DE102013202037A1 - Hermetische Durchführung, Verfahren zur Herstellung einer hermetischen Durchführung, Leiterplatte und chirurgisches Instrument - Google Patents

Hermetische Durchführung, Verfahren zur Herstellung einer hermetischen Durchführung, Leiterplatte und chirurgisches Instrument Download PDF

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Publication number
DE102013202037A1
DE102013202037A1 DE102013202037.6A DE102013202037A DE102013202037A1 DE 102013202037 A1 DE102013202037 A1 DE 102013202037A1 DE 102013202037 A DE102013202037 A DE 102013202037A DE 102013202037 A1 DE102013202037 A1 DE 102013202037A1
Authority
DE
Germany
Prior art keywords
circuit board
plastic
printed circuit
hermetic
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102013202037.6A
Other languages
German (de)
English (en)
Inventor
Sebastian Stühle
Sebastian Jungbauer
Martin Wieters
Alexander Bruss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Winter and Ibe GmbH
Original Assignee
Olympus Winter and Ibe GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Winter and Ibe GmbH filed Critical Olympus Winter and Ibe GmbH
Priority to DE102013202037.6A priority Critical patent/DE102013202037A1/de
Priority to PCT/EP2014/000269 priority patent/WO2014121912A1/de
Priority to CN201480007535.XA priority patent/CN104968253B/zh
Priority to JP2015556415A priority patent/JP6318176B2/ja
Publication of DE102013202037A1 publication Critical patent/DE102013202037A1/de
Priority to US14/819,896 priority patent/US20150340133A1/en
Withdrawn legal-status Critical Current

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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00064—Constructional details of the endoscope body
    • A61B1/0011—Manufacturing of endoscope parts
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00112—Connection or coupling means
    • A61B1/00114—Electrical cables in or with an endoscope
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00112—Connection or coupling means
    • A61B1/00121—Connectors, fasteners and adapters, e.g. on the endoscope handle
    • A61B1/00124—Connectors, fasteners and adapters, e.g. on the endoscope handle electrical, e.g. electrical plug-and-socket connection
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/2476—Non-optical details, e.g. housings, mountings, supports
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/2476—Non-optical details, e.g. housings, mountings, supports
    • G02B23/2492—Arrangements for use in a hostile environment, e.g. a very hot, cold or radioactive environment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/26—Lead-in insulators; Lead-through insulators
    • H01B17/30—Sealing
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/22—Installations of cables or lines through walls, floors or ceilings, e.g. into buildings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y10T29/4916—Simultaneous circuit manufacturing

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Surgery (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medical Informatics (AREA)
  • Public Health (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Biophysics (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Veterinary Medicine (AREA)
  • Molecular Biology (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Astronomy & Astrophysics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Electromagnetism (AREA)
  • Endoscopes (AREA)
  • Instruments For Viewing The Inside Of Hollow Bodies (AREA)
DE102013202037.6A 2013-02-07 2013-02-07 Hermetische Durchführung, Verfahren zur Herstellung einer hermetischen Durchführung, Leiterplatte und chirurgisches Instrument Withdrawn DE102013202037A1 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE102013202037.6A DE102013202037A1 (de) 2013-02-07 2013-02-07 Hermetische Durchführung, Verfahren zur Herstellung einer hermetischen Durchführung, Leiterplatte und chirurgisches Instrument
PCT/EP2014/000269 WO2014121912A1 (de) 2013-02-07 2014-02-03 Hermetische durchführung, verfahren zur herstellung einer hermetischen durchführung, leiterplatte und chirurgisches instrument
CN201480007535.XA CN104968253B (zh) 2013-02-07 2014-02-03 气密馈通件、用于生产气密馈通件的方法、印刷电路板和外科器械
JP2015556415A JP6318176B2 (ja) 2013-02-07 2014-02-03 密閉フィードスルー、密閉フィードスルーの製造方法、プリント回路基板、及び外科器具
US14/819,896 US20150340133A1 (en) 2013-02-07 2015-08-06 Hermetic feedthrough, method for producing a hermetic feedthrough, printed circuit board and surgical instrument

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102013202037.6A DE102013202037A1 (de) 2013-02-07 2013-02-07 Hermetische Durchführung, Verfahren zur Herstellung einer hermetischen Durchführung, Leiterplatte und chirurgisches Instrument

Publications (1)

Publication Number Publication Date
DE102013202037A1 true DE102013202037A1 (de) 2014-08-07

Family

ID=50070498

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102013202037.6A Withdrawn DE102013202037A1 (de) 2013-02-07 2013-02-07 Hermetische Durchführung, Verfahren zur Herstellung einer hermetischen Durchführung, Leiterplatte und chirurgisches Instrument

Country Status (5)

Country Link
US (1) US20150340133A1 (https=)
JP (1) JP6318176B2 (https=)
CN (1) CN104968253B (https=)
DE (1) DE102013202037A1 (https=)
WO (1) WO2014121912A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3387983A3 (de) * 2017-04-13 2018-10-24 Karl Storz SE & Co. KG Endoskop mit sensor zur erfassung einer physikalischen messgroesse

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3484341B1 (en) 2016-07-14 2023-03-08 Intuitive Surgical Operations, Inc. An endoscope including a plurality of individually testable subassemblies
CN121647581A (zh) 2016-07-14 2026-03-13 直观外科手术操作公司 包含在手术器械的主体内的压力测试端口
US11063382B2 (en) * 2018-05-22 2021-07-13 Flowserve Management Company Waterproof and explosion-proof circuit board and electronic valve actuator for flow control applications
DE102020135029A1 (de) * 2020-12-29 2022-06-30 Olympus Winter & Ibe Gmbh Halterung für einen Bildsensor eines chirurgischen Instruments
WO2022198445A1 (zh) * 2021-03-23 2022-09-29 柯惠有限合伙公司 内窥镜

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4549108A (en) * 1982-06-04 1985-10-22 U.S. Philips Corporation Multichannel X-ray detector with multiple electrical feedthrough members
DE4131534A1 (de) * 1991-09-21 1993-04-01 Standard Elektrik Lorenz Ag Vorrichtung zur isolierten herausfuehrung von leiterbahnen aus einem abschirmgehaeuse
DE10310070A1 (de) * 2003-03-07 2004-05-06 Siemens Ag Vakuumdurchführung
AT11044U1 (de) * 2008-04-14 2010-03-15 Kuvag Gesmbh & Co Kg Eingiessteil in einem duromer
DE102009011479A1 (de) * 2009-03-06 2010-09-09 Olympus Winter & Ibe Gmbh Chirurgisches Instrument
DE102009041255B3 (de) * 2009-09-11 2011-02-24 Asm Automation Sensorik Messtechnik Gmbh Längswasser-Sperre für elektrische Leitungen

Family Cites Families (11)

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US4598466A (en) * 1984-11-16 1986-07-08 Cordis Corporation Feedthrough
JPH04241831A (ja) * 1991-01-10 1992-08-28 Toshiba Corp 内視鏡
JPH05130972A (ja) * 1991-11-14 1993-05-28 Asahi Optical Co Ltd 電子内視鏡の先端部
US6592044B1 (en) * 2000-05-15 2003-07-15 Jacob Y. Wong Anonymous electronic card for generating personal coupons useful in commercial and security transactions
JP4162659B2 (ja) * 2005-01-11 2008-10-08 株式会社有沢製作所 フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末
DE102006015176B3 (de) * 2006-03-30 2007-07-05 Olympus Winter & Ibe Gmbh Videoendoskop mit elektrischem Leitungsanschluß
JP4682158B2 (ja) * 2007-01-16 2011-05-11 オリンパスメディカルシステムズ株式会社 撮像装置
US8247883B2 (en) * 2008-12-04 2012-08-21 Palo Alto Research Center Incorporated Printing shielded connections and circuits
US9288893B2 (en) * 2009-02-11 2016-03-15 Broadcom Corporation Implementations of twisted differential pairs on a circuit board
US20100307798A1 (en) * 2009-06-03 2010-12-09 Izadian Jamal S Unified scalable high speed interconnects technologies
KR20120035246A (ko) * 2010-10-05 2012-04-16 삼성전기주식회사 신호 전송용 회로기판 및 이의 제조 방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4549108A (en) * 1982-06-04 1985-10-22 U.S. Philips Corporation Multichannel X-ray detector with multiple electrical feedthrough members
DE4131534A1 (de) * 1991-09-21 1993-04-01 Standard Elektrik Lorenz Ag Vorrichtung zur isolierten herausfuehrung von leiterbahnen aus einem abschirmgehaeuse
DE10310070A1 (de) * 2003-03-07 2004-05-06 Siemens Ag Vakuumdurchführung
AT11044U1 (de) * 2008-04-14 2010-03-15 Kuvag Gesmbh & Co Kg Eingiessteil in einem duromer
DE102009011479A1 (de) * 2009-03-06 2010-09-09 Olympus Winter & Ibe Gmbh Chirurgisches Instrument
DE102009041255B3 (de) * 2009-09-11 2011-02-24 Asm Automation Sensorik Messtechnik Gmbh Längswasser-Sperre für elektrische Leitungen

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3387983A3 (de) * 2017-04-13 2018-10-24 Karl Storz SE & Co. KG Endoskop mit sensor zur erfassung einer physikalischen messgroesse
US11026562B2 (en) 2017-04-13 2021-06-08 Karl Storz Se & Co. Kg Endoscope

Also Published As

Publication number Publication date
CN104968253B (zh) 2017-04-12
JP2016507301A (ja) 2016-03-10
CN104968253A (zh) 2015-10-07
JP6318176B2 (ja) 2018-04-25
US20150340133A1 (en) 2015-11-26
WO2014121912A1 (de) 2014-08-14

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