DE102016218706A1 - Leistungshalbleitervorrichtung - Google Patents
Leistungshalbleitervorrichtung Download PDFInfo
- Publication number
- DE102016218706A1 DE102016218706A1 DE102016218706.6A DE102016218706A DE102016218706A1 DE 102016218706 A1 DE102016218706 A1 DE 102016218706A1 DE 102016218706 A DE102016218706 A DE 102016218706A DE 102016218706 A1 DE102016218706 A1 DE 102016218706A1
- Authority
- DE
- Germany
- Prior art keywords
- power semiconductor
- semiconductor device
- module
- terminal
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016-090222 | 2016-04-28 | ||
JP2016090222A JP2017199827A (ja) | 2016-04-28 | 2016-04-28 | パワー半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102016218706A1 true DE102016218706A1 (de) | 2017-11-02 |
Family
ID=60081574
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102016218706.6A Ceased DE102016218706A1 (de) | 2016-04-28 | 2016-09-28 | Leistungshalbleitervorrichtung |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2017199827A (ja) |
DE (1) | DE102016218706A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6576502B1 (ja) | 2018-04-11 | 2019-09-18 | 三菱電機株式会社 | 電力用半導体装置 |
JP7159618B2 (ja) | 2018-05-25 | 2022-10-25 | 富士電機株式会社 | 半導体モジュールおよび電力変換装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5067679A (ja) | 1973-10-16 | 1975-06-06 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9117688B2 (en) * | 2011-04-18 | 2015-08-25 | Mitsubishi Electric Corporation | Semiconductor device, inverter device provided with semiconductor device, and in-vehicle rotating electrical machine provided with semiconductor device and inverter device |
JP5888010B2 (ja) * | 2012-03-08 | 2016-03-16 | 日産自動車株式会社 | インバータモジュール |
-
2016
- 2016-04-28 JP JP2016090222A patent/JP2017199827A/ja active Pending
- 2016-09-28 DE DE102016218706.6A patent/DE102016218706A1/de not_active Ceased
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5067679A (ja) | 1973-10-16 | 1975-06-06 |
Also Published As
Publication number | Publication date |
---|---|
JP2017199827A (ja) | 2017-11-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE102011003307B4 (de) | Inverter oder Konverter mit einem Halbleiterleistungsmodul | |
DE112014000153T5 (de) | Leistungsumsetzungsvorrichtung | |
DE102010027955A1 (de) | Gestapelte Busschienen-Anordnung mit integrierter Kühlung | |
DE102009040444A1 (de) | Leistungsmodul | |
DE102008061188A1 (de) | Flüssig gekühlte Wechselrichteranordnung | |
DE102018205991A1 (de) | Leistungsmodul und Leistungsumrichtervorrichtung | |
DE102015221590A1 (de) | Halbleitermodul und Halbleitervorrichtung | |
DE10035613A1 (de) | Leistungsumwandlungsvorrichtung | |
DE112014005694B4 (de) | Halbleitermodul | |
DE112012006842B4 (de) | Halbleitervorrichtung | |
DE102010061011A1 (de) | Halbleiterbaugruppe und Verfahren zum Herstellen derselben | |
DE112016003006T5 (de) | Elektrischer Verdichter | |
DE102017213288B4 (de) | Halbleitermodul, Halbleitervorrichtung und elektrische Leistungsvorrichtung | |
DE102018205121A1 (de) | Stromwandlungsvorrichtung | |
DE112016003111T5 (de) | Leistungs-halbleitermodul | |
DE112015000139T5 (de) | Halbleitermoduleinheit und Halbleitermodul | |
DE112015006489T5 (de) | Stromrichter | |
DE102016219938A1 (de) | Drehelektromaschine | |
DE102017222481A1 (de) | Leistungsmodul für Leistungsumwandlungseinrichtung, Leistungsumwandlungseinrichtung und elekktrische Rotationsvorrichtung mit integriertem Steuergerät | |
DE102008063724B4 (de) | Sammelschienenanordnung mit eingebauter Kühlung, Fahrzeugwechselrichtermodul und Verfahren zum Kühlen eines Wechselrichtermoduls | |
DE102018208437A1 (de) | Halbleitervorrichtung | |
DE112019002429T5 (de) | Leistungsmodul | |
DE102016208029A1 (de) | Halbleitervorrichtung | |
DE102016212032A1 (de) | Halbleitermodul | |
DE102015216779B4 (de) | Leistungshalbleitervorrichtung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R012 | Request for examination validly filed | ||
R002 | Refusal decision in examination/registration proceedings | ||
R003 | Refusal decision now final |