DE102020124540A1 - Temperature control device and vacuum arrangement - Google Patents

Abstract

According to various embodiments, a temperature control device can have: a frame (102) which has a fastening device (102b) for fastening a component to be temperature-controlled on one side (101a) of the frame (102); a heat transfer wall (104) facing the side (101a) for exchanging thermal energy with the component; a cavity (111) adjacent to the heat transfer wall (104); two fluid connections (108a, 108b) which are fluidly coupled to one another by means of the cavity (111); a mechanical transducer (106) arranged to impart a force between the frame (102) and the heat transfer wall (104) in response to a pressure change to which the mechanical transducer (106) is subjected.

Description

Various exemplary embodiments relate to a temperature control device and a vacuum arrangement.

In general, substrates can be processed, e.g. machined, coated, heated, etched and/or structurally modified in a vacuum coating system. One method of coating a substrate is what is known as sputtering. For example, one layer or multiple layers can be deposited on a substrate by means of sputtering. For this purpose, a plasma-forming gas can be ionized by means of a cathode, it being possible for a material to be deposited (also referred to as coating material) of the cathode to be atomized by means of the plasma formed in the process. The atomized coating material can then be brought to a substrate where it can deposit and form a layer.

In order to dissipate the thermal energy that is released in the process, various components of the vacuum coating system can be water-cooled. If these have to be serviced outside of the vacuum coating system, a complex assembly process is usually necessary in order to separate a water-cooled component from the cooling circuit without cooling water getting into the vacuum coating system. For example, this task is performed by hand, which introduces humans as a source of error and is time-consuming. When coating the substrate, its surroundings can be parasitically coated, for example, so that conventionally cooled sacrificial sheets are used, which collect excess coating material. If these are to be exchanged, this complex assembly process is required.

According to various embodiments, it was clearly recognized that each fluid connection arranged in the vacuum chamber, which is opened and closed again during the assembly process, is a potential source of error, even if it is operated very conscientiously and meets the highest technological demands. According to various embodiments, this source of error is minimized by means of a temperature control device and a vacuum arrangement, in which the assembly through which fluid flows and the assembly to be cooled are separate from one another. This ensures that the cooling circuit remains closed when the component to be cooled is replaced.

The temperature control device and vacuum arrangement provided according to various embodiments thus simplify the maintenance effort and shorten the maintenance time, e.g. in a highly effective vacuum coating system. For example, it is made easier to automate the assembly steps (e.g. by means of a control device). This may allow fully automated operation to be implemented.

In an exemplary implementation, a maintenance component is inserted into a carrier system arranged in the vacuum chamber and fastened to it using a quick-release system. The cooling body through which fluid flows is integrated in the carrier system and is pressed onto and/or released from the maintenance component by means of an expansion body.

• 1 bis 8 jeweils eine Temperiervorrichtung gemäß verschiedenen Ausführungsformen in verschiedenen schematischen Ansichten;
• 9 und 10 jeweils ein Verfahren zum Betrieb der Temperiervorrichtung gemäß verschiedenen Ausführungsformen in verschiedenen schematischen Ansichten; und
• 11 eine Vakuumanordnung gemäß verschiedenen Ausführungsformen in einer schematischen Seitenansicht oder Querschnittsansicht.

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• 1 until 8th each a temperature control device according to different embodiments in different schematic views;
• 9 and 10 each a method for operating the temperature control device according to different embodiments in different schematic views; and
• 11 a vacuum assembly according to various embodiments in a schematic side view or cross-sectional view.

In the following detailed description, reference is made to the accompanying drawings that form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology such as "top", "bottom", "front", "back", "front", "rear", etc. is used with reference to the orientation of the figure(s) being described. Because components of embodiments can be positioned in a number of different orientations, the directional terminology is used for purposes of illustration and is in no way limiting. It is understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. It is understood that the features of the various exemplary embodiments described herein can be combined with one another unless specifically stated otherwise. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.

Throughout this specification, the terms "connected,""connected," and "coupled" are used to describe both a direct as well as an indirect connection (eg ohmic and/or electrically conductive, eg an electrically conductive connection), a direct or indirect connection and a direct or indirect coupling. In the figures, identical or similar elements are provided with identical reference symbols, insofar as this is appropriate.

According to various embodiments, the term "coupled" or "coupling" can be understood in the sense of a (e.g. mechanical, hydrostatic, thermal and/or electrical), e.g. direct or indirect, connection and/or interaction. For example, several elements can be coupled to one another along an interaction chain, along which the interaction can be exchanged, e.g. a fluid (then also referred to as fluid-conductingly coupled). For example, two elements coupled together can exchange an interaction with each other, e.g., a mechanical, hydrostatic, thermal and/or electrical interaction. A coupling of several vacuum components (e.g. valves, pumps, chambers, etc.) to one another can include that they are coupled to one another in a fluid-conducting manner. According to various embodiments, "coupled" may be understood to mean a mechanical (e.g., physical) coupling, such as by means of direct physical contact. A clutch may be configured to transmit mechanical interaction (e.g., force, torque, etc.).

A fluidic connection or coupling between two elements can enable the two elements to exchange a fluid (i.e. comprising or formed from a liquid material and/or gaseous material) with one another. The fluid-conducting connection can optionally be sealed off from the outside, so that the fluid is exchanged essentially without loss.

Various parts (also referred to as components) absorb thermal power (also referred to as heat output) during operation, e.g. by converting electrical power into thermal power or by absorbing thermal radiation. In the process, their temperature rises (also referred to as heating) until the heat loss inherently given off to the environment corresponds to the thermal power consumed (also referred to as power consumption). The temperature of the component results from the balance between heat loss and thermal power consumption.

In order to reduce the temperature, the heat dissipation of the component can be increased, e.g. by removing thermal energy from the component (also referred to as active cooling or simply referred to as cooling) using a so-called thermal contact wall. Thermal energy can also be supplied to the component in the same way (also referred to as active heating or simply referred to as heating). More generally, the component can be tempered (i.e., cooled and/or heated). The thermal contact wall clearly provides that wall through which the exchange of thermal energy between the component to be cooled and a fluid as a heat carrier (also referred to as a heat transport medium) takes place.

The thermal contact wall can, for example, be traversed by the fluid or at least border on the flowing fluid, which conductively absorbs part of the extracted heat and transports it away convectively (i.e. by means of mass transport). The fluid may be at a lower temperature than the thermal contact wall such that a continuous flow of heat is provided from the thermal contact wall to the fluid. By analogy, the thermal contact wall can have a lower temperature than the component to be tempered, so that a continuous flow of heat is provided from the component to the thermal contact wall. The fluid can thus absorb thermal power from the component and transport it away along the direction of flow. This process of absorbing heat using a flowing fluid means that a high level of performance can be transported away in a small space.

In principle, this heat transport can take place towards or away from the component to be temperature-controlled. Tempering the component can include cooling and/or heating the component. With regard to the temperature control device, reference is made here, inter alia, to the process of cooling the component by means of the temperature control device. What has been described for cooling can apply analogously to the process of heating the component by means of the temperature control device, with heat transport then taking place in the opposite direction.

According to various embodiments, a thermally conductive material may include or be formed from a metal. In principle, however, another thermally conductive material can also be used as an alternative or in addition to the metal. Thermally conductive may be understood herein as having a thermal conductivity of about 100 watts per meter Kelvin (W/m*K) or more, for example about 200 W/m*K or more (also referred to as highly thermally conductive), for example about 300 W/m K or more, for Example about 400 W/m·K or more. Examples of the high thermal conductivity metal include: copper, aluminum, or alloys thereof.

According to various embodiments, a fluid (e.g. a cooling fluid) may include or be formed from a gas (e.g. cooling gas) and/or a liquid (e.g. cooling liquid). For example, the liquid can include water or be formed from it. For example, the liquid may include or be formed from an oil, e.g., a synthetic and/or mineral oil. In general, it can be understood that any suitable fluid medium (also referred to as fluid) can be used as the cooling fluid.

1 10 illustrates a temperature control device 100 according to various embodiments in a schematic side view or cross-sectional view.

The temperature control device 100 has a frame 102, a heat transfer wall 104 and a mechanical converter 106 (also referred to as converter for short).

The frame 102 has a fastening device 102b on one side 101a (also referred to as the assembly side or more clearly as the upper side) of the temperature control device 100, which the heat transfer wall 104 faces. By means of the fastening device 102b, a component to be temperature-controlled (also referred to as a component), e.g. a maintenance component, can be fastened to the frame 102 on the assembly side 101a.

The heat transfer wall 104 may be configured to be movable 109 relative to the frame 102, e.g., movable 109 toward or away from the mounting face 101a (e.g., along direction 105). For example, the heat transfer wall 104 as a whole may be slidably supported relative to the frame 102, e.g., by means of a bearing device (e.g., comprising or formed of a linear bearing). Alternatively or additionally, the heat transfer wall 104 can be deformable such that at least a portion of the heat transfer wall 104 can be moved relative to the frame 102 .

The fastening device 102b can be set up, for example, to connect the component to the frame in such a way that a movement of the component relative to the frame, e.g. in direction 105 towards the assembly side 101a, or away from the assembly side 101a, is blocked if the Component is connected to the frame by means of the fastening device 102b. The fastening device 102b can be set up, for example, to create a form fit between the component and the frame 102, for example when the fastening device 102b is actuated.

To produce the positive connection, the fastening device 102b can have, for example, one or more than one eyelet, have one or more than one thread, have one or more than one groove, have one or more than one hook, or the like. In more general terms, the fastening device 102b can have one or more than one form-fitting contour in order to produce the form-fitting connection.

Examples of components of the fastening device include: a fastener, e.g. a quick-release fastener, a linear fastener and/or a bayonet fastener), a screw, a locking lug, a traction mechanism. Examples of establishing the connection by means of the fastening device include: a relative movement between the frame and the component to be tempered, the closure snapping into place, manual insertion of bolts, screwing in and/or hooking in a fastening means. Examples for implementing the relative movement include: a carriage that is moved in a U-profile of the frame 102; or an eccentric clamp that moves the slide.

The heat transfer wall 104 may include or be formed from a thermally conductive material, e.g., at least on the mounting face 101a. For example, the thermally conductive material may be exposed on the mounting face 101a.

The temperature control device 100 also has a cavity 111 and two fluid connections 108a, 108b (e.g. cooling fluid connections), which are coupled to one another in a fluid-conducting manner by means of the cavity 111.

The or each fluid connection 108a, 108b can, for example, have or be formed from a protruding tube stub. The or each fluid connection 108a, 108b can, for example, have a seal or be formed from it, e.g. a ring seal. The or each fluid connection 108a, 108b can have a thread, for example. The or each fluid connection 108a, 108b can have the click closure, for example.

The cavity 111 may abut the heat transfer wall 104, e.g., at least its thermally conductive material. This achieves that a fluid flowing through the cavity 111 is in physical contact with the heat transfer wall 104, e.g., with its thermally conductive material.

The transducer 106 may generally be configured to impart a force (also referred to as a contact force) between the frame and the heat transfer wall 104 (also referred to as a pressure-to-force transducer 106) in response to a change in pressure to which the transducer 106 is exposed ). The transducer 106 may generally be configured to change volume (also referred to as volume change), change shape, and/or change expansion in response to the pressure change. The transducer 106 may be coupled to the frame 102 and the heat transfer wall 104 such that the change in volume, shape, and/or expansion effects the contact force imparted between the frame 102 and the heat transfer wall 104 .

The change in pressure can include, for example, a pressure (also referred to as internal pressure) to which the interior of the expansion body is exposed and/or a pressure to which the exterior of the expansion body is exposed (also referred to as external pressure) is changed. For example, the change in pressure can include a change in the difference between the external pressure and the internal pressure. For example, the change in pressure can include that only the external pressure is changed or only the internal pressure is changed.

For example, a change in the contact pressure can be a function of the change in pressure, such that the contact pressure force increases with the change in pressure. For example, the pressing force may be directed away from the frame 102 such that the heat transfer wall 104 or at least a portion thereof is moved away from the frame 102 (also referred to as pressing operation). If the pressure change is inverted, the contact pressure can be reduced again until it is zero (also referred to as solution operation).

For example, the pressure-force converter 106 can have an expansion body (also referred to as an expandable body, pressure expansion body, or also as a pressure body for short). The expansion body can be set up to change its volume (also referred to as a change in volume) in response to the change in pressure. For example, the pressure expansion body can have a hollow body. Examples of an expansion body include: a balloon, a lifting cylinder, a tube, a bladder (e.g., a bellows), a closed cell foam, a flexible container.

A less complex implementation shows that the pressure-force converter 106 has a flexible container, which in the aerated state of the vacuum chamber 802 (see 11 ) is installed without pressure and accordingly has atmospheric air pressure inside. The pressure change can be brought about by evacuating the vacuum chamber 802 so that the pressure body expands and presses against the heat transfer wall 104 . The pressure body can have or be formed from rubber or silicone, for example.

The change in pressure can include, for example, the internal pressure that the expansion body encloses being changed relative to the external pressure that acts on the expansion body from the outside. The increase in volume can take place, for example, when the internal pressure increases relative to the external pressure. A reduction in volume can occur, for example, when the internal pressure decreases relative to the external pressure.

The pressing operation can include, for example, the external pressure of the mechanical converter 106 being reduced, for example in such a way that its volume is increased (also referred to as volume increase or expansion). The solution operation can include, for example, that the external pressure of the mechanical converter 106 is increased, for example in such a way that its volume is reduced (also referred to as volume increase or expansion).

Reference is made herein to, among other things, an expansion body as an exemplary transducer 106 . What has been described for the expansion body can apply analogously to a differently configured converter 106, which does not necessarily change its volume in order to generate the contact pressure.

For example, the frame 102 may include a portion 102a (also referred to as frame base 102a). The converter 106 can couple the rack base 102a and the heat transfer wall 104 to each other. The pressing force can then be imparted between the rack base 102a and the heat transfer wall 104 .

Reference is made herein to an easily understood example implementation of the temperature control device 100 in which the transducer 106 is disposed between the heat transfer wall 104 and the rack base 102a. What has been described for this exemplary implementation may apply by analogy to other implementations of the temperature control device 10 in which the transducer 106, the heat transfer wall 104 and the frame base 102a are arranged differently.

2 12 illustrates a temperature control device 100 according to various embodiments 200 in a schematic side view or cross-sectional view, in which the temperature control device 100 has a hollow body 204 (also referred to as a temperature control body), ie a body which has the cavity 111 . An outer wall of the temperature control body 204 can have the heat transfer wall 104 or be formed from it.

The temperature control body 204 can be designed, for example, in the form of a fluid line, which has a flat outer surface. The temperature control body 204 can, for example, have a heat sink or be formed from it.

The tempering body 204 and the converter 106 can thus be separate components. This achieves simpler manufacture and/or better temperature control. For example, the temperature control body 204 and the converter 106 can differ in their material, so that the converter 106 has a better pressure response and the temperature control body 204 has a better thermal conductivity.

For example, the temperature control body 204 can have or be formed from a first material (also referred to as temperature control material) and the converter 106 can have or be formed from a second material (also referred to as converter material).

For example, the temperature control material can have a higher thermal conductivity than the converter material. For example, the tempering material can have a greater modulus of elasticity than the converter material. For example, the tempering material can have a lower elastic limit than the converter material.

For example, the temperature control material can include or be formed from the thermally conductive material. For example, the transducer material may include or be formed from an elastomer (e.g., neoprene) or spring steel. The elastomer can have or be formed from a rubber or a silicone, for example.

In this case, the entire temperature control body 204 can be moved during the coupling movement and the decoupling movement. In order to compensate for this movement, the temperature control device can have a flexible fluid line 208a, 208b per fluid connection 108a, 108b, which fluidly couples the fluid connection 108a, 108b to the cavity 111. This reduces the risk of line breakage. The or each flexible fluid line 208a, 208b can have or be formed from a hose, for example. The or each flexible fluid line 208a, 208b can have or be formed from an elastomer, for example. The elastomer can have or be formed from a rubber or a silicone, for example.

3 10 illustrates a temperature control device 100 according to various embodiments 300 in a schematic side view or cross-sectional view, in which the converter 106 has the cavity 111 and the heat transfer wall 104 . In this case, the internal pressure can be the pressure of the fluid in the cavity 111 . This configuration achieves fewer parts and hence reduction in inventory cost and the like.

For example, the transducer 106 can be assembled from different materials. For example, a first portion of the transducer 106 may include the heat transfer wall 104 including or formed from the tempering material. For example, a second portion of the transducer 106 may include a deformation wall 304 that includes or is formed from the transducer material. While this configuration may be more difficult to manufacture, it allows the transfer of heat through the heat transfer wall 104 to be optimized.

Likewise, the deformation wall 304 and the heat transfer wall 104 may include or be formed from the same material, e.g., the transducer material. Although this configuration can make the transport of heat through the heat transfer wall 104 more difficult, it nevertheless achieves greater reliability of the temperature control device 100, clearly because there are fewer interfaces between different materials. However, the lower heat transport can be accepted if the component to be temperature-controlled clearly needs to be cooled less and/or if the contact surface between the component to be temperature-controlled and the heat transfer wall 104 is large enough.

Optionally, the temperature control device 100 can have a flexible fluid line 208a, 208b per fluid connection 108a, 108b, which couples the fluid connection 108a, 108b to the cavity 111 in a fluid-conducting manner. This reduces the risk of line breakage. The or each flexible fluid line 208a, 208b can have or be formed from a hose, for example. The or each flexible fluid line 208a, 208b can have or be formed from an elastomer, for example.

4 illustrates a temperature control device 100 according to various embodiments men 400 in a schematic side view or cross-sectional view, in which the cavity 111 is limited by the frame 102. This configuration clearly achieves that the frame 102 is cooled by means of the fluid.

For example, the frame 102 can be trough-shaped, so that the frame 102 has a recess 402 in which the cavity 111 is provided. For example, the heat transfer wall 104 can be disposed in the recess 402 . If the heat transfer wall 104 as a whole is to be movable relative to the frame 102 , the temperature control device 100 can also have a seal 404 (e.g. a sealing ring) which seals a gap between the heat transfer wall 104 and the frame 102 .

In the following, reference is made to more specific exemplary implementations of the temperature control device 100, in which the temperature control device 100 has the converter 106 and a temperature control body 204 separately therefrom. What has been described for these exemplary implementations can apply analogously to the embodiments of the temperature control device 100 explained above, in which the converter 106 and the temperature control body 204 have common components, for example.

5 FIG. 12 illustrates a temperature control device 100 according to various embodiments 500 in a schematic side view or cross-sectional view, in which the temperature control device 100 is coupled to the component 502 to be temperature-controlled. The component 502 to be temperature-controlled can, for example, have a metal sheet, for example a counter-sputtering plane, as will be described in more detail later.

The temperature control device 100 can have the temperature control body 204 through which the cavity 111 passes.

The converter 106 can have the expansion body 106e and optionally a pressure transmitter 106u. The pressure transmitter 106u can have a first contact surface with the temperature control body 204 and a second contact surface with the expansion body 106e, wherein the first contact surface and the second contact surface can optionally differ from one another. This ensures that the shape and size of the temperature control body 204 does not necessarily have to be adapted to the shape and size of the expansion body 106e and thus achieves greater flexibility in the design. For example, the first contact area can be smaller than the second contact area.

The expansion body 106e can have a fold 606f, for example, which improves its ability to expand. This means, for example, that the converter material from which the expansion body 106e is made does not necessarily have to have a high limit of elasticity.

The component to be tempered can optionally have a projection 506 (e.g. bar), the function of which will be described in more detail later. The protrusion 506 may extend into the trough-shaped frame 102 .

If the pressure (e.g. internal pressure and/or external pressure) to which the expansion body 106e is exposed changes, it displaces the pressure transmitter 106u in the direction of the assembly side 101a. This movement (also referred to as a stroke) is conveyed to the temperature control body 204 by means of the pressure transmitter 106u.

The stroke provided by the expansion body 106e can, for example, be greater than the sum of the distance s ₁ by which the temperature control body 204 can move until it contacts the component 502 to be temperature-controlled, and the distance s ₂ by which this moves Temperature-controlled component 502 can move freely before its movement is blocked by the fastening device.

The pressure transmitter 106u has, for example, a plate 510 (e.g. a metal sheet) and several pressure stamps 512 (e.g. angle profiles) as a separate assembly. In order to transfer the contact pressure to the temperature control body 204, the plate 510 of the pressure transmitter 106u can extend over the entire outline of the expansion body 106e. The pressure stamps 512 are respectively attached to the plate 510 of the pressure transmitter 106u. This arrangement allows flexible behavior of the pressure switch 106u.

The heat transfer wall 104 may optionally include or be formed from a stranded copper wire. This improves thermal contact and/or enables height compensation.

6 6 illustrates a temperature control device 100 according to various embodiments 600 in a perspective exploded view. The frame 102 (also referred to simply as a carrier) can be set up to accommodate the pressure transmitter and the temperature control body 204 (e.g. together with the heat transfer wall 104), e.g. in its recess 402.

As illustrated, the expansion body 106e may include or be formed from an elongate tube. The expansion body 106e can optionally have a fluid connection. This achieves to supply a fluid to the expansion body 106e so that the internal pressure of the expansion body 106e can be changed. This achieves that pressing force imparted to the heat transfer wall 104 can be better adjusted.

The fastening device 102b has, for example, one or more than one bolts 606 attached to the frame 102, which extend through the recess of the trough-shaped frame 102. The component 502 to be temperature-controlled can be coupled in a form-fitting manner by means of the or each bolt 606, as will be described in more detail below.

7 7 illustrates a temperature control device 100 according to various embodiments 700 in a perspective sectional view. If the pressure transmitter 106u is used, it can have corresponding recesses in which the bolts 606 are or can be arranged or through which the bolts 606 extend. This means that the pressure transmitter 106u can be provided as a coherent body, which homogenizes the spatial distribution of the pressing force.

8th 8 illustrates a temperature control device 100 according to various embodiments 800 in a perspective view.

The expansion body 106e can optionally have a fluid port 822 (also referred to as an internal pressure port) which extends through a side wall of the frame 102 . A fluid can be supplied to the expansion body 106e by means of the internal pressure connection 822, so that the internal pressure of the expansion body 106e can be changed. This achieves that pressing force imparted to the heat transfer wall 104 can be adjusted, for example by means of a control device. Clearly, the internal pressure connection 822 can be used to finely adjust the pressure difference and thus the contact pressure. This also facilitates an automated implementation of the temperature control device.

Alternatively or additionally, a leak test can be carried out using the internal pressure connection 822 . The leak test achieves improved reliability.

The frame 102 can optionally be mounted in a displaceable manner. For this purpose, the frame 102 can have a carrier support 844, which is slidably mounted on rollers (not shown) of a storage device. The frame 102 can be displaced by means of an actuating device (not shown). The actuator may be hand-operated or may include an electric drive device (e.g., comprising a motor, gear box, or reciprocating piston) for powering the displacement. The actuating device can, for example, have a lever system or be formed from it. The frame 102 can be set up, for example, as a carriage. This improves the slidable mounting of the frame 102.

The trough shape of the frame 102 ensures that the expansion of the expansion body 106 as a result of the pressure change is directed towards the mounting side 101a and thus towards the heat transfer wall 104 . If the expansion body 106 is a separate hollow body, the leak test can be carried out, for example. The leak test can include that the expansion body 106e is supplied with a test gas (e.g. helium) for leak testing.

9 illustrates a method for operating the temperature control device 100 according to various embodiments in various schematic views, namely a side view 901 and a cross-sectional view 903.

The method can include, in 900a, bringing together the temperature control device 100 and the component 502 to be temperature-controlled. The combination can include, for example, the component 502 to be temperature-controlled being arranged on the assembly side 101a and/or being brought into physical contact with the frame 102. The bringing together can have, for example, that the projection 506 of the component 502 is brought into the recess of the frame 102 . The projection 506 of the component 502 can have, for example, a recess 506a (also referred to as a fastening recess 506a), in which the bolt 606 of the fastening device 102b is received.

The mounting recess 506a may extend into the boss 506 along a curved or angled path, for example. This results in the projection 506 of the component 502 having a hook-shaped positive-locking contour 506h.

The unlocked position of the assembly is clearly shown here. Beam 506 is fully seated, resting, for example, on stud 606, on the edge of frame 102, and on an optional support.

The method may include, in 900b, attaching the component 502 to the frame 102, eg, by actuating the attachment device. Pressing the fastener can at for example, that the bolt 606 is displaced relative to the projection 506 of the component 502, so that the bolt 606 gets behind the hook-shaped form-fitting contour 506h (also referred to as fastening 900b). The detachment of the component 502 from the frame 102 (clearly unlocking) takes place in the reverse order.

As a result of the component 502 being fixed to the frame 102, movement of the component 502 away from the frame 102 is blocked (i.e., they are fixed together). It can be understood that such a positive locking mechanism can also be provided in other ways. It can be understood that alternatively or in addition to the bolt 606, the component 502 can also be screwed to the frame, entered into this or they can be otherwise fastened to one another.

The displacement of the bolt 606 relative to the projection 506 can include, for example, that the frame 102 (if this is slidably mounted) is displaced, e.g. along a direction 103 along which the recess of the frame 102 and/or the frame 102 itself are longitudinal .

Displacing the frame 102 can include, for example, the frame 102 being moved in a displaced manner by means of the lever system. To achieve low-resistance movement of the stage 102, the heat transfer wall 104 (e.g., the copper strand) may be spatially separated from the component 502 (e.g., a counter-sputtering plane) as the stage 102 translation occurs.

10 illustrates a method for operating the temperature control device 100 according to various embodiments in various schematic views, namely a side view 1001 and a cross-sectional view 1003.

The method may include, in 1000a, merging the heat transfer wall 104 with the component 502, e.g., by bringing them into physical contact. The method may optionally include, in 1000b, pressing the heat transfer wall 104 against the component 502.

The method may include, at 1000a and at 1000b, changing a pressure (also referred to as a pressure change) to which the transducer 106 is exposed. The pressure change may include the pressure inside the expansion body 106e (also referred to as internal pressure) being increased. Alternatively or additionally, the pressure change may include reducing the pressure outside of the transducer 106 (also referred to as external pressure).

For example, the temperature control device 100 in a vacuum chamber 802 (see 11 ) which is evacuated to reduce the external pressure. The internal pressure can then be, for example, atmospheric air pressure at the beginning and decrease with the expansion. The change in pressure means that the outside pressure is less than the inside pressure. The expansion body 106e raises the pressure transmitter 106u and/or the tempering body 204, for example until the heat transfer wall 104 is in physical contact with the component 502 and/or is pressed against it.

The further pressure change in 1000b can move the component 502 away from the frame 102, e.g., e.g. until the form-fitting contour 506h comes into physical contact with and/or is pressed against the bolt. A movement of the component 502 away from the frame 102 is clearly blocked by means of the form-fitting contour 506h.

According to various embodiments, the area with which the temperature control body 204 (e.g. its heat transfer wall 104) is in contact with the component 502 (also referred to as the heat transfer contact area) can be smaller than the area (also referred to as the pressing area) with which the expansion body 106e generates the power. This ensures that the pressure with which the heat transfer contact surface is pressed against the component is as high as possible. For example, when the vacuum chamber 802 is pumped down, the pressure differential across the expansion body 106e may be more than about 1 kilopascal (e.g., more than about 10 kilopascals) and/or a maximum of about 100 kilopascals (kPa).

The pressing force then results from the product of this pressure difference and the pressing surface. In an analogous manner, the pressure (also referred to as contact pressure) on the heat transfer contact surface results from the quotient of the contact pressure and the value of the heat transfer contact surface. If the expansion 23 of the pressing surface is approximately 85 mm (millimeters) and the parallel expansion 24 of the heat transfer contact surface is approximately 40 mm, for example, the pressure difference of 100 kPa results in a contact pressure of 223 kPa. In a similar way, a different pressure transmission ratio (contact pressure/pressure difference) can also be achieved or a different type of pressure transmitter can be used to achieve a pressure transmission ratio of more than 1.

The greater the pressure transmission ratio, the greater the variety of possible areas of application. For example, the pressure Transmission ratio that can prevail inside the expansion body 106e (eg pressure hose) atmospheric air pressure or less, so that a pump for generating a large internal pressure is not necessarily necessary. Of course, however, a pump can also be or will be coupled to the expansion body 106e (eg to its internal pressure connection) in order to increase the internal pressure and/or to control the contact pressure.

More generally speaking, an actuator can be activated in order to bring about, control and/or regulate the pressure change. For example, a first pump may be coupled to internal pressure port 822 as an actuator. Alternatively or additionally, a second pump can be coupled to the interior of the vacuum chamber 802 as an actuator.

According to various embodiments, the expansion body 106e (e.g. pressure hose) ensures that a uniform contact pressure is achieved over the entire longitudinal extent.

In an exemplary example, the contact load can be introduced by means of a flexible expansion body 106e, e.g. a hose made of rubber or silicone, below the tempering body 204. The expansion body 106e can be installed in the process environment in a pressureless state and form a separate volume. The evacuation of the vacuum chamber 802 generates a pressure difference, which presses the temperature control body 204 against the component 502 (e.g. locked shielding plates).

11 11 illustrates a vacuum assembly 1100 according to various embodiments in a schematic side view or cross-sectional view.

The vacuum arrangement 1100 can have a vacuum chamber 802 and the temperature control device 100 . The temperature control device 100 can be arranged at least partially, for example at least its heat transfer wall 104, its frame and/or its converter 106, in the vacuum chamber 802.

The vacuum assembly 1100 may include a heat source 1102 (e.g., a coating apparatus) that emits thermal energy, e.g., thermal radiation, during operation. The mounting side 101a may face the heat source 1102 . Reference is made herein to a coating device as an exemplary heat source 1102. The coating device may be configured to provide a coating material for coating a substrate and may emit thermal output while providing the coating material. It can be understood that what has been described for the coating device 1102 can apply by analogy to any other heat source that does not necessarily have to provide a coating material.

The coating device 1102 can be set up, for example, to carry out a physical vapor deposition, e.g. by means of a plasma. For example, the coating material can be atomized (also referred to as sputtering) by means of the plasma. The plasma can emit thermal radiation.

The mounting side 101a may face the coating device 1102 . For example, the coating device 1102 can be set up to emit a coating material and with it thermal power (also referred to as heat output) in the direction of the temperature control device 100 .

If the substrate (not shown) is to be transported in the vacuum chamber 802, the vacuum arrangement 1100 can also have a transport device which has a plurality of transport rollers 812. The transport device can be set up to transport a substrate to be coated along a transport path 1111, e.g. past the coating device 1102 and/or in the vacuum chamber 802. The transport path 1111 can run, for example, between the temperature control device 100 and the coating device 1102.

The transport device can have, for example, a multiplicity of transport rollers 812 which are set up for transporting a plate-shaped substrate. The plate-shaped substrate can be transported, for example, resting on the transport rollers 812 and/or placed in a substrate carrier (not shown). The plate-shaped substrate can have a wafer or another semiconductor substrate, for example.

Alternatively, the transport device can have an unwinding roller and a winding roller, which are set up to wind a strip-shaped substrate along the transport path 1111 from the unwinding roller to the winding roller. Optionally, the transport device can have a multiplicity of guide rollers, which are set up to deflect the transport path 1111 one or more times, so that the substrate is transported past the coating device 1102. A tape-shaped substrate (tape substrate) can be a film, a fleece, comprise or be formed from a tape and/or a fabric.

The component 502 to be temperature-controlled can be physically and/or thermally coupled to the heat transfer wall 104 . The component 502 to be temperature-controlled can, for example, have or be formed from a shielding device 502, which provides a so-called counter-sputtering plane. Reference is made herein to the shielding device as an exemplary component 502, among others. It can be understood that what has been described for the shielding device can apply analogously to any other component 502 to be temperature-controlled, which does not necessarily have to provide a shielding function.

The shielding device can be arranged, for example, between the transport path 1111 and the temperature control device 100 .

The shielding device 502 can have or be formed from one or more than one plate and/or one or more than one metal sheet. Furthermore, the shielding device can have an additional fastening device (also referred to as a counter-fastening device), which corresponds to the fastening device of the temperature control device 100 (can be coupled to it). The counter-fastening device can have the bar 506, for example, which has a plurality of hooks or other hook-shaped positive-locking contours 506h.

The temperature control device 100 and/or the shielding device 502 can be arranged between two transport rollers 812 of the transport device. This achieves that the space between the transport rollers 812 is protected from coating material since this accumulates on the shielding device 502 .

Alternatively or additionally, the shielding device 502 can have one or more than one through opening, through which a transport roller 812 of the transport device extends (not shown). This achieves that the transport device is protected from coating material since this accumulates on the shielding device 502 .

The temperature control device 100 thus achieves a cooling of the shielding device 502 in that thermal energy is withdrawn from the shielding device 502 by means of the fluid of the temperature control device 100 . If the shielding device 502 is sufficiently soiled with coating material, it can be uncoupled from the temperature control device 100 so that the shielding device 502 can be replaced as a whole.

The vacuum arrangement 1100 can have, for example, a fluid supply 1804 which is at least partially arranged outside of the vacuum chamber 802 . The fluid supply 1804 can be coupled to the two fluid connections 108a, 108b. The fluid supply 1804 can, for example, comprise a pump for driving a flow of fluid through the cavity 111 by means of the two fluid connections 108a, 108b. The fluid supply 1804 can have a fluid reservoir, for example, in which the fluid is arranged. The fluid supply 1804 can have, for example, a compensating tank in which the fluid is arranged.

According to various embodiments, the vacuum assembly 1100 may include a pump system 804 (comprising at least one vacuum pump, e.g., a high vacuum pump, e.g., a turbomolecular pump). The vacuum chamber 802 can be coupled to the pump system 804 (e.g. in a gas-conducting manner) in order to provide a negative pressure or a vacuum and can be set up in such a stable manner that it withstands the effects of the air pressure in the pumped-out state. When closed, the vacuum chamber 802 can, for example, be designed to be airtight, dust-tight and/or vacuum-tight. The pumping system 804 may allow some of the gas inside the processing chamber to be pumped out, thereby reducing the external pressure acting on the transducer 106 .

According to various embodiments, the vacuum assembly 1100 may include a gas delivery system 1716 (e.g., comprising one or more than one gas channel opening into the vacuum chamber). A process gas can be supplied to the vacuum chamber 802 by means of the gas supply system 1716 in order to form a process atmosphere in the vacuum chamber 802. The external pressure acting on the converter 106 can be formed from an equilibrium of process gas, which is supplied by means of the gas supply system 1716 and withdrawn by means of the pump system 804 .

According to various embodiments, the vacuum chamber 802 can be set up in such a way that a pressure (which is, for example, the external pressure) in a range from approximately 10 mbar to approximately 1 mbar (in other words rough vacuum) or less can be provided therein, for example a pressure in a Range from about 1 mbar to about 10 ^-3 mbar (in other words fine vacuum) or less, for example a pressure in a range from about 10 ^-3 mbar to about 10 ^-7 mbar (in other words high vacuum) or less, for example a pressure less than high vacuum, eg less than about 10 ^-7 mbar.

Various examples are described below, which relate to those described above and shown in the figures.

Example 1 is a tempering device, comprising: a frame having a fastening device for fastening a component to be tempered on one side of the frame; a side-facing (e.g., thermally conductive) heat transfer wall for exchanging thermal energy with the component; a cavity adjacent to the heat transfer wall; two fluid ports (e.g., cooling fluid ports) fluidly coupled to one another by means of the cavity; a mechanical transducer configured to mediate a force between the frame and the heat transfer wall in response to a change in pressure to which the mechanical transducer is subjected (e.g. by means of a change in volume of the transducer), which force, for example, drives the heat transfer wall away from the frame and /or pushed out of the rack.

Example 1 is a tempering device, comprising: a tub-shaped frame having a fastening device for fastening a component to be tempered on a side of the frame that is open; a side-facing (e.g., thermally conductive) heat transfer wall for exchanging thermal energy with the component, the heat transfer wall being disposed in the chassis; a cavity adjacent to the heat transfer wall; two fluid ports (e.g., cooling fluid ports) fluidly coupled to one another by means of the cavity; a mechanical transducer configured to displace the heat transfer wall out of the frame in response to a pressure change to which the mechanical transducer is subjected (e.g., by means of a volume change of the transducer).

Example 2 is the temperature control device according to example 1 or 1, wherein the heat transfer wall comprises or is formed from a thermally conductive material, wherein the thermally conductive material comprises or is formed from a metal, for example.

Example 3 is the temperature control device according to any one of Examples 1 to 2, wherein the frame has a portion which is opposite to the side, wherein the mechanical transducer is arranged between the portion and the heat transfer wall and/or wherein the mechanical transducer connects the portion and the heat transfer wall to each other couples.

Example 4 is the temperature control device according to one of Examples 1 to 3, wherein the converter is set up to displace the heat transfer wall out of the frame by means of the force.

Example 5 is the temperature control device according to any one of Examples 1 to 4, wherein the mechanical converter is configured to mediate a force between the frame and the heat transfer wall or to close the heat transfer wall in response to a pressure change of a fluid to which the mechanical converter is exposed push away.

Example 6 is the temperature control device according to any one of Examples 1 to 5, wherein the frame is trough-shaped (e.g. having a recess in which the heat transfer wall is arranged).

Example 7 is the temperature control device according to any one of Examples 1 to 6, further comprising: two flexible fluid lines (e.g. hoses), each fluid line of which fluidly couples a cooling fluid connection of the two fluid connections to the cavity.

Example 8 is the temperature control device according to any one of Examples 1 to 7, further comprising: a hollow body which has the cavity and is separated from an interior of the mechanical converter, for example.

Example 9 is the temperature control device according to any of Examples 1 to 8, wherein the heat transfer wall is movably mounted relative to the frame, so that the force imparted by means of the mechanical converter causes a movement of the heat transfer wall relative to the frame, e.g. to the side or from the side away.

Example 10 is the temperature control device according to one of Examples 1 to 9, the mechanical converter having a hollow body, the hollow body providing an expansion body, for example.

Example 11 is the temperature control device according to one of Examples 1 to 10, further comprising: an internal pressure connection which is fluidly coupled to an interior of the mechanical converter (e.g. its hollow body).

Example 12 is the temperature control device according to any one of Examples 1 to 11, further comprising: an actuator configured, in response to driving the actuator (eg having one or more than one pump), the pressure change to which the mechanical converter is exposed To effect, for example by an interior of the mechanical converter supplied and / or withdrawn a fluid.

Example 13 is the temperature control device according to example 12, further comprising: a control device which is set up to control the actuator, for example based on a characteristic value which represents the force.

Example 14 is the temperature control device according to one of Examples 1 to 13, wherein the mechanical converter has or is formed from an elastomer.

Example 15 is the temperature control device according to one of Examples 1 to 14, wherein the mechanical converter (e.g. its hollow body) is set up in such a way that the pressure change causes a change in volume of the mechanical converter.

Example 16 is the temperature control device according to any one of Examples 1 to 15, wherein the fastening device and/or the frame (e.g. by means of a bearing device) is movably mounted (e.g. relative to the heat transfer wall), e.g. between a first state and a second state.

Example 17 is the temperature control device according to any one of Examples 1 to 16, wherein the fastening device is configured to be brought from a first state to a second state, which produces a coupling of the component with the frame, and from the second state to the first state to be brought, which disengages the coupling of the component from the frame (also referred to as decoupling).

Example 18 is the temperature control device according to one of Examples 1 to 17, further comprising: an actuating device which is set up to bring the fastening device from the first state to the second state and from the second state to the first state, for example in which the frame is shifted by means of the actuating device.

Example 19 is the temperature control device according to one of examples 1 to 18, the fastening device having a carriage and/or a multiplicity of positive-locking contours for fastening the component.

Example 20 is a vacuum assembly comprising: a vacuum chamber, and a tempering device according to any one of Examples 1 to 19, the heat transfer wall of which is disposed in the vacuum chamber; an optional coating device configured to emit a coating material toward the heat transfer wall or at least emit the coating material into a coating area that the heat transfer wall faces; an optional transport device configured to transport a substrate past the heat transfer wall and/or the coating device and/or in the coating area; an optional fluid supply, which is set up to supply and/or withdraw a fluid from the cavity of the temperature control device (e.g. providing a fluid circuit).

Example 21 is the vacuum arrangement according to example 20, further comprising: a processing arrangement (e.g. having the coating device and/or the transport device) for processing a substrate in the vacuum chamber, the processing arrangement having, for example, the component to be temperature-controlled; wherein the processing arrangement is set up, for example, to supply thermal energy to the component when processing the substrate; wherein the component to be temperature-controlled is, for example, part of the coating device; wherein the component to be tempered is, for example, part of the transport device.

Example 22 is the vacuum assembly according to Example 21, a shielding device which has the member to be temperature-controlled (e.g. a shielding wall) and is arranged in the vacuum chamber on the side, the shielding device being arranged between the coating device and the heat transfer wall, for example; wherein the shielding device is arranged, for example, between the coating area and the heat transfer wall; for example, the shielding device physically touches the heat transfer wall.

Example 23 is the vacuum arrangement according to Example 22, wherein the shielding device has an additional frame which holds the component to be temperature-controlled; and/or wherein the component to be temperature-controlled has or is formed from a shielding wall; and/or wherein the shielding device or at least the component to be temperature-controlled can be moved relative to the temperature-control device, e.g. if the heat-transfer wall is arranged in a stationary manner in the vacuum chamber.

Claims (10)

Temperature control device (100), having: • a frame (102) which has a fastening device (102b) for fastening a component to be temperature-controlled on one side (101a) of the frame (102); • a heat transfer wall (104) facing the side (101a) for exchanging thermal energy with the component; • a cavity (111) adjacent to the heat transfer wall (104); • two fluid connections (108a, 108b) which are coupled to one another in a fluid-conducting manner by means of the cavity (111); • a mechanical transducer (106) arranged to impart a force between the frame (102) and the heat transfer wall (104) in response to a pressure change to which the mechanical transducer (106) is subjected. Temperature control device (100) according to claim 1 wherein the heat transfer wall (104) comprises or is formed from a thermally conductive material. Temperature control device (100) according to claim 1 or 2 wherein the frame (102) has a portion (102a) opposite the side (101a), the mechanical transducer (106) coupling the portion (102a) and the heat transfer wall (104) to each other. Temperature control device (100) according to one of Claims 1 until 3 wherein the frame (102) is trough-shaped, the transducer (106) being arranged to use the force to displace the heat transfer wall (104) out of the trough-shaped frame (102). Temperature control device (100) according to one of Claims 1 until 4 , further comprising: two flexible fluid lines, each fluid line fluidly coupling a cooling fluid port of the two fluid ports (108a, 108b) to the cavity (111). Temperature control device (100) according to one of Claims 1 until 5 wherein the heat transfer wall (104) is movably mounted relative to the frame (102) such that the force imparted by the mechanical transducer (106) causes movement of the heat transfer wall (104) relative to the frame (102). Temperature control device (100) according to one of Claims 1 until 6 , further comprising: an internal pressure port fluidly coupled to an interior of the mechanical converter (106). Temperature control device (100) according to one of Claims 1 until 7 wherein the mechanical transducer (106) comprises or is formed from an elastomer. Temperature control device (100) according to one of Claims 1 until 8th , wherein the mechanical converter (106) is set up such that the pressure change causes a change in volume of the mechanical converter (106). Vacuum arrangement (1100), comprising: • a vacuum chamber (802), and • a temperature control device (100) according to one of Claims 1 until 9 , whose heat transfer wall (104) is arranged in the vacuum chamber (802).

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