CN111107727A - Electronic module and pump driving device with same - Google Patents
Electronic module and pump driving device with same Download PDFInfo
- Publication number
- CN111107727A CN111107727A CN201911015846.1A CN201911015846A CN111107727A CN 111107727 A CN111107727 A CN 111107727A CN 201911015846 A CN201911015846 A CN 201911015846A CN 111107727 A CN111107727 A CN 111107727A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- electronic module
- module according
- pump drive
- seal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D13/00—Pumping installations or systems
- F04D13/02—Units comprising pumps and their driving means
- F04D13/06—Units comprising pumps and their driving means the pump being electrically driven
- F04D13/0686—Mechanical details of the pump control unit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/08—Sealings
- F04D29/086—Sealings especially adapted for liquid pumps
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K5/00—Casings; Enclosures; Supports
- H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
- H02K5/10—Casings or enclosures characterised by the shape, form or construction thereof with arrangements for protection from ingress, e.g. water or fingers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/023—Stackable modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
- H01R12/718—Contact members provided on the PCB without an insulating housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
- H01R13/11—Resilient sockets
- H01R13/115—U-shaped sockets having inwardly bent legs, e.g. spade type
Abstract
The invention relates to an electronic module, a pump drive having the electronic module, in particular to an electronic module (1) for a pump drive (2), having a circuit board (3), an intermediate housing (4), a housing cover (5), a seal (6) hydraulically separating the electronic module from the pump drive, and an electrical connection between the electronic module (1) and the pump drive (2). In an electronics module of a pump drive, the object of the invention is to provide improved sealing and the possibility of preassembly and pre-inspection, in particular to provide a sealing inspection possibility for an electronics module separate from the pump drive. According to the invention, the seal (6) is attached to the metal surface (7) of the printed circuit board (3) and separates the wet region (8) from the dry region (9) of the printed circuit board (3).
Description
Technical Field
The invention relates to an electronic module for a pump drive, comprising a printed circuit board, a central housing, a housing cover, a seal hydraulically separating the electronic module from the pump drive, and an electrical connection between the electronic module and the pump drive.
Background
A generic electronic module is known from DE 102016202226 a1, in which the winding wire ends of the stator electrical windings are guided past sealing rings in the interior of the electronic module and are electrically connected there to a circuit board. The pump drive must withstand high oil pressures during operation. This also relates to the through-opening through the housing of the electronic module. In this case, in particular, oil penetration into the electronics space occurs for a long time at the boundary surface. A further disadvantage of the direct contact of the winding wires with the electronic module is that the module cannot be preassembled and the tightness cannot be checked.
Disclosure of Invention
In an electronic module for a pump drive, the object of the invention is therefore to provide improved sealing and the possibility of preassembly and pre-inspection, in particular of sealing inspection of an electronic module separate from the pump drive.
This object is achieved according to the invention by the features of claim 1 and by a pump drive according to claim 13. Since the seal is coupled to the metal surface of the circuit board and separates the wet area from the dry area of the circuit board, the number and the circumference of the boundary surfaces, in particular between the metal area and the non-metal area of the circuit board, are reduced.
The metal surface of the circuit board can be a soldering surface on the circuit board. The welding surface can be simply applied over a large area, however its surface roughness must be as small as possible in order to meet the sealing requirements.
A smoother surface can be achieved by applying the conductor tracks of the circuit board as a sealing surface and thus a more sealed housing.
Preferably, the metal face should cover the entire wet area of the circuit board and extend partially into the dry area of the circuit board. Thereby, a transition between the metal and non-metal areas of the circuit board in the wet area is avoided. Thus, the oil under pressure is not allowed to penetrate into the boundary areas between the different materials.
Suitably, the vias of the circuit board should be arranged within the dry area of the circuit board. In this way, the vias do not have to meet the sealing requirements.
In order to prevent the complete metal surface from being interrupted by the contact means, it is provided that the contact means are coupled to the metal surface and are electrically connected thereto. By way of example, the contact means can be soldered on the surface of the metal face.
The clamping contact as a contact means is preferably suitable for use as an interface to an electric drive, in particular to a pump drive, on the basis of simple contacting.
Furthermore, it is provided that the sealing element is arranged between a sealing element receptacle in the intermediate housing and the circuit board, wherein the circuit board is supported on an annular support surface of the housing cover. The sealing requirements can be easily met by this arrangement. The seal is a common and proven to be a reliable sealing device. The annular support surface ensures that the seal bears against the circuit board over the entire circumference.
According to a first embodiment, the contact device is surface-mounted. Thereby preventing via placement in the wet area. Instead, the current is directed into the dry region via the metal face. Vias can be used there without any problem.
In a second embodiment, the contact element is sunk into a recess of the circuit board or penetrates completely through the circuit board, wherein the contact element is pressed in a medium-tight manner into the circuit board or soldered to the circuit board. The advantage of this solution is that the metal load capacity of the connection between the contact device and the circuit board is made greater.
For safety reasons, it is provided that a protective varnish is provided in the boundary region between the contact elements and the circuit board within the electronic module. Thereby eliminating the high possibility of leakage in the contact area.
There are typically a plurality of contact devices. In this case, each contact means is surrounded by its own seal.
This object is also achieved by a pump drive having an electronic module according to one of the preceding claims.
Drawings
The embodiments of the present invention are further described below with reference to the accompanying drawings. Wherein:
fig. 1 shows a first embodiment of an electronic module; and is
Fig. 2 shows a second embodiment of the electronic module.
And (4) prompting:has the advantages ofReference numerals of the footmark anddoes not haveCorresponding reference numerals of the subscripts denote the same-named details in the figures and the accompanying description. Details relate to other embodiments, prior art applications and/or details are variants. The claims, the introduction to the specification, the list of reference numerals and the abstract merely contain reference numerals without suffixes for reasons of simplicity.
Detailed Description
Fig. 1 shows a first embodiment of an electronic module 1, which has an intermediate housing 4, a housing cover 5, a circuit board 3 and contact means 10. The circuit board 3 carries electronic components 13 and contact devices 10 which are soldered to the surface of the conductor track plane. The contact means 10 and the adjoining circuit board region, in particular the metal surface 7, are arranged in the wet region 8 or delimit the wet region 8. The intermediate housing 4 has a groove-like seal receptacle 11 into which the seal 6 is inserted. The housing cover 5 has an annular support surface 12, with which the seal 6 is pressed into the seal receptacle 11 and a sealing effect is produced. The annular support surface 12 and the seal holder 11 are oriented to match each other. The circuit board 3 is largely located in a dry region 9 which is bounded by the housing cover 5, the intermediate housing 4 and partly by the circuit board 3 itself. The contact device 10 is configured to clamp the contact portion into which the mating contact portion 14 is inserted.
Fig. 2 shows a second embodiment of an electronic module 1a, which has a middle housing 4a, a housing cover 5a, a circuit board 3a and contact means 10 a. The circuit board 3a carries an electronic component 13a and a contact device 10a, the contact deviceIs not provided withSoldered to the surface, but with press-in contact 15a, which is pressed into a through-hole in the circuit board 3a and additionally soldered together. Additionally, a protective lacquer 16a is applied to the dry regionPress-fitting the contact portion 15a into a contact position with the circuit board 3 a. The contact elements 10a and the adjacent circuit board regions, in particular the metal surfaces 7a, are arranged in the wet region 8a or bound the wet region 8 a. The intermediate housing 4a has a groove-like seal receiving portion 11a into which the seal 6a is inserted. The housing cover 5a has an annular support surface 12a, with which the seal 6a is pressed into the seal receptacle 11a and a sealing effect is produced. The geometry of the annular support surface 12 and the seal receptacle 11a are adapted to one another. The circuit board 3a is largely located in a dry region 9a which is bounded by the housing cover 5a, the intermediate housing 4a and partly by the circuit board 3a itself. The contact device 10a is configured as a clamping contact into which the mating contact 14a is inserted.
List of reference numerals
1 electronic module
2 Pump drive
3 Circuit board
4 middle shell
5 case cover
6 sealing element
7 metal surface
8 wet area
9 dry region
10 contact device
11 seal receiving portion
12 support surface
13 electronic component
14 mating contact portion
15 press-fit contact part
16 protective paint
Claims (13)
1. Electronic module (1) for a pump drive (2), having a circuit board (3), a middle housing (4), a housing cover (5), a seal (6) hydraulically separating the electronic module (1) from the pump drive, and an electrical connection between the electronic module (1) and the pump drive (2), characterized in that the seal (6) is coupled to a metal surface (7) of the circuit board (3) and separates a wet region (8) from a dry region (9) of the circuit board (3).
2. An electronic module according to claim 1, characterized in that the metal face (7) is a soldering face on the circuit board (3).
3. An electronic module according to claim 1, characterized in that the metal face (7) is a conductor track of the circuit board (3).
4. Electronic module according to at least one of the preceding claims, characterized in that the metal face (7) covers the entire wet area (8) of the circuit board (3) and extends partially into the dry area (9) of the circuit board.
5. An electronic module according to claim 4, characterized in that the vias of the circuit board (3) are arranged in the dry area (9) of the circuit board.
6. Electronic module according to at least one of the preceding claims, characterized in that a contact means (10) is coupled to the metal face (7) and is electrically connected therewith.
7. The electronic module according to claim 6, characterized in that the contact means (10) is a clamping contact.
8. Electronic module according to at least one of the preceding claims, characterized in that the seal (6) is arranged between a seal receptacle (11) in the intermediate housing (4) and the circuit board (3), wherein the circuit board (3) is supported on an annular support surface (12) of the housing cover (5).
9. Electronic module according to at least one of the preceding claims, characterized in that the contact means (10) are surface-mounted.
10. The electronic module according to one of claims 1 to 8, characterized in that the contact means (10) sink into a recess of the circuit board (3) or penetrate completely through the circuit board (3), wherein the contact means (10) are pressed medium-tightly into the circuit board (3) or soldered together with the circuit board.
11. An electronic module according to claim 10, characterized in that a protective lacquer (16) is provided within the electronic module (1) at the border area between the contact means (10) and the circuit board (3).
12. Electronic module according to at least one of the preceding claims, characterized in that there are a plurality of contact means (10) and each contact means (10) is surrounded by its own seal (6).
13. Pump drive device with an electronic module (1) according to one of the preceding claims.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102018218434.8A DE102018218434A1 (en) | 2018-10-29 | 2018-10-29 | Electronics module, pump drive with this electronics module |
| DE102018218434.8 | 2018-10-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111107727A true CN111107727A (en) | 2020-05-05 |
Family
ID=70417200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911015846.1A Pending CN111107727A (en) | 2018-10-29 | 2019-10-24 | Electronic module and pump driving device with same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111107727A (en) |
| DE (1) | DE102018218434A1 (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1475039A (en) * | 2000-11-20 | 2004-02-11 | �ٿƵ���AMP�������ι�˾ | Holding element for holding carrier board |
| CN1914774A (en) * | 2004-02-13 | 2007-02-14 | 西门子公司 | Housing comprising a liquid-tight electric bushing |
| CN103608972A (en) * | 2011-06-16 | 2014-02-26 | 罗伯特·博世有限公司 | Contacting elements |
| CN103999561A (en) * | 2011-12-21 | 2014-08-20 | 罗伯特·博世有限公司 | Electronics module for a vehicle |
| CN104025284A (en) * | 2011-11-08 | 2014-09-03 | 罗伯特·博世有限公司 | Electronic Module For A Control Unit |
| CN107006132A (en) * | 2015-02-10 | 2017-08-01 | 大陆泰密克微电子有限责任公司 | Electromechanical component and the method for producing electromechanical component |
| CN107079595A (en) * | 2014-09-03 | 2017-08-18 | 大陆泰密克微电子有限责任公司 | Method for the control unit device of motor vehicle and for manufacturing this device |
| CN107105590A (en) * | 2017-06-15 | 2017-08-29 | 天津市中环三峰电子有限公司 | A kind of sensor sealing shroud and vavuum pump integral controller and encapsulating method |
| CN108293305A (en) * | 2015-12-10 | 2018-07-17 | 日立汽车系统株式会社 | Electronic control unit |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016202226A1 (en) | 2016-02-15 | 2017-08-17 | Bühler Motor GmbH | Brushless DC motor for driving a pump |
-
2018
- 2018-10-29 DE DE102018218434.8A patent/DE102018218434A1/en active Pending
-
2019
- 2019-10-24 CN CN201911015846.1A patent/CN111107727A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1475039A (en) * | 2000-11-20 | 2004-02-11 | �ٿƵ���AMP�������ι�˾ | Holding element for holding carrier board |
| CN1914774A (en) * | 2004-02-13 | 2007-02-14 | 西门子公司 | Housing comprising a liquid-tight electric bushing |
| CN103608972A (en) * | 2011-06-16 | 2014-02-26 | 罗伯特·博世有限公司 | Contacting elements |
| CN104025284A (en) * | 2011-11-08 | 2014-09-03 | 罗伯特·博世有限公司 | Electronic Module For A Control Unit |
| CN103999561A (en) * | 2011-12-21 | 2014-08-20 | 罗伯特·博世有限公司 | Electronics module for a vehicle |
| CN107079595A (en) * | 2014-09-03 | 2017-08-18 | 大陆泰密克微电子有限责任公司 | Method for the control unit device of motor vehicle and for manufacturing this device |
| CN107006132A (en) * | 2015-02-10 | 2017-08-01 | 大陆泰密克微电子有限责任公司 | Electromechanical component and the method for producing electromechanical component |
| CN108293305A (en) * | 2015-12-10 | 2018-07-17 | 日立汽车系统株式会社 | Electronic control unit |
| CN107105590A (en) * | 2017-06-15 | 2017-08-29 | 天津市中环三峰电子有限公司 | A kind of sensor sealing shroud and vavuum pump integral controller and encapsulating method |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102018218434A1 (en) | 2020-04-30 |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200505 |