DE102011117944B4 - Verfahren zum Bilden eines Silikat-Polierkissens - Google Patents

Verfahren zum Bilden eines Silikat-Polierkissens Download PDF

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Publication number
DE102011117944B4
DE102011117944B4 DE102011117944.9A DE102011117944A DE102011117944B4 DE 102011117944 B4 DE102011117944 B4 DE 102011117944B4 DE 102011117944 A DE102011117944 A DE 102011117944A DE 102011117944 B4 DE102011117944 B4 DE 102011117944B4
Authority
DE
Germany
Prior art keywords
polymeric microelements
polymeric
silicate
microelements
percent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102011117944.9A
Other languages
German (de)
English (en)
Other versions
DE102011117944A1 (de
Inventor
Donna M. Alden
Andrew R. Wank
Robert Gargione
Mark E. Gazze
Joseph So
David Drop
Shawn Riley
Mai Tieu Banh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of DE102011117944A1 publication Critical patent/DE102011117944A1/de
Application granted granted Critical
Publication of DE102011117944B4 publication Critical patent/DE102011117944B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0054—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impressing abrasive powder in a matrix
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
DE102011117944.9A 2010-11-12 2011-11-08 Verfahren zum Bilden eines Silikat-Polierkissens Active DE102011117944B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/945,504 US8202334B2 (en) 2010-11-12 2010-11-12 Method of forming silicate polishing pad
US12/945,504 2010-11-12

Publications (2)

Publication Number Publication Date
DE102011117944A1 DE102011117944A1 (de) 2012-05-16
DE102011117944B4 true DE102011117944B4 (de) 2023-06-29

Family

ID=45999143

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102011117944.9A Active DE102011117944B4 (de) 2010-11-12 2011-11-08 Verfahren zum Bilden eines Silikat-Polierkissens

Country Status (7)

Country Link
US (1) US8202334B2 (enExample)
JP (1) JP5845832B2 (enExample)
KR (1) KR101861372B1 (enExample)
CN (1) CN102463531B (enExample)
DE (1) DE102011117944B4 (enExample)
FR (1) FR2967368B1 (enExample)
TW (1) TWI593509B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8894732B2 (en) 2012-05-11 2014-11-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Hollow polymeric-alkaline earth metal oxide composite
US9073172B2 (en) 2012-05-11 2015-07-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Alkaline-earth metal oxide-polymeric polishing pad
US8888877B2 (en) * 2012-05-11 2014-11-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Forming alkaline-earth metal oxide polishing pad
US20150306731A1 (en) * 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US11524390B2 (en) * 2017-05-01 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Methods of making chemical mechanical polishing layers having improved uniformity
KR102293801B1 (ko) * 2019-11-28 2021-08-25 에스케이씨솔믹스 주식회사 연마패드, 이의 제조방법 및 이를 이용한 반도체 소자의 제조방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5578362A (en) 1992-08-19 1996-11-26 Rodel, Inc. Polymeric polishing pad containing hollow polymeric microelements
DE69427169T2 (de) 1993-01-29 2001-10-25 Canon K.K., Tokio/Tokyo Gasstrom-Sichter, Verfahren zum Sichten mittels eines Gasstroms, Verfahren und Vorrichtung zur Tonerherstellung
DE102010018012A1 (de) 2009-04-27 2010-10-28 Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark Verfahren zum Herstellen von Polierschichten eines chemisch-mechanischen Polierkissens mit verminderten Gaseinschlussdefekten

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3984833B2 (ja) * 2001-01-16 2007-10-03 キヤノン株式会社 現像剤担持体の再生方法
JP2003062748A (ja) * 2001-08-24 2003-03-05 Inoac Corp 研磨用パッド
US6986705B2 (en) * 2004-04-05 2006-01-17 Rimpad Tech Ltd. Polishing pad and method of making same
KR20090033251A (ko) * 2006-08-21 2009-04-01 니폰 쇼쿠바이 컴파니 리미티드 미립자, 미립자의 제조방법, 이 미립자를 포함하는 수지 조성물 및 광학 필름
JP5222586B2 (ja) * 2008-02-29 2013-06-26 富士紡ホールディングス株式会社 研磨パッドおよび研磨パッドの製造方法
JP2009254938A (ja) * 2008-04-14 2009-11-05 Nippon Shokubai Co Ltd 粒子の分級方法およびその方法を用いて得られる粒子
JP5543717B2 (ja) * 2009-02-13 2014-07-09 積水化学工業株式会社 熱膨張性マイクロカプセル及び熱膨張性マイクロカプセルの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5578362A (en) 1992-08-19 1996-11-26 Rodel, Inc. Polymeric polishing pad containing hollow polymeric microelements
DE69427169T2 (de) 1993-01-29 2001-10-25 Canon K.K., Tokio/Tokyo Gasstrom-Sichter, Verfahren zum Sichten mittels eines Gasstroms, Verfahren und Vorrichtung zur Tonerherstellung
DE102010018012A1 (de) 2009-04-27 2010-10-28 Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark Verfahren zum Herstellen von Polierschichten eines chemisch-mechanischen Polierkissens mit verminderten Gaseinschlussdefekten

Also Published As

Publication number Publication date
KR20120057518A (ko) 2012-06-05
US20120117889A1 (en) 2012-05-17
FR2967368B1 (fr) 2015-08-21
JP2012101353A (ja) 2012-05-31
CN102463531B (zh) 2014-10-01
TWI593509B (zh) 2017-08-01
JP5845832B2 (ja) 2016-01-20
US8202334B2 (en) 2012-06-19
TW201221293A (en) 2012-06-01
CN102463531A (zh) 2012-05-23
DE102011117944A1 (de) 2012-05-16
FR2967368A1 (fr) 2012-05-18
KR101861372B1 (ko) 2018-05-28

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R012 Request for examination validly filed
R016 Response to examination communication
R018 Grant decision by examination section/examining division
R020 Patent grant now final
R081 Change of applicant/patentee

Owner name: DUPONT ELECTRONIC MATERIALS HOLDING, INC., NEW, US

Free format text: FORMER OWNER: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC., NEWARK, DEL., US

R082 Change of representative

Representative=s name: MUELLER-BORE & PARTNER PATENTANWAELTE PARTG MB, DE

Representative=s name: ABITZ & PARTNER PATENTANWAELTE MBB, DE

R082 Change of representative

Representative=s name: MUELLER-BORE & PARTNER PATENTANWAELTE PARTG MB, DE