with a cooling device (102, 900) after one of the Claims 1 until 11 and/or a decoupling system (700). Claim 12 . Method for operating a cooling device (102), the cooling device being set up to cool a position-sensitive component (114) of a lithography system (1), comprising the step: Vibration decoupling (S) of the cooling line (130) from the support element (138). Procedure according to Claim 14 , wherein: the vibration decoupling comprises active vibration decoupling, and/or the vibration decoupling comprises regulating and/or pre-controlling a movement, in particular acceleration, and/or position of the cooling line (130) and/or the carrier element (138).

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