DE102013000223A1 - Servoverstärker mit Wärmesenke, die zwei Sätze von Wärme abgebenden Platten aufweist, die lotrecht aufeinander stehen - Google Patents

Servoverstärker mit Wärmesenke, die zwei Sätze von Wärme abgebenden Platten aufweist, die lotrecht aufeinander stehen Download PDF

Info

Publication number
DE102013000223A1
DE102013000223A1 DE102013000223A DE102013000223A DE102013000223A1 DE 102013000223 A1 DE102013000223 A1 DE 102013000223A1 DE 102013000223 A DE102013000223 A DE 102013000223A DE 102013000223 A DE102013000223 A DE 102013000223A DE 102013000223 A1 DE102013000223 A1 DE 102013000223A1
Authority
DE
Germany
Prior art keywords
heat
blades
transfer plate
heat transfer
releasing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102013000223A
Other languages
German (de)
English (en)
Inventor
Hiroshi Takigawa
Kenichi OKUAKI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fanuc Corp
Original Assignee
Fanuc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fanuc Corp filed Critical Fanuc Corp
Publication of DE102013000223A1 publication Critical patent/DE102013000223A1/de
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE102013000223A 2012-01-11 2013-01-04 Servoverstärker mit Wärmesenke, die zwei Sätze von Wärme abgebenden Platten aufweist, die lotrecht aufeinander stehen Withdrawn DE102013000223A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-003103 2012-01-11
JP2012003103A JP5249434B2 (ja) 2012-01-11 2012-01-11 直交する２組の放熱フィンを有する放熱用ヒートシンクを備えたサーボアンプ

Publications (1)

Publication Number Publication Date
DE102013000223A1 true DE102013000223A1 (de) 2013-12-05

Family

ID=48743111

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102013000223A Withdrawn DE102013000223A1 (de) 2012-01-11 2013-01-04 Servoverstärker mit Wärmesenke, die zwei Sätze von Wärme abgebenden Platten aufweist, die lotrecht aufeinander stehen

Country Status (4)

Country Link
US (1) US20130175021A1 (ja)
JP (1) JP5249434B2 (ja)
CN (2) CN103208468A (ja)
DE (1) DE102013000223A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019151914A1 (en) * 2018-02-02 2019-08-08 Telefonaktiebolaget Lm Ericsson (Publ) Cooling device for dissipating heat from an object

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9377828B2 (en) * 2013-08-12 2016-06-28 Dell Products L.P. Adjustable heat sink supporting multiple platforms and system configurations
US20150257249A1 (en) * 2014-03-08 2015-09-10 Gerald Ho Kim Heat Sink With Protrusions On Multiple Sides Thereof And Apparatus Using The Same
JP2017098274A (ja) * 2014-03-27 2017-06-01 三菱電機株式会社 ヒートシンク装置
WO2015157523A1 (en) * 2014-04-10 2015-10-15 Advanced Thermal Solutions, Inc. Multiple flow entrance heat sink
CN104602500A (zh) * 2015-01-30 2015-05-06 周玉翔 一种温度可视双层散热片
JP6126149B2 (ja) * 2015-02-26 2017-05-10 ファナック株式会社 放熱フィンを有する熱伝導部材を備えた空冷式レーザ装置
JP6062516B1 (ja) * 2015-09-18 2017-01-18 古河電気工業株式会社 ヒートシンク
US20180023895A1 (en) * 2016-07-22 2018-01-25 Trane International Inc. Enhanced Tubular Heat Exchanger
EP3510635B1 (en) * 2016-09-21 2024-01-31 Huawei Technologies Co., Ltd. Heatsink
US20180106500A1 (en) * 2016-10-18 2018-04-19 Trane International Inc. Enhanced Tubular Heat Exchanger
US20180192545A1 (en) * 2017-01-03 2018-07-05 Quanta Computer Inc. Heat dissipation apparatus
JP6931716B2 (ja) * 2017-04-21 2021-09-08 ケーエムダブリュ・インコーポレーテッド Ｍｉｍｏアンテナ装置
JP6918765B2 (ja) * 2018-11-29 2021-08-11 ファナック株式会社 放熱装置
CN112911893B (zh) * 2020-12-25 2023-05-05 Oppo广东移动通信有限公司 散热器及电子设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0396258A (ja) 1989-09-08 1991-04-22 Furukawa Electric Co Ltd:The ヒートパイプ式冷却器
JP2001196511A (ja) 2000-01-14 2001-07-19 Matsushita Electric Ind Co Ltd ヒートシンクとその製造方法およびそれを用いた冷却装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6138237Y2 (ja) * 1978-11-17 1986-11-05
JPS6130292U (ja) * 1984-07-26 1986-02-24 三菱アルミニウム株式会社 電気素子用放熱器
US5542176A (en) * 1992-09-21 1996-08-06 Hideaki Serizawa Radiation plate and method of producing the same
JP2006013296A (ja) * 2004-06-29 2006-01-12 Fuji Electric Holdings Co Ltd 半導体素子の冷却体
US6945319B1 (en) * 2004-09-10 2005-09-20 Datech Technology Co., Ltd. Symmetrical heat sink module with a heat pipe for spreading of heat
CN100543972C (zh) * 2005-08-08 2009-09-23 富准精密工业(深圳)有限公司 热管散热装置
US7690418B2 (en) * 2005-12-28 2010-04-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink
JP2007180453A (ja) * 2005-12-28 2007-07-12 Nippon Densan Corp ヒートシンク冷却装置
JP5041346B2 (ja) * 2006-06-02 2012-10-03 株式会社安川電機 モータ制御装置
JP2009225497A (ja) * 2008-03-13 2009-10-01 Fanuc Ltd 電源回生機能を有するサーボアンプ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0396258A (ja) 1989-09-08 1991-04-22 Furukawa Electric Co Ltd:The ヒートパイプ式冷却器
JP2001196511A (ja) 2000-01-14 2001-07-19 Matsushita Electric Ind Co Ltd ヒートシンクとその製造方法およびそれを用いた冷却装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019151914A1 (en) * 2018-02-02 2019-08-08 Telefonaktiebolaget Lm Ericsson (Publ) Cooling device for dissipating heat from an object
US11985797B2 (en) 2018-02-02 2024-05-14 Telefonaktiebolaget Lm Ericsson (Publ) Cooling device for dissipating heat from an object

Also Published As

Publication number Publication date
CN203085512U (zh) 2013-07-24
JP2013143488A (ja) 2013-07-22
JP5249434B2 (ja) 2013-07-31
CN103208468A (zh) 2013-07-17
US20130175021A1 (en) 2013-07-11

Similar Documents

Publication Publication Date Title
DE102013000223A1 (de) Servoverstärker mit Wärmesenke, die zwei Sätze von Wärme abgebenden Platten aufweist, die lotrecht aufeinander stehen
DE60315096T2 (de) Thermosiphon zur Kühlung einer Elektronik mit Hochleistungsoberflächen zur Verdampfung und Kondensation
DE4418611C2 (de) Halbleiterelementkühlvorrichtung
DE102013219489A1 (de) Kühlungsvorrichtung und Halbleitervorrichtung
DE112014003247B4 (de) Rippe für Wärmetauscher
DE102016001966B4 (de) Luftgekühlte Laservorrichtung mit Kühlrippen aufweisendem Wärmeübertragungsbauteil
DE102014105960A1 (de) LED- Beleuchtungseinrichtung mit einem verbesserten Kühlkörper bezogen
DE102016001965A1 (de) Luftgekühlte Laservorrichtung mit Kühlrippen aufweisendem, L-förmigem Wärmeübertragungselement
DE112017003768T5 (de) Kühlvorrichtung
DE102008060777A1 (de) Verfahren und Anordnung zur Kühlung von wärmeentwickelnden Computerkomponenten
DE2450093A1 (de) Waermetauscher
DE202006021052U1 (de) Wärmerohr-Kühlvorrichtung
DE202009010525U1 (de) Wärmeleitendes Modul
DE202015105830U1 (de) Wasserkühlvorrichtung zur Wärmeableitung und dazugehöriger Wasserblock
DE102014106342A1 (de) Lichtmodul für einen Scheinwerfer eines Fahrzeugs
DE102018203231A1 (de) Wärmetauscher zum kühlen mehrerer schichten aus elektronischen modulen
DE202017101406U1 (de) Kühlaufbau für Schnittstellenkarten
DE202012002974U1 (de) Fluid-Wärmetauschsysteme
DE102004040988B4 (de) Sammler für Wärmetauscher
DE102016124103A1 (de) Flüssigkeitsgekühlte Kühlvorrichtung
DE112018006027T5 (de) Verbesserte wärmeübertragungsfläche
DE112010002307T5 (de) Kühlkörper
DE102011079508B4 (de) Kühlstruktur für ein Halbleiterelement
DE102019121398A1 (de) Halbleitervorrichtung
DE202018100041U1 (de) Flüssigkeitskühlsystem

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R012 Request for examination validly filed

Effective date: 20140916

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee