DE102012224376A1 - Printed circuit arrangement and method for its production - Google Patents

Abstract

The invention relates to a conductor track arrangement (1) comprising a substrate (3), a vertical structure (33; 431; 432; 433; 531; 532; 63) formed on the substrate (3) and one of the structures (33; 431; 432; 433; 531; 532; 63) associated with the conductive section (12; 13; 551; 552; 651; 652).

Description

Technical area

The invention relates generally to a printed conductor arrangement and to a method for the production thereof.

State of the art

For the production of electronic circuits, conductor tracks are usually applied to a non-conductive substrate.

For forming a trace on a substrate, methods of flame spraying metal powder on a thermoplastic material are known. For example, in the patent DE 101 09 087 A1 discloses a method of manufacturing a molded component with an integrated trace.

Due to the manufacturing process, the deposited conductor tracks do not have a precisely defined edge, but form in cross-section a bell profile with a central maximum and wide side edges, as is known, for example, from a Gaussian distribution.

To ensure a precisely defined electrical separation between two adjacent tracks, they must be provided at a certain distance from each other. In this way, an insulating section can be ensured.

The ability to arrange two traces at a closer distance from each other is severely limited by existing technologies. This restricts the degree of freedom with regard to the dimensioning and shaping of the substrate as well as the conductor track and not least the degree of integration.

To reduce a minimum distance between two tracks or to increase the resolution, masks for flame spraying are proposed in order to shade the areas between the tracks and to ensure a precisely defined edge of the tracks. However, such masks tend to accumulate residues of the metal powder after repeated use, so they must be cleaned regularly.

It is therefore an object of the present invention to provide a reliable and easy separation of adjacent tracks on a substrate.

Disclosure of the invention

This object is achieved by the printed conductor arrangement according to claim 1 and by a molded part and a method according to the independent claims.

Further advantageous embodiments of the present invention are specified in the dependent claims.

According to a first aspect, a printed conductor arrangement is provided, which comprises a substrate having a structure formed on the substrate and extending perpendicular to a surface of the substrate, and a conductive section associated with the structure.

One idea of the above wiring arrangement is to provide on a substrate a structure extending perpendicular to a surface of the substrate and to form a conductive portion, for example by a directed application of conductive material to the substrate, e.g. B. by irradiation with conductive particles. The vertical orientation of the structure is provided so as to form an undercut with respect to a direction of irradiation. Thus, portions which are not hit by the conductive material of the irradiation and portions on which the conductive material of the irradiation is deposited may form on the structure.

In this way, it is possible to provide adjacent conductive portions on a substrate and to securely electrically separate from each other due to the shape of the structures on the substrate without using a mask, thus providing insulation of adjacent conductive portions.

Furthermore, this disadvantageous effects of a conventionally used mask, such as contamination of the tracks, damage to the tracks during removal of the mask, obstruction of the mask openings and the like, prevented, and thus increases the process reliability.

In addition, in this way with a single irradiation multiple tracks can be generated simultaneously.

Moreover, by substrate design and orientation of the substrate to the direction of irradiation, a conductor track width can be adjusted specifically. As a result, the size of the substrate can be minimized, so that an increased degree of freedom is provided in the design of functional components.

It can be provided that the conductive portion associated with the structure is formed on the structure. For example, the conductive portion associated with the structure may be formed directly adjacent to the structure. Alternatively, it is provided that the conductive portion associated with the structure can be formed at a small distance from the structure at this. In both cases, it is provided that the conductive portion assigned to the structure can essentially be modeled on a part of an outline of the structure.

Furthermore, the conductor track arrangement can be designed such that it comprises projecting and / or recessed structural sections with respect to the surface of the substrate.

Both a protruding structure and a recessed structure formed as a recess, for example, may cause shading of the radiation, depending on the direction of the irradiation with respect to the surface of the substrate.

According to one embodiment, the structure may have a longitudinal extent and the conductive portion associated with the structure may form a conductor track.

For example, it can be provided that the structure has a longitudinal extent. After irradiation, the conductive portion associated with the structure may also extend substantially along the length of the structure so that a trace is formed on the substrate.

In particular, the structure may be formed integrally with the substrate in the manufacture of the substrate. Thus, the formation of the track arrangement can be determined after irradiation of the substrate already in the manufacture of the substrate.

According to one embodiment, the conductive portion may be formed by irradiation of the substrate with, in particular conductive, material particles. The deposited by irradiation material particles can form conductive compounds by touching each other, so that after sufficient irradiation, a conductive portion is formed. The material may in particular be metal particles.

Adhesion of the material particles on the substrate or adhesion of the deposited material is dependent on an angle between the irradiation and the normal vector of the substrate surface. Maximum adhesion is achieved when the irradiation is perpendicular to the substrate surface. If there is an angle other than 0 ° between the irradiation and the normal vector of the substrate surface, an applied amount of material is smaller. If the radiation and the normal vector form a right angle, that is, if there is a grazing incidence, almost no material is deposited. On a surface having an undercut, no material is deposited in the shaded area.

It can be provided that the irradiation takes place with a radiation which converts the substrate or a layer provided on the substrate at the irradiation site.

For example, the substrate may be formed of an insulating material which becomes conductive by suitable irradiation at the points of incidence of the radiation.

Alternatively, a layer of a material which is sensitive to the radiation can be provided on the substrate. In this case, after the irradiation, for example, a fixation may be provided in a first step and in a subsequent step a coating with a conductive material may be provided. For example, the area shaded by the undercuts of the structure may be provided with an activator, so that subsequently only in this area in a chemo-galvanic step a conductive section can be formed.

A structure formed on the substrate, which is present between two adjacent tracks, is able to provide an insulating section between the two tracks, provided that it forms an undercut with respect to the irradiation.

Furthermore, the conductor track arrangement may be formed such that the structure is formed on the substrate as a protruding structure and in each case at a first edge of the structure, a first conductive portion and at a second edge of the structure, a second conductive portion is formed. In particular, the structure may protrude beyond the first conductive portion and the second conductive portion.

According to one embodiment, the structure may be in the form of a web on the substrate. After vertical irradiation of the substrate, a first conductive section and a second conductive section, which are separated from one another by the web, are formed on a first flank of the web, for example a left side, and on a second flank of the web, for example a right side , Although a conductive section also forms on the web itself, this will, with suitable irradiation, have an insulating distance to the first conductive section and to the second conductive section. In this way, a distance between two conductive sections on a substrate is limited by a minimum producible web width. This makes it possible to produce small interconnect arrangements and thus to reduce a space size of a substrate.

It can be provided that at least one first structure and a second structure are formed on the substrate, the first structure comprising at least one oblique first flank and the second structure at least one oblique first flank, wherein a first conductive portion on the oblique first flank of the first structure and a second conductive portion are formed on the inclined first flank of the second structure.

In this case, an oblique flank means in particular that the flank is arranged neither exactly perpendicular to the substrate surface nor parallel thereto. For example, the surface of the flank may have an angle of 30 °, 45 °, 60 °, 70 ° or 80 ° or an intermediate value with the substrate surface. This geometry enables further degrees of freedom in the production of a printed conductor arrangement. If, for example, the irradiation angle is selected such that the first structure largely shades off the second structure, a wider conductive portion will form on the oblique first flank of the first structure than on the oblique first flank of the second structure. In this way, it is possible to set a wiring resistance of a conductive portion. It is understood that the irradiation is directed largely perpendicular to the oblique first flank of the first structure and the oblique first flank of the second structure.

It can be provided that the structure is formed as a recess. In order to achieve an undercut through a first flank of the structure formed as a trench, in this case the irradiation will not be perpendicular to the substrate.

According to one aspect, a molded part is provided which comprises a printed conductor arrangement as described above. The molded part may be, for example, a housing of an electrical device. For example, it may be a headlight molding in a motor vehicle. In this case, for example, the structure may be provided such that after irradiation there are conductive sections on the molded part, so that cable feeds for a headlight can be dispensed with. As a result, an installation of a headlight in a motor vehicle production can be simplified.

Alternatively it can be provided to provide the structures on an inner side of an electrical hand-held device, such as a cordless screwdriver or cordless vacuum cleaner, so that a cable connection between a battery or battery compartment to the electric motor can be omitted. The fact that the structure is already formed during the production of the molding which constitutes the substrate means that the production of molded electrical devices can generally be simplified.

The wiring arrangement described above enables conductive portions closely adjacent to each other and thus closely spaced traces, since an effective insulation area can be formed in a small size, so that a molding can be made flexible and, in particular, can have a flexible package size.

According to one aspect, a method for applying a conductor track is provided. In this case, conductive material is applied to a substrate having a structure formed thereon, to form a conductive portion on the structure.

In one embodiment it can be provided that the structure formed on the substrate has a longitudinal extent such that the conductive portion is formed as a conductor track.

In summary, if the geometry of the substrate provides an electrically insulating separation of the interconnects, the interconnect arrangement described above permits the production of adjacent conductive sections or interconnects in a process step in which the irradiation simultaneously covers a larger substrate area. This allows accelerated deposition of the conductive portions or traces.

Brief descriptions of the drawings

Preferred embodiments of the present invention will now be described in more detail with reference to the accompanying drawings, in which like or similar reference characters designate the same or similar features. Show it:

1 a representation of a conductor arrangement according to the prior art on a substrate;

2 a representation of a conductor track arrangement with a web formed as a structure;

3 a representation of irradiation of a substrate which is provided with structures having a plurality of oblique edges;

4 a cross-sectional view according to 3 formed, neighboring tracks; and

5 a representation of an irradiation of a substrate in which the structure is formed as a recess.

Description of embodiments

1 shows in a perspective plan view of a conventional interconnect arrangement 1 standing on a substrate surface 4 a substrate 3 is trained.

On the substrate surface 4 are a first trace 51 and a second trace 52 educated. The two tracks 51 . 52 are applied in this example by irradiation according to the prior art. Therefore, the tracks show 51 . 52 in cross-section - viewed in the direction of the extension of the track - a bell profile according to a Gaussian curve. The first trace 51 has a vertex in cross section 91 on as well as a border area 71 , which has only a negligible amount of material blasted on, but the amount of blasted material is still sufficient for a conductive compound. The second track 52 has a vertex in cross section 92 on as well as a border area 72 which only has very little, but to form a conductive connection sufficient, radiated material.

Provided a distance between the first trace 51 and the second conductor 52 was chosen sufficiently large, so that the edge area 71 the first trace 51 and the border area 72 the second trace 52 do not overlap, an insulating portion between the first and the second conductor can be formed. It is immediately understandable that this distance is large due to the bell profile.

In the embodiments described below, the conductive portions are identified with traces.

2 shows in a perspective plan view of a conductor track arrangement 1 standing on a surface 4 a substrate 3 is formed, which is designed as a web structure 33 the width b has. The web has a height H and is integral with the substrate 3 formed, for example in an injection molding process. Furthermore, the structure has 33 a first flank 261 as well as a second flank 262 on. The surface 4 of the substrate 3 is exposed to an irradiation, not shown here, with, for example, conductive, material particles. This will be a first trace 12 and a second trace 13 directly adjacent to the first flank 261 and the second flank 262 educated.

The irradiation takes place only until it is ensured that a peak height h of the two interconnects formed by irradiation is the height H of the structure 33 does not exceed. This way is a supernatant 32 educated. Moreover, this is an insulating section 11 between the first and the second trace 12 . 13 formed, because at the first flank 261 and the second flank 262 in the region of the supernatant 32 no conductive material on the bridge 33 was separated.

The height h of the tracks 12 . 13 corresponds to the vertices 291 and 292 the first trace 12 or the second conductor track 13 , Only to supplement is the border area 271 the first trace 12 as well as the border area 272 the second trace 13 designated.

The representation of this embodiment can be seen immediately that a small distance between the first conductor track 12 and the second conductor 13 it is possible which of the width b of the web 33 equivalent. Thus, flexibility in the production of a molded part 2 improved, since tracks to achieve a mutual isolation only have to comply with the distance b.

3 illustrates a method of applying a trace to a substrate. A substrate 3 points to its substrate surface 4 a first structure 431 , a second structure 432 and a third structure 433 on. The first structure 431 has a sloping first flank 441 as well as a second flank 461 on. The second structure 432 has a sloping first flank 442 as well as a second flank 462 on. The third structure 433 has a sloping first flank 443 as well as a second flank 463 on. The three structures 431 . 432 such as 433 are formed adjacent to each other. It is understood that the substrate 3 together with the three structures 431 . 432 and 433 a molding 2 can form.

At a distance from the molding 2 is an irradiation device 101 arranged. From an opening 103 the irradiation device 101 occurs an irradiation 105 out on the three structures 431 . 432 such as 433 is directed, in particular on the oblique first edge 441 the first structure 431 , the sloping first flank 442 the second structure 432 as well as the sloping first flank 443 the third structure 433 ,

The irradiation 105 preferably falls substantially perpendicular to the inclined first flank 441 the first structure 431 , the sloping first flank 442 the second structure 432 as well as the sloping first flank 443 the third structure 433 , To this Way is an optimal creation of tracks on the molding 2 guaranteed. Through an interaction of the irradiation 105 and one by undercut of the second flanks of the respective structures, a plurality of mutually insulated interconnects can be prepared in a single irradiation process, as in the following 4 is shown.

4 shows in detail how two mutually insulated tracks 12 . 13 on a molding 2 with suitable structures 3 and appropriate irradiation 105 be generated.

On a surface 4 a substrate 3 are two structures 531 and 532 arranged, preferably in one piece with the substrate 3 are formed. The structure 531 has a sloping first flank 541 on and a second flank 561 , to which an oblique first flank 542 the second structure 532 immediately connected. Furthermore, the structure has 532 a second flank 562 on. A height H1 of the second flank 561 the first structure 531 is usually with a height H2 of the second flank 562 the second structure 532 to match. However, it is also contemplated that heights H1 and H2 may differ.

The sloping first flank 541 the first structure 531 closes an angle β with the second flank 561 the first structure 531 one. It can be provided that the second flank 561 the first structure 531 perpendicular to the substrate surface 4 stands. It is also contemplated the second flank 562 the second structure 532 also perpendicular to the substrate surface 4 align. The sloping first flank 541 the first structure 531 is preferably parallel to the oblique first edge 542 the second structure 532 ,

That with these structures 531 and 532 provided molding 2 is with an irradiation 105 irradiated. The irradiation 105 is substantially perpendicular to the oblique first flank 541 the first structure 531 as well as the parallel aligned oblique first edge 542 the second structure 532 directed. At the radiation 105 it may, for example, be an irradiation with, for example, conductive, material particles.

In this way, as is well known, a lot of material particles according to a bell curve on the molding 2 deposited. By doing that, the second flank 561 the first structure 531 for the irradiation 105 represents an undercut, the aforementioned bell profile divides but on the sloping first flank 541 the first structure 531 and the sloping first flank 542 the second structure 532 on. A maximum of material deposition in this configuration is close to a shading line 58 which, when irradiated between the first structure 531 and the second structure 532 is formed.

These points with maximum material application are in the figure as a vertex 591 as well as vertex 592 designated. A border of material on the sloping first flank 541 the first structure 531 is formed, is denoted by the reference numeral 571 designated. Another area with low material application on the sloping first flank 541 the second structure 532 is with the reference numeral 572 designated.

The result of irradiation 105 is a first track 551 on the sloping first flank 541 the first structure 531 is formed, and a second conductor 552 on the sloping first flank 542 the second structure 532 is formed. A width x1 of the first trace 551 here is significantly larger than a width x2 of the second conductor track 552 , This stems from a shadowing, the second flank 561 the first structure 531 opposite the sloping first flank 542 the second structure 532 causes. In this way, for example, the resistance of a conductor track can be adjusted. In this example, the resistance of the second trace would be 552 due to the smaller cross-section greater than the resistance of the first conductor track 551 ,

An insulating section 11 between the first trace 551 and the second conductor 552 is through an area free of a trace 54 the first structure 531 and an area free of a track 55 on the sloping first flank 542 the second structure 532 educated.

A molding 2 that with the described structures 531 and 532 is provided, allows the relatively simple formation of two mutually insulating interconnects in a single process step. It is conceivable the first and second structures 531 . 532 continue such that a kind of fine, sawtooth-like profile is formed on the molding and in this way after irradiation a plurality of interconnects in a single process step simultaneously on the molding 2 can be applied so as to produce a wiring arrangement with a plurality of interconnects.

5 shows a further embodiment, in which in a surface 4 a substrate 3 a structure 63 is introduced, which is the shape of a recess 63 having. This structure 63 has a first edge 661 as well as a second flank 662 on, passing through a floor 67 the structure 63 connected to each other. Will this molding 2 an irradiation 105 exposed to material particles, wherein a different angle of the irradiation angle is selected, so form on the substrate surface 4 on both sides of the structure 63 Material deposits.

However, due to the deviating from the vertical irradiation 105 the first flank 661 the structure 63 a shadowing of the radiation 105 along a shading line 68 , As a result, on the one hand, the first edge 661 the structure 63 free of material particles and it becomes one to the impact point of the Abschattungslinie 63 on the ground 67 the structure 63 reaching material-free and thus insulating insulating section 11 between a first resulting track 651 and a second resulting track 652 educated.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 10109087 A1 [0003]

Claims (12)

Trace arrangement ( 1 ), comprising: a substrate ( 3 ); One on a surface of the substrate ( 3 ) formed perpendicular to the surface structure ( 33 ; 431 ; 432 ; 433 ; 531 ; 532 ; 63 ); and - one of the structure ( 33 ; 431 ; 432 ; 433 ; 531 ; 532 ; 63 ) associated conductive portion ( 12 ; 13 ; 551 ; 552 ; 651 ; 652 ). Trace arrangement ( 1 ) according to claim 1, wherein the structure ( 33 ; 431 ; 432 ; 433 ; 531 ; 532 ; 63 ) associated conductive section ( 12 ; 13 ; 551 ; 552 ; 651 ; 652 ) on the structure ( 33 ; 431 ; 432 ; 433 ; 531 ; 532 ; 63 ) is trained. Trace arrangement ( 1 ) according to any one of the preceding claims, wherein the structure ( 33 ; 431 ; 432 ; 433 ; 531 ; 532 ; 63 ) comprises projecting and / or recessed structural sections. Trace arrangement ( 1 ) according to any one of the preceding claims, wherein the structure ( 33 ; 431 ; 432 ; 433 ; 531 ; 532 ; 63 ) has a longitudinal extent and that of the structure ( 33 ; 431 ; 432 ; 433 ; 531 ; 532 ; 63 ) associated conductive portion ( 12 ; 13 ; 551 ; 552 ; 651 ; 652 ) a conductor track ( 12 ; 13 ; 551 ; 552 ; 651 ; 652 ) along the longitudinal extent of the structure. Trace arrangement ( 1 ) according to any one of the preceding claims, wherein the structure ( 33 ; 431 ; 432 ; 433 ; 531 ; 532 ; 63 ) in the production of the substrate ( 3 ) integral with the substrate ( 3 ) is trained. Trace arrangement ( 1 ) according to any one of the preceding claims, wherein the conductive portion ( 12 ; 13 ; 551 ; 552 ; 651 ; 652 ) is formed by irradiation with material particles, in particular particles of conductive material. Trace arrangement ( 1 ) according to any one of claims 1 to 5, wherein the irradiation is carried out with a radiation which is the substrate ( 3 ) or one on the substrate ( 3 ) converted layer at the irradiation site. Trace arrangement ( 1 ) according to any one of the preceding claims, wherein the structure ( 33 ) from the substrate ( 3 ) is formed protruding and at a first edge ( 261 ) of the structure ( 33 ) a first conductive portion ( 12 ) and on a second flank ( 262 ) of the structure ( 33 ) a second conductive portion ( 13 ), the structure ( 33 ) in a direction extending perpendicular to the surface of the substrate via the first conductive portion (FIG. 12 ) and the second conductive portion ( 13 protrudes to the conductive portions ( 12 . 13 ) electrically separate from each other. Trace arrangement ( 1 ) according to one of claims 7 or 8, wherein the vertical structure ( 33 ) as a bridge ( 33 ) is trained. Trace arrangement ( 1 ) according to one of claims 1 to 9, wherein on the surface of the substrate ( 3 ) at least one first structure ( 431 ; 432 ; 433 ; 531 ) and a second structure ( 431 ; 432 ; 433 ; 532 ), the first structure ( 431 ; 432 ; 433 ; 531 ) at least one inclined first flank ( 441 ; 442 ; 443 ; 541 ) and the second structure ( 431 ; 432 ; 433 ; 532 ) at least one inclined first flank ( 441 ; 442 ; 443 ; 542 ), wherein a first conductive portion ( 591 ) on the sloping first flank ( 541 ) of the first structure ( 531 ) and a second conductive portion on the sloping first flank ( 542 ) of the second structure ( 532 ) are formed. Method for applying a conductor track ( 12 ; 13 ; 551 ; 552 ; 651 ; 652 ) on a surface of a substrate ( 3 ), comprising: providing a substrate ( 3 ) having a structure extending thereon perpendicular to the surface ( 431 ; 432 ; 433 ; 531 ; 532 ; 63 ); Directed application of conductive material to the substrate ( 3 ) to a conductive section ( 12 ; 13 ; 551 ; 552 ; 651 ; 652 ) on the structure ( 33 ; 431 ; 432 ; 433 ; 531 ; 532 ; 63 ) train. The method of claim 11, wherein the directional deposition of conductive material onto the substrate ( 3 ) is performed from a direction in which the vertical structure ( 431 ; 432 ; 433 ; 531 ; 532 ; 63 ) an area is shadowed.

Images