DE102016116535A1 - Elektronische Vorrichtung und deren Schaltungsmodul - Google Patents
Elektronische Vorrichtung und deren Schaltungsmodul Download PDFInfo
- Publication number
- DE102016116535A1 DE102016116535A1 DE102016116535.2A DE102016116535A DE102016116535A1 DE 102016116535 A1 DE102016116535 A1 DE 102016116535A1 DE 102016116535 A DE102016116535 A DE 102016116535A DE 102016116535 A1 DE102016116535 A1 DE 102016116535A1
- Authority
- DE
- Germany
- Prior art keywords
- zone
- circuit module
- light
- substrate
- translucent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 239000004922 lacquer Substances 0.000 claims description 13
- 238000001816 cooling Methods 0.000 claims description 2
- 239000003973 paint Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F23/00—Advertising on or in specific articles, e.g. ashtrays, letter-boxes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/18—Edge-illuminated signs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09936—Marks, inscriptions, etc. for information
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104136194A TWI557359B (zh) | 2015-11-03 | 2015-11-03 | 電子裝置及其電路模組 |
TW104136194 | 2015-11-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102016116535A1 true DE102016116535A1 (de) | 2017-05-04 |
Family
ID=56084717
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102016116535.2A Withdrawn DE102016116535A1 (de) | 2015-11-03 | 2016-09-05 | Elektronische Vorrichtung und deren Schaltungsmodul |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE102016116535A1 (zh) |
GB (1) | GB2544142A (zh) |
NL (1) | NL1042102B1 (zh) |
TW (1) | TWI557359B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106996542A (zh) * | 2015-10-23 | 2017-08-01 | 照明科学集团公司 | 用于层的加重区域的照明系统及相关方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7498521B2 (en) * | 2005-06-30 | 2009-03-03 | Intel Corporation | Method and apparatus for marking a printed circuit board |
DE112007003432A5 (de) * | 2007-02-01 | 2010-01-07 | Siemens Aktiengesellschaft | Schild zur Beschriftung |
DE102007017335C5 (de) * | 2007-04-11 | 2017-04-27 | FELA GmbH | Beleuchtungseinheit mit einer transparenten Trägerplatte und daraufsitzender Leuchtdiode |
DE202008017988U1 (de) * | 2008-05-26 | 2011-02-10 | C.R.F. Società Consortile per Azioni, Orbassano | Transparente Anzeigevorrichtung mit Leiterbahnen, die mit undurchsichtiger Beschichtung versehen sind |
US7542302B1 (en) * | 2008-07-14 | 2009-06-02 | International Business Machines Corporation | Minimizing thickness of deadfronted display assemblies |
CN201570214U (zh) * | 2009-10-23 | 2010-09-01 | 惠州市德赛视听科技有限公司 | 一种模块化标志发光块 |
DE102011106251A1 (de) * | 2011-06-27 | 2012-09-13 | Entertainment Distribution Company GmbH | Schaltungsanordnungskörper, insbesondere Bauteilplatine |
TWM429955U (en) * | 2012-01-20 | 2012-05-21 | Zhen-Rong Guo | Light-emitting nameplate |
TWM508053U (zh) * | 2015-05-12 | 2015-09-01 | Avexir Technologies Corp | 電路模組 |
CN204667882U (zh) * | 2015-05-14 | 2015-09-23 | 宇帷国际股份有限公司 | 固态硬盘 |
CN204629173U (zh) * | 2015-05-21 | 2015-09-09 | 宇帷国际股份有限公司 | 电路模组 |
TWI545583B (zh) * | 2015-11-03 | 2016-08-11 | 宇帷國際股份有限公司 | 電子裝置及其動態隨機存取記憶體 |
CN205122186U (zh) * | 2015-11-11 | 2016-03-30 | 宇帷国际股份有限公司 | 电子装置及其动态随机存取记忆体 |
CN205122137U (zh) * | 2015-11-11 | 2016-03-30 | 宇帷国际股份有限公司 | 电子装置及其电路模组 |
-
2015
- 2015-11-03 TW TW104136194A patent/TWI557359B/zh not_active IP Right Cessation
-
2016
- 2016-08-03 GB GB1613365.4A patent/GB2544142A/en not_active Withdrawn
- 2016-09-05 DE DE102016116535.2A patent/DE102016116535A1/de not_active Withdrawn
- 2016-10-14 NL NL1042102A patent/NL1042102B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
NL1042102A (en) | 2017-05-23 |
GB2544142A (en) | 2017-05-10 |
TW201608170A (zh) | 2016-03-01 |
GB201613365D0 (en) | 2016-09-14 |
TWI557359B (zh) | 2016-11-11 |
NL1042102B1 (en) | 2017-12-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE102016116532A1 (de) | Elektronische Vorrichtung und deren DRAM | |
DE10123633A1 (de) | Sensorelement | |
US9839121B2 (en) | Electronic device and dynamic random access memory thereof | |
DE102008016529A1 (de) | Leuchtdiodeneinheit | |
EP2218118A1 (de) | Anordnung mit mindestens einem optoelektronischen halbleiterbauelement | |
DE112013002398T5 (de) | Licht-emittierende Einheit | |
EP3207505B1 (de) | Datenträger mit flächiger lichtquelle | |
DE102015117486A1 (de) | Organische Leuchtdiode und Anordnung mit einer organischen Leuchtdiode | |
DE102016116527A1 (de) | Solid-State-Disk | |
DE102016116535A1 (de) | Elektronische Vorrichtung und deren Schaltungsmodul | |
DE102016116533A1 (de) | Elektronische Vorrichtung und deren DRAM | |
DE102016116565A1 (de) | Elektronische Vorrichtung und deren Schaltungsmodul | |
EP3788298A1 (de) | Kraftfahrzeugbeleuchtungsmodul | |
DE102008025173A1 (de) | Modul einer lichtemittierenden Diode für eine Instrumententafel | |
EP2161838A2 (de) | Elektrisches Haushaltsgerät sowie Glasfrontplatte für elektrisches Haushaltsgerät | |
DE202006014351U1 (de) | LED-Modul mit RGB LED-Chips | |
DE112012001840T5 (de) | LED-Beleuchtungseinheit | |
DE202021104561U1 (de) | Flachbauende Beleuchtungseinrichtung | |
WO2020057765A1 (de) | Lichtemittierende vorrichtung und verfahren zum herstellen derselben | |
EP0247377B1 (de) | Leiterplatte für Flächenanzeige | |
US9907173B2 (en) | Electronic device having a peripheral component interconnect express (PCI express, PCI-E) insert row and circuit module thereof | |
DE102013208221A1 (de) | Beleuchtungsanordnung und Flüssigkristallbildschirm mit Beleuchtungsanordnung | |
DE102005061553A1 (de) | Chipmodul mit einer Schutzvorrichtung | |
EP1221155A2 (de) | Leuchtdiodenanordnung in transparenten, flächenhaften werbeträgern | |
DE202014105890U1 (de) | Beleuchtungsvorrichtung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R012 | Request for examination validly filed | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |