DE102014015951A1 - Verfahren zum Bearbeiten eines elektrisch nicht leitenden oder halbleitenden Materials - Google Patents

Verfahren zum Bearbeiten eines elektrisch nicht leitenden oder halbleitenden Materials Download PDF

Info

Publication number
DE102014015951A1
DE102014015951A1 DE102014015951.5A DE102014015951A DE102014015951A1 DE 102014015951 A1 DE102014015951 A1 DE 102014015951A1 DE 102014015951 A DE102014015951 A DE 102014015951A DE 102014015951 A1 DE102014015951 A1 DE 102014015951A1
Authority
DE
Germany
Prior art keywords
additional
radiation
pulsed laser
laser radiation
electrons
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102014015951.5A
Other languages
German (de)
English (en)
Inventor
Uwe Stute
Anas Moalem
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
4JET Microtech GmbH and Co KG
Original Assignee
4JET Technologies GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 4JET Technologies GmbH filed Critical 4JET Technologies GmbH
Priority to DE102014015951.5A priority Critical patent/DE102014015951A1/de
Priority to PCT/DE2015/100434 priority patent/WO2016062303A1/fr
Publication of DE102014015951A1 publication Critical patent/DE102014015951A1/de
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B23/00—Re-forming shaped glass
    • C03B23/20—Uniting glass pieces by fusing without substantial reshaping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
DE102014015951.5A 2014-10-20 2014-10-20 Verfahren zum Bearbeiten eines elektrisch nicht leitenden oder halbleitenden Materials Withdrawn DE102014015951A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102014015951.5A DE102014015951A1 (de) 2014-10-20 2014-10-20 Verfahren zum Bearbeiten eines elektrisch nicht leitenden oder halbleitenden Materials
PCT/DE2015/100434 WO2016062303A1 (fr) 2014-10-20 2015-10-20 Procédé d'usinage d'un matériau électriquement non conducteur ou semi-conducteur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102014015951.5A DE102014015951A1 (de) 2014-10-20 2014-10-20 Verfahren zum Bearbeiten eines elektrisch nicht leitenden oder halbleitenden Materials

Publications (1)

Publication Number Publication Date
DE102014015951A1 true DE102014015951A1 (de) 2016-04-21

Family

ID=54541910

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102014015951.5A Withdrawn DE102014015951A1 (de) 2014-10-20 2014-10-20 Verfahren zum Bearbeiten eines elektrisch nicht leitenden oder halbleitenden Materials

Country Status (2)

Country Link
DE (1) DE102014015951A1 (fr)
WO (1) WO2016062303A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107788619A (zh) * 2017-11-13 2018-03-13 王文平 具有恒定加工压力的鞋材加工装置及鞋材多轴加工机

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10906832B2 (en) 2017-08-11 2021-02-02 Corning Incorporated Apparatuses and methods for synchronous multi-laser processing of transparent workpieces

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08155670A (ja) * 1994-12-05 1996-06-18 Nippondenso Co Ltd レーザ加工機とその加工方法
DE102005030670A1 (de) * 2004-11-05 2006-05-24 Lg. Philips Lcd Co., Ltd. Vorrichtung zum Schneiden eines Substrats und Verfahren unter Verwendung derselben
US20070158315A1 (en) * 2004-07-30 2007-07-12 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus and laser irradiation method
WO2011025903A1 (fr) 2009-08-28 2011-03-03 Corning Incorporated Procédés pour découpe au laser de substrats de verre
WO2011026074A1 (fr) 2009-08-31 2011-03-03 Corning Incorporated Procédés de découpe et de cassure au laser d’un verre mince
WO2011025908A1 (fr) 2009-08-28 2011-03-03 Corning Incorporated Procédés de découpe au laser d’articles provenant de substrats en verre trempé chimiquement
EP2507182B1 (fr) 2009-11-30 2014-03-05 Corning Incorporated Méthodes de découpe et séparation par laser de substrats en verre
WO2014161535A2 (fr) * 2013-04-04 2014-10-09 Lpkf Laser & Electronics Ag Procédé et dispositif de séparation d'un substrat

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1796038A1 (de) * 1967-09-01 1972-02-17 Comp Generale Electricite Verfahren zum Verschweissen von Werkstoffen mit Glas oder aehnlichen Stoffen
CH583978A5 (fr) * 1974-02-26 1977-01-14 Lasag Sa
JP3401425B2 (ja) * 1998-01-21 2003-04-28 理化学研究所 レーザー加工方法およびレーザー加工装置
DE19839343A1 (de) * 1998-08-28 2000-03-16 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Verfahren zum Bearbeiten eines Bauteils oder einer Bauteilanordnung mittels elektromagnetischer Strahlung sowie Vorrichtung zum Fügen, insbesondere Verlöten
JP2005292382A (ja) * 2004-03-31 2005-10-20 Kazuyuki Hirao 光学素子及びその製造方法並びに光学装置
DE102010025967B4 (de) * 2010-07-02 2015-12-10 Schott Ag Verfahren zur Erzeugung einer Vielzahl von Löchern, Vorrichtung hierzu und Glas-Interposer
WO2012136329A1 (fr) * 2011-04-06 2012-10-11 Picodrill Sa Procédé et dispositif pour le découpage électrothermique à haute performance par le développement maximal du champ électrique à l'intérieur du substrat
CN104025251B (zh) * 2011-09-21 2018-01-09 雷蒂安斯公司 切割材料的系统和过程
FI20120169A (fi) * 2012-05-22 2014-01-14 Arctic Ip Invest Ab Pinnoitus- ja materiaalinvalmistusmenetelmä

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08155670A (ja) * 1994-12-05 1996-06-18 Nippondenso Co Ltd レーザ加工機とその加工方法
US20070158315A1 (en) * 2004-07-30 2007-07-12 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus and laser irradiation method
DE102005030670A1 (de) * 2004-11-05 2006-05-24 Lg. Philips Lcd Co., Ltd. Vorrichtung zum Schneiden eines Substrats und Verfahren unter Verwendung derselben
WO2011025903A1 (fr) 2009-08-28 2011-03-03 Corning Incorporated Procédés pour découpe au laser de substrats de verre
WO2011025908A1 (fr) 2009-08-28 2011-03-03 Corning Incorporated Procédés de découpe au laser d’articles provenant de substrats en verre trempé chimiquement
WO2011026074A1 (fr) 2009-08-31 2011-03-03 Corning Incorporated Procédés de découpe et de cassure au laser d’un verre mince
EP2507182B1 (fr) 2009-11-30 2014-03-05 Corning Incorporated Méthodes de découpe et séparation par laser de substrats en verre
WO2014161535A2 (fr) * 2013-04-04 2014-10-09 Lpkf Laser & Electronics Ag Procédé et dispositif de séparation d'un substrat

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107788619A (zh) * 2017-11-13 2018-03-13 王文平 具有恒定加工压力的鞋材加工装置及鞋材多轴加工机

Also Published As

Publication number Publication date
WO2016062303A1 (fr) 2016-04-28

Similar Documents

Publication Publication Date Title
EP2931467B1 (fr) Méthode de production de points de rupture en ligne par une radiation d'un laser focalisé et pulsé très court ; méthode et dispositif de séparation d'une pièce au moyen d'un laser pulsé ultra court utilisant un gaz de protection
EP3334697B1 (fr) Procede de decoupe d'une couche de verre mince
DE112004000581B4 (de) Verfahren zum Schneiden von Glas
EP3169475B1 (fr) Procédé et dispositif d'usinage au laser de substrats plats cristallins, notamment de substrats semiconducteurs
EP2964416B1 (fr) Procédé de séparation d'un substrat
DE102013223637A1 (de) Verfahren zum Behandeln eines lasertransparenten Substrats zum anschließenden Trennen des Substrats
DE102004024643A1 (de) Werkstückteilungsverfahren unter Verwendung eines Laserstrahls
DE19736110A1 (de) Verfahren und Vorrichtung zur grat- und schmelzfreien Mikrobearbeitung von Werkstücken
DE102014015951A1 (de) Verfahren zum Bearbeiten eines elektrisch nicht leitenden oder halbleitenden Materials
EP1260838B1 (fr) Procédé de microstructuration directe de matériaux
DE102018120011A1 (de) Schweißverfahren zum Verbinden eines transparenten, aluminiumoxidhaltigen ersten Substrats mit einem opaken zweiten Substrat
WO2018189080A1 (fr) Arrangement et procédé de découpe à base de laser d'une pièce transparente cassante fragile
DE102019135283A1 (de) Verfahren zur Lasermaterialbearbeitung und Laserbearbeitungsanlage
DE102019219462A1 (de) Verfahren zum Schneiden eines Glaselements und Schneidsystem
WO2023088912A1 (fr) Procédé pour le traitement laser d'une pièce
EP3875436B1 (fr) Procédé de préparation et/ou de mise en uvre de la séparation d'un élément de substrat et élément de substrat
EP4031315B1 (fr) Procédé de découpe au laser et dispositif de découpe au laser associé
WO2023012210A1 (fr) Procédé et dispositif d'usinage au laser d'une pièce
WO2018234192A1 (fr) Système et procédé pour usiner une surface
EP3854515A1 (fr) Procédé de traitement de matériaux dures et cassants
EP3872041A1 (fr) Procédé de séparation d'un élément en verre et élément partiel en verre
DE102012025294A1 (de) Verfahren zum Erzeugen von Strukturen auf einer Oberfläche eines Werkstücks
DE102019128251A1 (de) Verfahren zum Fügen von zwei Fügepartnern mittels ultrakurzer Laserpulse
EP3924307B1 (fr) Procédé pour accroître la résistance d'un substrat de verre
DE102021204356A1 (de) Verfahren zur Laserbearbeitung von transparenten Materialien

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R082 Change of representative

Representative=s name: GRAMM, LINS & PARTNER PATENT- UND RECHTSANWAEL, DE

Representative=s name: GILLE HRABAL, DE

Representative=s name: DILG HAEUSLER SCHINDELMANN PATENTANWALTSGESELL, DE

R016 Response to examination communication
R016 Response to examination communication
R081 Change of applicant/patentee

Owner name: 4JET MICROTECH GMBH & CO. KG, DE

Free format text: FORMER OWNER: 4JET TECHNOLOGIES GMBH, 52477 ALSDORF, DE

R082 Change of representative

Representative=s name: DILG, HAEUSLER, SCHINDELMANN PATENTANWALTSGESE, DE

Representative=s name: GILLE HRABAL, DE

Representative=s name: DILG HAEUSLER SCHINDELMANN PATENTANWALTSGESELL, DE

R082 Change of representative

Representative=s name: DILG, HAEUSLER, SCHINDELMANN PATENTANWALTSGESE, DE

Representative=s name: DILG HAEUSLER SCHINDELMANN PATENTANWALTSGESELL, DE

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee