DE102017112132A1 - Optical circuit board with connector - Google Patents

Abstract

The invention is based on an optical printed circuit board (10a-c) having at least one substrate (12a-c), with at least one optical waveguide (14a-c) arranged on and / or in the substrate (12a-c) at least one edge element (40a-c), which in at least one mounted state is connected to the substrate (12a-c) in at least one edge region (42a-c) of the substrate (12a-c), and with at least one plug unit (44a). It is proposed that the edge element (40a-c) provide at least one reference point (46a-c) for alignment of the plug unit (44a-c) ,

Description

State of the art

The invention relates to an optical printed circuit board according to the preamble of claim 1 and of claim 10 and to a method for assembling an optical printed circuit board according to the preamble of claim 16.

From the German patent application DE 10 2012 112 683 A1 An optical circuit board is already known which has a substrate and a plurality of light guides arranged on the substrate. In an edge region of the substrate, an edge element of the optical circuit board is arranged, which is identical to the substrate and forms the edge region of the substrate. In a mounted state, a plug unit of the optical circuit board is disposed on the substrate. An alignment of the plug unit is effected by two receiving elements, which each have a receiving area, by means of which the plug unit is aligned.

The object of the invention is in particular to provide a generic printed circuit board with improved properties in terms of efficiency. The object is achieved by the features of claims 1, 10 and 16, while advantageous embodiments and modifications of the invention can be taken from the dependent claims.

Advantages of the invention

The invention is based on an optical circuit board having at least one substrate, with at least one light guide, which is arranged on and / or in the substrate, with at least one edge element, which in at least one mounted state is connected to the substrate in at least one edge region of the substrate is, and with at least one plug unit, which is arranged in the mounted state on the substrate and in particular connected to the substrate.

It is proposed that the edge element provide at least one reference point to an orientation of the plug unit.

In this context, an "optical printed circuit board" should be understood in particular to mean a printed circuit board which has at least one optical waveguide which is intended to transmit light signals. Furthermore, the optical circuit board may comprise elements and / or units which are attached to a substrate of the optical circuit board and / or at least partially incorporated in the substrate. These can be, for example, optoelectronic components and / or optical components, in particular linear and / or nonlinear optical components, electronic components and / or electrical conductors and / or units and / or elements for connection and / or coupling of the optical circuit board, in particular with optical systems and / or devices. In this context, a "substrate" is to be understood as meaning, in particular, a carrier element which is intended to form a base layer for an optical printed circuit board. Preferably, the substrate is designed plate-like. The substrate may in particular be made of a hard paper and / or of a polymer plastic and / or of a polymer plastic film and / or of a fiber-reinforced plastic and / or of a combination of different materials. In particular, the substrate may be single-layered or multi-layered. In particular, the substrate could have at least two, advantageously at least four, particularly advantageously at least eight, and preferably a plurality of layers which, for example, could be laminated together.

A "light guide" is to be understood in this context, in particular an optical transmission conductor, which is in particular intended to transport light signals. For example, the optical fiber could in particular comprise a transparent core, preferably of a glass or plastic fiber, and in particular a sheath of a material with a lower refractive index surrounding the core and of the core material. Alternatively, the light guide could in particular be free of at least one jacket and in particular be provided to transport light signals, for example via at least one fluid medium, such as air. Advantageously, the light guide is applied to the substrate and / or at least partially embedded in the substrate. In particular, the jacket of the light guide can be at least partially formed by a base layer applied to the substrate and / or at least partially by a layer of the substrate itself. In particular, the light guide extends to an edge of the substrate and preferably meets at an angle of 70 ° to 110 °, in particular from 80 ° to 100 °, preferably from 85 ° to 95 ° and particularly advantageously from 90 ° to the edge. The optical waveguide can be designed in particular as a single-mode optical waveguide and / or as a multimode optical waveguide. For example, the light guide could be at least partially integrated into the substrate and / or integrally connected to the substrate, advantageously formed integrally with the substrate. Alternatively, the optical waveguide could in particular be arranged on the substrate, for example in a coating arranged on the substrate.

By "in one piece" should be understood in particular to be at least materially bonded, for example by a welding process, an adhesive process, an injection process and / or another process that appears expedient to a person skilled in the art, and / or advantageously shaped in one piece, for example by a Manufacture from a casting and / or by a production in a one- or multi-component injection molding process and advantageously from a single blank.

Advantageously, the optical printed circuit board on a plurality of optical fibers, which are arranged at least in an edge region of the substrate, in particular at least substantially parallel to each other. In this context, an "edge region" of the at least one substrate should be understood to mean, in particular, a maximum of 20 mm, advantageously not more than 10 mm and particularly advantageously not more than 5 mm in the direction of a center of the substrate, starting from an edge of the at least one substrate extends. By "at least substantially parallel" should be understood in particular an orientation of a direction relative to a reference direction, in particular in a plane, wherein the direction relative to the reference direction a deviation in particular less than 5 °, advantageously less than 2 ° and particularly advantageously less than 1 °.

By way of example, the optical printed circuit board could have at least one coating which could be designed, in particular, as a protective layer and / or as an insulating layer. The coating could in particular be interrupted in the edge area and / or have at least one recess, in order in particular to expose the light guide. The optical waveguide could, for example, be arranged and / or run at least partially in the recess and / or the interruption of the coating. Alternatively or additionally, the optical waveguide could be embedded in particular in the substrate and arranged, for example, at least for the most part between at least two layers of the substrate.

The edge element is arranged in particular in the mounted state within the edge region of the substrate. A "plug unit" is to be understood in particular a unit which forms at least a part of a plug. The plug unit could, for example, be provided for making contact with at least one further optical unit. The optical circuit board could, for example, have the further optical unit. For example, the plug unit could have at least one part of at least one adapter, which could be provided, for example, for contacting the further optical unit.

The plug unit could be connected in the mounted state, for example by means of at least one frictional and / or by means of at least one positive connection with the substrate. For example, in the assembled state, the plug unit could be connected to the substrate by means of at least one clamping connection and / or by means of at least one screw connection and / or by means of at least one latching connection. Alternatively or additionally, the plug unit in the assembled state could be connected to the substrate, for example by means of at least one cohesive connection, for example by means of an adhesive connection.

A "reference point" should be understood in particular to be a reference which defines and / or defines a position, in particular a position and / or an orientation of the plug unit, in particular relative to the substrate and advantageously relative to the light guide. The reference point could be, for example, at least one marking, which could be provided in particular for the orientation of the plug unit. Alternatively or additionally, the reference point could be at least part of at least one surface, in particular at least one contact surface and / or at least one reference surface, to which the plug unit could be aligned in particular. By way of example, the edge element could define at least one contact and / or at least one distance of the plug unit relative to the light guide by means of the reference point.

By "intended" is intended to be understood in particular specially designed and / or equipped. The fact that an object is intended for a specific function should in particular mean that the object fulfills and / or executes this specific function in at least one application and / or operating state.

In particular, a high efficiency, in particular with respect to a mounting, can be achieved by the embodiment according to the invention. In particular, a simple assembly can be made possible in which the plug unit can be easily aligned by means of the reference point. On a separate alignment of the plug unit can be dispensed with in particular, which in particular a low installation time and / or low installation costs can be made possible.

In the assembled state, the edge element could be, for example, by means of at least one non-positive and / or by means of at least one positive connection with the substrate be connected. Preferably, the edge element is integrally connected in the assembled state with the substrate, whereby in particular a high stability can be achieved.

In addition, it is proposed that the edge element in the assembled state is materially bonded to the substrate, for example by means of an adhesive bond. As a result, the edge element can in particular be connected to the substrate in a cost-effective and, in particular, additionally stable manner.

Furthermore, it is proposed that the edge element is formed identically with the substrate and forms the edge region of the substrate. In particular, the edge element and the substrate are formed from one and the same element, in particular from one and the same plate. In particular, the edge element forms a part of the substrate facing away from a center of the substrate. As a result, in particular a particularly simple assembly and / or a particularly high stability can be ensured.

It is also proposed that the edge element is formed separately from the substrate and as an at least substantially rigid element. In particular, the edge element differs from a film and / or from a gel and / or from a region filled in particular with air, around which the plug unit in the mounted state is spaced, in particular, from an edge of the substrate. Alternatively or additionally, the edge element could have a lens structure. By the notion that the edge element is formed "separately" from the substrate, it should be understood in particular that the edge element and the substrate are movable relative to one another in at least one disassembled state and, in particular, exist as separate elements and / or units. An "at least substantially rigid" element is to be understood in particular to be an element in which, for any directions, an extension of the element along at least one of these directions by a maximum of 5%, in particular of not more than 2%, advantageously of maximum 1%, particularly advantageously of not more than 0.1%, preferably not more than 0.01%, of an original extent of the element in the direction of mechanical, in particular by applying at least one mechanical force to the element, is variable. The original extent of the element in the direction corresponds in particular to an extension of the element in the direction in a powerless state, in which the element, in particular with the exception of gravity, in particular, free from external influences on the element forces. As a result, in particular a high degree of flexibility can be made possible, wherein suitable edge elements can be used in particular for different substrates and / or plug units. An exit region of the light guide, on which the light guide strikes an edge of the substrate in particular, can be protected in particular by means of the edge element. In particular, a widening of a beam of electromagnetic radiation can be achieved, whereby in particular an irradiation intensity can be increased.

For example, the plug unit could be formed in one piece and in particular in one piece. Advantageously, the plug unit is designed in several parts. The plug unit preferably has at least one first plug element and at least one second plug element, which are connected to one another in the mounted state. In the mounted state, in particular, at least one subregion of the first plug element and at least one subregion of the second plug element rest against one another and touch each other at least partially. As a result, especially a particularly high efficiency can be achieved.

For example, the first plug element could have at least one first reference surface, which in the assembled state could be aligned flush with at least one edge surface of the edge element, in particular at least the reference point, and in particular could rest against the edge surface of the edge element. In particular, the edge surface of the edge member and the first reference surface of the first male member in the mounted state could be arranged in direct contact. As a result, the plug unit and in particular the first plug element could in particular be optimally aligned.

Furthermore, it is proposed that the second plug element has at least one second reference surface, which in the assembled state is aligned flush with at least one edge surface of the edge element and, in particular in the mounted state, is arranged in extension with the edge surface of the edge element. In particular, the edge surface of the edge element and the second reference surface of the second connector element in the assembled state at least substantially and advantageously are arranged completely flush with each other. As a result, the plug unit and in particular the second plug element can in particular be optimally aligned.

It is also proposed that the second plug element has at least one further second reference surface, which in the mounted state at least one further reference point relative to an alignment of the first plug element relative defined to the substrate. In particular, the edge surface of the edge element and the further second reference surface of the second connector element in the assembled state are arranged spaced apart with respect to at least one depth direction. The depth direction is in particular aligned at least substantially perpendicular to an edge of the substrate and in particular to the edge surface of the substrate. In particular, the depth direction points from the edge area towards a center of the substrate. In particular, the further second reference surface comprises the further reference point. As a result, the first plug element can be aligned, in particular, in a desired position relative to the second plug element and thus, in particular, relative to the substrate.

In addition, it is proposed that the first plug element and in particular additionally the second plug element in each case in particular form / form at least a part of a plug outer housing. The first plug element forms in particular at least a portion of at least 30%, in particular of at least 40%, advantageously of at least 50%, and preferably of at least 60%, of a surface of the plug outer housing. A "plug outer housing" is to be understood in particular a unit which in the mounted state forms an outermost boundary of at least one plug and / or advantageously the plug unit and which is arranged visible in the mounted state, in particular for an operator. As a result, in particular, an additional and / or separate plug outer housing can be dispensed with, as a result of which, in particular, low costs can be achieved.

In another aspect of the invention, taken alone or in combination with other aspects of the invention, there is provided an optical circuit board having at least one substrate and at least one optical fiber disposed on and / or in the substrate. wherein the optical circuit board has at least one rigid edge element, which is formed separately from the substrate and connected in at least one mounted state with the substrate in at least one edge region of the substrate. The inventive design can be achieved in particular a high efficiency, in particular with respect to a mounting.

Furthermore, it is proposed that the edge element has at least one main body with a refractive index which corresponds at least essentially to a refractive index of the optical waveguide. By the notion that a first refractive index "at least essentially" corresponds to a second refractive index, it should be understood, in particular, that a quotient of the first refractive index and the second refractive index has a value of at least 0.95, in particular of at least 0.97 of at least 0.99, and preferably at least 0.999. A "basic body" of a unit is to be understood in particular to mean a unit which forms a mass fraction and / or volume fraction of at least 70%, in particular of at least 80%, advantageously of at least 90% and preferably of at least 95% of the unit, and in particular a mold and / or shape of the unit defined at least in large part. The edge element and in particular the base body could, for example, be formed from at least one at least substantially transparent and / or optically flat material. For example, the main body could be formed, at least for the most part, of glass and / or of plastic and / or of at least one polymer. By "at least to a large extent" should be understood in particular to a proportion of at least 70%, in particular at least 80%, advantageously at least 90% and preferably at least 95%. As a result, in particular an optimal transmission of electromagnetic radiation, in particular in the form of light, can be made possible.

For example, the edge element could exclusively comprise the base body and in particular consist of the base body. Preferably, the edge element has at least one coating which is arranged on a side of the main body facing away from the substrate, in particular on a front edge of the main body. The coating could, for example, be formed as a protective layer and / or as an insulating layer. Preferably, the coating is formed as an antireflection coating. A "coating" is to be understood, in particular, as meaning a layer of a substance which adheres in particular to a surface of at least one component, in particular of the base body. In particular, the coating has a material thickness which is less than 10%, preferably less than 5% and in particular less than 1% of a material thickness of the component on which the coating is applied. In particular, the coating has an at least substantially constant material thickness. In particular, the coating has a material thickness of less than 1 mm, in particular less than 0.3 mm, advantageously less than 0.1 mm, preferably less than 0.03 mm and particularly preferably less than 0.01 mm. By the use of the coating having an "at least substantially constant material thickness", it should be understood in particular that an amount of the material thickness in the region of the coating of the component is less than 20%, in particular by less than 10% and advantageously by less than 5%. As a result, in particular optimal transmission properties with regard to transmission of electromagnetic radiation, in particular in the form of light, can be provided. In particular, a side of the base body facing away from the substrate can be optimally prepared for coupling to the plug unit and / or with at least one further optical unit. By the edge element, which has the main body and the coating, in particular inaccuracies of a polishing process can be improved and / or compensated. In particular, it is proposed that the optical printed circuit board has at least one adhesive which connects the edge element in particular to the substrate with a material fit and which has a refractive index which is at least essentially corresponds to a refractive index of the light guide. The adhesive could in particular be designed as an adhesive, in particular as an optical adhesive. As a result, in particular a high stability can be achieved.

Furthermore, it is proposed that the edge element is intended to modify at least one radiation. For example, the base body and / or the coating could be provided to modify the radiation. By the term that an object is intended to "modify at least one radiation", it should be understood in particular that the object modifies and / or alters at least one property, in particular at least one optical property. The edge element could for example modify at least one wavelength and / or at least one propagation direction and / or at least one light bundle. For example, the edge element could have at least one hologram and / or a changing refractive index and / or at least one scattering object, which could be designed in particular for light scattering and, for example, in the form of at least one pattern and / or object, and / or at least one spherical surface and / or have at least one mode converter. For example, the edge element could consist of at least two materials and / or of at least one material that changes in at least one property. This can be achieved in particular a high degree of flexibility in terms of design freedom.

An efficiency, in particular with respect to a mounting, can in particular be further increased by a method for mounting an optical circuit board according to the invention, comprising at least one substrate, with at least one edge element, which in at least one mounted state is connected to the substrate in at least one edge region of the substrate is, with at least one light guide, which is arranged on and / or in the substrate, and with at least one plug unit, which is arranged on the substrate, wherein the plug unit is aligned with the edge element. In particular, the edge element could be formed identically with the substrate and in particular form the edge region of the substrate. Alternatively, the edge element could in particular be formed separately from the substrate and, in particular in the method, in particular materially and advantageously before the alignment of the plug unit on the edge element, be connected to the substrate. In particular, then, in particular in a state in which the edge element is connected to the substrate, the plug unit could be aligned with the edge element. For example, in the method, the second plug element could first be arranged on the substrate, for example by means of an adhesive connection. Then, in particular, the first plug element could be arranged on the substrate and, in particular, be pushed onto the substrate and in particular additionally the second plug element arranged on the substrate.

The optical circuit board should not be limited to the application and embodiment described above. In particular, to perform a functionality described herein, the optical circuit board may have a different number than a number of individual elements, components, and units referred to herein.

list of figures

Further advantages emerge from the following description of the drawing. In the drawings, three embodiments of the invention are shown. The drawings, the description and the claims contain numerous features in combination. The person skilled in the art will expediently also consider the features individually and combine them into meaningful further combinations.

• 1 ein Substrat und eine Steckereinheit einer optischen Leiterplatte in einem montierten Zustand in einer schematischen Darstellung,
• 2 das Substrat und ein erstes Steckerelement und ein zweites Steckerelement der Steckereinheit in dem montierten Zustand in einer schematischen Schnittdarstellung,
• 3 das Substrat, das zweite Steckerelement und zwei Steckerpins der optischen Leiterplatte in dem montierten Zustand in einer schematischen Darstellung,
• 4 ein Substrat und ein erstes Steckerelement und ein zweites Steckerelement einer Steckereinheit einer alternativen optischen Leiterplatte in einem montierten Zustand in einer schematischen Schnittdarstellung,
• 5 das Substrat, mehrere Lichtleichter und eine weitere optische Einheit der optischen Leiterplatte in einer schematischen Darstellung,
• 6 ein Substrat und ein erstes Steckerelement und ein zweites Steckerelement einer Steckereinheit einer alternativen optischen Leiterplatte in einem montierten Zustand in einer schematischen Schnittdarstellung,
• 7 das Substrat in einem teilweise behandelten Zustand in einer schematischen Darstellung,
• 8 das Substrat und ein Aufnahmeelement der optischen Leiterplatte in einem weiteren teilweise behandelten Zustand in einer schematischen Draufsicht,
• 9 einen Ausschnitt des Substrats und das Aufnahmeelement in einer schematischen Draufsicht,
• 10 ein alternatives Substrat in einem teilweise behandelten Zustand in einer schematischen Darstellung,
• 11 das Substrat und das Aufnahmeelement und ein Steckerpin der optischen Leiterplatte in einem weiteren teilweise behandelten Zustand in einer schematischen Draufsicht,
• 12 das Substrat und das Aufnahmeelement, welches stark vereinfacht dargestellt ist, in einem weiteren teilweise behandelten Zustand in einer schematischen Darstellung und
• 13 ein Substrat und ein Aufnahmeelement einer alternativen optischen Leiterplatte in einem teilweise behandelten Zustand in einer schematischen Draufsicht.

Show it:

• 1 a substrate and a plug unit of an optical circuit board in an assembled state in a schematic representation,
• 2 the substrate and a first plug element and a second plug element of the plug unit in the assembled state in a schematic sectional view,
• 3 the substrate, the second connector element and two optical connector pins Printed circuit board in the assembled state in a schematic representation,
• 4 a substrate and a first plug element and a second plug element of a plug unit of an alternative optical circuit board in an assembled state in a schematic sectional view,
• 5 the substrate, several light facilitators and another optical unit of the optical circuit board in a schematic representation,
• 6 a substrate and a first plug element and a second plug element of a plug unit of an alternative optical circuit board in an assembled state in a schematic sectional view,
• 7 the substrate in a partially treated state in a schematic representation,
• 8th the substrate and a receiving element of the optical circuit board in a further partially treated state in a schematic plan view,
• 9 a section of the substrate and the receiving element in a schematic plan view,
• 10 an alternative substrate in a partially treated state in a schematic representation,
• 11 the substrate and the receiving element and a plug pin of the optical circuit board in a further partially treated state in a schematic plan view,
• 12 the substrate and the receiving element, which is shown greatly simplified, in a further partially treated state in a schematic representation and
• 13 a substrate and a receiving element of an alternative optical circuit board in a partially treated state in a schematic plan view.

Description of the embodiments

1 shows an optical circuit board 10a with a substrate 12a , The substrate 12a has a base plate 64a on (cf. 2 ). The base plate 64a forms the substrate 12a for the most part. The substrate 12a has a coating 66a on. The coating 66a of the substrate 12a is in a mounted state on the base plate 64a arranged. In the assembled state, the coating is 66a of the substrate 12a on a main surface of the base plate 64 arranged.

The optical circuit board 10a has an edge element 40a on. The edge element 40a is in the assembled state with the substrate 12a in an edge area 42a of the substrate 12a connected. In the mounted state, the edge element is 40a integral with the substrate 12a connected.

In the present embodiment, the edge element 40b identical to the substrate 12b educated. The edge element 40b forms the edge area 42b of the substrate 12b out.

In one the edge area 42a facing area has the coating 66a of the substrate 12a at least one recess 68a on (cf. 2 and 3 ). In the present embodiment, the coating 66a of the substrate 12a in one the edge area 42a facing area two recesses 68a on. From the recesses 68a only one will be described below. In the assembled state is a plug unit 44a in a region of the recess 68a on the substrate 12a at.

The optical circuit board 10a indicates the plug unit 44a on (cf. 1 to 3 ). The plug unit 44a is in the mounted state on the substrate 12a arranged. In the present embodiment, the plug unit 44a formed in two parts. The plug unit 44a has a first plug element 48a and a second plug element 50a on. In the assembled state, the first connector element 48a and the second connector element 50a connected with each other.

The first connector element 48a forms a part of a plug outer housing, in particular a large part of a plug outer housing. In the mounted state, the first plug element surrounds 48a partly the substrate 12a , especially the base plate 64a of the substrate 12a , The first connector element 48a partially engages around the second connector element in the mounted state 50a ,

The second plug element 50a is in the mounted state on the main surface of the base plate 64a arranged. In the assembled state, the second plug element is located 50a at the recess 68a the coating 66a of the substrate 12a at. The first connector element 48a clamps in the mounted state, the second connector element 50a on the substrate 12a one.

In the assembled state, the second connector element 50a on the substrate 12a attached. For example, the second plug element could 50a on the substrate 12a be secured by a screw connection. In the present embodiment, the second connector element 50a on the substrate 12a attached by an adhesive connection.

The first connector element 48a has at least one projection 70a on (cf. 2 ). In the present embodiment, the first connector element 48a a variety of projections 70a on. Of multiply existing objects, only one is provided with a reference numeral in the figures. From the projections 70a only one will be described below. In an alternative embodiment, the first plug element 48a for example, free of protrusions 70a be.

The lead 70a partially attacks the substrate 12a , especially in the base plate 64a of the substrate 12a , one. The lead 70a partially bores into the substrate 12a , especially in the base plate 64a of the substrate 12a , The lead 70a presses a first reference surface 52a of the first connector element 48a in the direction of an edge surface 56a of the edge element 40a ,

The edge element 40a has the edge surface 56a on. The edge surface 56a includes a reference point 46a to an orientation of the plug unit 44a , The edge element 40a represents a reference point 46a to an orientation of the plug unit 44a ready.

The first connector element 48a has the first reference surface 52a on. The first reference surface 52a For example, in the assembled state, it could be flush with the edge surface 56a of the edge element 40a be aligned. In the assembled state, the first reference surface 52a for example, on the edge surface 56a of the edge element 40a issue.

The second plug element 50a has a second reference surface 54a on. In the present embodiment, the second reference surface 54a in the assembled state flush with the edge surface 56a of the edge element 40a aligned. In the assembled state, the second reference surface 54a in an extension of the edge surface 56a of the edge element 40a arranged.

The second plug element 50a has a reference element 76a on (cf. 2 and 3 ). The reference element 76a forms the second reference surface 54a out. The reference element 76a completed with the help of the second reference surface 54a a front surface of the edge element 40a , which is a contact surface for contacting and balancing a ferrule of another optical unit (not shown).

In the present embodiment, the first connector element 48a formed to a large extent of a metal. Alternatively, the first plug element could 48a be formed for the most part of a polymer. Also conceivable are other materials that appear appropriate to a person skilled in the art. The first connector element 48a has a part of an adapter for an optical fiber connector, in particular an MT connector, on.

To a transmission of electromagnetic radiation, in particular of light, has the optical circuit board 10a several light guides 14a on (cf. 4 ). From the light guides 14a only one will be described below.

The light guide 14a is in the mounted state on the substrate 12a arranged. Alternatively, the light guide could 14a in the assembled state in the substrate 12a be arranged. The light guide 14a is to a transmission of electromagnetic radiation, in particular in the form of light, to another optical unit 72a the optical circuit board 10a intended.

The optical circuit board 10a indicates the further optical unit 72a on. The further optical unit 72a has a lens 74a on. The Lens 74a differs from a lens which is intended for a collimated beam. Alternatively, the further optical unit could 72a have at least one waveguide and / or at least one cable of waveguides.

In the transmission of electromagnetic radiation to the further optical unit 72a guides a transmission path through the edge element 40a therethrough.

In a method of mounting the optical circuit board 10a becomes the plug unit 44a on the substrate 12a arranged. The second plug element 50a will be in the recess 68a the coating 66a of the substrate 12a arranged. The first connector element 48a becomes on the substrate 12a arranged. The first connector element 48a is over the substrate 12a pushed. The plug unit 44a becomes on the edge element 40a aligned.

The second plug element 50a indicates an increase 78a on (cf. 1 to 3 ). In the assembled state, the increase 78a the second connector element 50a at one of the reference points 46a of the edge element 40a opposite side of the second connector element 50a arranged.

The second plug element 50a has another second reference surface 80a on. The increase 78a the second connector element 50a forms the second second reference surface 80a out. The second second reference surface 80a is at a reference point 46a of the edge element 40a facing side of the elevation 78a arranged. The second second reference surface 80a defines another reference point in the mounted state 108c to an alignment of the first plug element 48c relative to the substrate 12c ,

The reference point 46a of the edge element 40a defines a stop level for the increase 78a the second connector element 50a , in particular for the further second reference surface 80a the increase 78a the second connector element 50a , In the assembled state is the other second reference surface 80a a function of the reference point 46a of the edge element 40a , The second second reference surface 80a is a distance in the assembled state 82a spaced apart to an edge of the light guide 14a. The edge of the light guide 14a is in the edge area 42a of the substrate 12a arranged.

In 4 and 5 is a modification of the embodiment of 1 to 3 shown. In the present embodiment, an edge element 40a ' in a mounted state, materially bonded to a substrate 12a ' connected. In the mounted state, the edge element is 40a ' with the substrate 12a ' connected by an adhesive connection.

The edge element 40a ' is separate from the substrate 12a ' educated. In the mounted state, the edge element is 40a ' in an edge area 42a ' of the substrate 12a ' with the substrate 12a ' connected. The edge element 40a ' is formed as a substantially rigid element. The edge element 40a ' is special for an optical circuit board 10a ' educated.

The edge element 40a ' has a basic body 58a ' on. The main body 58a ' has a refractive index which is substantially a refractive index of the optical fiber 14a ' equivalent.

The edge element 40a ' has a coating 60a ' on. The coating 60a ' of the edge element 40a ' is at a front edge of the main body 58a ' arranged. The coating 60a of the edge element 40a ' is formed as an antireflection coating. In the assembled state, the coating is 60a ' of the edge element 40a ' at a the substrate 12a ' opposite side of the body 58a ' arranged. Alternatively, the edge element could 40a ' free from a coating 60a ' be.

At one the substrate 12a ' facing side of the body 58a is the edge element 40a ' with the substrate 12a ' connected by the adhesive bond. The optical circuit board 10a ' has an adhesive 62a ' on (cf. 4 and 5 ). The adhesive 62a ' connects in the mounted state, the edge element 40a ' with the substrate 12a ' , The adhesive 62a ' has a refractive index which is substantially a refractive index of the optical fiber 14a ' equivalent.

In an alternative embodiment, the edge element could 40a ' modify a radiation.

In 6 to 13 two further embodiments of the invention are shown. The following descriptions are essentially limited to the differences between the embodiments, with respect to the same components, features and functions on the description of the embodiment of 1 to 5 can be referenced. To distinguish the embodiments, the letter a in the reference numerals of the embodiment in the 1 to 5 by the letters b and c in the reference numerals of the embodiments of the 6 to 13 replaced. With respect to identically designated components, in particular with regard to components with the same reference numerals, can in principle also to the drawings and / or the description of the embodiment of 1 to 5 to get expelled.

6 shows an alternative optical circuit board 10b , The optical circuit board 10a has a substrate 12b and an edge element 40b on. The edge element 40b is in an assembled state in an edge region 42b of the substrate 12b with the substrate 12b connected.

The edge element 40b is integral with the substrate in an assembled condition 12b connected. In the present embodiment, the edge element 40b identical to the substrate 12b educated. The edge element 40b forms the edge area 42b of the substrate 12b out.

In one the edge area 42b facing area has a coating 66b of the substrate 12b in the present embodiment, two recesses 68b on (cf. 7 ). From the recesses 68b only one will be described below.

The substrate 12b has at least one mounting recess 84b on. In the present embodiment, the substrate 12b , in particular per recess 68b the coating 66b of the substrate 12b , two mounting holes 84b on. The mounting recesses 84b are to a fastening of a second connector element 50b a plug unit 44b intended.

A position of the fastening recesses 84b is particularly variable and depends in particular on an embodiment of the second plug element 50b and / or the plug unit 44b from. When viewed in a plan view, the fixing recesses 84b a substantially circular shape. Alternatively or additionally, the mounting recesses could 84b each have at least one slot. In particular, the attachment recesses could result in a variable attachment of the second connector element 50b the plug unit 44b be provided and in particular a displacement of the second connector element 50b the plug unit 44b allow and / or enable and / or allow. This could be the Befestigungsausnehmungen 84b in particular a flush arrangement in a region of the edge element facing away from a center 40b allow.

The mounting recesses 84 are in a depth direction 86b spaced apart. The depth direction 86b is substantially perpendicular to an edge of the substrate 12b aligned. The depth direction 86b points from the edge area 42b towards a center of the substrate 12b ,

The substrate 12b has at least one reference mark 88b on. In the present embodiment, the substrate 12b , in particular per recess 68b the coating 66b of the substrate 12b , in particular a single reference mark 88b on. The reference mark 88b has a longitudinal direction which is substantially parallel to optical fibers 14b is aligned.

For example, the reference mark 88b and in particular additionally the light guides 14b by means of a high-precision machine on and / or in the substrate 12b be arranged. The reference mark 88b and in particular additionally the light guides 14b could in particular be produced in the same process step, in particular in the same lithography process step. In particular, high precision, in particular in a range of micrometers or submicrometers, could thereby be achieved.

The reference mark 88b is at a determination and / or a definition of a position of a receiving element 16b provided (cf. 8th ). The optical circuit board 10b has the receiving element 16b on. The receiving element 16b is with the substrate 12b connected.

The receiving element 16b has a recording area 18b for a connector pin 20b on (cf. 11 ). The recording area 18b has a longitudinal direction 32b which is substantially parallel to the depth direction 86b is aligned. The longitudinal direction 32b of the recording area 18b is essentially parallel to the light guides 14b aligned. In the assembled state, the receiving element sets 16b a position of the connector pin 20b relative to the light pipe 14b partly fixed.

The optical circuit board 10b has the connector pin 20b on. Per recess 68b the coating 66b of the substrate 12b has the optical circuit board 10b exactly one connector pin 20b on. In a mounted state is the connector pin 20b partly in a main reception area 22b of the recording area 18b arranged.

The recording area 18b has the main reception area 22b on. The main reception area 22b is to a recording of the connector pin 20b intended. The main reception area 22b has a longitudinal direction which is substantially parallel to the longitudinal direction 32b of the recording area 18b is aligned.

The recording area 18b has a secondary reception area 24b on. The secondary reception area 24b has a transverse extent 26b which is larger than a transverse extent 28b of the main reception area 22b (see. 9 ).

The optical circuit board 10b has a fastener 30b on (cf. 11 ). The fastener 30b is to a fastening of the connector pin 20b in the recording area 18b intended. In the assembled state, the fastener 30b partly within the secondary reception area 24b arranged.

The fastener 30b is to a cohesive attachment of the connector pin 20b in the recording area 18b intended. In the assembled state, the fastener 30b formed as a cured raw mass. The raw material is formed in the present embodiment as a cured adhesive. Alternatively, the raw material could be formed as a hardened solder and / or as a cured welding compound.

The secondary reception area 24b is with respect to the longitudinal direction 32b of the receiving element 16b in one end area 34b of the recording area 18b arranged.

The recording area has a further secondary recording area 36b on. With regard to the longitudinal direction 32b of the receiving element 16b is the additional secondary reception area 36b to the secondary recording area 24b spaced.

The additional secondary reception area 36b is with respect to the longitudinal direction 32b of the receiving element 16b in a front area 38b of the recording area 18b arranged. By doing assembled state is the fastener 30b partly within the additional secondary reception area 36b arranged.

The secondary reception area 24b is with respect to the longitudinal direction 32b of the receiving element 16b on one side next to the main reception area 22b arranged. In the present embodiment, the secondary recording area 24b with respect to the longitudinal direction 32b of the receiving element 16b on two sides next to the main reception area 22b arranged.

The additional secondary reception area 36b is with respect to the longitudinal direction 32b of the receiving element 16b on one side next to the main reception area 22b arranged. In the present embodiment, the additional secondary recording area 36b with respect to the longitudinal direction 32b of the receiving element 16b on two sides next to the main reception area 22b arranged.

The substrate 12b has at least one more reference mark 90b on (cf. 8th and 11 ). In the present embodiment, the substrate 12b , in particular per recess 68b the coating 66b of the substrate 12b , a particular only further reference mark 90b on. The further reference mark 90b is to an alignment of the plug unit 44b , in particular of the second plug element 50b the plug unit 44b , intended for assembly.

For example, the further reference mark 90b by means of a high-precision machine on and / or in the substrate 12b be arranged.

The substrate 12b has at least one processing mark 92b on (cf. 8th and 11 ). In the present embodiment, the substrate 12b , in particular per recess 68b the coating 66b of the substrate 12b , four processing marks 92b on. Alternatively, the substrate could 12b a different number of processing marks 92b exhibit.

The processing marks 92b are formed as a reference for a polishing process. A total number of editing marks 92b which in the polishing process from the substrate 12b are removed, are a reference for a tolerance for the mounting recess 84b ,

In 8th is a polish edge 94b of the substrate 12b followed by the dashed line after the polishing process. A total number of editing marks 92b which the polish edge 94b is formed as an angle reference in a review.

In the present embodiment, the substrate 12b a substantially straight edge surface 56b on (cf. 7 ). The essentially straight edge surface 56b defines a plane in which, in particular, substantially all points of the edge surface 56b are arranged.

Alternatively, the substrate could 12b in the edge area 42b at least one indentation 96b have (see. 10 and 11 ). The substrate 12b could, in particular per recess 68b the coating 66b of the substrate 12b , a dent 96b exhibit. For example, the indentation could 96b to an engagement of a part of the plug unit 44b be provided.

The recess 68b the coating 66b of the substrate 12b is to expose part of the light guides 14b intended. The recess 68b the coating 66b of the substrate 12b is to a visualization of the reference mark 88b and / or the further reference mark 90b and / or the processing marks 92b intended.

For example, the reference mark 88b and / or the further reference mark 90b and / or the processing mark 92b on the same layer of the substrate 12b be arranged. Alternatively or additionally, the reference mark could 88b and / or the further reference mark 90b and / or the processing mark 92b For example, at least two and advantageously at least three different layers of the substrate 12b be arranged. The reference mark 88b and / or the further reference mark 90b and / or the processing mark 92b could, for example, on at least one copper layer and / or on at least one light guide layer of the substrate 12b be arranged.

In the present embodiment, the receiving area 18b , in particular the main reception area 22b when viewed in a cross-sectional plane which is in particular perpendicular to a main plane of extension of the substrate 12b is aligned, a substantially V-shaped shape (see. 12 ). For example, the receiving element 16b and in particular additionally the receiving area 18b be made by means of a high-precision machine. The receiving element 16b and in particular additionally the receiving area 18b For example, they could be made over at least substantially a full longitudinal extent by means of a high precision machine. Alternatively, for example, at least a portion of the receiving element 16b and in particular in addition to the receiving area 18b be made by means of a high-precision machine, such as in particular at least a portion of the main receiving area 22b ,

In a method of manufacturing the optical circuit board 10b becomes a viscous raw mass of the fastener 30b in the main reception area 22b arranged before the connector pin 20b in the main reception area 22b is arranged. The connector pin 20b is in the raw mass of the fastener 30b pressed, this in the secondary recording area 24b and the additional secondary reception area 36b dodging. In the method of manufacturing the optical circuit board 10b becomes the connector pin 20b in the main reception area 22b arranged.

13 shows a substrate 12c and a receiving element 16c an alternative optical circuit board 10c , The receiving element 16c has a recording area 18c with a main reception area 22c and a secondary reception area 24c on. The secondary reception area 24c is with respect to the longitudinal direction 32c of the receiving element 16c in one end area 34c of the recording area 18c arranged.

In the present embodiment, the receiving area 18c two additional reception areas 36c on. With regard to the longitudinal direction 32c of the receiving element 16c are the additional secondary reception areas 36c to the secondary recording area 24c spaced. The secondary reception area 24c and the other secondary reception areas 36c are with respect to the longitudinal direction of extension 32c of the receiving element 16c substantially uniform over a longitudinal extent of the receiving element 16c arranged distributed.

In the present embodiment, the receiving area 18c , in particular the main reception area 22c when viewed in a cross-sectional plane which is in particular perpendicular to a main plane of extension of the substrate 12c is aligned, a substantially U-shaped shape.

In one of an edge surface 56c of the edge element 40c opposite end of the receiving area 18c indicates the recording area 18a when viewed in a plan view, a substantially semicircular shape with a radius 98 of substantially 0.5 mm. When viewed in a plan view, the main receiving area 22c a width 100c of substantially 1 mm, in particular at a tolerance of substantially 0.05 mm.

When viewed in a plan view, there is a distance 102c a central axis of the main receiving area 22c to an axis of symmetry substantially 2.3 mm, in particular at a tolerance of substantially 0.05 mm. A distance 104c one of the symmetry axis facing away extension of a reference mark 88c to the symmetry axis when viewed in a plan view is substantially 3.8 mm.

An extension 106c from a beginning of the substantially semicircular shape of the receiving area 18c to one of the edge surface 56c of the edge element 40c opposite end of the reference mark 88c when viewed in a plan view is substantially 2 mm, in particular at a tolerance of substantially 0.01 mm.

LIST OF REFERENCE NUMBERS

10

Optical circuit board

12

substratum

14

optical fiber

16

receiving element

18

reception area

20

Connector pin

22

Main reception area

24

Besides receiving area

26

transverse extension

28

transverse extension

30

fastener

32

Longitudinal extension

34

end

36

Further additional reception area

38

front area

40

edge element

42

edge region

44

plug unit

46

reference point

48

First plug element

50

Second plug element

52

First reference surface

54

Second reference surface

56

edge surface

58

body

60

coating

62

adhesives

64

baseplate

66

coating

68

recess

70

head Start

72

Further optical unit

74

lens

76

reference element

78

increase

80

Another second reference surface

82

distance

84

mounting recess

86

depth direction

88

reference mark

90

Further reference mark

92

processed mark

94

polish edge

96

indentation

98

radius

100

width

102

distance

104

distance

106

extension

108

Another reference point

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 102012112683 A1 [0002]

Claims (16)

Optical circuit board having at least one substrate (12a-c), with at least one light guide (14a-c), which is arranged on and / or in the substrate (12a-c), with at least one edge element (40a-c), which in at least one mounted state is connected to the substrate (12a-c) in at least one edge region (42a-c) of the substrate (12a-c), and at least one plug unit (44a-c) mounted in the mounted state on the substrate (12a-c), characterized in that the edge element (40a-c) provides at least one reference point (46a-c) for alignment of the plug unit (44a-c). Optical circuit board after Claim 1 , characterized in that the edge element (40a-c) in the mounted state is integrally connected to the substrate (12a-c). Optical circuit board after Claim 2 , characterized in that the edge element (40a ') in the mounted state is materially connected to the substrate (12a'). Optical circuit board after Claim 2 characterized in that the edge member (40a; 40b-c) is formed identically with the substrate (12a; 12b-c) and forms the edge portion (42a; 42b-c) of the substrate (12a; 12b-c). Optical circuit board according to one of the Claims 1 to 3 , characterized in that the edge element (40a ') is formed separately from the substrate (12a') and as an at least substantially rigid element. Optical circuit board according to one of the preceding claims, characterized in that the plug unit (44a-c) has at least one first plug element (48a-c) and at least one second plug element (50a-c) which are connected together in the mounted state. Optical circuit board after Claim 6 characterized in that the second male member (50a-c) has at least one second reference surface (54a-c) aligned flush with at least one edge surface (56a-c) of the edge member (40a-c) in the assembled state. Optical circuit board after Claim 7 , characterized in that the second plug element (50a-c) has at least one further second reference surface (80a-c) which in the mounted state at least one further reference point (108a-c) to an alignment of the first plug element (48a-c) defined relative to the substrate (12a-c). Optical circuit board according to one of the Claims 6 to 8th , characterized in that the first plug element (48a-c) forms at least a part of a plug outer housing. Optical circuit board, in particular according to one of the preceding claims, with at least one substrate (12a ') and with at least one light guide (14a') which is arranged on and / or in the substrate (12a '), characterized by at least one rigid edge element (12). 40a ') formed separately from the substrate (12a') and connected in at least one mounted state to the substrate (12a ') in at least one edge region (42a') of the substrate (12a '). Optical printed circuit board according to one of the preceding claims, characterized in that the edge element (40a ') has at least one main body (58a') with a refractive index which at least essentially corresponds to a refractive index of the optical waveguide (14a '). Optical circuit board after Claim 11 , characterized in that the edge element (40a ') has at least one coating (60a') which is arranged on a side of the main body (58a ') facing away from the substrate (12a'). Optical circuit board according to one of the Claims 1 to 3 or 5 to 12 characterized by at least one adhesive (62a ') connecting the edge member (40a') to the substrate (12a ') and having a refractive index at least substantially equal to a refractive index of the optical fiber (14a'). Optical circuit board according to one of the preceding claims, characterized in that the edge element (40a-c) is provided to modify at least one radiation. Edge element for an optical circuit board (10a-c) according to one of the preceding claims. Method for mounting an optical printed circuit board (10a-c), in particular according to one of Claims 1 to 14 , with at least one substrate (12a-c), with at least one edge element (40a-c) in at least one mounted state with the substrate (12a-c) in at least one edge region (42a-c) of the substrate (12a-c ), with at least one light guide (14a-c), which is arranged on and / or in the substrate (12a-c), and with at least one plug unit (44a-c), which on the substrate (12a-c) is arranged, characterized in that the plug unit (44a-c) on the edge element (40a-c) is aligned.

Images