DE102018218434A1 - Electronics module, pump drive with this electronics module - Google Patents
Electronics module, pump drive with this electronics module Download PDFInfo
- Publication number
- DE102018218434A1 DE102018218434A1 DE102018218434.8A DE102018218434A DE102018218434A1 DE 102018218434 A1 DE102018218434 A1 DE 102018218434A1 DE 102018218434 A DE102018218434 A DE 102018218434A DE 102018218434 A1 DE102018218434 A1 DE 102018218434A1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- printed circuit
- electronic module
- pump drive
- contact means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D13/00—Pumping installations or systems
- F04D13/02—Units comprising pumps and their driving means
- F04D13/06—Units comprising pumps and their driving means the pump being electrically driven
- F04D13/0686—Mechanical details of the pump control unit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/08—Sealings
- F04D29/086—Sealings especially adapted for liquid pumps
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K5/00—Casings; Enclosures; Supports
- H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
- H02K5/10—Casings or enclosures characterised by the shape, form or construction thereof with arrangements for protection from ingress, e.g. water or fingers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/023—Stackable modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
- H01R12/718—Contact members provided on the PCB without an insulating housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
- H01R13/11—Resilient sockets
- H01R13/115—U-shaped sockets having inwardly bent legs, e.g. spade type
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Details Of Reciprocating Pumps (AREA)
- Details And Applications Of Rotary Liquid Pumps (AREA)
Abstract
Die Erfindung betrifft ein Elektronikmodul (1) für einen Pumpenantrieb (2), mit einer Leiterplatte (3), einem Zwischengehäuse (4), einem Gehäusedeckel (5), einer Dichtung (6), welche das Elektronikmodul hydraulisch vom Pumpenantrieb trennt und einer elektrischen Verbindung zwischen dem Elektronikmodul (1) und dem Pumpenantrieb (2). Aufgabe der Erfindung ist es bei einem Elektronikmodul eines Pumpenantriebs für eine verbesserte Dichtigkeit und für die Möglichkeit einer Vormontage und Vorprüfbarkeit, insbesondere der Möglichkeit einer Dichtheitsprüfung des vom Pumpenantrieb getrennten Elektronikmoduls zu sorgen. Diese Aufgabe wird erfindungsgemäß durch die Merkmale des Anspruchs 1 und durch einen Pumpenantrieb gemäß Anspruch 13 gelöst.The invention relates to an electronic module (1) for a pump drive (2), with a printed circuit board (3), an intermediate housing (4), a housing cover (5), a seal (6) which hydraulically separates the electronic module from the pump drive and an electrical one Connection between the electronics module (1) and the pump drive (2). The object of the invention is to provide for an electronic module of a pump drive for improved tightness and for the possibility of pre-assembly and pre-testability, in particular the possibility of a leak test of the electronic module separated from the pump drive. This object is achieved according to the invention by the features of claim 1 and by a pump drive according to claim 13.
Description
Die Erfindung betrifft ein Elektronikmodul (
Aus der
Aufgabe der Erfindung ist es daher bei einem Elektronikmodul für einen Pumpenantrieb für eine verbesserte Dichtigkeit und für die Möglichkeit einer Vormontage und Vorprüfbarkeit, insbesondere der Möglichkeit einer Dichtheitsprüfung des vom Pumpenantrieb getrennten Elektronikmoduls zu sorgen.The object of the invention is therefore to provide an electronic module for a pump drive for improved tightness and for the possibility of pre-assembly and pre-testability, in particular the possibility of a leak test of the electronic module separated from the pump drive.
Diese Aufgabe wird erfindungsgemäß durch die Merkmale des Anspruchs 1 und durch einen Pumpenantrieb gemäß Anspruch 13 gelöst. Da die Dichtung (
Die metallische Fläche (
Eine glattere Oberfläche lässt sich durch die Verwendung einer Leiterbahn der Leiterplatte als Dichtfläche erreichen und damit ein dichteres Gehäuse.A smoother surface can be achieved by using a conductor track of the printed circuit board as a sealing surface and thus a denser housing.
Vorzugsweise soll die metallische Fläche (
Zweckmäßigerweise sollte eine Durchkontaktierung der Leiterplatte (
Um die geschlossene metallisierte Fläche nicht durch Kontaktmittel (
Aufgrund der einfachen Kontaktierung eignen sich Klemmkontakte als Kontaktmittel (
Weiter ist vorgesehen, dass die Dichtung (
Gemäß einer ersten Ausführungsform ist das Kontaktmittel (
Bei einer zweiten Ausführungsform taucht das Kontaktmittel (
Aus Sicherheitsgründen ist vorgesehen, dass ein Grenzbereich zwischen dem Kontaktmittel (
In der Regel sind mehrere Kontaktmittel vorhanden. In diesem Fall ist jedes Kontaktmittel (
Die Aufgabe wird auch durch einen Pumpenantrieb mit einem Elektronikmodul nach einem der genannten Ansprüche gelöst.The object is also achieved by a pump drive with an electronics module according to one of the claims mentioned.
Ausführungsbeispiele der Erfindung werden nachfolgend anhand der Zeichnung näher erläutert. Es zeigen:
-
1 eine erste Ausführungsform eines Elektronikmoduls und -
2 eine zweite Ausführungsform eines Elektronikmoduls.
-
1 a first embodiment of an electronic module and -
2nd a second embodiment of an electronic module.
Hinweis: Bezugszeichen mit Index und entsprechende Bezugszeichen ohne Index bezeichnen namensgleiche Einzelheiten in den Zeichnungen und der Zeichnungsbeschreibung. Es handelt sich dabei um die Verwendung in einer anderen Ausführungsform, dem Stand der Technik und/oder die Einzelheit ist eine Variante. Die Ansprüche, die Beschreibungseinleitung, die Bezugszeichenliste und die Zusammenfassung enthalten der Einfachheit halber nur Bezugszeichen ohne Index.Note: Reference symbols with an index and corresponding reference symbols without an index denote details of the same name in the drawings and the description of the drawing. This is the use in another embodiment, the prior art and / or the detail is a variant. For the sake of simplicity, the claims, the introduction to the description, the list of reference symbols and the summary contain only reference symbols without an index.
BezugszeichenlisteReference list
- 11
- ElektronikmodulElectronics module
- 22nd
- PumpenantriebPump drive
- 33rd
- LeiterplatteCircuit board
- 44th
- ZwischengehäuseIntermediate housing
- 55
- GehäusedeckelHousing cover
- 66
- Dichtungpoetry
- 77
- metallische Flächemetallic surface
- 88th
- NassbereichWet area
- 99
- TrockenbereichDry area
- 1010th
- KontaktmittelContact means
- 1111
- DichtungsaufnahmeSeal holder
- 1212th
- StützflächeSupport surface
- 1313
- elektrisches Bauteilelectrical component
- 1414
- GegenkontaktCounter contact
- 1515
- EinpresskontaktPress-in contact
- 1616
- SchutzlackProtective varnish
ZITATE ENTHALTEN IN DER BESCHREIBUNG QUOTES INCLUDE IN THE DESCRIPTION
Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of documents listed by the applicant has been generated automatically and is only included for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
Zitierte PatentliteraturPatent literature cited
- DE 102016202226 A1 [0002]DE 102016202226 A1 [0002]
Claims (13)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102018218434.8A DE102018218434A1 (en) | 2018-10-29 | 2018-10-29 | Electronics module, pump drive with this electronics module |
CN201911015846.1A CN111107727A (en) | 2018-10-29 | 2019-10-24 | Electronic module and pump driving device with same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102018218434.8A DE102018218434A1 (en) | 2018-10-29 | 2018-10-29 | Electronics module, pump drive with this electronics module |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102018218434A1 true DE102018218434A1 (en) | 2020-04-30 |
Family
ID=70417200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102018218434.8A Pending DE102018218434A1 (en) | 2018-10-29 | 2018-10-29 | Electronics module, pump drive with this electronics module |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN111107727A (en) |
DE (1) | DE102018218434A1 (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016202226A1 (en) | 2016-02-15 | 2017-08-17 | Bühler Motor GmbH | Brushless DC motor for driving a pump |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10057460C1 (en) * | 2000-11-20 | 2002-08-08 | Tyco Electronics Amp Gmbh | Holding element with a holding clip, arrangement with a carrier plate and a holding element and arrangement with holding element and carrier strip |
DE102004007230B4 (en) * | 2004-02-13 | 2006-03-30 | Siemens Ag | Housing with liquid-tight electrical feedthrough |
DE102011077589A1 (en) * | 2011-06-16 | 2012-12-20 | Robert Bosch Gmbh | contacting |
DE102012213916A1 (en) * | 2011-11-08 | 2013-05-08 | Robert Bosch Gmbh | Electronic module for a control unit |
DE102011089474A1 (en) * | 2011-12-21 | 2013-06-27 | Robert Bosch Gmbh | Electronic module for a vehicle |
DE102014217552A1 (en) * | 2014-09-03 | 2016-03-03 | Conti Temic Microelectronic Gmbh | Control device for a motor vehicle and method for producing such |
DE102015209191A1 (en) * | 2015-02-10 | 2016-08-11 | Conti Temic Microelectronic Gmbh | Mechatronic component and method for its production |
US10501031B2 (en) * | 2015-12-10 | 2019-12-10 | Hitachi Automotive Systems | Electronic control device |
CN107105590A (en) * | 2017-06-15 | 2017-08-29 | 天津市中环三峰电子有限公司 | A kind of sensor sealing shroud and vavuum pump integral controller and encapsulating method |
-
2018
- 2018-10-29 DE DE102018218434.8A patent/DE102018218434A1/en active Pending
-
2019
- 2019-10-24 CN CN201911015846.1A patent/CN111107727A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016202226A1 (en) | 2016-02-15 | 2017-08-17 | Bühler Motor GmbH | Brushless DC motor for driving a pump |
Also Published As
Publication number | Publication date |
---|---|
CN111107727A (en) | 2020-05-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R012 | Request for examination validly filed | ||
R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H05K0005020000 Ipc: H05K0005060000 |
|
R120 | Application withdrawn or ip right abandoned |