DE102014116342B4 - Substrate holding device and method for processing a substrate - Google Patents

Abstract

According to various embodiments, a substrate holding device (100) may comprise: a carrier plate (102) having a recess (112) for receiving at least one holding frame (132a, 132b) for holding a substrate (220) by means of the at least one holding frame (132a, 132b) the recess (112), the recess (112) extending from an upper side (102a) of the support plate (102) to a lower side (102b) of the support plate (102) through the support plate (102); wherein the carrier plate (102) has at least one centering region (104) such that an opening width (112a, 112b) of the recess (112) from the upper side (102a) towards the lower side (102b) in the at least one centering region (104 ), and the at least one holding frame (132a, 132b), which has at least one centering section (134a, 134b) such that when inserting the at least one holding frame (132a, 132b) into the recess (112) the at least one centering section (112) 134a, 134b) forms a positive connection with the at least one centering region (104), whereby the at least one holding frame (132a, 132b) is kept centered in the recess.

Description

The invention relates to a substrate holding device and a method for processing a substrate.

In general, a substrate or multiple substrates, for. As wafers or other plate-shaped substrates, for example, during a coating process (or other processes for treating substrates) are held by means of a substrate support. In this case, the substrate carrier can be used, for example, to hold the substrate or the substrates at a predefined position in a coating chamber or to transport it through a coating chamber and / or to move it in the coating chamber. In this case, for example, substrate carriers are conventionally used, in which substrates are inserted only loosely, wherein the substrates in this case can easily fall out of the substrate carrier, for. B. when venting a vacuum chamber due to the sunken air. Therefore, conventional substrate carriers can have a cover element which rests on the substrate and weights it or presses the substrate against the substrate carrier. Alternatively, for example, wafers are clamped between two flexible structures (eg between two rubber rings, and thus fixed in a holder.

In JP 2010-129 764 A For example, a susceptor for processing a wafer is described, wherein a first susceptor member has a smaller diameter than the wafer and holds a central portion of the wafer, and wherein a second susceptor member holds a spacer and the first susceptor member, wherein the spacer holding an outer edge of the wafer.

In DE 10 2010 052 689 A1 a substrate holder for a surface coating of substrates is described, wherein the substrate holder is formed in a frame shape. In this case, an oblique edge surface is provided on the substrate holder, on which the substrate rests, so that a complete coating of the surface without encroaching on unwanted areas of the substrate takes place.

In US 4 599 069 A a substrate holder is described, wherein a substrate is inserted into a holder having a cylindrical wall portion and a flange portion. Further, a heat conducting plate is inserted into the holder, wherein the heat conducting plate rests on the substrate.

It is an object of the present invention to provide improved substrate holding devices and an improved method of processing a substrate.

According to various embodiments, a substrate holding device (also referred to as substrate holder, substrate carrier or wafer carrier) is provided, by means of which one or more substrates can be held, wherein the substrate holding device has a carrier plate with one or more recesses, in each case a substrate can be held by means of two in the respective recess inserted frame (also referred to as a holding frame or sub-frame and upper frame or sub-frame or sub-mask and upper mask), wherein the substrate is disposed between the two frames. For example, the respective substrate can rest on a lower frame (subframe) and have no direct physical contact with an overlying upper frame (upper frame). In this case, the substrate holding device is set up such that the two frames (or at least one frame) center in the carrier plate when inserted into the respective recess of the carrier plate and occupy a predefined position and / or orientation. For this purpose, at least one centering region may have in the respective recess an obliquely (eg at an angle of approximately 10 ° to approximately 60 °) to the surface or upper side of the carrier plate. Suitably, the two frames (or at least one frame) may have a sloping surface so that the frames are positioned in the support plate due to the sloping surfaces.

Illustratively, the carrier plate can have a tapering region (eg at the corners in the form of a half hexagonal elevation) in which a matching section of at least one frame can engage in a form-fitting manner, thereby defining the position of the frame in the carrier plate. Clearly, the frame can slip into a predefined position in the carrier plate, d. H. the frame or frames center themselves in the recess of the support plate due to gravity (and the sloping surfaces) itself. The substrate support described herein may be suitable for, for example, horizontal handling of substrates (eg, the support plate may not be perpendicular to the substrates) be placed or turned over head, if the substrates are to remain in their position), since the frame or the frame remain in the recess due to gravity.

According to various embodiments, a substrate holding device comprises: a carrier plate having a recess for receiving at least one holding frame for holding a substrate by means of the at least one holding frame in the recess, the recess passing from an upper side of the carrier plate to a lower side of the carrier plate through the carrier plate extends; the carrier plate at least one centering region (or for example a plurality of centering regions) such that an opening width of the recess from the upper side toward the lower side in the at least one centering region (or in the several centering regions) is continuous (eg strictly monotonic, e.g. linear), and the at least one holding frame having at least one centering (or more centering) such that when inserting the at least one holding frame in the recess, the at least one centering (or more centering) a positive connection with the at least one centering (or the plurality of centering areas), whereby the at least one holding frame is kept centered in the recess.

Furthermore, the at least one holding frame has two holding frames, wherein the two holding frames are centered in the recess when being inserted into the recess, wherein the two holding frames are arranged such that a receiving space for receiving an edge portion of the holding frame is inserted between the two holding frames inserted into the recess Substrate is provided. This edge portion, for example, serve as a support and form the vertical support / positioning.

Furthermore, the at least one centering region (or the plurality of centering regions) may be provided on an inner circumferential wall of the recess. Furthermore, the at least one centering section (or the several centering sections) may be provided on an outer circumferential wall of the at least one holding frame.

Furthermore, the recess in the at least one centering region (or in the several centering regions) can each have at least one planar centering surface. Furthermore, the at least one support frame in the at least one centering section (or in the several centering sections) may each have at least one planar centering surface. Thus, the positive connection can be formed by means of the at least one planar centering surface in the at least one centering region of the recess and by means of the at least one planar centering surface in the at least one centering section of the at least one support frame.

Furthermore, an inner circumferential wall of the at least one holding frame may have a chamfer. In other words, the at least one holding frame may be beveled on the inner circumferential wall thereof.

Furthermore, the recess may be parallelepiped-shaped and have four corner regions (inner corner regions), one centering region being provided at each of the four corner regions of the recess. Furthermore, the recess may be prismatic and have three or more than three corner regions (inner corner regions), wherein one centering region is provided at each of the three or more than three corner regions of the recess. Clearly, the corner regions of the recess can be set up as centering areas.

Furthermore, the respective centering region (eg at the corner regions of the recess) may be formed by means of an at least partially oblique-prismatic corner recess (eg in the form of a partial region of a hexagonal elevation). Further, the plurality (eg, three, four, or more than four) centering portions may be formed at the corner portions of the recess by means of a respective at least partially oblique-prismatic corner recess. Clearly, the recess may be cuboid and have four oblique-prismatic corner recesses.

Furthermore, the at least one holding frame may have a cuboid outer contour with four corner sections (outer corner sections), one centering section being provided at each of the four corner sections of the at least one holding frame. Furthermore, the at least one holding frame may have a prismatic outer contour with three or more than three corner sections (outer corner sections), one centering section being provided at each of the three or more corner sections of the at least one holding frame. Illustratively, the corner sections of the at least one holding frame can be set up as centering sections.

Furthermore, the respective centering section (eg at the corner sections of the at least one holding frame) can be formed by means of an at least partially inclined-prismatic elevation. Furthermore, the plurality of centering sections can be formed on the plurality of (eg, three, four, or more than four) corner sections of the at least one support frame by means of at least partially oblique-prismatic elevation. Illustratively, the at least one holding frame may have a cuboid outer contour with four oblique-prismatic corner sections (outer corner sections).

According to various embodiments, a substrate holding device comprises: a support plate having a frusto-conical or truncated pyramid-shaped recess extending from an upper surface of the support plate to an underside of the support plate through the support plate; a first support frame with a truncated cone-shaped or truncated pyramid-shaped outer contour, which matches the truncated cone-shaped or truncated pyramidal shape Recess is provided, which is positively inserted in the truncated cone-shaped or truncated pyramid-shaped recess; and a second support frame with a frusto-conical or truncated pyramid-shaped outer contour, which is provided matching the truncated cone-shaped or truncated pyramid-shaped recess, which is positively inserted into the truncated cone-shaped or truncated pyramid-shaped recess; wherein the outer diameter of the two holding frames are provided such that a receiving space for receiving a substrate is provided between the two in the truncated cone-shaped or truncated pyramid-shaped recess in a form-fitting inserted holding frame.

According to various embodiments, a substrate holding device comprises: a carrier plate having a through hole, the through hole having a plurality of corner portions, and the through hole extending from an upper side of the carrier plate to a lower side of the carrier plate through the carrier plate; wherein the carrier plate has a centering region at each corner region, each centering region having at least one centering surface (eg a curved centering surface or a plurality of planar centering surfaces) tilted at an angle of 10 ° to 60 ° against the top side and / or bottom side the carrier plate extends from the top to the bottom of the carrier plate through the carrier plate.

Furthermore, the substrate holding device has at least one holding frame matching the passage opening of the carrier plate, wherein the holding frame has a plurality of outer corner sections matching the plurality of centering regions of the carrier plate such that the outer corner sections of the at least one holding frame form a positive connection when the holding frame is inserted into the passage opening form with the centering areas.

According to various embodiments, a substrate holding device may include: a carrier plate having a recess extending from an upper side of the carrier plate to a lower side of the carrier plate through the carrier plate for receiving a first holding frame and a second holding frame in the recess; wherein the carrier plate has a plurality of centering regions such that an opening width of the recess continuously (eg, strictly monotonically or linearly) decreases from the upper side to the lower side, the first holding frame, the first holding frame having a plurality of first centering sections (matching the a plurality of centering areas), that upon insertion of the first holding frame in the recess, the plurality of first centering form a positive engagement with the plurality of centering, whereby the first holding frame is kept centered in the recess; the second holding frame, the second holding frame having a plurality of second centering portions (matching the plurality of centering portions) such that upon insertion of the second holding frame into the recess, the plurality of second centering portions form a positive fit with the plurality of centering portions, thereby centering the second holding frame in the recess is held; wherein the two holding frames are arranged such that a receiving space for receiving a substrate is provided between the two holding frames inserted into the recess.

According to various embodiments, a method for processing a substrate comprises: inserting a first support frame for holding the substrate in a recess in a support plate; Inserting the substrate into the recess on the first support frame; Inserting a second holding frame in the recess, wherein the second holding frame is arranged such that the substrate is arranged between the two holding frame, wherein between the second holding frame and the substrate, a gap remains, so that the substrate only on the first (or lower ) Holding frame rests. In this case, the insertion of the first holding frame and / or the second holding frame by means of a magnetic gripper or a suction gripper (also referred to as a vacuum gripper) take place.

According to various embodiments, engagement surfaces on the support frame may be adapted to the gripper.

According to various embodiments, the four centering regions may be formed at the corner regions of the recess by means of a respective at least partial pyramidal or oblique-pyramidal corner recess. In this case, the four centering regions may each have a plurality (two, three, four or more than four) trapezoidal surfaces at the corner regions.

According to various embodiments, the four centering regions may be formed at the corner regions of the recess by means of a respective at least partially oblique-prismatic corner recess. In this case, the four centering regions may each have a plurality (two, three, four or more than four) trapezoidal or rectangular surfaces at the corner regions.

According to various embodiments, the four centering sections can be formed on the four outer corner sections of the at least one holding frame by means of at least one partial pyramidal or oblique pyramidal elevation. The four centering on the Outside corner sections each have a plurality (two, three, four or more than four) trapezoidal surfaces.

According to various embodiments, the four centering sections may be formed on the four outer corner sections of the at least one holding frame by means of a respective at least partially oblique-prismatic elevation. In this case, the four centering sections may each have a plurality (two, three, four or more than four) trapezoidal or rectangular surfaces at the outer corner sections.

Embodiments of the invention are illustrated in the figures and are explained in more detail below.

Show it

1A a support plate of a substrate holding device in a schematic cross-sectional view or side view, for explaining partial aspects of the invention according to various embodiments;

1B a carrier plate of a substrate holding device in a schematic cross-sectional view, according to various embodiments;

1C two holding frames of a substrate holding device in a schematic cross-sectional view, according to various embodiments;

1D and 1E a substrate holding device, each in a schematic cross-sectional view, according to various embodiments;

1F a carrier plate of a substrate holding device in a schematic cross-sectional view, according to various embodiments;

2 and 3 a substrate holding device, each in a schematic cross-sectional view, according to various embodiments;

4A to 4C a substrate holding device, each in a schematic perspective view, according to various embodiments;

5 a substrate holding device in a schematic plan view, according to various embodiments; and

6 a substrate holding device in a schematic perspective view, according to various embodiments.

In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology such as "top", "bottom", "front", "back", "front", "rear", etc. is used with reference to the orientation of the described figure (s). Because components of embodiments can be positioned in a number of different orientations, the directional terminology is illustrative and so far not limiting in any way.

As used herein, the terms "connected," "connected," and "coupled" are used to describe both direct and indirect connection, direct or indirect connection, and direct or indirect coupling. In the figures, identical or similar elements are provided with identical reference numerals, as appropriate.

According to various embodiments, the substrate holding device described herein may be used to transport substrates, e.g. As wafers, in a process chamber, for. B. in a horizontal coating system, used, for. B. for coating the substrates by means of a physical vapor deposition (PVD) and / or chemical vapor deposition (CVD). In this case, the substrate holding device can be provided in such a way and the coating system can be set up in such a way that the substrates can be coated from below and / or from above, e.g. B. simultaneously from below and from above, or z. B. successively from below and from above without discharging the substrates from the coating plant.

According to various embodiments, a support may or may not be provided for one or more substrates, which may be inexpensively manufactured, e.g. B. without the material of the wearer must be milled. For this purpose, the substrate holding device may for example be structurally designed such that in a support plate exclusively (from top to bottom or from bottom to top) continuous cuts can be made, for. Example by means of a water jet or by means of a laser beam to produce the substrate holding device from the carrier plate. In other words, for example, a support plate can be structurally designed so that in the support plate exclusively (from top to bottom or from bottom to top) continuous cuts can be made, for. Example by means of a water jet or by means of a laser beam to produce a corresponding substrate holding device from the carrier plate.

According to various embodiments, the substrate holding device (or at least the support plate of the substrate holding device) are made of material having a hexagonal lattice structure (e.g., titanium). Thus, the substrate holding device may be suitable, for example, for use at high temperatures.

Furthermore, the substrate holding device can be set up such that all components used for fully automatic loading and unloading of the substrates are suitable, for. B. by means of a charging robot. Furthermore, the substrate holding device may be configured such that all components used can be easily cleaned, for. As wet-chemically or by dry ice blasting.

1A illustrates a carrier plate 102 in a schematic cross-sectional view or side view, wherein the carrier plate 102 a top 102 (or an upper surface) and a bottom 102b (or a lower surface). The two surfaces can be plane-parallel to each other. The carrier plate 102 can be a thickness along the direction 105 (perpendicular to the two surfaces 102 . 102b ) in a range of about 3 mm to about 80 mm, e.g. A thickness in a range of about 1 cm to about 6 cm. According to various embodiments, the carrier plate 102 consist of titanium or titanium. Alternatively, the carrier plate 102 be made of any other suitable material, for. B. of a composite material or of metal, for. B. stainless steel. Furthermore, the carrier plate 102 a width along the direction 101 (parallel to the two surfaces 102 . 102b ) in a range of about 50 cm to about 5 m, z. B. a width in a range of about 1 m to about 3 m. Furthermore, the carrier plate 102 a length parallel to the two surfaces 102 . 102b and across the width direction 101 , in a range of about 40 cm to about 5 m, z. B. a width in a range of about 0.5 m to about 2 m.

According to various embodiments, the carrier plate 102 be adapted to the size and size of the substrates to be included as well as the size (eg coating width and / or lock length) of the process equipment used for treating the substrates.

1B illustrates a substrate holding device 100 with a carrier plate 102 in a schematic cross-sectional view, according to various embodiments. The carrier plate 102 has a recess 112 on, with the recess 112 from the top 102 the carrier plate 102 to a bottom 102b the carrier plate 102 through the carrier plate 102 extends through. The recess 112 can, from the direction 105 considered to be circular, square or any n-shaped. The shape of the recess 112 can be adapted to the outer contour of the male substrate or are, for. B. can the recess 112 be substantially circular for receiving circular wafers or square (eg, with rounded or truncated corners) for receiving square wafers (eg, with rounded or cut corners).

According to various embodiments, the recess 112 set up so that in the recess 112 at least one holding frame for holding a substrate can be accommodated, wherein the substrate can be held in the recess by means of the at least one holding frame. For example, the substrate may be on a support frame in the recess 112 rest and / or a support frame may be on or above the substrate in the recess 112 be arranged. According to various embodiments, the recess 112 be set up so that in the recess 112 two holding frames (a so-called sub-frame or a so-called sub-mask and a so-called upper frame or a so-called upper mask) can be accommodated for holding a substrate, wherein the substrate by means of the two holding frame in the recess 112 can be held.

According to various embodiments, the carrier plate 102 at least one centering area 104 such that there is an opening width 112a . 112b the recess 112 from the top 102 towards the bottom 112b in the at least one centering area 104 continuously reduced. The recess can be clear 112 from the carrier plate 102 obliquely with respect to the surfaces 102 . 102b the carrier plate 102 be cut out, z. B. by means of a water jet or laser beam.

As in 1B is shown, the at least one centering 104 the carrier plate 102 through the entire carrier plate 102 extend through. Alternatively, such as in 1C is illustrated, the at least one centering 104 only partially from the top 102 in the carrier plate 102 extend into it. For example, multiple cuts by means of a jet of water or laser beam may be necessary to accommodate the in 1C illustrated shape of the recess 112 from the carrier plate 102 cut.

According to various embodiments, such as in 1B is illustrated, a substrate holding device 100 a carrier plate 102 with a passage opening 112 (also as a recess 112 designated), wherein the passage opening 112 from the top 102 the carrier plate 102 to the bottom 102b the carrier plate 102 through the carrier plate 102 extends through; the carrier plate 102 a centering area 104 or more centering areas 104 having, each centering area 104 at least one centering surface 104f which tilts at an angle of 10 ° to 60 ° against the top 102 and / or the bottom 102b the carrier plate 102 from the top 102 to the bottom 102b the carrier plate 102 through the carrier plate 102 extends through.

According to various embodiments, such as in 1B is illustrated has a substrate holding device 100 a carrier plate 102 with a truncated cone-shaped or truncated pyramid-shaped recess 112 on which is from the top 102 the carrier plate 102 to a bottom 102b the carrier plate 102 through the carrier plate 102 extends through. As in 1C can be illustrated, the truncated cone-shaped or truncated pyramid-shaped recess 112 a truncated cone-shaped or truncated pyramid-shaped area 104 (also as a centering area 104 designated). The recess can be clear 112 through the centering surface 104f be defined or become. In this case, the substrate holding device 100 be configured such that a double-sided coating in the substrate holding device 100 Substrate may be possible.

In an analogous manner, the carrier plate 102 a variety of recesses 112 have for simultaneously receiving and holding a plurality of substrates.

Illustratively shows, for example 1B a base carrier 102 (also referred to as a carrier plate 102 ), which can position one or preferably more wafers for a PVD process. The base carrier 102 has funnel-shaped cutouts depending on the number of wafers to be picked up 112 with the funnel shape pointing in the direction of gravity when the base carrier 102 used for transporting wafers. For example, the angle of the funnel may be in a range of about 15 ° to about 60 °. According to various embodiments, the material of the base carrier 102 consist of a material with a hexagonal lattice structure (eg titanium). The heelless funnel shape, as in 1B is illustrated, allows a greatly simplified manufacturing technology such as laser beam or water jet cutting. By means of water-jet cutting, for example, no heat can be introduced during cutting, and thus, for example, no distortion is introduced into the cut parts. The tolerances to be achieved are, for example, +/- 0.02 mm with a surface finish of Ra 0.8.

As in 1D is illustrated, the substrate holding device 100 a support frame 132a or 132b or more holding frames 132a and 132b on. The at least one holding frame 132a . 132b can have at least one centering section 134a . 134b such that when inserting the at least one holding frame 132a . 132b in the recess 112 the at least one centering section 134a . 134b a positive connection with the at least one centering area 104 the carrier plate 102 forms, whereby the at least one holding frame 132a . 132b in the recess 112 is kept centered.

As in 1E in a schematic cross-sectional view of the substrate holding device 100 is illustrated, the support frame 132a or 132b or can the support frame 132a and 132b from above into the recess 112 in the carrier plate 102 be inserted and due to the centering surface 104f and the matching outer contour of the holding frame 134a or 134b or the support frame 132a and 132b in the recess 112 Center.

As in 1E is illustrated has a substrate holding device 100 in one embodiment at least the following: a carrier plate 102 with a recess 112 for receiving at least one holding frame 132a . 132b for holding a substrate by means of the at least one holding frame 132a . 132b in the recess 112 , with the recess from the top 102 the carrier plate 102 towards the bottom 102b the carrier plate 102 into the carrier plate or through the carrier plate 102 extends through; the carrier plate 102 at least one centering area 104 such that an opening width of the recess from the upper side (eg the opening width 112a ) towards the bottom (eg the opening width 112b ) in the at least one centering area 104 continuously reduced; and the at least one holding frame 132a . 132b , the at least one centering section 134a . 134b such that when inserting the at least one holding frame 132a . 132b in the recess 112 the at least one centering section 134a . 134b a positive connection with the at least one centering area 104 the carrier plate 102 forms, whereby the at least one holding frame 132a . 132b in the recess 112 is kept centered.

The two support frames 132a . 132b are set up so that the two support frame 132a . 132b such in the recess 112 Center that between the two in the recess 112 inserted holding frame 132a . 132b A gap 130 (also as a recording room 130 is provided), in which a substrate can be at least partially received.

Such as in 1E is illustrated, the at least one centering area 104 on an inner circumferential wall of the recess 112 be provided or, wherein the at least one centering 134a . 134b the at least one holding frame 132a . 132b on an outer circumferential wall of the at least one holding frame 132a . 132b is provided. Thus, for example, the two support frame 132a . 132b matching the recess 112 be or be provided. As in 1E is shown, the two holding frame 132a . 132b essentially flush with the surfaces 102 . 102b the carrier plate 102 in the recess 112 lie. Thus, for example, cavities can be avoided, which would be filled in a coating process with coating material, whereby, for example, the support frame 132a . 132b with the carrier plate 102 liable to be connected and / or which due to material accumulation the support frame 132a . 132b no longer in the recess 112 the carrier plate 102 could fit.

Alternatively, such as in 1F is illustrated, the support frame 132a . 132b over the top 102 and / or the bottom 102b the carrier plate 102 protrude.

According to various embodiments, the two holding frames may define a coating area in which a substrate positioned between the two holding frames may be coated. Illustratively, the two holding frames can be provided in such a way that they cover or shield (mask) at least one edge section of a substrate positioned between the two holding frames.

If the recess 112 by means of jet cutting (eg water jet cutting or laser beam cutting) into the carrier plate 102 it may be helpful if the cutting beam does not intersect along curved lines but along a polygon train. For example, if the inclined centering 104f is cut along a circular line (seen from above), leaving a truncated cone-shaped recess 112 yields, has the cutting beam at the top 102 the carrier plate 102 a different speed than on the bottom 102b the carrier plate 102 because the paths to be cut on the top 102 and the bottom 102b the carrier plate 102 differ from each other. According to various embodiments, the recess 112 in the at least one centering area 104 at least one flat centering surface 104f exhibit. Furthermore, the at least one support frame 132a . 132b in the at least one centering section 134a . 134b have at least one planar centering surface for forming the positive connection with the centering surface 104f the carrier plate 102 ,

The centering surface must be clear 104f in the centering area 104 the carrier plate 102 be cut exactly so that here the centering surface 104f can be formed as a plane or as a plurality of levels, for example, a curved centering 104f can not be cut as accurately as a flat centering 104f , The same applies to the matching centering surfaces of the holding frame 132a . 132b ,

As in 2 is shown in a schematic cross-sectional view, a substrate 220 such as a wafer, e.g. B. a semiconductor wafer, for. A silicon wafer, in the substrate holding device 100 be included. The substrate 220 For example, on the lower support frame 132b rest, z. B., the substrate 220 completely with the edge region of the substrate 220 on the lower support frame 132b rest. Furthermore, the substrate 220 only in sections in the edge region of the substrate 220 (For example, with a square substrate each with the corners) on the lower support frame 132b rest.

Case only a one-sided treatment of the substrate 220 is required, the holding frame may be formed as a closed holding plate or, so that one side of the substrate is completely covered (or masked).

Between the upper support frame 132a and the substrate 220 can remain a narrow gap, z. B. with a gap height (along the direction 105 ) in a range of 0.1 mm approximately to about 0.5 mm, or with a gap height of less than 500 μm, 400 μm, 300 μm, 200 μm or 100 μm. Thus, for example, a low manufacturing tolerance for the components of the substrate holding device 100 required. The substrate holding device 100 may be arranged or be such that plate-shaped substrates of any thickness, for. B. with a thickness in a range of about 0.1 mm to about 1 cm, in the recess 112 can be included

According to various embodiments, the gap 130 between the two support frames 132a . 132b have a gap height, which corresponds to the thickness of the substrate to be recorded 220 may be adjusted, for. B. with a gap height (along the direction 105 ) in a range of 0.1 mm approximately to about 1 mm, or with a gap height of less than 1 mm, 500 μm, 300 μm or 200 microns. For example, the lateral extent of the two support frame 132a . 132b (in relation to the opening width of the recess 112 ) Define the distance in which the two holding frame 132a . 132b come to rest in the recess. In this regard, the substrate holding device 100 be provided such that different support frame 132a . 132b for substrates 220 can be used with different substrate thicknesses. Clearly, the upper support frame 132a no physical contact with the substrate 220 to have.

Further, the upper support frame can / may 132a and / or the lower support frame 132b be chamfered, or in other words have a bevel, as in 3 is illustrated in a schematic cross-sectional view. According to various embodiments, the inner peripheral wall of the lower and / or the upper support frame 132a . 132b have a chamfer. Thus, for example, the substrate 220 be coated more homogeneous, since, for example, no or less shading of the substrate 220 due to the support frame 132a . 132b takes place.

By means of the substrate holding device 100 For example, a substrate or multiple substrates can be processed, for. B. horizontally transported, wherein the method may include: inserting the first holding frame 132b for holding the substrate 220 in the recess 112 in the carrier plate 102 ; Insert the substrate 220 in the recess 112 on the first holding frame 132b ; Insert the second holding frame 132a in the recess 112 , wherein the second support frame 132a is set up such that the substrate 220 between the two support frames 132a . 132b is arranged, wherein between the second holding frame 132a and the substrate 220 a gap remains, leaving the substrate 220 only on the first support frame 132b rests. In this case, the insertion of the first holding frame 132b and / or the second support frame 132a done by means of a magnetic gripper or a suction pad. This can / can the first holding frame 132b and / or the second support frame 132a have corresponding elevations (areas), at which the magnetic gripper or the suction pads the respective holding frame 132a . 132b can hold on.

Illustratively, the sub-mask can be the first one 132b in the base carrier 102 be inserted, the positioning by the robot loading due to the funnel shape (or due to the at least one centering 104 in the base carrier 102 and the at least one centering section 134a . 134b on the sub-mask 132b and the top mask 132a ), since all parts (eg the sub-mask 132b relative to the base carrier 102 ) center yourself. After the sub-mask 132b in the base carrier 102 is inserted, the overlay of the wafer 220 done with a small gap 130s (See, for example 3 ) all around to the base carrier 102 , Subsequently, the overlay of the upper mask takes place 132a , which centers itself due to the funnel shape (in the end position). The upper mask touches 132a never the surface of the wafer 220 , Then is this process for all by means of the substrate holding device 100 to be carried wafers 220 completed, for example, a PVD process may begin. By means of the side and above the substrate 220 remaining column 130a . 130s (See, for example 3 ), for example, an efficient evacuation during insertion of the substrate holding device 100 be supported in a vacuum chamber, since no gas volumes are trapped.

Illustratively, several wafers can be used 220 in the substrate holding device 100 when the substrate holding device 100 , in analogous manner as described above, a plurality of recesses 112 and in each case the associated holding frame 132a . 132b having.

The unloading process is like the loading process in the reverse order, possibly the sub-mask 132b permanently in the base carrier 102 can remain. Optionally, the sub mask 132b and the base carrier 102 be firmly connected or become. In this case, only the top mask needs 132a in the recess 112 Center. According to various embodiments, the material of the base carrier 102 consist of a material with a hexagonal lattice structure (eg titanium) as well as all other components (eg the holding frame 132a . 132b ) also.

The heelless funnel shape of all parts used, such as in 1B or 3 illustrates greatly simplified manufacturing technology such as laser beam or water jet cutting. The water jet cutting can be advantageous over the laser beam cutting, since no heat and thus no distortion in the cut parts are introduced. Furthermore, by means of water jet cutting tolerances of less than +/- 0.02 mm and surface quality of less than Ra 0.8 can be achieved. Ra describes the mean roughness (the arithmetic mean of deviations from the center line) in microns).

According to various embodiments, all components can be used for fully automatic loading and / or unloading of the wafers 220 and their masks 132a and 132b suitable. According to various embodiments, the loading of the substrate holding device 100 with substrates after one Cleaning all parts done, z. B. after a wet-chemical cleaning or after a dry ice blasting.

Hereinafter, various modifications and configurations of the substrate holding apparatus will be described 100 and details of the recess 112 and the support frame 132a . 132b described, with respect to the 1A to 1F . 2 and 3 analogous to the basic features and functions described above. Furthermore, the features and functions described below can analogously to those in the 1A to 1F . 2 and 3 described substrate holding device 100 be transferred or with the in the 1A to 1F . 2 and 3 described substrate holding device 100 be combined.

In the following 4A to 4C . 5 and 6 Each is a substrate holding device 100 shown in various views, wherein the substrate holding device 100 in a manner analogous to that described above, comprises a support plate 102 with a passage opening 112 , wherein the passage opening 112 several corner areas 412e (also referred to as corner recesses), and wherein the passage opening 112 from a top 102 the carrier plate 102 to a bottom 102b the carrier plate 102 through the carrier plate 102 extends through. In this case, the carrier plate 102 at every corner 412e a centering area 104 have, each centering 104 at least one centering surface 104f has (for example, in each case a plurality of centering surfaces 104f , z. B. in each case five flat centering surfaces 104f ), which tilted at an angle of 15 ° to 60 ° against the top 102 and / or bottom 102b the carrier plate 102 from the top 102 to the bottom 102b the carrier plate 102 through the carrier plate 102 extends through. Illustrative are only the corner areas of the recess 112 in the carrier plate 102 as centering areas 104 set up. Each centering area can do this 104 several flat centering surfaces 104f have, for. B. in the form of a crooked-prismatic shaped corner recess 412e ,

Illustratively, the carrier plate 102 several substantially square-shaped recesses 112 each having the square shaped recesses 112 four corner recess 412e having, which for centering the support frame 132a . 132b in the respective recess 112 serve.

Furthermore, the substrate holding device 100 at least one holding frame 132a . 132b (eg two retaining frames 132a . 132b ) to match the through hole 112 the carrier plate 102 on, wherein the at least one holding frame 132a . 132b several outer corner sections 432e . 442e so matching the multiple centering areas 104 (or to the prismatic shaped corner recesses 412e ) of the carrier plate 102 that has the outer corner sections 432e . 442e the at least one holding frame 132a . 132b when inserting the at least one holding frame 132a . 132b in the passage opening 112 a positive connection with the centering areas 104 (or with the prismatic shaped corner recesses 412e ) form.

According to various embodiments, the support frame 132a . 132b due to the precise manufacture and storage in the carrier plate 102 a very good thermal contact with the carrier plate 102 exhibit.

Illustratively, the carrier plate 102 several recesses 112 have, each of the recesses 112 is cuboid and four corner areas (inner corner areas) 412e and in each of the four corner areas 412e at least one centering area 104 is provided, or wherein each of the four corner areas 412e as centering area 104 is trained. Each of the four corner areas 412e For example, a pyramid-shaped corner recess 412e (or a crooked prismatic corner recess 412e ) exhibit. Alternatively, each of the four corner areas 412e For example, a cone-shaped corner recess 412e have (not shown). Fits to any of the support frame 132a . 132b in each case a centering section 134a . 134b at each of the four outer corner sections 432e . 442e or each of the four outer corner sections 432e . 442e can as a centering section 134a . 134b be educated. For example, each of the four outer corner sections 432e . 442e of the respective holding frame 132a . 132b be formed by a respective at least partially oblique-prismatic survey.

It is understood that each of the four outer corner sections 432e . 442e the support frame 132a . 132b suitable for the four inner corners 412e in the carrier plate 102 are designed so that holding frame 132a . 132b in the recess 112 be kept centered and thus a substrate 220 between the centered holding frame 132a . 132b can or can be included.

According to various embodiments, the thickness of the carrier plate 102 essentially the added thicknesses of the two support frames 132a . 132b plus plus the gap height of the gap 130 for picking up the substrate 220 ,

According to various embodiments, the two holding frames are located 132a . 132b (or is at least the upper support frame 132a ) free in the recess 112 the carrier plate 102 and are (are) held solely by gravity. Thus, the substrate holding device 100 only for the substantially horizontal transport of substrates 220 be used. Due to gravity, the oblique configuration of the centering regions and centering sections (or the centering surfaces) also generates the exact positioning and / or position (or orientation) of the holding frames 132a . 132b (or at least the upper support frame 132a ) in the recess 112 the carrier plate 102 ,

According to various embodiments, a gripper may be attached to the sections 432e . 442 the support frame 132a . 132b attack. The sections can 432e . 442 the support frame 132a . 132b be adapted to the particular gripper used or are, for. B. in their size.

Claims (10)

Substrate holding device ( 100 ), comprising: a support plate ( 102 ) with a recess ( 112 ) for receiving two holding frames ( 132a . 132b ) for holding a substrate ( 220 ) by means of the two holding frames ( 132a . 132b ) in the recess ( 112 ), wherein the recess ( 112 ) from a top side ( 102 ) of the carrier plate ( 102 ) to a bottom ( 102b ) of the carrier plate ( 102 ) through the carrier plate ( 102 extends); • wherein the carrier plate ( 102 ) at least one centering area ( 104 ) such that an opening width ( 112a . 112b ) of the recess ( 112 ) from the top ( 102 ) towards the bottom ( 102b ) in the at least one centering area ( 104 ) continuously reduced, and • the two holding frames ( 132a . 132b ), each having at least one centering section ( 134a . 134b ) such that when inserting the two holding frames ( 132a . 132b ) in the recess ( 112 ) the respective at least one centering section ( 134a . 134b ) a positive connection with the at least one centering region ( 104 ), whereby the two holding frames ( 132a . 132b ) are kept centered in the recess, wherein the two support frame ( 132a . 132b ) are arranged such that between the two in the recess ( 112 ) inserted retaining frame ( 132a . 132b ) a recording room ( 130 ) for receiving an edge portion of the substrate ( 220 ). Substrate holding device according to claim 1, wherein the at least one centering region ( 104 ) on an inner peripheral wall of the recess ( 112 ) and wherein the respective at least one centering section ( 134a . 134b ) on a respective outer peripheral wall of the two support frames ( 132a . 132b ). Substrate holding device according to claim 1 or 2, wherein the at least one centering region ( 104 ) at least one planar centering surface ( 104f ) and wherein the respective at least one centering section ( 134a . 134b ) has at least one planar centering surface for forming the positive connection. Substrate holding device according to one of claims 1 to 3, wherein a respective inner peripheral wall of the two holding frames ( 132a . 132b ) has a chamfer. Substrate holding device according to one of claims 1 to 4, wherein the recess ( 112 ) is cuboidal and four corner areas ( 412e ), and wherein the at least one centering region ( 104 ) has four centering areas, which at the four corner areas ( 412e ) of the recess are provided. Substrate holding device according to one of claims 1 to 5, wherein the two holding frames ( 132a . 132b ) each have a cuboid outer contour with four outer corner sections ( 432e . 442e ) and wherein the respective at least one centering section ( 134a . 134b ) has four centering sections, which at the respective four outer corner sections ( 432e . 442e ) of the two holding frames ( 132a . 132b ) are provided. Substrate holding device ( 100 ), comprising: A support plate ( 102 ) with a truncated cone-shaped or truncated pyramid-shaped recess ( 112 ) extending from an upper side of the carrier plate ( 102 ) to an underside of the carrier plate ( 102 ) extends through the carrier plate; • a first support frame ( 132b ) with a truncated cone-shaped or truncated pyramid-shaped outer contour which matches the truncated-cone-shaped or truncated pyramid-shaped recess ( 112 ) is provided which positively in the truncated cone-shaped or truncated pyramid-shaped recess ( 112 ) is inserted; A second holding frame ( 132a ) with a truncated cone-shaped or truncated pyramid-shaped outer contour which matches the truncated-cone-shaped or truncated pyramid-shaped recess ( 112 ) is provided which positively in the truncated cone-shaped or truncated pyramid-shaped recess ( 112 ) is inserted; • where the outer diameters of the two holding frames ( 132a . 132b ) are provided such that a receiving space ( 130 ) for receiving a substrate ( 220 ) between the two in the truncated cone-shaped or truncated pyramid-shaped recess ( 112 ) form-fitting inserted holding frame ( 132a . 132b ). Substrate holding device, comprising: a carrier plate ( 102 ) with a passage opening ( 112 ), wherein the passage opening ( 112 ) several corner areas ( 412e ), and wherein the passage opening ( 112 ) from a top side ( 102 ) of the carrier plate to a bottom ( 102b ) of the carrier plate through the carrier plate ( 102 extends); • wherein the carrier plate ( 102 ) at each corner area ( 412e ) a centering area ( 104 ), each centering area having at least one centering surface ( 104f ), which is tilted at an angle of 10 ° to 60 ° against the top and / or the underside of the carrier plate from the top ( 102 ) to the bottom ( 102b ) of the carrier plate ( 102 ) through the carrier plate ( 102 extends); and at least one holding frame ( 132a . 132b ) matching the passage opening ( 112 ) of the carrier plate ( 102 ), wherein the at least one holding frame ( 132a . 132b ) several outer corner sections ( 432e . 442e ) so fitting to the plurality of centering areas ( 104 ) of the carrier plate ( 102 ), that the outer corner sections ( 432e . 442e ) of the at least one holding frame ( 132a . 132b ) when inserting the at least one holding frame ( 132a . 132b ) in the passage opening ( 112 ) a positive connection with the centering areas ( 104 ) form. A method of processing a substrate, the method comprising: • inserting a first support frame ( 132b ) for holding the substrate in a recess ( 112 ) in a carrier plate ( 102 ), wherein the recess ( 112 ) from a top side ( 102 ) of the carrier plate ( 102 ) to a bottom ( 102b ) of the carrier plate ( 102 ) through the carrier plate ( 102 ), wherein the carrier plate ( 102 ) at least one centering area ( 104 ) such that an opening width ( 112a . 112b ) of the recess ( 112 ) from the top ( 102 ) towards the bottom ( 102b ) in the at least one centering area ( 104 ) continuously reduced; and wherein the first support frame ( 132b ) at least one first centering section ( 134b ) such that when inserting the first holding frame ( 132b ) in the recess ( 112 ) the at least one first centering section ( 134b ) a positive connection with the at least one centering region ( 104 ), whereby the first holding frame ( 132b ) in the recess ( 112 ) is kept centered; • insert the substrate ( 220 ) in the recess ( 112 ) on the first support frame ( 132b ); • insert a second support frame ( 132a ) in the recess, wherein the second support frame ( 132a ) at least one second centering section ( 134a ) such that when inserting the second holding frame ( 132a ) in the recess ( 112 ) the at least one second centering section ( 134a ) a positive connection with the at least one centering region ( 104 ), whereby the second holding frame ( 132a ) in the recess ( 112 ) is kept centered, wherein the second support frame ( 132a ) is arranged such that the substrate ( 220 ) between the two holding frames ( 132a . 132b ) is arranged, wherein between the second support frame ( 132a ) and the substrate ( 220 ) A gap ( 130a ) remains, so that the substrate ( 220 ) only on the first support frame ( 132b ) rests. Method according to claim 9, wherein the insertion of the first support frame ( 132b ) and / or the second support frame ( 132a ) takes place by means of a magnetic gripper or a suction gripper.

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