DE102018126802A1 - Cooling device for a first electronics module and at least one second electronics module, supply device for such a cooling device and method for cooling a first electronics module and at least one second electronics module - Google Patents

Abstract

Cooling device (1) for cooling a first electronics module (21) and at least a second electronics module (22), comprising
- A first cooling channel arrangement (31) which is assigned to the first electronics module in a first section (91), and
- At least one second cooling duct arrangement (32) which is assigned to the second electronics module in a second section (92), the first cooling duct arrangement (91) having at least one first input opening (51) and the second cooling duct arrangement (32) having at least one second input opening (52 ), wherein a cooling fluid can be introduced into the first cooling channel arrangement (31) via the first input opening (51) and into the second cooling channel arrangement (32) via the second input opening (52), a supply device (10) being provided the first cooling duct arrangement (31) and the second cooling duct arrangement (32) can be coupled and has a first supply duct (41) and at least one second supply duct (42) separate from the first supply duct (41), which is designed such that the first supply duct ( 41) the cooling fluid to the first input opening (51) and the second supply channel (42) the cooling fluid to the second input opening (52) leads.

Description

The present invention relates to a cooling device for a first electronics module and at least one second electronics module, a supply device for such a cooling device and a method for cooling a first electronics module and at least one second electronics module.

Electronic modules, in particular power electronics modules, are known from the prior art. They primarily serve as carriers for electrical and electronic components. For this purpose, they have a metallization on one component side, to which the components can be bound, for example. To dissipate the heat emanating from the individual electronic components, a cooling channel arrangement is provided on the cooling side of the carrier opposite the component side, which typically consists of a base body into which at least one channel is embedded. As for example from the DE 10 2013 109 246 A1 known, the channels can be loop-shaped, preferably U-shaped. In order to introduce a corresponding cooling fluid into the base body, supply devices are provided which lead a cooling fluid to inlet openings of the channels and discharge cooling fluid emerging from the outlet opening of the channels.

Systems are also known from the prior art in which a plurality of electronic modules are arranged next to one another in a row, for example in a one-dimensional array. In this case, the cooling channel arrangements assigned to the electronic modules are equipped with a common supply device which supplies the cooling fluid with the inlet openings of all cooling channel arrangements.

Starting from this prior art, it is the object of the present invention to provide a cooling device for cooling a first electronic module and a second electronic module, which is improved compared to the cooling devices known from the prior art, in particular with regard to their efficiency and their installation space economy .

This object is achieved by a cooling device according to claim 1, by a supply device according to claim 9 and a method according to claim 10. Further advantages and features of the invention result from the subclaims and the description and the accompanying figures.

• • eine erste Kühlkanalanordnung, die dem ersten Elektronikmodul in einem ersten Abschnitt zugeordnet ist, und
• • mindestens eine zweite Kühlkanalanordnung, die dem zweiten Elektronikmodul in einem zweiten Abschnitt zugeordnet ist,

wobei die erste Kühlkanalanordnung mindestens eine erste Eingangsöffnung und die zweite Kühlkanalanordnung mindestens eine zweite Eingangsöffnung aufweist, wobei ein Kühlfluid jeweils über die erste Eingangsöffnung in die erste Kühlkanalanordnung und über die zweite Eingangsöffnung in die zweite Kühlkanalanordnung einleitbar ist, wobei eine Versorgungsvorrichtung vorgesehen ist, die an die erste Kühlkanalanordnung und die zweite Kühlkanalanordnung koppelbar ist und die einen ersten Versorgungskanal und mindestens einen vom ersten Versorgungskanal separaten zweiten Versorgungskanal aufweist, wobei die Versorgungsvorrichtung derart gestaltet ist, dass das Kühlfluid über den ersten Versorgungskanal zur ersten Eingangsöffnung und über den zweiten Versorgungskanal zur zweiten Eingangsöffnung führbar ist bzw. im Betrieb geleitet wird.According to the invention, a cooling device for cooling a first electronics module and at least one second electronics module is provided, comprising

• A first cooling channel arrangement which is assigned to the first electronics module in a first section, and
• At least one second cooling duct arrangement which is assigned to the second electronics module in a second section,

wherein the first cooling channel arrangement has at least one first input opening and the second cooling channel arrangement has at least one second input opening, wherein a cooling fluid can be introduced into the first cooling channel arrangement via the first input opening and into the second cooling channel arrangement via the second input opening, a supply device being provided the first cooling duct arrangement and the second cooling duct arrangement can be coupled and which has a first supply duct and at least one second supply duct separate from the first supply duct, the supply device being designed in such a way that the cooling fluid via the first supply duct to the first input opening and via the second supply duct to the second input opening is feasible or is managed in operation.

Compared to the cooling devices known from the prior art, it is provided according to the invention that the first cooling duct arrangement and the second cooling duct arrangement are separate, i. H. separately or insulated, from the respective first supply channel and the second supply channel are supplied with the cooling fluid. It can thereby be avoided that the cooling fluid provided to the second cooling channel arrangement already interacts with the first cooling channel arrangement before the cooling fluid is fed into the second cooling channel arrangement. Correspondingly, cooler or “fresher” cooling fluid can be provided to the second cooling duct arrangement in comparison to a system with a common supply duct which runs below the first and the second cooling duct arrangement. This has a particularly positive effect for electronics modules arranged one behind the other in a row along a primary direction, for example in a one-dimensional or multidimensional array, in which the supply device supplies the individual cooling duct arrangements in succession, since the second separate supply duct redirects in a targeted manner the first cooling channel arrangement can be implemented. In particular, the second supply channel in the first section is deliberately kept at a distance from the first cooling channel arrangement, while the first supply channel directly adjoins the first cooling channel arrangement.

In particular, it is obvious to the person skilled in the art that the first electrical module and the at least second electrical module can also be provided together or separately or can be produced separately. For example, the first and the second electrical module (s) form a one-piece component component or a plurality of component components of a kit. The same applies to the first and the second cooling channel arrangement. It is particularly preferably provided that the supply device comprises several individual supply device sections in the sense of individual component components of a kit, which are plugged together or can be plugged together, or the supply device is realized as a one-piece component component. Furthermore, it is conceivable that the first electrical module, the first cooling duct arrangement and / or at least one supply device section are realized together as an integral or one-piece component component. The same applies analogously preferably also for the second electrical modules, the second cooling channel arrangements and at least the associated supply device sections. It is preferably provided that a plurality of component components for the cooling device are plugged together or put together in the sense of a kit. For example, it is also conceivable that the first electrical module, the first cooling duct arrangement, the second electrical modules, the second cooling duct arrangements and / or the supply device sections or the supply device are manufactured separately and then assembled.

• • ein erster Bereich mit dem ersten Elektronikmodul und mindestens dem zweiten Elektronikmodul,
• • ein zweiter Bereich mit der ersten Kühlkanalanordnung und mindestens der zweiten Kühlkanalanordnung und
• • ein dritter Bereich mit der Versorgungsvorrichtung

schichtartig entlang einer Stapelrichtung übereinander gestapelt angeordnet sind.It is preferably provided that in an assembled state

• A first area with the first electronics module and at least the second electronics module,
• A second area with the first cooling duct arrangement and at least the second cooling duct arrangement and
• • a third area with the supply device

are stacked one above the other along a stacking direction.

In the assembled state, the entire system thus forms a flat product, i. H. an object, the height of which is smaller compared to the longitudinal extent and transverse extent in the stacking direction. It is preferably provided that the first supply channel and / or the second supply channel are configured in a shaft-like manner, in particular with a cross section that is rectangular in a plane running perpendicular to the direction of flow. It is conceivable that a dimensioning of the first or the second supply duct depends on the expected consumption of the first cooling duct arrangement or the second cooling duct arrangement. For example, it is conceivable that the second cooling duct arrangement is dimensioned larger than the first cooling duct arrangement, or that the number of second inlet openings is larger than the number of first inlet openings. In this case, it would be conceivable for the second supply channel to have a larger dimension, for example in the stacking direction, to have a larger dimension than the first supply channel.

In particular, the first electronics module and / or the second electronics module is a power electronics module. The first electronics module and / or the second electronics module preferably has a component side for mounting electrical and / or electronic components, which can be connected in particular to a structured metallization. On the side opposite the component side of the first electronics module, the electronics module has a cooling side, via which heat, which emanates from the electrical or electronic components, is dissipated during operation of the first electronics module. Accordingly, the first cooling duct arrangement adjoins the cooling side, in particular directly. The same applies analogously to the second electronics module. For example, the first electronics module and / or the second electronics module is a metal-ceramic substrate.

According to a preferred embodiment of the present invention, it is provided that the second supply duct has a stepped course or a height offset for guiding the second supply duct to the second cooling duct arrangement, in particular in a transition region between the first section and the second section. As a result, it is advantageously possible to have the second supply channel directly adjoin the second cooling channel arrangement by means of the height offset, as a result of which the cooling fluid can be introduced into the second inlet openings of the second cooling channel arrangement via the second supply channel. In particular, it is provided that with each section change, that is to say, for example during the transition from the first to the second section, there is a height offset for the respective supply channels, ie for a plurality of supply channels, in particular if there are more than two supply channels. It is preferably provided that the second section adjoins the first section when viewed in the primary direction. The height offset can then begin in the first section and / or end in the second section. However, it is also conceivable that the supply device is designed such that the height offset takes place between the first section and the second section, ie in the primary direction seen in a space between the first electronics module and the second electronics module. It is preferably provided that a length of the transition region in which the height offset occurs, measured in the primary direction, is less than 0.5 times the length of the first electronic module measured in the primary direction, preferably less than 0.3 times and particularly preferably less than 0.1 times the length of the first electronics module. In other words: seen in the primary direction, the height offset takes place in a comparatively narrow area.

It is particularly preferably provided that the first supply channel and the second supply channel are arranged one above the other in the first section, the first supply channel and the second supply channel preferably being separated from one another by a wall which extends essentially parallel to a main extension plane of the cooling device. In other words: seen in the stacking direction, the first supply channel directly adjoins the second supply channel, the first supply channel and the second supply channel preferably running parallel to one another along a primary direction, in particular in the first section or over more than half of those measured in the primary direction Length of the first electronics module.

The first supply channel and the second supply channel preferably form a shaft-like course in the first section, through which the cooling fluid can be passed in each case. The arrangement of the first supply channel and the second supply channel in the first section, which are directly adjacent to one another, enables a form of the supply device which is as space-saving as possible to be realized. For example, the first supply channel and the second supply channel seen in the primary direction (perpendicular to the main extension plane) have a purely rectangular cross-sectional profile, the height dimension of the rectangle in a direction running parallel to the stacking direction being smaller than a transverse dimensioning dimensioned perpendicular to the stacking direction and perpendicular to the primary direction , preferably smaller by a factor of 0.5, preferably smaller by a factor of 0.25 and particularly preferably smaller by a factor of 0.15. In particular, the separation by the wall proves to be advantageous because it enables a comparatively simple separation between the first supply channel and the second supply channel to be achieved.

It is preferably provided that the wall is manufactured in such a way that its thermal conductivity is comparatively low, in particular lower than the thermal conductivity of a base body of the cooling channel arrangement. For example, the wall is made of a material whose thermal conductivity is comparatively low, in particular less than the thermal conductivity of a base body of the cooling channel arrangement. It is also conceivable that the wall for reducing the thermal conductivity is structured accordingly and, for example, has cavities or at least one porous section. The wall is preferably made completely porous or is completely provided with cavities. It is also conceivable that the wall is in several parts, in particular a corresponding cavity being formed between the wall parts. The probability of a thermal interaction between the cooling fluid in the second supply channel and the first cooling channel arrangement can be further reduced by reducing the thermal conductivity.

The first section and the second section are preferably arranged one behind the other when viewed in the primary direction, the first supply channel and the second supply channel extending essentially along the primary direction. Due to the longitudinal extent of the first supply channel and the second supply channel, the cooling fluid is given a direction of flow with which the cooling fluid is guided below the first cooling channel arrangement, the second cooling channel arrangement and the third cooling channel arrangement, the cooling fluid passing the first section and the second section in succession.

In a further embodiment of the present invention, it is provided that the supply device has a first drain channel and a second drain channel separate from the first drain channel, the first drain channel for draining the cooling fluid from at least a first outlet opening of the first cooling channel arrangement and the second drain channel for draining the Cooling fluid is provided from at least one second outlet opening of the second cooling channel arrangement, the first outlet channel and the second outlet channel being arranged one above the other in the stacking direction in the stacking section, and / or the first outlet channel and the second outlet channel extending essentially along the primary direction.

The supply device is preferably divided into a first partial area and a second partial area along a secondary direction running perpendicular to the primary direction and perpendicular to the stacking direction, the first supply channel and the second supply channel being arranged in the first partial area in the assembled state, and the first discharge channel in the second partial area and the second drain channel. The first sub-area thus ensures the supply of the cooling fluid to the cooling channel arrangement and the second sub-area leads for removing the used cooling fluid from the cooling channel arrangement. Preferably, the first partial area and / or the second partial area, viewed in the primary direction, extend over the entire length of the supply device, the first partial area and the second partial area, in particular viewed in the secondary direction, being arranged next to one another. The first partial area is preferably arranged on a first edge side of the assembled system and the second partial area is arranged on a second edge side of the system. In a direction perpendicular to the primary direction or to the primary direction, ie seen in the secondary direction, the first partial area and the second partial area preferably each form half of the system. However, it is also conceivable that in particular the second partial area is smaller than the first partial area or vice versa.

It is preferably provided that the supply device has a liquid reservoir for introducing the cooling fluid into the first supply channel and into the second supply channel and a liquid reservoir for collecting the cooling fluid flowing off via the first outlet and via the second outlet, preferably the first supply channel and the second Supply channel and / or the first drain channel and the second drain channel seen in the primary direction between the liquid reservoir for introduction, d. H. the upstream fluid reservoir, and the fluid reservoir for collection, d. H. the outlet-side liquid reservoir are arranged, d. H. are arranged in particular at one level. In particular, it is provided that the inlet-side and / or the outlet-side liquid reservoir in each case the first and the second supply channel, ie. H. all supply channels, is provided jointly or the first drain channel and the second drain channel. It is particularly preferably provided that the wall, which separates the first supply channel from the second supply channel, projects into or opens into the liquid reservoir on the inlet side. As a result, the cooling fluid can be distributed or distributed over the first and second supply channels in the simplest possible way. The inlet-side liquid reservoir itself can then be supplied with the cooling fluid via a corresponding supply connection, for example via an external cooling circuit. Accordingly, it is provided that the first drain channel and the second drain channel open into the outlet-side liquid reservoir, and that the used cooling fluid collected here can be drained from the supply device via a drain connection, for example into the external cooling circuit. According to a preferred embodiment of the present invention, it is provided that the first supply channel extends over the first section, in particular only over the first section or only a region of the first section, and the second supply channel extends over the first section and the second section . In other words, seen in the primary direction, the first supply channel ends with the first section and thereby provides the installation space in the second section which is used by the second supply channel in order to implement the desired height offset and the cooling fluid via the second supply channel to the second Bring cooling duct arrangement. In this case, the first supply channel, for example in the primary direction, can be flush with the first electronics module or its side surface running parallel to the stacking direction at the end of the first section, and / or in the primary direction can be set back. When viewed in the primary direction, the first supply duct preferably ends immediately behind the last first inlet opening. In this context, directly means in particular that, viewed in the primary direction, the distance between the last first entrance opening and the end of the first supply duct is less than 1 cm, preferably less than 0.5 cm and particularly preferably less than 0.25 cm. This makes it possible to prevent the cooling fluid from collecting in an area located behind the last input opening, viewed in the primary direction.

It is particularly preferably provided that the first cooling channel arrangement and / or the second cooling channel arrangement has at least one channel, in particular a loop-shaped channel, which is located between the first input opening and the first output opening and / or between the second input opening and the second output opening Secondary direction extends, wherein the secondary direction extends obliquely to the primary direction, in particular perpendicular to the primary direction. It is also conceivable that the secondary direction running parallel to the main extension plane is inclined with respect to the primary direction by an angle between 45 ° and 90 °, preferably between 75 ° and 90 ° and particularly preferably between 80 ° and 90 ° with respect to the primary direction. Due to the course of the channel, which extends essentially obliquely to the primary direction, a lateral offset of the cooling fluid, i.e. a transverse offset to the primary direction, can be implemented in the supply device; in particular, the cooling fluid can be transferred from the first partial area of the supply device into the second partial area of the supply device transfer. In particular, the loop-shaped channel is configured, for example as a U-shaped channel, in such a way that the cooling fluid is brought as close as possible to the first or second cooling channel arrangement. It is particularly preferably provided that the channel consists of a loop, in particular a single U- shaped arch, and / or a plurality of loops is formed, the deflecting sections of which, for example, run parallel to the main extension plane and in the immediate vicinity of the electronics module. It is also conceivable that the channel runs at least partially parallel to the primary direction. In particular, the channel is arranged in such a way that its loop-shaped course with its reversal point is as far as possible in an area below the electronic or electrical component on the first electronics module and / or on the second electronics module. The first or the second cooling channel arrangement can be realized in particular by layering a plurality of ceramic and / or metal layers, in each of which corresponding recesses, for example in the form of rectangles, cuboids or circles, are embedded, and the channels being formed by superimposing the individual layers is realized. When the individual metal or ceramic layers are connected, a monolithic or one-piece body is created. The person skilled in the art understands monolithic here in particular to mean a layer-free body, as is preferably produced during a DCB process from metal or ceramic layers superimposed on one another.

Another object of the present invention is a supply device for a cooling device for cooling a first electronics module and at least one second electronics module, in particular according to a cooling device according to the invention, wherein the supply device can be coupled to a first cooling channel arrangement assigned to the first electronics module and to a second cooling channel arrangement assigned to the second electronics module and has a first supply channel and at least one second supply channel separate from the first supply channel, which is designed in such a way that the first supply channel leads the cooling fluid to the first input opening and the second supply channel leads the cooling fluid to the second input opening, in particular in the assembled state. All the advantages and features described for the cooling device can be transferred analogously to the supply device and vice versa.

Another object of the present invention is a method for cooling a first electronics module and at least a second electronics module with a cooling device according to the invention. All the features and advantages described for the cooling device can be transferred analogously to the method for cooling a first electronics module and at least one second electronics module and vice versa.

Further advantages and features result from the following description of preferred embodiments of the object according to the invention with reference to the attached figures. Individual features of the individual embodiments can be combined with one another in the context of the invention.

• 1: schematische Darstellung einer Kühlvorrichtung für ein erstes Elektronikmodul und mindestens ein zweites Elektronikmodul gemäß einer ersten beispielhaften Ausführungsform der vorliegenden Erfindung in einer ersten Schnittansicht;
• 2: schematische Darstellung der Kühlvorrichtung aus 1 in eine Draufsicht;
• 3: schematische Darstellung der Kühlvorrichtung aus 1 in einer zweiten Schnittansicht und
• 4: schematische Darstellung einer Kühlvorrichtung für ein erstes Elektronikmodul und mindestens ein zweites Elektronikmodul gemäß einer zweiten beispielhaften Ausführungsform der vorliegenden Erfindung in einer Schnittansicht

It shows:

• 1 : schematic representation of a cooling device for a first electronics module and at least one second electronics module according to a first exemplary embodiment of the present invention in a first sectional view;
• 2nd : schematic representation of the cooling device 1 in a top view;
• 3rd : schematic representation of the cooling device 1 in a second sectional view and
• 4th : schematic representation of a cooling device for a first electronics module and at least one second electronics module according to a second exemplary embodiment of the present invention in a sectional view

In the 1 to 3rd is schematically a cooling device 1 for cooling a first electronic module 21 and a second electronics module 22 according to a first exemplary embodiment of the present invention. Such first electronics modules 21 or second electronics modules 22 , for example in the form of a metal-ceramic substrate, preferably serve as a carrier for electronic or electrical components 5 to the electronics module 21 , 22 , 23 especially a metallization 6 of the respective electronics module 21 , 22 , 23 are connectable. Essential components of a metal-ceramic substrate are one along a main extension plane HSE extending ceramic layer and a metal layer or metallization bonded to the ceramic layer 6 . The ceramic layer is made of at least one material comprising a ceramic. The metallization 6 and the ceramic layer are along a perpendicular to the main plane of extent HSE extending stack direction S arranged one above the other and cohesively connected to one another via a connecting surface. The metallization is in the finished state 6 on one component side 3rd of the metal-ceramic substrate to form conductor tracks or connection points for the electrical components 5 structured. In the embodiment shown, it is a matter of a first electronic module 21 , a second electronics module 22 and a third electronics module 23 composite system. For the person skilled in the art, this system can be easily expanded to a large number of electronic modules which are combined to form a system 21 , 22 , 23 expand power electronics modules in particular.

In particular, in the illustrated embodiment, the 1 to 3rd the first electronics module 21 , the second electronics module 22 and the third electronics module 23 in a plane parallel to the main extension plane HSE extending plane along a primary direction PR next to each other, preferably to form a row, arranged or strung together. This forms the first electronics module 21 , the second electronics module 22 and the third electronics module 23 a one-dimensional array of electronic modules 21 , 22 , 23 . For example, the first electronics module 21 , the second electronics module 22 and the third electronics module 23 , in the primary direction PR seen, congruent or aligned to each other. But it is also conceivable that the first is the first electronics module 21 , the second electronics module 22 and the third electronics module 23 laterally offset from each other. The first electronics module 21 , the second electronics module 22 and the third electronics module 23 are in the stacking direction S seen arranged at the same height and thus lay in the stacking direction S seen a first area 11 firmly.

The first electronics module 21 is also a first cooling channel arrangement 31 , the second electronics module 22 a second cooling channel arrangement 32 and the third electronics module 23 a third cooling channel arrangement 33 assigned. It is conceivable, for example, that the first cooling duct arrangement 31 integral part of the first electronics module 21 , the second cooling channel arrangement 32 integral part of the second electronics module 22 and / or the third cooling channel arrangement 33 integral part of the third electronics module 23 , each on its cooling side 4th , is. In particular, form the first cooling duct arrangement 31 , the second cooling channel arrangement 32 and the third cooling channel arrangement 33 a second area 12th from, in the assembled state, in the stacking direction S seen below the first area 11 with the first electronics module 21 , the second electronics module 22 and the third electronics module 23 is arranged, preferably in the stacking direction S seen the same height. In particular, the first area 11 and the second area 12th in layers in the stacking direction S arranged one above the other and preferably adjoin one another directly.

It is also provided that the first cooling duct arrangement 31 , the second cooling channel arrangement 32 and the third cooling channel arrangement 33 each have a base body, in each of which at least one channel 48 is embedded, which is designed such that a via a first input opening 51 in the channel 48 introduced fluid initially in the direction of the first electronics module 21 , of the second electronics module 22 or the third electronics mode 22 is conveyed and within the base body and after passing a deflection point again in the opposite direction, in particular obliquely or perpendicular to the main plane of extent HSE extending direction, is discharged. For example, the channels embedded in the base bodies 48 in a perpendicular to the main extension plane HSE extending cutting plane seen U-shaped or loop-shaped around the first electronics module 21 , the second electronics module 22 or the third electronics module 23 each evenly on the respective component side 4th to be able to cool.

In particular, the channels 48 designed as single loops or as multiple loops. It is conceivable that the channels 48 , or the location of the channels 48 is adapted to the location of heat sources, for example certain electronic components 5 on the component side 4th . By means of the channels 48 This enables targeted cooling on the component side within the base body 4th realize. It is also provided that the channels embedded in the base body 48 are also designed so that in addition to the direction of flow in the direction of the respective electronic module 21 , 22 , 23 (ie parallel to the stacking direction or perpendicular to the main extension plane HSE ) also the coolant in the channels 48 along a secondary direction SR is conveyed, the secondary direction SR for example perpendicular to the primary direction PR and preferably parallel to the main extension plane HSE runs. It is also conceivable that the secondary direction SR oblique to the primary direction PR runs, for example, forming an angle with respect to the primary direction PR between 45 ° and 90 °, preferably between 60 ° and 90 ° and particularly preferably between 75 ° and 90 °. In other words: the channels 48 in the first cooling channel arrangement 31 , the second cooling channel arrangement 32 and the third cooling channel arrangement 33 are designed in such a way that they cause a lateral offset between a parallel to the primary direction PR running flow before entering the respective cooling channel arrangement 31 , 32 , 33 and one parallel to the primary direction PR running flow after exiting the respective cooling channel arrangement 31 , 32 , 33 to lead.

In particular, it is provided that first entrance openings 51 , second entrance openings 52 , and third entrance openings 53 , via which the cooling fluid into the corresponding cooling channel arrangement 31 , 32 or 33 is initiated in a first section 61 below the assembled system from the first electronics module 21 , the second electronics module 22 and the third electronics module 23 are arranged. Here are the first entrance openings 51 , the second entrance openings 52 and the third entrance openings 53 preferably along a parallel to the primary direction PR extending line arranged, in particular in one on the first edge side 71 subsequent area of the composite system. But it is also conceivable that the individual first entrance openings 51 , the second entrance openings 52 and / or third entrance openings 53 in the primary direction PR seen are not congruent to each other or different distances from the first edge 71 exhibit. On the in the secondary direction SR opposite second edge 72 have the first cooling channel arrangement 31 , the second cooling channel arrangement 32 and the third cooling channel arrangement 33 corresponding first exit openings 81 , second exit openings 82 and third exit openings 83 on. The first exit openings 81 , the second exit openings 82 and the third exit openings 83 are preferably along another parallel to the primary direction PR extending line arranged and / or in the primary direction PR seen not congruent to each other, ie they have different distances from the second edge side 72 of the system.

In particular, the channels 48 in the first cooling channel arrangement 71 , the second cooling channel arrangement 72 and the third cooling channel arrangement 73 designed to remove the cooling fluid from that of the first edge side 71 facing first section 61 to one of the second margins 72 facing second section 62 to convey while doing so along the secondary direction SR the cooling fluid preferably within the respective base body as close as possible to the first electronics module 21 , the second electronics module 22 or the third electronics module 23 to transport.

In operation, the cooling fluid passes through the respective first inlet opening 51 in the channel 48 in and over the in at the end of the channel 48 provided first exit opening 81 out again. It is conceivable that the transverse to the primary direction PR trained channels 48 form a single, in particular U-shaped, loop, or form a plurality, for example three to ten, loops. The same applies analogously to the second entrance and exit openings 52/82 or third entrance and exit openings 53/83 and their channels 48 .

By means of a supply device 10th it is provided the first entrance openings 51 , the second entrance openings 52 and the third entrance openings 53 to supply with the cooling fluid. This is the supply device 10th in a third area 13 in layers in the stacking direction S seen below the second area 12th arranged. Here is the supply device 10th in particular designed in such a way that that of the first edge side 71 part of the system facing 61 the supply device 10th to supply the first entrance opening 51 , the second entrance opening 52 and the third entrance opening 53 is provided during that of the second edge side 72 of the system facing second section 62 is provided to drain the used cooling fluid. In particular, the first section extends 61 in the assembled state in the stacking direction S seen below the first entrance openings 51 , the second entrance openings 52 and the third entrance openings 53 while the second section 62 in the assembled state in the stacking direction S seen below the first exit openings 81 , the second exit openings 82 and the third exit openings 83 is arranged. Here are the first part 61 and the second section 62 Seen transversely to the primary direction PR arranged side by side and extend in length parallel to the primary direction PR , preferably over the entire length of the arrangement from the first electronics module 21 , second electronics module 22 and third electronics module 23 . By moving in the primary direction PR running channeling the cooling fluid is given a main flow direction, which is substantially parallel to the primary direction PR runs and along which the cooling fluid successively the first cooling channel arrangement 31 , the second cooling channel arrangement 32 and the third cooling channel arrangement 33 happens. The first section 61 will also have a liquid reservoir 45 supplied with the cooling fluid, while the used cooling fluid also in a liquid reservoir 45 drains away. In the primary direction PR seen the first electronics module 21 , the second electronics module 22 and the third electronics module 23 (with the corresponding cooling channel arrangements) between the liquid reservoirs 45 arranged for supply and disposal. The liquid reservoirs 45 in particular form part of the supply device 10th and are in the stacking direction S seen at the same height as the first section 61 and the second section 62 arranged. The liquid reservoirs preferably have 45 Connections, especially a supply connection 54 and a drain port 55 on which the supply device 10th can be connected to an external cooling fluid circuit so as to supply the cooling device with fresh cooling fluid 10th to deliver and used cooling fluid from the corresponding liquid reservoir 45 dissipate again. The main functionality of the supply device 10th consists of the cooling fluid on the first inlet openings 51 , the second entrance openings 52 and the third entrance openings 53 to distribute.

For a homogeneous cooling of the first electronics module 21 , of the second electronics module 22 and the third electronics module 23 it is provided that the supply device 10th , especially the first section 61 the supply device 10th a first supply channel 41 and at least one second supply channel 42 having. In the present case, the supply device comprises 10th next to the second Supply channel 42 a third supply channel 43 . This is the first supply channel 41 , the second supply channel 42 and the third supply channel 43 formed separately and essentially follow the primary direction in their longitudinal extent PR . For example, the first supply channel 41 and the second supply channel 42 through a substantially parallel to the main extension plane HSE trending wall 8th separated from each other. The first supply channel 41 is to supply the first entrance openings 51 , the second supply channel 42 to supply the second entrance opening 52 and the third supply channel 43 to supply the third entrance openings 53 intended. By separating the first supply channel 41 and the second supply channel 42 The cooling fluid can advantageously be guided in such a way that that for the second inlet openings 52 provided cooling fluid is guided so that it is as unused as possible at the second inlet openings 52 arrives.

For this purpose, it is particularly provided that in a first section 91 below the first electronics module 21 a distance of the second supply channel 42 to the first cooling duct arrangement 31 in the stacking direction S seen is greater than the distance of the first supply channel 41 to the first cooling duct arrangement 31 . In the first part 91 of the first electronics module 21 closes in the stacking direction S seen the first cooling channel arrangement 31 preferably directly to the first supply channel 41 on while the distance of the second supply channel 42 to the first cooling duct arrangement 31 ensures that in the second supply channel 42 led cooling fluid does not interact with the first cooling channel arrangement 31 .

In the primary direction PR seen the first supply channel ends 41 in the first part 91 or with the completion of the first section 91 , the first electronic module 21 is assigned and in the stacking direction S below the first electronics module 21 lies while the second supply channel 42 itself in the primary direction PR down to a second section 92 , which is below the second electronics module 22 lies, extends. Here is the second supply channel 42 in the stacking direction S seen offset in height compared to its course in the first section 91 . In particular, the second supply channel 42 in the second section 92 compared to the first section 91 offset in height and directly adjacent to the second cooling duct arrangement 32 at. The third supply channel 43 is designed so that its in the stacking direction S dimensioned distance to the first cooling duct arrangement 31 or second cooling channel arrangement 32 in the first part 91 and in the second section 92 of the second electronics module 32 is greater than the corresponding distances between the first supply channel 41 or second supply channel 42 in the first part 91 or second section 92 . The distance between the third supply channel 43 to the second cooling duct arrangement 32 in the second section 92 smaller than the distance of the third supply channel 43 to the first cooling duct arrangement 31 in the first part 91 . The distance of the third supply channel preferably corresponds 43 to the second cooling duct arrangement 32 in the second section 92 the distance of the second supply channel 42 to the first cooling duct arrangement 41 in the first part 91 .

In particular, it is provided that the distance between the second supply channel changes 42 or third supply channel 43 to the second area 12th after the first section 91 or the second section 92 each reduced until the second supply channel 42 on the second cooling duct arrangement 32 in the second section 92 and the third supply channel 43 on the third cooling channel arrangement 33 in the third section 93 is present. For the height offset of the second supply channel 42 or third supply channel 43 in the stacking direction S seen it is preferably provided that a wall 8th that, for example, the first supply channel 41 from the second supply channel 42 separates, takes a graded course. It is also provided that the wall 8th that, for example, the first supply channel 41 and the second supply channel 42 separates from one another, is made from a material with a comparatively low thermal conductivity, preferably from a material with a thermal conductivity that is less than the thermal conductivity of the base body of the first cooling channel arrangement 31 , the second cooling channel arrangement 32 and / or the third cooling duct arrangement 33 is. It is also conceivable that the wall 8th is formed in several parts and in particular comprises cavities or is at least partially porous. These structural measures advantageously allow the thermal conductivity of the wall 8th alternatively or additionally reduce.

In the illustrated embodiment are in the stacking direction S seen the first supply channel 41 , the second supply channel 42 and the third supply channel 43 each formed with the same height. Alternatively, it is also conceivable for the heights to differ from one another and, for example, to be adapted to the size of the cooling channel arrangement and / or the number of the inlet opening in order to take into account the fact that the individual electronic modules 21 , 22 , 23 need or consume different amounts of cooling fluid per unit of time.

It is also provided that the first supply channel 41 , the second supply channel 42 and the third supply channel 43 each the common input Liquid reservoir 45 arise from. The walls protrude here 8th that the respective supply channels 41 , 42 , 43 separate from one another and which extend essentially parallel to one another, into the inlet-side liquid reservoir 45 inside. In particular, ends in the primary direction PR seen in the first section 61 the first supply channel 41 before the second section 92 below the second electronics module 22 begins or the second supply channel 42 ends before the third section 93 below the third electronics module 23 starts etc.

While in 1 the side view of the first section 61 with the first supply channel 41 , the second supply channel 42 and the third supply channel 43 is shown in 3rd the second section 62 with a first drain channel 65 , a second drain channel 66 and a third drain channel 67 shown, especially in the area of the second edge side 72 . The first drain channel 65 , the second drain channel 66 and the third drain channel 67 serve to discharge the from the first exit openings 81 , the second exit openings 82 and the third exit openings 83 leaking and used cooling fluids. The first drain channel 65 , the second drain channel 66 and the third drain channel 67 open into a common outlet-side liquid reservoir 45 . The first drain channel 65 that the first exit openings 91 the first cooling channel arrangement 31 is assigned, points in the primary direction PR seen a stepped course, with each section of an electronic module 21 , 22 , 23 can be assigned, the distance of the first drain channel 65 to the corresponding cooling duct arrangement 31 , 32 , 33 increases. The same applies to the second drain channel 66 or third drain channel 67 , the second drain channel 66 in the primary direction PR seen only with the second section 92 begins, or where the third drain channel 67 in the primary direction PR seen only with the third section 93 , the third electronics module 23 assigned begins. In particular, the first drain channel 65 , the second drain channel 66 and the third drain channel 67 reversed to the first supply channel 41 , the second supply channel 42 and the third supply channel 43 .

In 4th is schematically a cooling device 1 for a first electronics module 21 and at least one second electronics module 22 according to a second exemplary embodiment of the present invention shown in a sectional view. The object differs from the 4th in front of the one from the 1 to 3rd essentially only in that in the 4th Adapter elements 15 provided between the first electronics module 21 and the second electronics module 22 or between the second electronics module 22 and the third electronics module 33 are arranged. About the adapter elements 15 finds a connection between the first electronic module, for example 21 and the second electronic module 22 or the first cooling channel arrangement 31 and the second cooling channel arrangement 32 instead of. It is also provided the adapter elements 15 are designed such that the adapter element 15 for the height offset of the second supply channel 42 or the third supply channel 43 between the first section 91 and the second section 92 or between the second section 92 and the third section 93 worries. In particular, there is a stepped course of the second supply channel 42 or the third supply channel 43 inside the adapter element 15 realized. In addition, it is preferably provided that the adapter element 15 additionally a graded course for the first drain run channel 65 , the second drain channel 66 or the third drain channel 67 inside the adapter element 15 realized. In other words: the adapter element 15 connects both the supply channels 41 , 42 , 43 as well as the drain channels 65 , 66 , 67 with each other and is configured accordingly.

Reference list

1

Cooler

3rd

Component side

4th

Cooling side

5

Component

6

Metallization

8th

wall

10th

Supply device

11

first area

12th

second area

13

third area

15

Adapter element

21

first electronics module

22

second electronics module

23

third electronics module

31

first cooling channel arrangement

32

second cooling channel arrangement

33

third cooling channel arrangement

41

first supply channel

42

second supply channel

43

third supply channel

45

Liquid reservoir

48

channel

51

first entrance opening

52

second entrance opening

53

third entrance opening

54

Supply connection

55

Discharge connection

61

first section

62

second section

65

first drain channel

66

second drain channel

67

third drain channel

71

first edge page

72

second margin

81

first exit opening

82

second exit opening

83

third exit opening

91

first section

92

second part

93

third section

PR

Primary direction

SR

Secondary direction

S

Stacking direction

HSE

Main extension level

QUOTES INCLUDE IN THE DESCRIPTION

This list of documents listed by the applicant has been generated automatically and is only included for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent literature cited

• DE 102013109246 A1 [0002]

Claims (10)

Cooling device (1) for cooling a first electronics module (21) and at least a second electronics module (22), comprising - A first cooling channel arrangement (31) which is assigned to the first electronics module (21) in a first section (91), and - At least one second cooling duct arrangement (32) which is assigned to the second electronics module (22) in a second section (92), the first cooling duct arrangement (91) having at least one first inlet opening (51) and the second cooling duct arrangement (32) at least one second Input opening (52), wherein a cooling fluid can be introduced into the first cooling channel arrangement (31) via the first input opening (51) and into the second cooling channel arrangement (32) via the second input opening (52), a supply device (10) being provided which can be coupled to the first cooling duct arrangement (31) and the second cooling duct arrangement (32) and which has a first supply duct (41) and at least one second supply duct (42) separate from the first supply duct (41), and wherein the supply device (10) is designed such that the cooling fluid via the first supply channel (41) to the first inlet opening (51) and via the second supply supply channel (42) to the second input opening (52) can be guided. Cooling device (1) according to Claim 1 , wherein the second supply channel (42) has a stepped course or a height offset for leading the second supply channel (42) to the second cooling channel arrangement (32), in particular in a transition area between the first section (91) and the second section (92). Cooling device (1) according to one of the preceding claims, wherein the first supply channel (41) and the second supply channel (42) in the first section (91), in particular in the stacking direction (S), are arranged one above the other, the first supply channel (41) and the second supply channel (42) is preferably separated from one another by a wall (8) which extends essentially parallel to a main extension plane (HSE) of the cooling device (1). Cooling device (1) according to one of the preceding claims, wherein the second section (92) and the first section (91) are arranged one behind the other as seen in a primary direction (PR), the first supply channel (41) and the second supply channel (42) extend substantially along the primary direction (PR). Cooling device (1) according to one of the preceding claims, wherein the supply device (10) has a first outlet channel (65) and a second outlet channel (66) separate from the first outlet channel (65), the first outlet channel (65) for discharging the cooling fluid At least one first outlet opening (81) of the first cooling channel arrangement (31) and the second outlet channel (66) are provided for discharging the cooling fluid from at least one second outlet openings (82) of the second cooling channel arrangement (32), the first outlet channel (65) and the second discharge channel (66) in the second section (92) are arranged one above the other in the stacking direction (S) and / or the first discharge channel (65) and the second discharge channel (66) extend essentially along the primary direction (PR). Cooling device (1) according to one of the preceding claims, wherein the supply device (10) a liquid reservoir (45) for introducing the cooling fluid into the first supply channel (41) and the second supply channel (42) and / or a liquid reservoir (45) for collecting the Cooling fluid flowing via the first drain channel (65) and the second drain channel (66), the first supply channel (41) and the second supply channel (41) and / or the first drain channel (65) and the second drain channel (66) preferably being shown in FIG Primary direction (PR) is arranged between the liquid reservoir (45) for introduction and the liquid reservoir (45) for collecting. Cooling device (1) according to one of the preceding claims, wherein the first supply channel (41) extends over the first section (91), in particular only over the first section (91) and / or only a region of the first section (91), and the second supply channel (42) extends over the first section (91) and the second section (92). Cooling device (1) according to one of the Claims 4 to 7 , wherein the first cooling duct arrangement (31) and / or the second cooling duct arrangement (32) has at least one duct (48), in particular a loop-shaped duct (48), which is located between the first inlet opening (51) and the first outlet opening (81) and / or between the second input opening (52) and the second output opening (82) along a secondary direction (SR), the secondary direction (SR) obliquely to the primary direction (PR), in particular perpendicular to the primary direction (P). Supply device (10) for a cooling device (1) for cooling a first electronic module (21) and at least a second electronic module (22), in particular according to one of the preceding claims, wherein the supply device (10) - to the first cooling channel arrangement (31) and second cooling channel arrangement (32), can be coupled and - has a first supply channel (41) and at least one second supply channel (42) separate from the first supply channel (41), the supply device (10) being designed such that the cooling fluid via the first supply channel (41) to the first inlet opening (51) and can be guided to the second input opening (52) via the second supply channel (42) Method for cooling a first electronics module (21) and at least one second electronics module (22) with a cooling device (1) according to one of the Claims 1 to 8th .

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