DE102009031227A1 - Vorrichtung zum Auflöten eines Leiters auf einen Schaltungsträger - Google Patents

Vorrichtung zum Auflöten eines Leiters auf einen Schaltungsträger Download PDF

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Publication number
DE102009031227A1
DE102009031227A1 DE102009031227A DE102009031227A DE102009031227A1 DE 102009031227 A1 DE102009031227 A1 DE 102009031227A1 DE 102009031227 A DE102009031227 A DE 102009031227A DE 102009031227 A DE102009031227 A DE 102009031227A DE 102009031227 A1 DE102009031227 A1 DE 102009031227A1
Authority
DE
Germany
Prior art keywords
electrical conductor
soldering
hold
metallization
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102009031227A
Other languages
German (de)
English (en)
Inventor
Ernst M. Wolf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WOLF PRODUKTIONSSYSTEME GmbH
Original Assignee
WOLF PRODUKTIONSSYSTEME GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WOLF PRODUKTIONSSYSTEME GmbH filed Critical WOLF PRODUKTIONSSYSTEME GmbH
Priority to DE102009031227A priority Critical patent/DE102009031227A1/de
Priority to PCT/EP2010/000275 priority patent/WO2010083976A1/fr
Publication of DE102009031227A1 publication Critical patent/DE102009031227A1/de
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/002—Resistance welding; Severing by resistance heating specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/08—Seam welding not restricted to one of the preceding subgroups
    • B23K11/087—Seam welding not restricted to one of the preceding subgroups for rectilinear seams
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Photovoltaic Devices (AREA)
DE102009031227A 2009-01-23 2009-07-01 Vorrichtung zum Auflöten eines Leiters auf einen Schaltungsträger Ceased DE102009031227A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102009031227A DE102009031227A1 (de) 2009-01-23 2009-07-01 Vorrichtung zum Auflöten eines Leiters auf einen Schaltungsträger
PCT/EP2010/000275 WO2010083976A1 (fr) 2009-01-23 2010-01-19 Procédé de brasage d'un conducteur sur un support de circuit

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009005990.3 2009-01-23
DE102009005990 2009-01-23
DE102009031227A DE102009031227A1 (de) 2009-01-23 2009-07-01 Vorrichtung zum Auflöten eines Leiters auf einen Schaltungsträger

Publications (1)

Publication Number Publication Date
DE102009031227A1 true DE102009031227A1 (de) 2010-07-29

Family

ID=42282722

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102009031227A Ceased DE102009031227A1 (de) 2009-01-23 2009-07-01 Vorrichtung zum Auflöten eines Leiters auf einen Schaltungsträger

Country Status (2)

Country Link
DE (1) DE102009031227A1 (fr)
WO (1) WO2010083976A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012001883B3 (de) * 2012-02-01 2013-04-25 Isabellenhütte Heusler Gmbh & Co. Kg Lötverfahren und entsprechende Löteinrichtung
EP2730496A3 (fr) * 2012-11-12 2018-03-14 Airbus Defence and Space GmbH Composant plat pour aéronef et procédé de sa fabrication
CN112059344A (zh) * 2020-08-17 2020-12-11 晶澳（邢台）太阳能有限公司 一种mbb串焊机焊带压制工装

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2607007A1 (fr) * 2011-12-19 2013-06-26 Komax Holding AG Dispositif de soudure destiné à la fixation d'une bande conductrice d'électricité sur une cellule solaire
CN102950401B (zh) * 2012-10-26 2016-09-14 秦皇岛博硕光电设备股份有限公司 柔性焊接头及焊接装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9613046D0 (en) * 1996-06-21 1996-08-28 Delta Millennia Limited Making an electrical joint

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012001883B3 (de) * 2012-02-01 2013-04-25 Isabellenhütte Heusler Gmbh & Co. Kg Lötverfahren und entsprechende Löteinrichtung
WO2013083295A1 (fr) 2012-02-01 2013-06-13 Isabellenhütte Heusler Gmbh & Co. Kg Procédé de brasage et dispositif de brasage associé
EP2647270A1 (fr) * 2012-02-01 2013-10-09 Isabellenhütte Heusler GmbH & Co. Kg Procédé de brasage et dispositif de brasage associé
EP2730496A3 (fr) * 2012-11-12 2018-03-14 Airbus Defence and Space GmbH Composant plat pour aéronef et procédé de sa fabrication
CN112059344A (zh) * 2020-08-17 2020-12-11 晶澳（邢台）太阳能有限公司 一种mbb串焊机焊带压制工装

Also Published As

Publication number Publication date
WO2010083976A1 (fr) 2010-07-29

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
R016 Response to examination communication
R082 Change of representative

Representative=s name: PETERSEN, FRANK, DIPL.-ING., DE

Representative=s name: JANY UND PETERSEN PATENTANWAELTE PARTNERSCHAFT, DE

R082 Change of representative

Representative=s name: PETERSEN, FRANK, DIPL.-ING., DE

Representative=s name: JANY UND PETERSEN PATENTANWAELTE PARTNERSCHAFT, DE

R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final
R082 Change of representative

Representative=s name: PETERSEN, FRANK, DIPL.-ING., DE

R003 Refusal decision now final

Effective date: 20140815