WO2012028144A2 - A cooling device with at least two coolant flow modules - Google Patents

A cooling device with at least two coolant flow modules Download PDF

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Publication number
WO2012028144A2
WO2012028144A2 PCT/DK2011/000098 DK2011000098W WO2012028144A2 WO 2012028144 A2 WO2012028144 A2 WO 2012028144A2 DK 2011000098 W DK2011000098 W DK 2011000098W WO 2012028144 A2 WO2012028144 A2 WO 2012028144A2
Authority
WO
WIPO (PCT)
Prior art keywords
coolant
flow
cooling device
manifold
inlet manifold
Prior art date
Application number
PCT/DK2011/000098
Other languages
French (fr)
Other versions
WO2012028144A3 (en
Inventor
Klaus Olesen
Lars Paulsen
Original Assignee
Danfoss Drives A/S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danfoss Drives A/S filed Critical Danfoss Drives A/S
Publication of WO2012028144A2 publication Critical patent/WO2012028144A2/en
Publication of WO2012028144A3 publication Critical patent/WO2012028144A3/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C14—SKINS; HIDES; PELTS; LEATHER
    • C14B—MECHANICAL TREATMENT OR PROCESSING OF SKINS, HIDES OR LEATHER IN GENERAL; PELT-SHEARING MACHINES; INTESTINE-SPLITTING MACHINES
    • C14B1/00—Manufacture of leather; Machines or devices therefor
    • C14B1/02—Fleshing, unhairing, samming, stretching-out, setting-out, shaving, splitting, or skiving skins, hides, or leather
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0031—Radiators for recooling a coolant of cooling systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/14—Safety or protection arrangements; Arrangements for preventing malfunction for preventing damage by freezing, e.g. for accommodating volume expansion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A cooling device (14) for cooling a surface (10) is disclosed. The cooling device (14) comprises at least two coolant flow modules, an inlet manifold (2) and an outlet manifold (3). Each coolant flow module comprises at least one flow cell (9) arranged to guide a flow of coolant along a surface (10) to be cooled. The inlet manifold (2) is arranged to deliver coolant to each of the coolant flow modules, and the outlet manifold (3) is arranged to receive coolant from each of the coolant flow modules, the coolant flow modules being arranged fluidly in parallel between the inlet manifold (2) and the outlet manifold (3). The cooling device (14) further comprises a coolant return system (6) interconnecting the outlet manifold (3) and the inlet manifold (2) in such a manner that a closed coolant circuit (1) is formed by the inlet manifold (2), the coolant flow modules, the outlet manifold (3) and the coolant return system (6). A coolant circulation means, such as a pump (12), is arranged to cause coolant to circulate in the closed coolant circuit (1). A heat exchanger (7) is arranged to exchange heat between an air flow and coolant flowing in the coolant return system (6). In the cooling device (14) of the invention, the closed coolant circuit (1) provides efficient heat transfer from the surface (10) to be cooled without the disadvantages of an open coolant circuit requiring a coolant supply. The heat exchanger provides heat removal from the device (14) and makes the device (14) easy to install.

Description

A COOLING DEVICE WITH AT LEAST TWO COOLANT FLOW MODULES
FIELD OF THE INVENTION
The present invention relates to a cooling device for providing cooling to one or more surfaces. More particularly, the cooling device of the present invention comprises at least two coolant flow modules and a heat exchanger arranged to exchange heat between an air flow and coolant which has been heated while flowing in the coolant flow modules. The invention further relates to a power module assembly with at least one power module defining a surface to be cooled, and comprising such a cooling device. BACKGROUND OF THE INVENTION
Electronic components, such as power modules, produce heat, and it is therefore often necessary to provide cooling for such components during operation in order to ensure that they operate in a correct manner. In some cooling devices the cooling is provided by allowing a part of the electronic component to heat exchange with a passing flow of air. This is a simple manner of providing cooling, since it does not require plumbing or introduce the risk of leaking liquid in the vicinity of the electronic component. On the other hand, the relatively low thermal capacity of air requires a very high flow rate in order to transfer heat from the electronic component sufficiently fast. Such an approach therefore requires power for fans to be used, thus increasing cost and reducing efficiency. Furthermore, powerful fans generate noise, which may be
inappropriate in certain applications. An alternative approach is to use a relatively large heat transfer area, but this in turn requires a much greater volume for the heat exchanger, a volume which may not be readily available in modern equipment, and spreading the heat efficiently out from a relatively small electronic component to the relatively large heat exchanger may be difficult.
Other cooling devices apply liquid cooling where a flow of liquid is passed along the surface to be cooled. The relatively high thermal capacity of the liquid ensures an efficient heat transfer from the electronic component to the cooling liquid. However, the liquid cooling approach requires plumbing and liquid supply.
US 7,660,120 B2 discloses a power supply unit for an electrical appliance, such as a computer. The electrical appliance has a fan device, wherein a radiator for a liquid cooling device is integrated into the power supply unit.
US 6,263,957 B1 discloses an integrated active cooling device for board mounted electric components. The device may include a plate couplable to and supportable by the electronic component, the plate having at least one channel therein. The device may further comprise a closed-circuit circulation pipe having a heat-receiving portion disposed in the at least one channel to place the heat- receiving portion in thermal communication with the plate. The circulation pipe further has a heat-removing portion distal from the heat receiving portion.
DESCRIPTION OF THE INVENTION
It is an object of embodiments of the invention to provide a cooling device which provides efficient cooling of one or more surfaces while using air as a heat transfer medium.
It is a further object of embodiments of the invention to provide a cooling device which can easily be adapted to a desired cooling rate.
It is an even further object of embodiments of the invention to provide an efficient cooling device which is compact in size.
It is an even further object of embodiments of the invention to provide a power module assembly which can be efficiently cooled while maintaining a compact size.
According to a first aspect the invention provides a cooling device comprising: - at least two coolant flow modules, each comprising at least one flow cell, each of the flow cells being arranged to guide a flow of coolant along a surface to be cooled,
- an inlet manifold and an outlet manifold, the inlet manifold being
arranged to deliver coolant to each of the coolant flow modules, and the outlet manifold being arranged to receive coolant from each of the coolant flow modules, the coolant flow modules being arranged fluidly in parallel between the inlet manifold and the outlet manifold,
- a coolant return system interconnecting the outlet manifold and the inlet manifold in such a manner that a closed coolant circuit is formed by the inlet manifold, the coolant flow modules, the outlet manifold and the coolant return system,
- a coolant circulation means arranged to cause coolant to circulate in the closed coolant circuit, and - a heat exchanger arranged to exchange heat between an air flow and coolant flowing in the coolant return system.
In the present context the term 'cooling device' should be interpreted to mean a device which is adapted to transfer heat from a heat producing component, thereby reducing the temperature of said component. The cooling device comprises at least two coolant flow modules. In the present context the term 'coolant' should be interpreted to mean a fluid which is arranged to transfer heat away from a surface to be cooled. The coolant may be a liquid or a mixed state fluid, i.e. a fluid containing a mixture of liquid and gaseous fluid. In the latter case, the coolant may be a refrigerant flowing in a refrigerant circuit where expansion and compression of the coolant is
alternatingly performed, the state of the coolant thereby depending on the position of the coolant along the refrigerant circuit. Each of the coolant flow modules comprises at least one flow cell, each being arranged to guide a flow of coolant along a surface to be cooled. Thereby heat from the surface to be cooled is transferred to the coolant flowing in the flow cells. The cooling device further comprises an inlet manifold and an outlet manifold. The inlet manifold is arranged to deliver coolant to each of the coolant flow modules, and the outlet manifold is arranged to receive coolant from each of the coolant flow modules. The coolant flow modules are arranged fluidly in parallel between the inlet manifold and the outlet manifold. This arrangement minimises the temperature gradient of coolant flowing from the inlet manifold to the outlet manifold.
The cooling device further comprises a coolant return system. The coolant return system interconnects the outlet manifold and the inlet manifold in such a manner that a closed coolant circuit is formed by the inlet manifold, the coolant flow modules, the outlet manifold and the coolant return system. Accordingly, coolant from the inlet manifold is distributed among the coolant flow modules. In the flow cell(s), the coolant is guided along the surface(s) to be cooled, and is collected in the outlet manifold, and finally the coolant is returned to the inlet manifold via the coolant return system, and the coolant is thereby ready to be once again distributed among the coolant flow modules. The closed coolant circuit allows the liquid or mixed phase coolant to be re-circulated to provide continuous cooling of the surface(s) to be cooled, and an external supply of coolant is therefore not required, thereby allowing the cooling device to be installed without the requirement of plumbing and pipe work. The coolant circulation means is arranged to cause coolant to circulate in the closed coolant circuit. The coolant circulation means may be or comprise a pump which actively urges the flow of the coolant along the coolant circuit. As an alternative, the coolant circulation means may be or comprise a compressor, or any other suitable active circulation means. As another alternative, the coolant may be self-circulating, the coolant circulation means in this case being provided as a result of cooperation between the design of the closed coolant circuit and the coolant, and without the use of an external power source. For instance, the coolant may be under a reduced pressure which causes the coolant to boil when it is heated due to the heat transfer from the surface(s) to be cooled. Thereby steam bubbles are formed in the coolant, and the bubbles cause an upward flow which drives the coolant along the closed coolant circuit, i.e. causes circulation of the coolant. This is sometimes referred to as a 'bubble pump'. As a further alternative, the coolant may be self-circulating by means of convective flow wherein the density change caused by heating the coolant cause the warm coolant to rise, thereby causing a general flow of the coolant.
Since heat transfer takes place as coolant is guided along the surface(s) to be cooled by means of the flow cells, the temperature of the coolant flowing in the closed coolant circuit is increased each time a full circle of the closed coolant circuit is completed. In order to prevent the temperature of the coolant from increasing continuously and indefinitely, the cooling device comprises a heat exchanger which is arranged to exchange heat between an air flow and coolant medium flowing in the coolant return system. It is an advantage that the heat exchanger is arranged in such a manner that heat exchange takes place with coolant flowing in the coolant return system, because it is thereby ensured that heat is transferred from the coolant to the air flow after heat has been
transferred to the coolant from the surface(s) to be cooled while the coolant flows in the flow cells, and before the coolant is supplied to the inlet manifold for distribution among the module inlet manifolds and further onto the flow cells. Thereby it is ensured that the temperature of coolant supplied to the flow cells is as low as possible, thereby ensuring efficient heat transfer from the surface(s) to be cooled to the coolant, and thereby efficient cooling is provided.
Furthermore, a uniform temperature of coolant supplied to each of the coolant flow modules is ensured.
In summary, the cooling device of the invention comprises a liquid or two-phase cooling system arranged in thermal contact with the surface(s) to be cooled and forming a closed circuit in which the liquid or two-phase coolant circulates. Furthermore, the cooling device comprises a heat exchanger, e.g. in the form of an air to liquid heat exchanger, which provides heat exchange between an air flow and the coolant flowing in the closed circuit, thereby removing heat from the cooling device. The liquid or two-phase cooling system provides efficient heat transfer from the surface(s) to be cooled, and the heat exchanger allows the heat to be easily removed from the cooling device. The liquid or two-phase cooling system may be provided as a compact unit, e.g. integrated into an electrical component which requires cooling. In this case installation of the cooling device is very similar to the installation of ordinary cooling devices applying air cooling. However, the liquid or two-phase cooling system allows the cooling device to be easily adapted to a desired and required cooling rate.
As described above, the coolant may be a refrigerant which is alternatingly expanded and compressed while circulating the closed coolant circuit. In this case the closed coolant circuit function as a refrigerant circuit, where the part of the closed coolant circuit accommodating the flow cells acts as an evaporator, and the heat exchanger acts as a condenser.
The cooling device may further comprise air circulation means arranged to provide a heat exchanging air flow in the heat exchanger. The air circulation means may, e.g., be or comprise a fan arranged at or near the coolant return system, the fan being arranged in such a manner that it blows air across a heat exchanging part of the coolant return system. As an alternative, the air circulation means may be or comprise any other suitable kind of device being capable of creating a flow of air, such as a blower and/or nozzles, etc.
The coolant return system may comprise at least two coolant return paths, the coolant return paths being arranged fluidly in parallel between the outlet manifold and the inlet manifold, and each of the coolant return paths forming part of the heat exchanger. According to this embodiment, the coolant passes from the outlet manifold towards the inlet manifold via at least two parallel flow paths, i.e. the at least two coolant return paths. Each of the coolant return paths forms part of the heat exchanger, i.e. coolant flowing in each of the coolant return paths is brought into thermal contact with the air flow in the heat exchanger. This is an advantage, because it provides efficient heat exchange between the coolant and the air flow, among other things due to an increased surface area of the heat exchanging part of the coolant return system.
Accordingly, heat which has been transferred to the coolant from a surface to be cooled while the coolant was flowing in the flow cells is, according to this embodiment, efficiently removed from the cooling device by means of the air flow. Thereby a relatively high cooling capacity can be obtained.
The coolant return system may comprise an intermediate reservoir fluidly interconnecting a heat exchanging part of the coolant return system and the inlet manifold or the outlet manifold. According to this embodiment, the coolant may flow from the outlet manifold to the intermediate reservoir while passing the heat exchanger and thereby exchanging heat with the air flow. Subsequently the coolant flows from the intermediate reservoir to the inlet manifold. Collecting the coolant in an intermediate reservoir after the heat exchange and before supplying the coolant to the inlet manifold allows the coolant to be mixed after the heat exchange, thereby ensuring a uniform temperature of the coolant being supplied to the inlet manifold. This may, e.g., be relevant in the case that a temperature gradient has been introduced in the coolant by the heat exchanger. As an alternative, coolant may flow from the outlet manifold to the intermediate reservoir, before entering the heat exchanging part of the coolant return system.
In the case that the coolant return system comprises an intermediate reservoir as described above, the coolant circulation means may be arranged between an outlet opening formed in the intermediate reservoir and an inlet opening formed in the inlet manifold, or between an outlet opening formed in the outlet manifold and an inlet opening formed in the intermediate reservoir. In this case the coolant circulation means may advantageously be or comprise a pump or similar means. According to this embodiment, the coolant circulation means draws coolant from the intermediate reservoir/outlet manifold, via the outlet opening formed in the intermediate reservoir/outlet manifold, and delivers it directly to the inlet manifold/intermediate reservoir via the inlet opening formed in the inlet manifold/intermediate reservoir.
As an alternative to the embodiment described above, a heat exchanging part of the coolant return system may directly interconnect the outlet manifold and the inlet manifold. According to this embodiment, the coolant flows directly from the outlet manifold to the inlet manifold while exchanging heat with the air flow. This is a simple construction which allows at least the inlet manifold, the outlet manifold, the module inlet manifolds and the module outlet manifolds to be manufactured in one piece, e.g. in the form of machined cavities or sheet metal parts.
The cooling device may further comprise an expansion tank arranged in the closed coolant circuit. The expansion tank may be used as a coolant buffer in the sense that when the cooling device is initially installed and charged with coolant, an additional amount of coolant, corresponding to the volume of the expansion tank, is supplied to the closed coolant circuit. In the case that a coolant loss is introduced during operation of the cooling device, the coolant stored in the expansion tank can be used in the closed coolant circuit, and it is therefore not necessary to replenish the closed coolant circuit in order to have a fully operational cooling device. Furthermore, the expansion tank reduces the requirements to accuracy when the closed cooling system is initially charged.
Each of the flow modules may comprise a module inlet manifold, a module outlet manifold and at least two flow cells establishing parallel flow paths between the module inlet manifold and the module outlet manifold, and the inlet manifold may be arranged to deliver coolant to each of the module inlet manifolds, and the outlet manifold may be arranged to receive coolant from each of the module outlet manifolds.
According to this embodiment, coolant from the module inlet manifold is supplied directly to each of the flow cells, and each of the flow cells deliver coolant directly to the module outlet manifold. Thereby the temperature gradient of the coolant flowing from the module inlet manifold to the module outlet manifold is minimised. Furthermore, each of the flow cells is arranged to guide a flow of coolant along a surface to be cooled. Thereby heat from the surface to be cooled is transferred to the coolant flowing in the flow cells. Accordingly, the fluidly parallel arrangement of the flow cells provides efficient and uniform cooling of the surface to be cooled.
Furthermore, the inlet manifold is arranged to deliver coolant to each of the module inlet manifolds, and the outlet manifold is arranged to receive coolant from each of the module outlet manifolds, and the coolant flow modules are arranged fluidly in parallel between the inlet manifold and the outlet manifold. Accordingly, the flow cells are arranged in parallel within the respective coolant flow modules, and the coolant flow modules are further arranged fluidly in parallel relatively to each other. This arrangement minimises the temperature gradient of coolant flowing from the inlet manifold to the outlet manifold. Thus, according to this embodiment, coolant from the inlet manifold is distributed among the module inlet manifolds of the coolant flow modules. From each of the module inlet manifolds, the coolant is distributed among the flow cells, guided along the surface(s) to be cooled via each of the flow cells and collected in the module outlet manifold of the coolant flow module in question. Coolant from each of the module outlet manifolds is then collected in the outlet manifold, and finally the coolant is returned to the inlet manifold via the coolant return system, and the coolant is thereby ready to be once again distributed among the coolant flow modules.
The flow cells of at least one of the coolant flow modules may be arranged in a two-dimensional pattern along a surface to be cooled. According to this embodiment, the flow cells of a given coolant flow module are arranged in parallel in two directions along the surface to be cooled. Thereby very uniform cooling can be provided to the surface to be cooled, because the temperature gradient introduced as coolant passes along a surface to be cooled, via a given flow cell, is only introduced along a small part of the surface, i.e. the part covered by the flow cell in question. Furthermore, the two-dimensional distribution of the flow cells allows the cooling device to be designed in such a manner that 'tailored cooling' is obtained, i.e. in such a manner that more cooling is provided to areas of the surface which are expected to produce a large amount of heat, and less cooling is provided to areas of the surface which are expected to produce a smaller amount of heat.
At least one of the flow cells of at least one of the coolant flow modules may define a meandering flow path between the module inlet manifold and the module outlet manifold. According to this embodiment, a turbulent flow of the coolant is provided. Such turbulent flow causes a constant exchange of coolant lying adjacent to the surface to be cooled with coolant from within the body of the coolant flow. The surface to be cooled is thereby constantly being presented with fresh, cool coolant in a manner in which utilises the potential heat transfer capacity of the coolant to the greatest possible extent. At least the closed coolant circuit may form an integrated part of a power module assembly, said power module assembly comprising one or more surfaces to be cooled. According to this embodiment, the closed coolant circuit is built directly into the power module assembly. Thus, the power module assembly is manufactured and delivered along with the closed coolant circuit. Accordingly, when the power module assembly is installed at the operating site, the operator does not have to worry about the coolant circuit part of the cooling device. The power module assembly is simply installed and air cooling connected. This makes the installing process very easy, and the risk of errors being introduced during installation of the power module assembly is minimised. According to a second aspect the invention provides a power module assembly comprising at least one power module defining at least one surface to be cooled, and a cooling device according to the first aspect of the invention, said cooling device being arranged to provide cooling for at least one of said surface(s). It should be noted that a person skilled in the art would readily recognise that any feature described in combination with the first aspect of the invention could also be combined with the second aspect of the invention, and vice versa.
BRIEF DESCRIPTION OF THE DRAWINGS The invention will now be described in further detail with reference to the accompanying drawings in which
Fig. 1 is a perspective view of a part of a cooling device according to a first embodiment of the invention,
Figs. 2 and 3 are perspective views of the part of Fig. 1 from a reverse angle and during manufacture of the cooling device,
Fig. 4 is another part of the cooling device according to the first embodiment of the invention,
Fig. 5 is an end view of a coolant circuit of a cooling device according to the first embodiment of the invention, Fig. 6 is a cross sectional view a the coolant circuit similar to the coolant circuit of Fig. 5,
Fig. 7 is a perspective view of the coolant circuit of the cooling device according to the first embodiment of the invention,
Fig. 8 is a perspective view of the coolant circuit of Fig. 7 with a pump and an expansion tank mounted thereon,
Fig. 9 is a perspective view of a cooling device according to the first
embodiment of the invention, Fig. 10 is a perspective view of the cooling device of Fig. 9 from a reverse angle,
Fig. 11 is a perspective view of a coolant circuit for a cooling device according to a second embodiment of the invention, and Fig. 12 is an exploded view of the coolant circuit of Fig. 11.
DETAILED DESCRIPTION OF THE DRAWINGS
Fig. 1 is a perspective view of a coolant circuit 1 for a cooling device according to a first embodiment of the invention. The coolant circuit 1 comprises an inlet manifold 2 and an outlet manifold 3. The inlet manifold 2 is fluidly connected to seven module inlet manifolds 4, each module inlet manifold 4 forming part of a coolant flow module. The outlet manifold 3 is fluidly connected to seven module outlet manifolds 5, each forming part of one of the coolant flow modules. Baffles (not shown) can be received in cavities formed at the positions of each of the module inlet manifolds 4 and module outlet manifolds 5, each baffle defining at least two flow cells fluidly interconnecting the module inlet manifold 4 and the module outlet manifold 5 of the corresponding coolant flow module. Thus, coolant flows from the inlet manifold 2, into each of the module inlet manifolds 4, further on to the module outlet manifolds 5, via the respective flow cells, and finally into the outlet manifold 3. The coolant circuit 1 shown in Fig. 1 may advantageously be manufactured from an extruded aluminium plate with machined cavities for receiving the baffles and machined holes for fluid communication.
Figs. 2 and 3 are perspective views of the coolant circuit 1 of Fig. 1 , seen from a reverse angle. In Figs. 2 and 3 the inlet manifold 2 and the outlet manifold 3 are clearly seen. In Fig. 2 channels for the inlet manifold 2 and the outlet manifold 3 have been formed by attaching walls to the extruded aluminium plate. In Fig. 3 the ends of the channels have been closed by end walls, thereby completing the inlet manifold 2 and the outlet manifold 3.
Fig. 4 is a perspective view of a coolant return system 6 for a cooling device according to the first embodiment of the invention. The coolant return system 6 comprises an inlet manifold 2a, an outlet manifold 3a and a heat exchanging part 7 fluidly interconnecting the outlet manifold 3a and the inlet manifold 2a. Thus, coolant can flow from the outlet manifold 3a to the inlet manifold 2a, via the heat exchanging part 7, while exchanging heat with an air flow across the heat exchanging part 7. The coolant return system 6 of Fig. 4 is connectable to the extruded aluminium plate shown in Figs. 1-3, in such a manner that the inlet manifolds 2, 2a shown in Figs. 1-3 and 4, respectively, are arranged adjacent to each other, and in such a manner that the outlet manifolds 3, 3a shown in Figs. 1-3 and 4, respectively, are arranged adjacent to each other. Fig. 5 is an end view of a coolant circuit 1 according to the first embodiment of the invention. In Fig. 5 the extruded aluminium plate shown in Figs. 1-3 and the coolant return system 6 shown in Fig. 4 have been assembled to form the coolant circuit 1.
Fig. 6 is a cross sectional view of a coolant circuit 1 which is similar to the coolant circuit 1 of Fig. 5. In Fig. 6 the coolant flow in the coolant circuit 1 is illustrated. The cross section of Fig. 6 intersects one of the cavities shown in Fig. 1. A baffle 8 is arranged in the cavity, the baffle defining at least two flow cells 9, one of which is shown in Fig. 6, each of the flow cells 9 establishing a fluid connection between a module inlet manifold 4 and a module outlet manifold 5.
The coolant flow in the coolant circuit 1 illustrated in Fig. 6 is as follows. Coolant 2 from the inlet manifold 2 enters module inlet manifolds 4 of each of the coolant flow modules of the cooling device. Only one module inlet manifold 4 is shown in Fig. 6. From the module inlet manifold 4, the coolant is supplied to a number of flow cells 9 defined by the baffle 8. Only one of the flow cells 9 is shown in Fig. 6.
In the flow cells 9, the coolant is guided along a surface 10 of a power module 11. Power modules 11 produce heat, and guiding a flow of coolant along the surface 10 of the power module 11 allows the produced heat to be transferred to the coolant and removed along with the coolant flow.
From the flow cells 9, and after having passed the surface 10, the coolant enters a module outlet manifold 5. From each of the module outlet manifolds 5 the coolant enters the outlet manifold 3 formed from the channel shown in Figs. 1-3. A pump 12 pumps the coolant from the outlet manifold 3 to an intermediate reservoir 16 formed by the tube illustrated in Fig. 4. From the intermediate reservoir 16 the coolant flows towards the inlet manifold 2, via the heat exchanging part 7 of the coolant return system 6, thereby completing a closed coolant circuit 1. In the heat exchanging part 7 of the coolant return system 6 the coolant exchanges heat with an ambient air flow. In the case that the coolant flowing in the coolant return system 6 is a liquid, the heat exchanging part 7 thereby forms a liquid to air heat exchanger. In any event, the heat which was previously transferred from the surface 10 of the power module 11 to the coolant is transferred to the ambient air flow in the heat exchanger 7, and thereby the heat is transferred away from the cooling device.
The pump 12 creates a fluid flow which causes the coolant to flow along the closed coolant circuit 1.
The direct coolant flow along the surface 10 provides efficient heat transfer away from the surface 10. The closed coolant circuit 1 provides recirculation of the coolant flowing along the surface 10, and thereby it is not necessary to provide the cooling device with a coolant supply. Finally, the heat exchanger 7 ensures that heat is transferred away from the cooling device in an easy manner, and that the temperature of the coolant flowing in the closed coolant circuit 1 is not increased, or is only increased insignificantly, during operation.
Figs. 7 and 8 are perspective views of the coolant circuit 1 of Fig. 6. It is clear from Figs. 7 and 8 how the extruded aluminium plate shown in Figs. 1-3 and the coolant return system shown in Fig. 4 are assembled to form the closed coolant circuit. In Fig. 8 the pump 12 is shown. Furthermore, an expansion tank 13 is mounted on an end part of the inlet manifold 2. As described above, the expansion tank 13 allows a surplus of coolant to be initially supplied to the closed coolant circuit 1 , thereby avoiding the requirement of replenishing the coolant charge and reducing the requirements to the accuracy of the supplied coolant charge.
Fig. 9 is a perspective view of a cooling device 14 according to the first embodiment of the invention. The coolant circuit 1 illustrated in Fig. 8 is provided with six power modules 11 , each arranged at a position corresponding to a coolant flow module. A seventh power module has been removed, thereby revealing a baffle 8 defining a number of flow cells, each defining a meandering flow path between the module inlet manifold and the module outlet manifold. Accordingly, the power modules 11 are arranged in such a manner that when coolant flows in the flow cells of a given flow module, it passes along a surface of the power module 11 arranged adjacent to said flow module, substantially as described above with reference to Fig. 6.
The cooling device 14 is further provided with three fans 15 arranged adjacent to the heat exchanging part 7 of the coolant return system 6. The fans 15 are thereby capable of providing a flow of air across the heat exchanger 7, thereby providing efficient heat transfer from the coolant flowing in the heat exchanger 7 to the ambient air.
Fig. 10 is a perspective view of the cooling device 14 of Fig. 9, seen from a reverse angle. In Fig. 10 the fans 15 are clearly seen. Fig. 11 is a perspective view of a part of a coolant circuit 1 for a cooling device according to a second embodiment of the invention. The coolant circuit 1 of Fig. 11 is similar to the coolant circuit 1 illustrated in Figs. 1-10, in that it comprises an inlet manifold 2, and outlet manifold 3, and a number of flow modules, each comprising a module inlet manifold 4 fluidly connected to the inlet manifold 2, and a module outlet manifold 5 fluidly connected to the outlet manifold 3.
The coolant circuit 1 further comprises an intermediate reservoir 16. A heat exchanger 7 is arranged in such a manner that it fluidly interconnects the outlet manifold 3 and the intermediate reservoir 16. An outlet opening 17 of the intermediate reservoir 16 is arranged adjacent to an inlet opening 18 of the inlet manifold 2. Thereby a pump can easily be arranged in this region for pumping coolant from the intermediate reservoir 16 towards the inlet manifold 2, via the outlet opening 17 and the inlet opening 18.
Accordingly, coolant flowing in the coolant circuit 1 of Fig. 11 flows from the inlet manifold 2 into each of the module inlet manifolds 4. From a given module inlet manifold 4, the coolant is distributed among a number of flow cells and guided along a surface to be cooled before entering a module outlet manifold 5. From the module outlet manifolds 5 the coolant flows into the outlet manifold 3, and further on to the intermediate reservoir 16, via the heat exchanger 7, where heat exchange takes place between the coolant and an ambient air flow. From the intermediate reservoir 16 the coolant is supplied to the inlet manifold 2, by means of a pump as described above, thereby completing the coolant cycle.
By collecting the coolant in the intermediate reservoir 16 before supplying it to the inlet manifold 2 it is ensured that the coolant is thoroughly mixed, thereby providing a uniform temperature of the coolant. Furthermore, it is advantageous that a pump can be arranged as described above in order to create the required coolant flow in the coolant circuit 1. Fig. 12 is an exploded view of the coolant circuit 1 of Fig. 11. The inlet manifold 2, the outlet manifold 3, the intermediate reservoir 16 and the heat exchanger 7 can be clearly seen.

Claims

1. A cooling device (14) comprising:
- at least two coolant flow modules, each comprising at least one flow cell (9), each of the flow cell(s) (9) being arranged to guide a flow of coolant along a surface (10) to be cooled,
- an inlet manifold (2) and an outlet manifold (3), the inlet manifold (2) being arranged to deliver coolant to each of the coolant flow modules, and the outlet manifold (3) being arranged to receive coolant from each of the coolant flow modules, the coolant flow modules being arranged fluidly in parallel between the inlet manifold (2) and the outlet manifold
(3),
- a coolant return system (6) interconnecting the outlet manifold (3) and the inlet manifold (2) in such a manner that a closed coolant circuit (1) is formed by the inlet manifold (2), the coolant flow modules, the outlet manifold (3) and the coolant return system (6),
- a coolant circulation means arranged to cause coolant to circulate in the closed coolant circuit (1), and
- a heat exchanger (7) arranged to exchange heat between an air flow and coolant flowing in the coolant return system (6).
2. A cooling device (14) according to claim 1 , further comprising air circulation means (15) arranged to provide a heat exchanging air flow in the heat exchanger (7).
3. A cooling device (14) according to claim 1 or 2, wherein the coolant return system (6) comprises at least two coolant return paths, the coolant return paths being arranged fluidly in parallel between the outlet manifold (3) and the inlet manifold (2), and each of the coolant return paths forming part of the heat exchanger (7).
4. A cooling device (14) according to any of the preceding claims, wherein the coolant return system (6) comprises an intermediate reservoir (16) fluidly interconnecting a heat exchanging part (7) of the coolant return system and the inlet manifold (2) or the outlet manifold (3).
5. A cooling device (14) according to claim 4, wherein the coolant circulation means (12) is arranged between an outlet opening (17) formed in the
intermediate reservoir (16) and an inlet opening (18) formed in the inlet manifold (2), or between an outlet opening formed in the outlet manifold (3) and an inlet opening formed in the intermediate reservoir (16).
6. A cooling device (14) according to any of claims 1-3, wherein a heat exchanging part (7) of the coolant return system (6) directly interconnects the outlet manifold (3) and the inlet manifold (2).
7. A cooling device (14) according to any of the preceding claims, further comprising an expansion tank (13) arranged in the closed coolant circuit (1).
8. A cooling device (14) according to any of the preceding claims, wherein each of the flow modules comprises a module inlet manifold (4), a module outlet manifold (5) and at least two flow cells (9) establishing parallel flow paths between the module inlet manifold (4) and the module outlet manifold (5), and wherein the inlet manifold (2) is arranged to deliver coolant to each of the module inlet manifolds (4), and the outlet manifold (3) is arranged to receive coolant from each of the module outlet manifolds (5).
9. A cooling device (14) according to claim 8, wherein the flow cells (9) of at least one of the coolant flow modules are arranged in a two-dimensional pattern along a surface (10) to be cooled.
10. A cooling device (14) according to any of the preceding claims, wherein at least one of the flow cells (9) of at least one of the coolant flow modules defines a meandering flow path.
11. A cooling device (14) according to any of the preceding claims, wherein at least the closed coolant circuit (1) forms an integrated part of a power module assembly, said power module assembly comprising one or more surfaces (10) to be cooled.
12. A power module assembly comprising at least one power module (11) defining at least one surface (10) to be cooled, and a cooling device (14) according to any of the preceding claims, said cooling device (14) being arranged to provide cooling for at least one of said surface(s) (10).
PCT/DK2011/000098 2010-08-31 2011-08-29 A cooling device with at least two coolant flow modules WO2012028144A2 (en)

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DKPA201000778 2010-08-31
DKPA201000778 2010-08-31

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