DE102015013500A1 - Bildgebender Sensor für eine Bauteilhandhabungsvorrichtung - Google Patents

Bildgebender Sensor für eine Bauteilhandhabungsvorrichtung Download PDF

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Publication number
DE102015013500A1
DE102015013500A1 DE102015013500.7A DE102015013500A DE102015013500A1 DE 102015013500 A1 DE102015013500 A1 DE 102015013500A1 DE 102015013500 A DE102015013500 A DE 102015013500A DE 102015013500 A1 DE102015013500 A1 DE 102015013500A1
Authority
DE
Germany
Prior art keywords
component
imaging sensor
receiving
receiving device
turning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102015013500.7A
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German (de)
English (en)
Inventor
Uladimir Prakapenka
Siarhei Lakhadanou
Stephan Spichtinger
Rainer Miehlich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Muehlbauer GmbH and Co KG
Original Assignee
Muehlbauer GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Muehlbauer GmbH and Co KG filed Critical Muehlbauer GmbH and Co KG
Priority to DE102015013500.7A priority Critical patent/DE102015013500A1/de
Priority to PCT/EP2016/072480 priority patent/WO2017063836A1/de
Priority to TW105130581A priority patent/TW201715197A/zh
Publication of DE102015013500A1 publication Critical patent/DE102015013500A1/de
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
DE102015013500.7A 2015-10-16 2015-10-16 Bildgebender Sensor für eine Bauteilhandhabungsvorrichtung Withdrawn DE102015013500A1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE102015013500.7A DE102015013500A1 (de) 2015-10-16 2015-10-16 Bildgebender Sensor für eine Bauteilhandhabungsvorrichtung
PCT/EP2016/072480 WO2017063836A1 (de) 2015-10-16 2016-09-22 Bildgebender sensor für eine bauteilhandhabungsvorrichtung
TW105130581A TW201715197A (zh) 2015-10-16 2016-09-22 用於元件操控裝置的成像傳感器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102015013500.7A DE102015013500A1 (de) 2015-10-16 2015-10-16 Bildgebender Sensor für eine Bauteilhandhabungsvorrichtung

Publications (1)

Publication Number Publication Date
DE102015013500A1 true DE102015013500A1 (de) 2017-04-20

Family

ID=57136819

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102015013500.7A Withdrawn DE102015013500A1 (de) 2015-10-16 2015-10-16 Bildgebender Sensor für eine Bauteilhandhabungsvorrichtung

Country Status (3)

Country Link
DE (1) DE102015013500A1 (zh)
TW (1) TW201715197A (zh)
WO (1) WO2017063836A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021052756A1 (de) * 2019-09-18 2021-03-25 Muehlbauer GmbH & Co. KG Bauteilhandhabung mit bauteilinspektion
CN113118032A (zh) * 2021-04-12 2021-07-16 万安裕维电子有限公司 一种pcb板自动定位控制系统及定位方法
WO2022084271A1 (de) * 2020-10-20 2022-04-28 Integrated Dynamics Engineering Gmbh Vorrichtung und verfahren zum abbilden eines objektes in zumindest zwei ansichten
WO2022233521A1 (de) 2021-05-07 2022-11-10 Muehlbauer GmbH & Co. KG Optische bauteilinspektion

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017008869B3 (de) * 2017-09-21 2018-10-25 Mühlbauer Gmbh & Co. Kg Bauteilzentrierung
CN114384096B (zh) * 2021-12-30 2024-03-29 北京无线电计量测试研究所 用于表贴晶体元器件的x射线照相治具及设备

Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1985004385A1 (en) 1984-03-22 1985-10-10 Mostek Corporation Manipulation and handling of integrated circuit dice
US4619043A (en) 1983-05-02 1986-10-28 Tdk Corporation Apparatus and method for mounting chip type electronic parts
JPH01193630A (ja) 1988-01-28 1989-08-03 Nikka Densoku Kk 粒状物搬送および検査装置
JPH02193813A (ja) 1989-01-20 1990-07-31 Murata Mfg Co Ltd 電子部品の整列・反転方法
US5064291A (en) * 1990-04-03 1991-11-12 Hughes Aircraft Company Method and apparatus for inspection of solder joints utilizing shape determination from shading
DE4321613A1 (de) * 1993-06-25 1995-01-05 Siemens Ag Verfahren zur berührungslosen Lötstellenprüfung
JPH08227904A (ja) 1995-10-30 1996-09-03 Rohm Co Ltd チップボンディング装置
US5750979A (en) 1994-11-29 1998-05-12 Japan Elanco Company Limited Side face examination apparatus for pressed articles, conveyor for pressed articles and external appearance examination apparatus for pressed articles
EP0906011A2 (de) 1997-09-24 1999-03-31 Siemens Aktiengesellschaft Vorrichtung zum Bestücken von flachen Bauelementeträgern mit elektrischen Bauelementen
DE19913134A1 (de) 1998-03-23 1999-10-21 Murata Manufacturing Co Übertragungsvorrichtung für Chipkomponenten
US6079284A (en) 1997-08-06 2000-06-27 Shinogi Qualicaps Co., Ltd. Visual inspection apparatus for tablets
JP2001074664A (ja) 1999-09-01 2001-03-23 Shionogi Qualicaps Kk 錠剤の側面検査装置及び該側面検査装置を用いた錠剤の外観検査装置
EP1116950A1 (en) * 2000-01-17 2001-07-18 Agilent Technologies, Inc. Method and apparatus for inspecting a printed circuit board assembly
WO2002054480A1 (en) 2000-12-29 2002-07-11 Yeint Co., Ltd Lighting system used in apparatus for inspecting surface mounted chip
DE10128476A1 (de) * 2001-06-12 2003-01-02 Siemens Dematic Ag Optische Sensorvorrichtung zur visuellen Erfassung von Substraten
DE102008018586A1 (de) 2008-04-12 2009-11-05 Mühlbauer Ag Optische Erfassungsvorrichtung und Verfahren für die Erfassung von Oberflächen von Bauteilen
DE102010053912A1 (de) * 2010-12-09 2012-06-14 Mühlbauer Ag Optische Untersuchungseinrichtung und optisches Untersuchungsverfahren
EP1470747B1 (de) 2002-01-30 2014-05-14 ASM Assembly Systems GmbH & Co. KG Chipentnahmevorrichtung, bestücksystem und verfahren zum entnehmen von chips von einem wafer

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6236747B1 (en) * 1997-02-26 2001-05-22 Acuity Imaging, Llc System and method for image subtraction for ball and bumped grid array inspection
JP2003124700A (ja) * 2001-10-15 2003-04-25 Nidec Copal Corp 撮像装置
EP1595138B1 (en) * 2003-01-09 2010-07-07 Panasonic Corporation Image recognition apparatus and image recognition method
TWI345053B (en) * 2007-03-16 2011-07-11 Ind Tech Res Inst Image-acquiring system with high-spectrum resolution and method for the same
DE202007012346U1 (de) * 2007-09-04 2007-12-20 Goldlücke, Jürgen Vorrichtung zur optischen Analyse der Struktur einer Probe eines porigen Werkstoffes
DE102011104225B4 (de) * 2011-06-15 2017-08-24 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zum Positionieren eines elektronischen Bauteils und / oder eines Trägers relativ zu einer Ausstoßeinrichtung

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4619043A (en) 1983-05-02 1986-10-28 Tdk Corporation Apparatus and method for mounting chip type electronic parts
WO1985004385A1 (en) 1984-03-22 1985-10-10 Mostek Corporation Manipulation and handling of integrated circuit dice
JPH01193630A (ja) 1988-01-28 1989-08-03 Nikka Densoku Kk 粒状物搬送および検査装置
JPH02193813A (ja) 1989-01-20 1990-07-31 Murata Mfg Co Ltd 電子部品の整列・反転方法
US5064291A (en) * 1990-04-03 1991-11-12 Hughes Aircraft Company Method and apparatus for inspection of solder joints utilizing shape determination from shading
DE4321613A1 (de) * 1993-06-25 1995-01-05 Siemens Ag Verfahren zur berührungslosen Lötstellenprüfung
US5750979A (en) 1994-11-29 1998-05-12 Japan Elanco Company Limited Side face examination apparatus for pressed articles, conveyor for pressed articles and external appearance examination apparatus for pressed articles
JPH08227904A (ja) 1995-10-30 1996-09-03 Rohm Co Ltd チップボンディング装置
US6079284A (en) 1997-08-06 2000-06-27 Shinogi Qualicaps Co., Ltd. Visual inspection apparatus for tablets
EP0906011A2 (de) 1997-09-24 1999-03-31 Siemens Aktiengesellschaft Vorrichtung zum Bestücken von flachen Bauelementeträgern mit elektrischen Bauelementen
DE19913134A1 (de) 1998-03-23 1999-10-21 Murata Manufacturing Co Übertragungsvorrichtung für Chipkomponenten
JP2001074664A (ja) 1999-09-01 2001-03-23 Shionogi Qualicaps Kk 錠剤の側面検査装置及び該側面検査装置を用いた錠剤の外観検査装置
EP1116950A1 (en) * 2000-01-17 2001-07-18 Agilent Technologies, Inc. Method and apparatus for inspecting a printed circuit board assembly
WO2002054480A1 (en) 2000-12-29 2002-07-11 Yeint Co., Ltd Lighting system used in apparatus for inspecting surface mounted chip
DE10128476A1 (de) * 2001-06-12 2003-01-02 Siemens Dematic Ag Optische Sensorvorrichtung zur visuellen Erfassung von Substraten
EP1470747B1 (de) 2002-01-30 2014-05-14 ASM Assembly Systems GmbH & Co. KG Chipentnahmevorrichtung, bestücksystem und verfahren zum entnehmen von chips von einem wafer
DE102008018586A1 (de) 2008-04-12 2009-11-05 Mühlbauer Ag Optische Erfassungsvorrichtung und Verfahren für die Erfassung von Oberflächen von Bauteilen
DE102010053912A1 (de) * 2010-12-09 2012-06-14 Mühlbauer Ag Optische Untersuchungseinrichtung und optisches Untersuchungsverfahren

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021052756A1 (de) * 2019-09-18 2021-03-25 Muehlbauer GmbH & Co. KG Bauteilhandhabung mit bauteilinspektion
WO2022084271A1 (de) * 2020-10-20 2022-04-28 Integrated Dynamics Engineering Gmbh Vorrichtung und verfahren zum abbilden eines objektes in zumindest zwei ansichten
CN113118032A (zh) * 2021-04-12 2021-07-16 万安裕维电子有限公司 一种pcb板自动定位控制系统及定位方法
WO2022233521A1 (de) 2021-05-07 2022-11-10 Muehlbauer GmbH & Co. KG Optische bauteilinspektion

Also Published As

Publication number Publication date
TW201715197A (zh) 2017-05-01
WO2017063836A1 (de) 2017-04-20

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Free format text: PREVIOUS MAIN CLASS: G01B0011300000

Ipc: G01B0011000000

R016 Response to examination communication
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee