DE102016219422A1 - Elektronisches Steuergerät - Google Patents
Elektronisches Steuergerät Download PDFInfo
- Publication number
- DE102016219422A1 DE102016219422A1 DE102016219422.4A DE102016219422A DE102016219422A1 DE 102016219422 A1 DE102016219422 A1 DE 102016219422A1 DE 102016219422 A DE102016219422 A DE 102016219422A DE 102016219422 A1 DE102016219422 A1 DE 102016219422A1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- board section
- printed circuit
- section
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 16
- 230000001154 acute effect Effects 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 claims 1
- 238000001816 cooling Methods 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102016219422.4A DE102016219422A1 (de) | 2016-10-06 | 2016-10-06 | Elektronisches Steuergerät |
PCT/EP2017/073644 WO2018065207A1 (fr) | 2016-10-06 | 2017-09-19 | Appareil de commande électronique |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102016219422.4A DE102016219422A1 (de) | 2016-10-06 | 2016-10-06 | Elektronisches Steuergerät |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102016219422A1 true DE102016219422A1 (de) | 2018-04-12 |
Family
ID=59955555
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102016219422.4A Withdrawn DE102016219422A1 (de) | 2016-10-06 | 2016-10-06 | Elektronisches Steuergerät |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102016219422A1 (fr) |
WO (1) | WO2018065207A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4376559A1 (fr) * | 2022-11-28 | 2024-05-29 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Carte de circuit imprimé et son procédé de production |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4107657A1 (de) | 1991-03-09 | 1992-09-17 | Telefunken Electronic Gmbh | Montageanordnung fuer auf einer leiterplatte befestigten stecker |
DE10348010A1 (de) | 2002-10-15 | 2004-04-29 | Denso Corp., Kariya | Mehrschichtleiterplatte, Verfahren zu deren Herstellung und Mehrschichtleiterplatte verwendendes Mobilgerät |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005012404B4 (de) * | 2005-03-17 | 2007-05-03 | Siemens Ag | Leiterplatte |
US7889086B2 (en) * | 2007-09-28 | 2011-02-15 | Hella Kgaa | Camera arrangement in a motor vehicle |
JP2015082576A (ja) * | 2013-10-22 | 2015-04-27 | 富士通株式会社 | 電子装置、電子機器及び電子装置の製造方法 |
-
2016
- 2016-10-06 DE DE102016219422.4A patent/DE102016219422A1/de not_active Withdrawn
-
2017
- 2017-09-19 WO PCT/EP2017/073644 patent/WO2018065207A1/fr active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4107657A1 (de) | 1991-03-09 | 1992-09-17 | Telefunken Electronic Gmbh | Montageanordnung fuer auf einer leiterplatte befestigten stecker |
DE10348010A1 (de) | 2002-10-15 | 2004-04-29 | Denso Corp., Kariya | Mehrschichtleiterplatte, Verfahren zu deren Herstellung und Mehrschichtleiterplatte verwendendes Mobilgerät |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4376559A1 (fr) * | 2022-11-28 | 2024-05-29 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Carte de circuit imprimé et son procédé de production |
WO2024115097A1 (fr) * | 2022-11-28 | 2024-06-06 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Carte de circuit imprimé et son procédé de fabrication |
Also Published As
Publication number | Publication date |
---|---|
WO2018065207A1 (fr) | 2018-04-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R163 | Identified publications notified | ||
R005 | Application deemed withdrawn due to failure to request examination |