DE102016119712A1 - Substrate carrier and processing arrangement - Google Patents

Abstract

According to various embodiments, a substrate carrier may include: two spaced apart carrier rails (102a, 102b), a spacer assembly (104) that fixes the two carrier rails (102a, 102b) at a predefined distance from each other; a substrate holding plate (106) having a holding portion (106h) for holding at least one substrate; and a plurality of support structures (108) holding the substrate support plate (106) between the two support rails (102a, 102b), each of the support structures (108) having a decoupling structure for vibration decoupling the substrate support plate (108) from the two support rails (108). 102a, 102b).

Description

Various embodiments relate to a substrate carrier and a processing arrangement.

In general, a substrate, such as a glass substrate, a metal tape and / or a semiconductor substrate, may be treated (processed), e.g. be coated so that the chemical and / or physical properties of the substrate can be changed. For example, a vacuum deposition system can be used to deposit one or more layers on a substrate or on multiple substrates by means of chemical and / or physical vapor deposition. In order to realize a large-scale deposition on correspondingly large-area substrates efficiently, a so-called in-line system can be used in which a substrate is transported, for example by means of rollers and / or by means of a substrate carrier through the entire system, wherein during the transport of the substrate through the in-line system in one or more areas of the in-line system, a coating process can be performed.

For processing multiple substrates, e.g. Wafers or other workpieces, these can be held by means of a substrate carrier and / or transported by means of a substrate carrier. For example, the substrate carrier may be used to hold the substrates at a predefined position in a processing chamber (e.g., a coating chamber), to transport through a processing chamber, and / or to move in the processing chamber. The transport by means of a substrate carrier (also referred to as a carrier) can be helpful, for example, for mechanically sensitive substrates. It may also be helpful to transport a multiplicity of substrates by means of just one substrate carrier. Furthermore, such carriers can be designed so that the substrates can be processed simultaneously on both sides. In this case, for example, the substrate carrier may or may not be mounted laterally outside a processing area, and the substrates held by the substrate carrier may be processed on both sides within the processing area (for example, coated from above and below).

Furthermore, a plurality of substrate carriers can be transported to form a substrate carrier band, so that, for example, a processing area above the substrate carrier can be separated by gas from a processing area below the substrate carrier. Clearly, the substrate carrier can form a closed surface with the substrates inserted or laid on, for example, so that material vapor propagation from one side of the substrate carrier to the other side can be reduced or avoided.

Conventionally, the substrate carriers can be transported by means of transport rollers or the like. In this case, the substrate carrier at two opposite end portions each having a storage area, with which the substrate carrier can then be transported lying on correspondingly suitably arranged transport rollers lying.

One aspect of various embodiments can be seen illustratively to reduce or avoid mechanical vibration or vibration in the areas of a substrate support in which the substrates are held (e.g., rested). The excitation of mechanical vibrations can be caused by the transport of the substrate support itself. For example, the substrate carrier may or may not be constructed torsionally so that it will not deflect at unsupported locations. It may also be favorable, for example for reasons of vacuum technology, to construct a substrate carrier with a low structural height, which may facilitate, for example, a gas separation along the transport direction.

Furthermore, it may be necessary for the substrate carrier to be suitable for vacuum and to withstand the respective process conditions in the processing area. Thus, the substrate carrier is conventionally made of hard materials such as stainless steel. These conventional designs transmit vibrations that occur during transport on transport rollers directly to the substrates, so that they can be damaged and / or fall out of the substrate carrier.

According to various embodiments, a substrate carrier is provided which can fulfill the desired process-technical requirements, is inexpensive, and prevents or at least reduces the transmission of mechanical vibrations to the transported substrates.

According to various embodiments, a substrate carrier may include: two spaced apart carrier rails, a spacer assembly that fixes the two carrier rails at a predefined distance from each other; a substrate holding plate having a holding portion for holding at least one substrate; a plurality of support structures holding the substrate support plate between the two support rails, each of the support structures having a decoupling structure for vibration decoupling the substrate support plate from the two support rails.

In this construction, the support rails, the spacer assembly, and the substrate support plate can be correspondingly torsionally rigid (eg made of stainless steel) designed to give the substrate support the desired stability. At the same time, the entire substrate holding plate is kept vibration-isolated, so that substrates can be kept as free of vibration as possible by means of the substrate holding plate.

The two carrier rails are fixed to one another at a predefined distance, so that they can be configured to fit a transport system, e.g. mating with correspondingly spaced stump rollers mounted on opposite (e.g., inner) sidewalls of a processing chamber (e.g., a vacuum processing chamber).

According to various embodiments, the spacer assembly may include a first spacer and a second spacer. These can each connect the two carrier rails together. The substrate holding plate may be disposed between the two spacers.

According to various embodiments, the substrate carrier may further comprise: another substrate holding plate having a holding portion for holding at least one substrate. In this case, the spacer arrangement may further comprise a third spacer, which connects the two carrier rails together. The further substrate holding plate can be arranged between the two carrier rails. Furthermore, the further substrate holding plate can be arranged between the second spacer and the third spacer. Furthermore, a plurality of further holding structures can be used which connect the further holding plate with the two carrier rails. Each of the further holding structures may have a decoupling structure for vibration decoupling the further holding plate from the two carrier rails.

According to various embodiments, the substrate carrier may further comprise a plurality of connection structures connecting the substrate holding plate to the first spacer and / or the second spacer. Each of the connection structures may include a decoupling structure for vibration decoupling the substrate support plate from the first spacer and the second spacer.

According to various embodiments, the substrate carrier may further comprise a plurality of further connection structures connecting the further substrate holding plate with the second spacer and the third spacer. Each of the further connection structures may have a decoupling structure for vibration decoupling of the further substrate support plate from the second spacer and / or the third spacer.

According to various embodiments, a gap may be provided between the substrate holding plate and the two carrier rails, respectively. On the one hand, this can be helpful for vibration decoupling and, on the other hand, it can permit lateral thermal expansion of the substrate holding plate, since it can also be heated during processing and can thus expand thermally.

According to various embodiments, the substrate carrier is set up such that a direct positive connection between the substrate holding plate and the two carrier rails is avoided. A frictional connection or a connection between the substrate holding plate and the two carrier rails is designed vibration-damped.

According to various embodiments, the substrate support plate may be releasably secured to the two support rails by means of the plurality of support structures. For example, a screw embedded in a flexible (e.g., soft) sleeve or the like as a buffer member may be used. According to various embodiments, the substrate holding plate 106 may be clamped by means of the screw between two buffer elements.

According to various embodiments, the decoupling structure may comprise at least one buffer element. The buffer element can be made of a material and / or be shaped such that it provides a material damping (also referred to as material damping).

According to various embodiments, the decoupling structure may comprise at least one flexible buffer element, e.g. of a flexible material such as an elastomer (e.g., Viton), a gum (e.g., nitrile-butadiene rubber, NBR), a thermoplastic (e.g., polyetheretherketone, PEEK), and / or the like.

According to various embodiments, a processing assembly may include a substrate carrier as described herein and a processing device having a transport system for transporting the substrate carrier. The transport system may, for example, have two spaced-apart transport devices for supporting the two carrier rails of the substrate carrier.

According to various embodiments, the processing device may include a processing chamber for processing a substrate. The two transport devices may or may not be disposed on opposite lateral chamber walls of the processing chamber. Thus, for example, the substrate carrier can hang freely between the two transport devices in a processing area of the processing chamber, ie be stored only by means of the carrier rails.

According to various embodiments, a processing arrangement may comprise a substrate carrier, a processing chamber with a processing area, a transport system for transporting the substrate carrier in the processing area for processing a substrate transported by the substrate carrier in the processing area.

According to various embodiments, the transport system may comprise two spaced apart transport devices for supporting the two carrier rails of the substrate carrier. A first transport device may or may not be arranged on a first lateral chamber wall of the processing chamber. A second transport device may be arranged on one of the first lateral chamber wall opposite the second lateral chamber wall of the processing chamber or be.

According to various embodiments, a processing arrangement may comprise: a transport system for transporting the substrate carrier, the transport system having two spaced-apart transport devices configured for supporting the substrate carrier by means of the carrier rails thereof.

According to various embodiments, the processing assembly may further include: a processing chamber (eg, a vacuum processing chamber) within which at least one substrate (eg, a semiconductor substrate) transported by the substrate carrier may be processed (eg, coated), the two transport devices being on opposite side chamber walls the processing chamber are arranged. Clearly, a horizontal substrate transport can be made possible by means of the substrate carrier.

According to various embodiments, a substrate carrier may include: two spaced apart carrier rails, a first spacer and a second spacer which fix the two carrier rails at a predefined distance from each other; a holding plate having a holding portion for holding at least one substrate, the holding plate being disposed between the two carrier rails and between the first spacer and the second spacer; a plurality of (support rail) support structures connecting the support plate to the two support rails, each of the support structures having a decoupling structure for vibration decoupling the support plate from the two support rails.

According to various embodiments, a substrate carrier may include: a pair of spaced support rails, a first spacer, a second spacer, and a third spacer, the three spacers interconnecting the two support rails and defining a predefined distance between the two support rails; a first holding plate having a holding portion for holding at least one substrate, the first holding plate being disposed between the two carrier rails and between the first spacer and the second spacer; a second holding plate having a holding portion for holding at least one substrate, the second holding plate being disposed between the two carrier rails and between the second spacer and the third spacer; a plurality of first support structures connecting the two support plates respectively to the two support rails, each of the first support structures having a decoupling structure for vibration decoupling the two support plates from the two support rails, and a plurality of second support structures including the first support plate with the first spacer and the second spacer connecting and connecting the second holding plate to the second spacer and the third spacer, wherein each of the second holding structures has a decoupling structure for vibration decoupling the two holding plates from the spacers.

According to various embodiments, a substrate carrier may include: two carrier rails which are fixed by a spacer assembly at a predefined distance from each other; at least one holding plate having a holding portion for holding at least one substrate, wherein the at least holding plate is vibration-decoupled to the two carrier rails, and wherein the at least one holding plate is vibration-decoupled mounted on the spacer assembly.

According to various embodiments, a substrate carrier may include: two spaced apart carrier rails, at least two spacers interconnecting the two carrier rails, and one define a predefined distance between the two carrier rails; at least one holding plate having a holding portion for holding at least one substrate, wherein the holding plate between the two carrier rails and the at least two spacers is arranged; a plurality of support structures connecting the at least one support plate to the two support rails, each of the support structures having a decoupling structure for vibration decoupling the at least one support plate from the two support rails.

According to various embodiments, the holding plate (also referred to as a substrate holding plate) may have one or more holes for receiving one or more substrates. For example, a substrate may be disposed between an upper frame and subframe with the upper frame and subframe being inserted into a recess or a through hole in the holding plate.

According to various embodiments, the holding plate (also referred to as a substrate holding plate) may have bearing surfaces for placing a plurality of substrates on the holding plate.

For example, by means of the substrate carrier described herein, it is possible to reduce the number of transport rollers necessary to transport the substrates lossless (e.g., without breakage losses) by means of the substrate support. Although the larger roller spacing can transmit more vibrations to the carrier rails of the substrate carrier, but this can be compensated by means of the vibration-insulated mounting of the substrate holding plate. According to various embodiments, the distance of the transport rollers may be increased from usually 200 mm to 250 mm to 350 mm. Depending on the length of the system in the transport direction, this results in a considerable saving in transport rollers and thus in construction costs and maintenance costs.

The spacer assembly may include one or more spacers (also referred to as spacers). These spacers are firmly blocked, for example, with the carrier rails and provide the corresponding predefined track width. According to various embodiments, the track width may range from about 1 m to about 5 m. The width of the substrate holding plate is insignificantly smaller than the track width, so that only a gap remains between the substrate holding plate and the carrier rails, e.g. a gap having a nip width in a range of about 0.5 cm to about 10.0 cm.

The substrate support plate may be stabilized by means of the support structures horizontally (e.g., in the x-y direction). Further, the substrate holding plate may be vertically stabilized by means of the connection structures. By means of the connection structures, adjacent substrate holding plates can also be connected to one another.

By means of the substrate carrier described herein, it is possible, for example, to increase the transport speed of the substrate carrier through the processing system, and nevertheless to transport the substrates losslessly (for example without breakage losses). The higher transport speed can transmit more vibrations to the carrier rails of the substrate carrier, but this can be compensated for by means of the vibration-insulated mounting of the substrate holding plate.

Embodiments are illustrated in the figures and are explained in more detail below.

• 1 einen Substratträger in einer schematischen Draufsicht, gemäß verschiedenen Ausführungsformen;
• 2A und 2B jeweils einen Substratträger in einer schematischen Draufsicht, gemäß verschiedenen Ausführungsformen;
• 3A einen Substratträger in einer schematischen Draufsicht, gemäß verschiedenen Ausführungsformen;
• 3B einen Substratträger in einer schematischen Querschnittsansicht, gemäß verschiedenen Ausführungsformen;
• 3C bis 3E jeweils schematische Detail-Schnittansichten eines Substratträgers, gemäß verschiedenen Ausführungsformen; und
• 4A und 4B jeweils eine Prozessieranordnung in einer schematischen Ansicht, gemäß verschiedenen Ausführungsformen.

Show it

• 1 a substrate carrier in a schematic plan view, according to various embodiments;
• 2A and 2 B each a substrate carrier in a schematic plan view, according to various embodiments;
• 3A a substrate carrier in a schematic plan view, according to various embodiments;
• 3B a substrate carrier in a schematic cross-sectional view, according to various embodiments;
• 3C to 3E respectively schematic detail sectional views of a substrate carrier, according to various embodiments; and
• 4A and 4B each a processing arrangement in a schematic view, according to various embodiments.

In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology such as "top", "bottom", "front", "back", "front", "rear", etc. is used with reference to the orientation of the figure (s) described. Because components of embodiments can be positioned in a number of different orientations, the directional terminology is illustrative and is in no way limiting. It is understood that others Embodiments may be used and structural or logical changes may be made without departing from the scope of the present invention. It should be understood that the features of the various exemplary embodiments described herein may be combined with each other unless specifically stated otherwise. The following detailed description is therefore not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.

As used herein, the terms "connected," "connected," and "coupled" are used to describe both direct and indirect connection, direct or indirect connection, and direct or indirect coupling. In the figures, identical or similar elements are provided with identical reference numerals, as appropriate.

According to various embodiments, a substrate carrier is provided for use with PVD (physical vapor deposition) vacuum coating equipment, e.g. for use in the horizontal transport of thin (e.g., less than 1 mm thick), fragile substrates (e.g., comprising a semiconductor material, e.g., silicon wafers, or the like).

In PVD vacuum deposition systems for the horizontal transport of thin substrates (e.g., Si wafers), the substrates are usually transported on a so-called carrier (referred to herein as substrate support) through the vacuum deposition equipment. The carrier can be moved, for example, in the transport direction on both sides on rails via actively driven transport rollers through the vacuum coating system. Each time the front edge of the carrier rails hits the driven transport rollers, the rails of the carrier vibrate. Amplitude and frequency of the vibration are dependent, for example, on the center distance of the transport rollers, the transport speed of the carrier, as well as the structural design of the rails and the running surface of the transport rollers.

The vibrational excitation of the carrier is technically not completely avoidable. In the case of conventional carriers, the vibration is transmitted via the mechanical elements of the carrier down to the supported substrates and can lead to the breakage of individual substrates. Various constructive measures on the carrier can lead primarily to the reduction of vibration excitation, however, an excitation of the carrier to the vibration technically can not be completely avoided and there is a risk with conventional carriers that existing vibrations from the location of the excitation (eg from the carrier rail) can transfer to the substrates. The transmission of the vibrations from the carrier rail to the substrates is in conventional carriers in particular by a continuous from the rail to Substrataufnehmer present form and / or adhesion of the mechanical elements of the carrier, which are made of metallic materials, preferably made of stainless steel.

According to various embodiments, a carrier (substrate carrier) is provided in which the transmission of the technically unavoidable excitation oscillation generated, for example, between transport rollers and carrier rails of the carrier, are reduced by damping measures such that the oscillation transmitted to the respective substrate is minimized in amplitude and frequency is that the breakage rate of damaged substrates is reduced. Furthermore, a carrier (substrate carrier) is provided which has a structurally simple structure, for example in order to keep its manufacturing costs and maintenance costs low.

According to various embodiments, a carrier (substrate carrier) is provided in which the technically induced vibrations are transmitted by vibration damping elements (also referred to as buffer elements) as far as possible not or only with reduced amplitude and reduced frequency to the substrate.

According to various embodiments, no mechanical connection of a metallic material is provided between the location of the vibration excitation (i.e., the rail) and the location of the substrates (substrate receiving), which could ideally transmit the vibrations. The mounting of the substrate holder is structurally designed such that the mechanical connection of the substrate holder to the next element (for example the carrier rail) takes place via vibration isolators (also referred to as buffer elements). At places where the mechanical connection of the substrate holder to the next element (eg a substrate receiving stabilizer) must be made of metallic materials for technically and economically reasonable reasons, is achieved via vibration-damping decouplers that the substrate recording stabilizer vibration damped him the next following element (eg Support rail) is mounted.

According to various embodiments, the hardness of the damping elements (eg the buffer elements) may be adjusted accordingly. For example, the damping elements may comprise a material that is softer or more so is more elastic than the material of the carrier rails and / or the substrate holding plate.

According to various embodiments, a reduction in the breakage rate of transported substrates compared to conventional carriers can be achieved. Furthermore, a cost savings can be achieved by simplified components of the carrier.

The corresponding vacuum coating equipment adapted to the substrate carrier may be provided at lower cost, e.g. For example, the center distance of the transport rollers, which is an important criterion for vibrational excitation, can be increased since the excitation oscillation is attenuated clearly by damping measures up to the substrate. This means that less required transport rollers per length of vacuum coating equipment may be needed, resulting in significant cost savings.

According to various embodiments, the vibration-damped carrier described herein may be configured such that automated loading / unloading of the substrates is possible. For example, the substrates can be placed with or without holding frame on the substrate holding plate or inserted into recesses of the substrate holding plate. For this purpose, for example, a robot arm with suction pads can be used.

1 illustrates a substrate carrier 100 in a schematic plan view, according to various embodiments. The substrate carrier 100 For example, has two spaced carrier rails 102 . 102b on. The two carrier rails 102 . 102b are by means of a spacer arrangement 104 in a (predefined) distance 101 fixed to each other. The distance 101 corresponds to or defines the track width of the to the substrate carrier 100 suitable transport system (cf. 4 ).

The substrate carrier 100 has a substrate holding plate 106 with a holding area 106h for holding one or more substrates. The holding area 106h is configured such that in the holding area 106h held substrates can be coated homogeneously, for example in a coating system, ie a coating area of the coating system can be at least as wide as the holding area 106h (see. 4A ).

According to various embodiments, the substrate carrier 100 several holding structures 108 on which the substrate holding plate 106 between the two carrier rails 102 . 102b hold. For vibration decoupling, each of the support structures 108 a decoupling structure. The holding structures 108 are set up, the substrate holding plate 106 vibration decoupled between the carrier rails 102 . 102b to store. The retaining structures can be clearly illustrated 108 be set up so that this the substrate holding plate 106 from the carrier rails 102 . 102b mechanically decoupled. The spacer arrangement 104 and the carrier rails 102 . 102b Illustratively form a stable frame, wherein the substrate holding plate 106 is mounted vibration-decoupled in this context.

The spacer arrangement 104a can serve, for example, the width 101 to hold, for example, alone with the support structures 108 may not be possible due to the vibration-damping or movable storage.

Between the carrier rails 102 . 102b and the substrate holding plate 106 can a gap 102s remain in direct physical contact between carrier rails 102 . 102b and substrate holding plate 106 that the mechanical vibrations from the carrier rails 102 . 102b directly on the substrate holding plate 106 would be transferred to avoid.

According to various embodiments, the substrate carrier 100 a length (eg in the direction 103 ) in a range of about 0.5 m to about 5 m. According to various embodiments, the substrate carrier 100 a width (eg in the direction 101 ) in a range of about 0.5 m to about 5 m. The longitudinal direction 103 For example, during transport of the substrate carrier 100 define the transport direction in a processing plant or correspond to the transport direction.

The following are various modifications and configurations of the substrate carrier 100 and details of the carrier rails 102 . 102b , the distance holding arrangement 104a . 104b , the substrate holding plate 106 , and the holding structures 108 described, with respect to the 1 analogous to the basic features and functions described above. Furthermore, the features and functions described below can be applied analogously to those in 1 described substrate carrier 100 be transferred or with the in 1 described substrate carrier 100 be combined.

As in 2A is shown in a schematic plan view, the spacer arrangement 104 a first spacer 104a and a second spacer 104b each having the two carrier rails 102 . 102b connect with each other. The substrate holding plate is between the two spacers 104a . 104b arranged. According to various embodiments, the substrate carrier 100 Furthermore, several connection structures 210 comprising the substrate holding plate 106 with the first spacer 104a and the second spacer 104b connect. Each of the connection structures 210 may be a decoupling structure for vibration decoupling of the substrate holding plate 106 from the first spacer 104a and the second spacer 104b exhibit. The connection structures 210 may be arranged, the substrate holding plate 106 vibration decoupled between the spacers 104a . 104b to store.

According to various embodiments, the support structures 108 the substrate holding plate 106 laterally, eg in the direction 101 and / or towards 103 , stabilize. The connection structures 210 can the substrate holding plate 106 vertically (eg perpendicular to the directions 101 . 103 ) stabilize.

As in 2 B is shown in a schematic plan view, the substrate carrier 100 furthermore at least one further substrate holding plate 206 exhibit. The further substrate holding plate 206 can be just like the substrate holding plate 106 be configured, ie illustratively, several substrate holding plates 106 . 206 in the substrate carrier 100 be kept vibration isolated.

For storing the further substrate holding plate 206 can the spacer arrangement 104 a third spacer 104c which also (eg in an analogous manner as described above), the two carrier rails 102 . 102b connects with each other. The further substrate holding plate 206 can between the two carrier rails 102 . 102b and between the second spacer 104b and the third spacer 104c be arranged. Accordingly, several more support structures 108 as above for the substrate support plate 106 is described, used to the additional retaining plate 206 between the two carrier rails 102 . 102b to store.

Accordingly, other connection structures 210 as above for the substrate support plate 106 described, which is the further substrate holding plate with the second spacer 104b and the third spacer 104c can connect. According to various embodiments, at least one of the connection structures 210 be furnished, including the two substrate holding plates 106 . 206 connect to.

According to various embodiments, at least one of the connection structures 210 the substrate holding plate 106 with the further substrate holding plate 206 by means of positive locking (and optionally additionally by means of adhesion) connect. In this case, the two substrate holding plates 106 . 206 by means of the connection structure 210 be connected by clamping, then the connection structure 210 vibration decoupled with the respective spacer (eg the second spacer 104b in 2 B ) connected is.

3A illustrates a substrate carrier 100 in a schematic plan view, according to various embodiments. The substrate carrier 100 has, in an analogous manner as described above, several (eg three) substrate holding plates 106 on. Here are the carrier rails 102 . 102b by means of a spacer arrangement 104 with several spacers 304 connected to each other, and in each case a substrate holding plate 106 is between two adjacent spacers 304 the spacer arrangement 104 arranged.

As in 3A Illustrated is any of the substrate holding plates 106 several substrate receiving areas 306 have, for example, a number of 10 to 100, or even more than 100, for example, depending on the size of the substrates to be transported and the size of the respective substrate holding plate 106 ,

3B illustrates the in 3A illustrated substrate carrier 100 in a cross-sectional view through one of the spacers 304 the spacer arrangement 104 therethrough, according to various embodiments.

According to various embodiments, the carrier rails 102 . 102b have a profile, such as a c-shaped profile, a u-shaped profile, or the like. The carrier rails 102 . 102b may have such a profile that, for example, transport roller stumps in the carrier rails 102 . 102b can intervene (cf. 4A ).

3C and 3D illustrates each of the in the 3A and 3B illustrated substrate carrier 100 in a cross-sectional view through one of the spacers 304 the spacer arrangement 104 therethrough, according to various embodiments.

According to various embodiments, the spacer may be 304 the two carrier rails 102 . 102b firmly connect with each other, for example, be screwed to this or otherwise be positively and / or non-positively attached. The spacer 304 For example, it may be a pipe or a rod (or the like).

The substrate holding plates 106 can not directly on the spacer 304 be attached, there otherwise vibrations directly from the carrier rails 102 . 102b over the spacer 304 on the substrate holding plate 106 would transfer. Therefore, as described above, a vibration damping connection structure 210 used the substrate holding plate 106 by means of the spacer 304 to stabilize, if necessary. According to various embodiments, the connection structure 210 a stabilizer arrangement 318 on which a substrate holding plate 106 or more substrate holding plates 106 clamps. The stabilizer arrangement 318 is vibration isolated on the spacer 304 assembled.

As in 3D is shown, the stabilizer assembly 318 two clamping elements 318a . 318b having the two sides of the spacer 304 arranged substrate holding plates 106 connect with each other in a clamped way. The clamping elements 318a . 318b the stabilizer arrangement 318 surround the spacer 304 and are attached to this vibration isolation.

As in 3C is illustrated, the clamping elements 318a . 318b the stabilizer arrangement 318 by means of several buffer elements 310p . 320p from the spacer 304 be vibration isolated stored. In this case, at least one first buffer element 310p be arranged such that the stabilizer arrangement 318 no direct contact with the carrier rails 102 . 102b or that the stabilizer arrangement 318 from the carrier rails 102 . 102b are vibration isolated. Thus, for example, between the stabilizer assembly 318 and the carrier rails 102 . 102b provided a gap. Furthermore, one or more second buffer elements 320p be arranged such that the stabilizer arrangement 318 no direct contact with the spacer 304 or that the stabilizer arrangement 318 from the spacer 304 vibration isolated. Thus, for example, between the stabilizer assembly 318 and the spacer 304 provided a gap. The buffer elements 310p . 320p can be annular, for example, so-called O-rings made of an elastic material.

According to various embodiments, the spacer may be 304 detachable on the carrier rails 102 . 102b be fastened, for example by means of one screw. For assembly purposes, the stabilizer assembly 318 and spacers 304 have a twist-securing, for example, a through hole for at least temporarily securing the stabilizer assembly 318 and the spacer 304 against twisting during assembly or maintenance. According to various embodiments, the substrate holding plates 106 due to the detachable attachment to the spacers 304 be easily exchanged.

3E illustrates the in the 3A and 3B illustrated substrate carrier 100 in a cross-sectional view through one of the support structures 108 therethrough, according to various embodiments.

According to various embodiments, the respective substrate holding plate 106 by means of the correspondingly assigned holding structures 108 detachable on the two carrier rails 102 . 102b be attached, for example by means of a screw 308s , According to various embodiments, the substrate holding plates 106 due to the detachable attachment to the carrier rails 102 . 102b be easily exchanged.

Each of the support structures 108 can a holder 308h have, the rotationally secured 332 on the respective carrier rail 102 . 102b is attached, for example, is screwed. The substrate holding plate 106 can be clamped to the holder 308h be fastened, for example by means of the screw and corresponding rings and / or sleeves as buffer elements.

According to various embodiments, buffer elements become 308p used the substrate holding plate 106 secure vibration-insulated. The substrate holding plate 106 for example, between two buffer elements 308p be trapped or become. Furthermore, another buffer element 318P used, for example, a direct physical contact of the substrate holding plate 106 with the screw 308s can prevent.

As in 3E is shown, the substrate holding plate 106 be stored so that it laterally (eg in the direction 101 ), eg a possible thermal expansion of the substrate holding plate 106 to take into account. The substrate holding plate 106 For example, only along the vertical direction 105 (perpendicular to the substrate support surface of the substrate holding plate 106 ) be or become clamped.

According to various embodiments, the substrate holding plate 106 a through hole 308d or a suitable recess 308d have, so the screw 308s the substrate holding plate 106 can clamp accordingly.

The height (eg in the direction 105 ), for clamping the substrate carrier 100 maximum is available, for example, by means of a sleeve 328 be defined, which by means of the screw 308s to the holder 308h can be pressed. The sleeve 328 For example, by means of a collar and the buffer elements 308p a predefined pressure on the substrate holding plate 106 exercise.

It is understood that there are various suitable options, the substrate holding plate 106 between the carrier rails 102 . 102b to store vibration isolated.

According to various embodiments, the connection structures 210 be designed such (eg clamping) that a thermal expansion of the substrate holding plate 106 is compensated.

According to various embodiments, it may be helpful to use the buffer elements for vibration-isolated storage of the substrate holding plate 106 so that they can be protected against process influences. For example, coating can not avoid having the spacer assembly 104 is at least partially coated, as this, as the substrate holding plate 106 , between the two carrier rails 102 . 102b extends. As in 3D is shown, the clamping elements 318a . 318b the stabilizer arrangement 318 be arranged such that between these and the substrate holding plate 106 no vertical gap remains free. Clearly, a gap between two adjacent substrate holding plates 106 by means of the clamping elements 318a . 318b be covered. Thus, for example, no coating material from one side above the substrate support 100 on the other side below the substrate carrier 100 what, for example, a gas separation between areas above and below the substrate carrier 100 supported.

According to various embodiments, at least one clamping element 318a . 318b the stabilizer arrangement 318 directly on the two adjacent substrate holding plates 106 be clamped. The respective clamping element 318a . 318b (or both clamping elements) can essentially over the entire ready (in the direction 101 ) of the substrate holding plate 106 or the substrate carrier 100 extend, cf. 3B ,

According to various embodiments, at least one clamping element 318a . 318b the stabilizer arrangement 318 (or both clamping elements) each to their vibration-insulated storage verendeten buffer elements 310p . 320p cover partially or completely. The gap between the respective spacer 304 and the stabilizer assembly 318 which the spacer 304 surrounds, for example, by means of the through hole 322 be evacuated.

According to various embodiments, the sleeve may also 328 the buffer elements 308p . 318P the holding structures 108 cover.

4A illustrates a processing arrangement 400 in a schematic view, according to various embodiments.

According to various embodiments, the processing arrangement 400 a transport system for transporting the substrate carrier 100 , The transport system can be two spaced apart transport devices 402a . 402b have for storing the substrate carrier 100 by means of its carrier rails 102 . 102b ,

According to various embodiments, the substrate carrier 100 as described above, by means of the transport system through a processing area 404a . 404b a processing chamber 406 be transported through (see. 4B ).

In the processing area 404a . 404b can by means of the substrate support 100 transported substrates are processed, for example, be coated or treated in other ways.

As in 4B is illustrated in a schematic view, the processing arrangement 400 at least one processing chamber 406 have for processing by means of the substrate carrier 100 transported substrates. The two spaced apart transport devices 402a . 402b may be on opposite lateral chamber walls 406w the processing chamber 406 be arranged. The respective substrate carrier 100 can on the transport devices 402a . 402b be transported lying on the floor. The transport devices 402a . 402b For example, define a transport layer 400e in which one or more substrate carriers 100 be transported.

According to various embodiments, the processing arrangement 400 a processing device 408 or multiple processing devices 408 (eg magnetrons) above and / or below the transport plane 400e exhibit. Thus, by means of the respective substrate carrier 100 transported substrates are processed on one side and / or both sides.

For example, as a processing device 408 sputter 408 (so-called magnetrons) are used, by means of the respective substrate carrier 100 transported substrates coated on one side and / or both sides.

As described above, the substrate carrier 100 be set up so that this one processing area 404a above the transport level 400e from a processing area 404b below the transport level 400e separated. For example, thus a gas exchange (eg, the exchange of gaseous coating material) between the two processing areas 404a . 404b be prevented or at least reduced. Thus, for example, the opposing sides of the respective substrate can be processed differently.

According to various embodiments, the processing chamber 406 be a vacuum chamber and be coupled for example with a vacuum pump assembly so that it can be evacuated, for example, to a pressure of less than 1 mbar.

According to various embodiments, a substrate carrier 100 for use in a processing arrangement 400 described. The substrate carrier 100 has a mechanical damping to a vibration transmission to the means of the substrate carrier 100 to reduce transported substrates. The damping of the vibration can be achieved, for example, by the substrate receiving plate (also referred to as the substrate holding plate 106 ) in z-direction (eg in direction 105 ) at one or more points between two vibration isolators (also as buffer elements 308p referred to) is clamped. According to various embodiments, the Shore hardness of the vibration isolators is substantially lower (ie softer) than the Shore hardness of the material of the substrate mounting plate. The required stroke for clamping the substrate mounting plate in the z-direction thus takes place, for example, matched to the Shore hardness of the vibration isolators. The stroke is mechanically limited by a spacer (also called a sleeve 328 referred to), which in its length to the thickness of the substrate receiving plate (in the direction 105 ) and the Shore hardness of the vibration isolators is tuned.

A technically necessary shift of the substrate receiving plate (eg by heating) in the xy direction (eg in the direction 101 and / or direction 103 ) is made possible by sliding the substrate receiving plate, which is clamped between the vibration isolators. A stop of the cylindrical or flat surface of the receiving bore (as a recess 308d referred to) of the substrate receiving plate to a hard metallic, cylindrical surface of the spacer is avoided in that the spacer over its entire height with one or more layers of an elastic and damping material (eg a shrink tube, also referred to as a buffer element 318P ) is surrounded.

The two rails (also as carrier rails 102 . 102b designated) of the substrate carrier 100 are via one or more spacers (also called spacers 304 referred to) connected to each other. The one or more spacers, for example, ensure the required track width between the two rails in the transport direction.

The substrate receiving stabilizer (also as a stabilizer arrangement 318 or clamping elements 318a . 318b is held in its axial direction on both sides relative to the rails and horizontally or vertically relative to the spacer at a distance by a vibration isolator (also referred to as a buffer element 310p ) is compressed in a suitable groove geometry between rail, spacer and substrate receiving stabilizer such that no direct contact of the substrate receiving stabilizer with the rails and the spacer is possible. The gap dimension and the groove geometry between Substrataufnahmestabilisators and rail or between Substrataufnahmestabilisator and spacers are dimensioned in the compressed state so that it tuned to the number of installed spacers and Shore hardness of the compressed vibration isolators leads to a noticeable vibration damping.

Claims (10)

Substrate Carrier (100), comprising: Two spaced support rails (102a, 102b); A spacer arrangement (104) which fixes the two carrier rails (102a, 102b) at a distance from each other; A substrate holding plate (106) having a holding portion (106h) for holding at least one substrate; and A plurality of support structures (108) holding the substrate support plate (106) between the two support rails (102a, 102b), each of the support structures (108) having a decoupling structure for vibration decoupling the substrate support plate (108) from the two support rails (10); 102a, 102b). Substrate carrier according to Claim 1 wherein the spacer assembly (104) comprises a first spacer (104a) and a second spacer (104b) connecting the two support rails (102a, 102b) together, the substrate support plate (106) being interposed between the two spacers (104a, 104b). 104b) is arranged. Substrate carrier according to Claim 2 , further comprising: • another substrate support plate (206) having a holding portion for holding at least one substrate, the spacer assembly (104) having a third spacer (104c) interconnecting the two support rails (102a, 102b); another substrate support plate (206) between the two support rails (102a, 102b) and between the second spacer (104b) and the third spacer (104c); and • a plurality of further support structures (108) connecting the further support plate (206) to the two support rails (102a, 102b), each of the further support structures (108) having a decoupling structure for vibration decoupling the further support plate (206) from the two support rails (102a, 102b). Substrate carrier according to Claim 2 or 3 , further comprising: a plurality of connection structures (210) connecting the substrate support plate (106) to the first spacer (104a) and / or the second spacer (104b), each of the connection structures (210) having a decoupling structure for vibration decoupling the substrate Retaining plate (106) from the first spacer (104a) and the second spacer (104b), respectively. Substrate carrier according to Claim 3 , further comprising: a plurality of further connection structures (210) which connect the further substrate support plate (206) to the second spacer (104b) and / or the third spacer (104c), wherein each of the further connection structures (210) has a decoupling structure for Vibration decoupling the further substrate support plate (206) from the second spacer (104b) and the third spacer (104c), respectively. Substrate carrier according to one of Claims 1 to 5 wherein a respective gap (102s) is provided between the substrate holding plate (106) and the two carrier rails (102a, 102b). Substrate carrier according to one of Claims 1 to 6 wherein the substrate support plate (106) is releasably secured to the two support rails (102a, 102b) by means of the plurality of support structures (108). Substrate carrier according to one of Claims 1 to 7 wherein the decoupling structure comprises at least one buffer element (308p, 318p, 310p, 320p) of a flexible material and / or wherein the decoupling structure comprises at least one flexible buffer element (308p, 318p, 310p, 320p). A processing assembly (400), comprising: a transport system for transporting a substrate carrier (100) according to any one of Claims 1 to 8th • wherein the transport system has two spaced transport devices (402a, 402b) and • wherein the two transport devices (402a, 402b) are arranged to support the substrate carrier (100) by means of the carrier rails (102a, 102b). Processing arrangement (400) according to Claim 9 , further comprising: a processing chamber (406), wherein the processing arrangement is set up to process at least one substrate transported within the processing chamber by means of the substrate carrier, and wherein the two transport devices are arranged on opposite side chamber walls (406w) of the processing chamber (406) are arranged.

Images