DE102014109220A1 - PCB connecting element - Google Patents

Abstract

Circuit board connection element (1) for electrically and / or mechanically connecting two printed circuit boards (2, 3) comprising at least: - a carrier body (4) having solderable SMD connection surfaces (7) and / or pluggable THT wire connections (7) on a first surface (5) 8), which are solderable in a soldering process on a first circuit board (2) and on a second surface (6) at least one press-in pin (9), which in a press-fitting process in a metallized hole (10) of a second circuit board (3) can be pressed ; - At least one on the support body (4) mounted support body (11) having a support surface (12) for supporting on the first circuit board (2), so that a mechanical relief of the SMD pads (7) or the THT wire connections (8) Pressing is given.

Description

The invention relates to a printed circuit board connection elements and a method for producing a printed circuit board assembly.

Electronic devices, such as measuring devices for process technology, usually contain one or more printed circuit boards, on which electrical components are fastened and printed conductors are applied. Often, the space in the device is limited, so that in addition to rigid circuit boards and space-saving flexible circuit boards are used. Often several printed circuit boards are connected to each other. In particular, in measuring devices which are exposed to high mechanical loads, a firm connection between the circuit boards is of great importance.

From printed circuit board manufacturing various methods for assembly and connection of printed circuit boards are known. For example, so-called SMD components (Surface Mounted Device) are mounted on contact surfaces on the front side of the printed circuit board. By contrast, THT components (through-hole technology) have connecting wires which are inserted through an opening in the printed circuit board and fastened on the opposite side or back side of the printed circuit board. Here, a mixed assembly with SMD and THT components is possible. The soldering of SMD components is usually done in a reflow process. In preparation for this, the circuit board is provided at the points to be equipped with solder paste, which forms a Lotpastendepot. Subsequently, the component is positioned on the corresponding solder depot. The so-equipped printed circuit board is exposed to a heat source, for example, placed on a hot plate or supplied to a solder oven, wherein the solder paste is melted and thereby a connection of the component is made with the circuit board.

In addition to this pure soldering technique, there are also alternative solderless connection techniques, such as the press-fit technology.

The press-fit technology is based on pressing a press-fit pin into a metallised hole (through-hole) of a printed circuit board. As essential is to be considered that the diagonal of the pin cross-section is greater than the diameter of the metallized hole. The overpressure created during pressing can be absorbed either by the deformation in the hole or the deformation of the pin.

Manual and automated methods for connecting two circuit boards are known from the prior art. One possibility is to connect two printed circuit boards together in two press-fit processes by means of a special printed circuit board connection element which has press-fit pins on two different surfaces. In this case, in a first press-fitting process, the printed circuit board connection element or the press-fit pins of the first surface are pressed into the metallic holes of the first printed circuit board and in a second press-fit process the printed circuit board connection element or the press-fit pins of the second surface are pressed into the metallic holes of the second printed circuit board provided for this purpose. This procedure known from the prior art, however, has some disadvantages. Thus, the printed circuit boards, which have already been equipped beforehand, are subjected to increased mechanical stresses in the two press-in processes, which inevitably occur during the press-fitting process. This then leads to increased error rates or increased rejects in the production process. In addition, as already described, in addition to the necessary assembly of the printed circuit board (in some cases, only one printed circuit board is equipped) two further manufacturing operations, namely the first and second press-fitting, necessary.

The invention is therefore based on the object to enable the simplified connection of at least two circuit boards.

The object is achieved by a printed circuit board connection element and a method for producing a printed circuit board assembly.

• – einen Trägerkörper aufweisend an einer ersten Oberfläche lötfähige SMD-Anschlussflächen und/oder steckbare THT-Drahtanschlüsse, die in einem Lötvorgang an einer ersten Leiterplatte anlötbar sind und an einer zweiten Oberfläche mindestens ein Einpressstift, der in einem Einpressvorgang in ein metallisiertes Loch einer zweiten Leiterplatte einpressbar ist;
• – mindestens einen an dem Trägerkörper angebrachten Stützkörper mit einer Stützfläche zum Abstützen an der ersten Leiterplatte, sodass eine mechanische Entlastung der SMD-Anschlussflächen oder der THT-Drahtanschlüsse beim Einpressvorgang gegeben ist.

With regard to the printed circuit board connection element, the object is achieved by a printed circuit board connecting element for electrically and / or mechanically connecting two printed circuit boards, the printed circuit board connecting element comprising at least the following:

• - A support body having on a first surface solderable SMD pads and / or plug-in THT wire connections, which are solderable in a soldering on a first circuit board and on a second surface at least one press-in, in a press-fit into a metallized hole of a second circuit board can be pressed in;
• - At least one attached to the support body support body with a support surface for supporting on the first circuit board, so that a mechanical relief of the SMD pads or the THT wire connections is given during the press-fitting.

According to the invention, the object is achieved in that the PCB connection element once a terminal block with SMD pads and / or plug-in THT wire connections on a first surface of the PCB connection element and once a terminal block with at least one press-in pin on a second surface of the printed circuit board connecting element. In this way, the PCB connection element during the placement of the first ggfl. also solder the second circuit board on the SMD pads and / or pluggable THT wire connections and can in a following on the placement process press-fitting with the second if necessary. Also first circuit board electrically and / or mechanically connected. Compared to those known from the prior art thus a press-in process can be saved.

An advantageous embodiment provides that the carrier body has a carrier underside and the support surface is substantially flush with the carrier underside.

An advantageous embodiment provides that the ratio of the support surface of the support body to a single SMD pad is at least 2: 1, in particular 4: 1, particularly preferably 5: 1.

An advantageous embodiment provides that the printed circuit board connecting element has at least one contour element, via which a positioning of the carrier body takes place on the first printed circuit board. In particular, it is provided that the at least one contour element is made of a metallic material, so that it can be brazed to the first circuit board in the soldering process. Especially provided is the contour element is a guide pin.

An advantageous embodiment provides that at least one spring is provided within the carrier body, which connects an SMD pad and / or a pluggable THT wire connection with the at least one press-in pin electrically.

An advantageous embodiment provides that the first and the second surface of the carrier body lie in different planes.

• – Anlöten der SMD-Anschlussflächen und/oder THT-Drahtanschlüsse an die erste Leiterplatte in dem Lötvorgang, wobei die SMD-Anschlussflächen und/oder steckbaren THT-Drahtanschlüsse an entsprechende Anschlussflächen der ersten Leiterplatte angelötet werden;
• – Einpressen des mindestens einen Einpressstiftes in das metallisierte Loch der zweiten Leiterplatte, sodass eine mechanische und/oder elektrische Verbindung der ersten und zweiten Leiterplatte mittels des Leiterplattenverbindungselementes gegeben ist.

With regard to the method, the object is achieved by a method for producing a printed circuit board assembly having at least one first printed circuit board and a second printed circuit board, which are electrically and / or mechanically interconnected via at least one printed circuit board connection element, in particular according to one of the embodiments described above, wherein the Procedure provides at least the following steps:

• Soldering the SMD pads and / or THT wire connections to the first circuit board in the soldering process, wherein the SMD pads and / or pluggable THT wire connections are soldered to corresponding pads of the first circuit board;
• - Pressing the at least one press-fit pin in the metallized hole of the second circuit board, so that a mechanical and / or electrical connection of the first and second circuit board is given by means of the circuit board connection element.

An advantageous embodiment provides that for the manufacture of the circuit board assembly of the soldering process is carried out as the only soldering process for producing the printed circuit board assembly.

An advantageous embodiment provides that the at least one contour element is soldered to the first circuit board during the soldering process.

The invention will be explained in more detail with reference to the following drawings. It shows:

1 : a schematic representation of a printed circuit board connection element according to the invention,

2 a schematic representation of a printed circuit board assembly, and

3 : a flowchart of the method according to the invention.

• – Einen Trägerkörper 4, bspw. ein aus Kunststoff bestehendes Gehäuse, der an einer ersten Oberfläche 5 lötfähige SMD-Anschlussflächen 7 und/oder steckbare THT-Drahtanschlüsse 8 und an einer zweiten Oberfläche 6 zumindest ein Einpressstift 9, typischerweise jedoch mehrere Einpressstifte, aufweist. Vorzugsweise liegen die erste und die zweite Oberfläche 5, 6 des Trägerkörpers 4 in verschiedenen Ebenen. Um ein Entkoppeln der Lötstellen der SMD-Anschlussflächen 7 bzw. der steckbaren THT-Drahtanschlüsse 8 zu ermöglichen, ist es besonders vorteilhaft, wenn innerhalb des Trägerkörpers 4 Federn 16 vorgesehen sind, die jeweils eine SMD-Anschlussfläche 7 oder einen steckbaren THT-Drahtanschluss 8 mit einem Einpressstift 9 elektrisch verbinden. Es versteht sich von selbst, dass die Erfindung auch ohne Federn 16 möglich ist und dass in diesem Fall, die einzelnen SMD-Anschlussflächen 7 bzw. die einzelnen steckbaren THT-Drahtanschlüsse 8 innerhalb des Trägerkörpers 4 miteinander elektrisch verbunden sind. In 1 sind exemplarisch drei THT-Drahtanschlüsse 8 gezeigt, die je nach Ausprägung der Erfindung auch durch SMD-Anschlussflächen 7 oder eine Kombination aus beidem ersetzt werden können. Typischerweise sind die Abstände zwischen den einzelnen THT-Drahtanschlüssen 8 bzw. der einzelnen SMD-Anschlussflächen 7 entsprechend eines Rastermaßes nach DIN-Norm 40801 ausgebildet. Ein Rastermaß definiert den Abstand zweier benachbarter Rasterlinien, auf denen die THT-Drahtanschlüsse 8 bzw. die SMD-Anschlussflächen 7 liegen. Typischerweise sind Rastermaße von 2 mm oder kleiner üblich, sodass die Abstände zwischen den THT-Drahtanschlüssen 8 bzw. den SMD-Anschlussflächen 7 bei 2 mm oder kleiner liegen.
• – Mindestens einen an dem Trägerkörper 4 angebrachten Stützkörper 11 mit einer Stützfläche 12 zum Abstützen des Leiterplattenverbindungselementes 1 an einer ersten Leiterplatte 2, sodass eine mechanische Entlastung der SMD-Anschlussflächen 7 oder der THT-Drahtanschlüsse 8 beim Einpressvorgang gegeben ist. Als besonders vorteilhaft für die Erfindung hat sich herausgestellt, wenn eine Trägerunterseite 13 des Trägerkörpers 4 im Wesentlichen bündig mit der Stützfläche des Stützkörpers 11 ist bzw. abschließt, da in diesem Fall eine mechanische Entlastung der SMD-Anschlussflächen 7 und/oder der THT-Drahtanschlüsse 8 beim Einpressvorgang gegeben ist. Ferner hat sich gezeigt, dass es vorteilhaft ist, wenn das Verhältnis der Stützfläche 12 des Stützkörpers 11 zu einer einzigen SMD-Anschlussfläche 7, in dem Fall, dass das Leiterplattenverbindungselement 2 ausschließlich SMD-Anschlussflächen 7 und keine THT-Drahtanschlüsse 8 aufweist, mindestens 2:1, insbesondere 4:1, besonders bevorzugt 5:1 ist.
• – Mindestens ein Konturelement 14 über das eine vereinfachte Positionierung des Trägerkörpers 4 auf der ersten Leiterplatte 2 ermöglicht wird. Dieses Merkmal ist als optional anzusehen, da es einen gewissen vorteilhaften Effekt bei der Positionierung erzielt. Prinzipiell ist die Erfindung jedoch auch ohne dieses Merkmal möglich. Durch die Verwendung eines metallischen Werkstoffes, bspw. Kupfer oder eine Kupferlegierung wie Messing bzw. Bronze, ist ein Anlöten des Konturelementes 14 möglich, sodass eine vereinfachte Montage gegeben ist. Das Konturelement 14 kann bspw. ein Führungsstift 14 oder auch eine Führungsleiste 14 sein. Typischerweise wird für eine bessere Lötfähigkeit die Oberfläche noch zusätzlich galvanisch verzinkt.

1 shows a schematic representation of a circuit board connection element according to the invention 2 for electrically and / or mechanically connecting two printed circuit boards 2 . 3 , The PCB connector 2 has the following:

• - A carrier body 4 For example, a housing made of plastic, on a first surface 5 solderable SMD connection surfaces 7 and / or plug-in THT wire connections 8th and on a second surface 6 at least one press-in pin 9 , but typically several press-fit pins. Preferably, the first and second surfaces are located 5 . 6 of the carrier body 4 in different levels. To decouple the solder joints of the SMD pads 7 or the plug-in THT wire connections 8th to allow, it is particularly advantageous if within the carrier body 4 feathers 16 are provided, each having an SMD pad 7 or a plug-in THT wire connection 8th with a press-fit pin 9 connect electrically. It goes without saying that the invention also without springs 16 is possible and that in this case, the individual SMD pads 7 or the individual pluggable THT wire connections 8th within the carrier body 4 are electrically connected to each other. In 1 are exemplary three THT wire connections 8th shown, depending on the extent of the invention by SMD pads 7 or a combination of Both can be replaced. Typically, the distances between the individual THT wire connections 8th or the individual SMD connection surfaces 7 according to a grid measure DIN standard 40801 educated. A grid dimension defines the distance between two adjacent grid lines on which the THT wire connections 8th or the SMD pads 7 lie. Typically, pitches of 2mm or smaller are common, so the spacing between the THT wire terminals 8th or the SMD pads 7 at 2 mm or smaller.
• - At least one on the carrier body 4 attached support body 11 with a support surface 12 for supporting the circuit board connection element 1 on a first circuit board 2 so that a mechanical discharge of the SMD pads 7 or the THT wire connections 8th given during the press-in process. As a particularly advantageous for the invention has been found when a carrier base 13 of the carrier body 4 substantially flush with the support surface of the support body 11 is or closes, as in this case, a mechanical relief of the SMD pads 7 and / or the THT wire connections 8th given during the press-in process. Furthermore, it has been shown that it is advantageous if the ratio of the support surface 12 of the support body 11 to a single SMD pad 7 , in the event that the PCB connector 2 only SMD connection surfaces 7 and no THT wire connections 8th has at least 2: 1, in particular 4: 1, more preferably 5: 1.
• - At least one contour element 14 about a simplified positioning of the carrier body 4 on the first circuit board 2 is possible. This feature is considered optional as it provides some advantageous positioning effect. In principle, however, the invention is also possible without this feature. By using a metallic material, for example. Copper or a copper alloy such as brass or bronze, is a soldering of the contour element 14 possible, so that a simplified assembly is given. The contour element 14 can, for example, a guide pin 14 or also a guide strip 14 be. Typically, the surface is additionally galvanized for better solderability.

2 shows a schematic representation of a circuit board assembly 18 , For simplicity, was in 2 a circuit board connector 1 with only a single THT wire connection 8th and a single press-fit pin 9 shown. It goes without saying, however, that typically several THT wire connections 8th and / or SMD pads 7 as well as several press-fit pins 9 available.

• – Eine erste Leiterplatte 2 mit Bohrungen zum Durchstecken der THT-Drahtanschlüsse 8 und/oder Lötpads bzw. Anschlussflächen zum Anlöten der SMD-Anschlussflächen 7 (in 2 sind die SMD-Anschlussflächen nicht dargestellt).
• – Eine zweite Leiterplatte 3 mit metallisierten Löchern 10 zum Einpressen der Einpressstifte 9.
• – Ein Leiterplattenverbindungselement 1, welches gemäß der Figurenbeschreibung zu 1 ausgebildet ist.

The circuit board assembly 18 in 2 includes:

• - A first circuit board 2 with holes for inserting the THT wire connections 8th and / or solder pads or pads for soldering the SMD pads 7 (in 2 the SMD pads are not shown).
• - A second circuit board 3 with metallized holes 10 for pressing in the press-fit pins 9 ,
• - A PCB connector 1 , which according to the description of the figures to 1 is trained.

3 shows a flow chart of the inventive method for producing a in 2 shown circuit board assembly 18 ,

• – Anlöten der SMD-Anschlussflächen 7 und/oder THT-Drahtanschlüsse 8 des Leiterplattenverbindungselementes 1 an die erste Leiterplatte 2 in einem Lötvorgang, wobei die SMD-Anschlussflächen 7 und/oder steckbaren THT-Drahtanschlüsse 8 an entsprechende Lötpads bzw. Anschlussflächen bzw. Bohrungen der ersten Leiterplatte 2 angelötet werden. Dieser Vorgang des Anlötens findet gleichzeitig mit der eigentlichen Bestückung der ersten Leiterplatte 2 statt. So werden bspw. bei der SMD-Bestückung der ersten Leiterplatte 2 auch die SMD-Anschlussflächen des Leiterplattenverbindungselementes 1 mit angelötet, sodass, im Vergleich zu den aus dem Stand der Technik bekannten Verfahren, der erste Einpressvorgang beim Herstellen der Leiterplattenanordnung 18 eingespart wird. Das Gleiche gilt natürlich auch für THT-Drahtanschlüsse 8 bzw. eine Kombination aus SMD-Anschlussflächen und THT-Drahtanschlüssen. In dem Fall, dass das Konturelement 14 aus einem metallischen Werkstoff ist, wird dieses ebenfalls in dem Lötvorgang angelötet.
• – Einpressen des mindestens einen Einpressstiftes 9 in das metallisierte Loch 10 der zweiten Leiterplatte 3, sodass eine mechanische und/oder elektrische Verbindung der ersten und zweiten Leiterplatte 2, 3 mittels des Leiterplattenverbindungselementes 1 gegeben ist.

The method of manufacturing the printed circuit board assembly 18 with at least a first circuit board 2 and a second circuit board 3 connected via a PCB connector 1 electrically and / or mechanically connected to each other provides the following steps:

• - Soldering the SMD pads 7 and / or THT wire connections 8th of the PCB connector 1 to the first circuit board 2 in a soldering process, with the SMD pads 7 and / or plug-in THT wire connections 8th to corresponding solder pads or pads or holes of the first circuit board 2 be soldered. This process of soldering takes place simultaneously with the actual assembly of the first circuit board 2 instead of. Thus, for example, in the SMD assembly of the first circuit board 2 also the SMD pads of the PCB connector 1 soldered with, so that, compared to the methods known from the prior art, the first press-in process in the manufacture of the printed circuit board assembly 18 is saved. The same applies of course to THT wire connections 8th or a combination of SMD pads and THT wire connectors. In the case that the contour element 14 is made of a metallic material, this is also soldered in the soldering process.
• - Pressing the at least one press-in pin 9 into the metallized hole 10 the second circuit board 3 , so that a mechanical and / or electrical connection of the first and second circuit board 2 . 3 by means of the PCB connection element 1 given is.

The method described above has in the manufacture of a printed circuit board assembly 18 with a circuit board connection element according to the invention on the advantage that not two press-in operations, as is the case in the known from the prior art circuit board connection elements with two rows of Einpressstiften that at different surfaces are arranged, are necessary. The first press-in process is "replaced" by a soldering process in which the circuit board connection element is soldered simultaneously when the printed circuit board is fitted.

In 3 the inventive method is shown that in the left branch under the label "LP2", which for PCB 2 stands, the SMD assembly of the second circuit board 3 is indicated. This is divided into two parts, once the rear side and once the loading of the front. At the same time, as shown in the right branch, the first circuit board 2 (marked with "LP1") equipped with SMD components. Again, this process is divided into two parts, once the rear side and once the front side. In one of these two assembly operations also the PCB connection element 1 with its SMD pads 7 and / or THT wire connections 8th soldered. In 3 This soldering is exemplary in the assembly of the front of the first circuit board 2 shown. It is also conceivable that this takes place in the assembly of the back. After both boards have been populated accordingly, with two printed circuit boards 2 . 3 during the assembly process and the circuit board connection element according to the invention 1 was soldered, the two circuit board 2 . 3 in a last press-in process by means of the press-fit pin 9 connected with each other.

LIST OF REFERENCE NUMBERS

1

 PCB connecting element

2

 First circuit board

3

 Second circuit board

4

 Carrier body, in particular housing

5

 First surface of the carrier body

6

 Second surface of the carrier body

7

 SMD pads

8th

 THT-wire connections

9

 Insert pin

10

 Metallized hole of the second circuit board

11

 support body

12

 support surface

13

 Carrier base

14

 contour element

15

 support bracket

16

 feather

17

 solder

18

 Printed circuit board assembly

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited non-patent literature

• DIN standard 40801 [0023]

Claims (11)

PCB connector ( 1 ) for electrically and / or mechanically connecting two printed circuit boards ( 2 . 3 ) at least comprising: - a carrier body ( 4 ) having a first surface ( 5 ) solderable SMD pads ( 7 ) and / or plug-in THT wire connections ( 8th ), which in a soldering process on a first circuit board ( 2 ) are solderable and on a second surface ( 6 ) at least one press-in pin ( 9 ), which is pressed into a metallised hole ( 10 ) a second circuit board ( 3 ) is einpressbar; At least one on the carrier body ( 4 ) attached support body ( 11 ) with a support surface ( 12 ) for supporting on the first circuit board ( 2 ), so that a mechanical relief of the SMD pads ( 7 ) or the THT wire connections ( 8th ) is given during the press-in process. Printed circuit board connection element according to claim 1, wherein the carrier body ( 4 ) a carrier base ( 13 ) and the support surface ( 12 ) substantially flush with the carrier underside ( 13 ). Printed circuit board connection element according to claim 1 or 2, the ratio of the support surface ( 12 ) of the supporting body ( 11 ) to a single SMD pad ( 7 ) is at least 2: 1, in particular 4: 1, more preferably 5: 1. Printed circuit board connection element according to one or more of the preceding claims, wherein the printed circuit board connection element ( 1 ) at least one contour element ( 14 ), via which a positioning of the carrier body ( 4 ) on the first circuit board ( 2 ) he follows. Printed circuit board connection element according to claim 4, wherein the at least one contour element ( 14 ) is made of a metallic material, so that this in the soldering process to the first circuit board ( 2 ) is solderable. Printed circuit board connection element according to claim 4 or 5, wherein the contour element ( 14 ) a guide pin ( 15 ). Printed circuit board connection element according to one or more of the preceding claims, wherein inside the support body ( 4 ) at least one spring ( 16 ), which has an SMD pad ( 7 ) and / or a pluggable THT wire connection ( 8th ) with the at least one press-in pin ( 9 ) electrically connects. A printed circuit board connector according to one or more of the preceding claims, wherein the first and second surfaces ( 5 . 6 ) of the carrier body lie in different planes. Method for producing a printed circuit board arrangement with at least one first printed circuit board ( 2 ) and a second circuit board ( 3 ) connected via at least one printed circuit board connection element ( 1 ), in particular according to one of claims 1 to 8, are electrically and / or mechanically interconnected, the method providing at least the following steps: soldering the SMD pads ( 7 ) and / or THT wire connections ( 8th ) to the first printed circuit board ( 2 ) in the soldering process, wherein the SMD pads ( 7 ) and / or plug-in THT wire connections ( 8th ) to corresponding pads of the first circuit board ( 2 ) are soldered; - Pressing the at least one press-in pin ( 9 ) into the metallized hole ( 10 ) of the second circuit board ( 3 ), so that a mechanical and / or electrical connection of the first and second circuit board ( 2 . 3 ) by means of the printed circuit board connection element ( 1 ) given is. The method of claim 9, wherein the soldering process is performed as the sole soldering process for producing the printed circuit board assembly for producing the printed circuit board assembly. Method according to claim 9 or 10, wherein the at least one contour element ( 14 ) during the soldering process to the first printed circuit board ( 2 ) is soldered.

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