DE102017204402A1 - Bauelement mit mikromechanischem Sensormodul - Google Patents

Bauelement mit mikromechanischem Sensormodul Download PDF

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Publication number
DE102017204402A1
DE102017204402A1 DE102017204402.0A DE102017204402A DE102017204402A1 DE 102017204402 A1 DE102017204402 A1 DE 102017204402A1 DE 102017204402 A DE102017204402 A DE 102017204402A DE 102017204402 A1 DE102017204402 A1 DE 102017204402A1
Authority
DE
Germany
Prior art keywords
sensor
stress
sensor module
carrier
electrical contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE102017204402.0A
Other languages
German (de)
English (en)
Inventor
Uwe Hansen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE102017204402.0A priority Critical patent/DE102017204402A1/de
Priority to US15/912,049 priority patent/US10788387B2/en
Priority to JP2018047641A priority patent/JP7037967B2/ja
Publication of DE102017204402A1 publication Critical patent/DE102017204402A1/de
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/04—Means for compensating for effects of changes of temperature, i.e. other than electric compensation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L27/00—Testing or calibrating of apparatus for measuring fluid pressure
    • G01L27/002—Calibrating, i.e. establishing true relation between transducer output value and value to be measured, zeroing, linearising or span error determination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
    • G01L9/06—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices
    • G01L9/065—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices with temperature compensating means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/12—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance, i.e. electric circuits therefor
    • G01L9/125—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance, i.e. electric circuits therefor with temperature compensating means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
DE102017204402.0A 2017-03-16 2017-03-16 Bauelement mit mikromechanischem Sensormodul Pending DE102017204402A1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE102017204402.0A DE102017204402A1 (de) 2017-03-16 2017-03-16 Bauelement mit mikromechanischem Sensormodul
US15/912,049 US10788387B2 (en) 2017-03-16 2018-03-05 Component having a micromechanical sensor module
JP2018047641A JP7037967B2 (ja) 2017-03-16 2018-03-15 微小機械センサモジュールを備える構成要素

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102017204402.0A DE102017204402A1 (de) 2017-03-16 2017-03-16 Bauelement mit mikromechanischem Sensormodul

Publications (1)

Publication Number Publication Date
DE102017204402A1 true DE102017204402A1 (de) 2018-09-20

Family

ID=63372418

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102017204402.0A Pending DE102017204402A1 (de) 2017-03-16 2017-03-16 Bauelement mit mikromechanischem Sensormodul

Country Status (3)

Country Link
US (1) US10788387B2 (ja)
JP (1) JP7037967B2 (ja)
DE (1) DE102017204402A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020212591A1 (de) 2020-10-06 2022-04-07 Robert Bosch Gesellschaft mit beschränkter Haftung Schaltungsanordnung, Steuergerät mit einer Schaltungsanordnung und Verfahren zum Betreiben einer Schaltungsanordnung

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112484902B (zh) * 2020-12-15 2021-08-24 吉林大学 一种电容式压力传感器及温漂解决方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5195046A (en) * 1989-01-10 1993-03-16 Gerardi Joseph J Method and apparatus for structural integrity monitoring
US6948377B2 (en) * 2003-12-08 2005-09-27 Honeywell International, Inc. Method and apparatus for detecting the strain levels imposed on a circuit board
JP4303727B2 (ja) * 2004-01-16 2009-07-29 イビデン株式会社 多層プリント配線板およびプリント配線板用試験体
US7036387B2 (en) * 2004-05-11 2006-05-02 Sun Microsystems, Inc. Integrated strain gages for board strain characterization
WO2008023465A1 (en) * 2006-08-25 2008-02-28 Kyocera Corporation Microelectronic machine mechanism device, and its manufacturing method
US20090303076A1 (en) * 2008-06-04 2009-12-10 Seagate Technology Llc Wireless and battery-less monitoring unit
US20120043999A1 (en) * 2008-07-01 2012-02-23 Quevy Emmanuel P Mems stabilized oscillator
US9021887B2 (en) * 2011-12-19 2015-05-05 Infineon Technologies Ag Micromechanical semiconductor sensing device
US9080932B2 (en) * 2013-05-13 2015-07-14 Apple Inc. Electronic device with printed circuit board stress monitoring
US9888561B2 (en) * 2015-07-21 2018-02-06 Apple Inc. Packaged electrical components with supplemental conductive structures
US9593991B2 (en) * 2015-07-29 2017-03-14 Apple Inc. Printed circuits with embedded strain gauges
US10353503B2 (en) * 2015-10-29 2019-07-16 Texas Instruments Incorporated Integrated force sensing element
US10562761B2 (en) * 2015-11-18 2020-02-18 Kathirgamasundaram Sooriakumar Waterproof microphone and associated packing techniques
US10549982B2 (en) * 2016-02-15 2020-02-04 Stmicroelectronics S.R.L. Pressure sensor encapsulated in elastomeric material, and system including the pressure sensor
EP3261366B1 (en) * 2016-06-21 2021-09-22 Sciosense B.V. Microphone and pressure sensor package and method of producing the microphone and pressure sensor package
WO2019178355A1 (en) * 2018-03-16 2019-09-19 Vesper Technologies, Inc. Transducer system with configurable acoustic overload point
US20190354238A1 (en) * 2018-05-21 2019-11-21 UltraSense Systems, Inc. Ultrasonic touch detection and decision
US11095990B2 (en) * 2018-06-19 2021-08-17 Knowles Electronics, Llc Microphone assembly with reduced noise

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020212591A1 (de) 2020-10-06 2022-04-07 Robert Bosch Gesellschaft mit beschränkter Haftung Schaltungsanordnung, Steuergerät mit einer Schaltungsanordnung und Verfahren zum Betreiben einer Schaltungsanordnung

Also Published As

Publication number Publication date
JP7037967B2 (ja) 2022-03-17
US10788387B2 (en) 2020-09-29
JP2018200301A (ja) 2018-12-20
US20180266909A1 (en) 2018-09-20

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