DE102008004422A1 - Holder for semiconductor wafer, comprises front side and rear side for one-sided sealing of semiconductor wafer, and rear plate is provided, which is arranged parallel to semiconductor wafer, facing rear side - Google Patents

Abstract

The holder (1) comprises a front side and a rear side for one-sided sealing of a semiconductor wafer (10). A rear plate (30) is provided, which is arranged parallel to the semiconductor wafer, facing the rear side. A seal (60) is provided, which is formed as ring-shaped and comprises a wedge-shaped lip lying radially in the interior.

Description

The The invention relates to a holder for a semiconductor wafer for one-sided sealing of the semiconductor wafer according to the The preamble of claims 1 to 3.

It is known, semiconductor wafers for processing, especially in etching or coating processes, in chemical solution baths or immerse cleaning solutions. For certain operations However, the semiconductor wafers are only on one side of the Be subjected to treatment. The other side must be covered or sealed. It is known, the semiconductor wafers one-sided with a protective layer such as in the form of To cover paints or foils, which, however, in a further process step must be removed again, which is time consuming and costly is.

Known are also holders in which the semiconductor wafers in such a way be inserted that one side covered by the bracket while at least part of the other side is for the treatment remains accessible.

Of the US 2 006/004 6499 A1 a holder for a semiconductor wafer for unilateral sealing of the semiconductor wafer is to be taken, which has a parallel to the semiconductor wafer arranged, the back facing back plate, which supports the semiconductor wafer and in particular covers the back. The holder described therein further comprises a closure for securing the semiconductor wafer to the rear plate, wherein the closure covers the front of an outer edge of the semiconductor wafer and having an opening through which at least a portion of an inner surface of the front side of the semiconductor wafer is accessible. Furthermore, the holder described there has a seal which seals the front side of the semiconductor wafer relative to the closure, in particular with regard to fluid media during chemical etching or cleaning processes. The seal is designed as an O-ring. A disadvantage of known holders is that the seal adheres to the semiconductor wafer and thus damage to the semiconductor wafer can not be avoided. In addition, residues of the fluid media may adhere between the O-ring seal and the semiconductor wafer, thereby contaminating the semiconductor wafers.

The known holders for one-sided sealing of the semiconductor wafers also have the disadvantage that they are not for automated Processes are suitable.

Of the Invention is therefore the object of an improved holder for the one-sided sealing of semiconductor wafers, in which the semiconductor wafers can be treated on one side, without the risk of contamination or damage consists. In particular, the invention is based on the object, a to provide improved mounting, which is an automated Process allows.

The The object is achieved by a holder with the features of claims 1 or 2 Or 3.

advantageous Embodiments and developments of the invention are specified in the subclaims.

According to the invention the seal of the holder is annular and has a radially inner, wedge-shaped lip. By the wedge-shaped lip becomes the transition between the closure and the semiconductor wafer filled so that no deposits of fluid media between the shutter and the seal or between the seal and the semiconductor wafer are possible, so that the semiconductor wafer less dirty. In particular, allows such a trained seal also a streamlined transition between the holder and the semiconductor wafer, allowing the treatment process in the baths is not affected.

In an alternative solution to the problem has the holder Chamfering, which in particular on the outer circumference of Closure or along the opening of the closure are arranged to flow in this way, too designed bracket to receive the treatment process not affected and turbulence in the bath flow avoids.

In a further alternative solution of the invention the holder has at least one coding based on which, for example either automated, it can be detected what kind of semiconductor wafer is arranged in the holder or in which orientation the Holder handled for an automated process must be, making the holder for an automated Process is suitable.

According to a particularly preferred embodiment of the invention, the holder has both the annular seal, which has an inner, wedge-shaped lip, as well as the inventive codings and he inventive chamfers or any combination of the three alternative embodiments to a particularly streamlined Hal provide an automated process.

Of the Closure is preferably designed as a bayonet closure, because such a closure particularly easy to open and can be closed, in particular only by a rotation by a few angular degrees, so that such a closure in particular is beneficial for an automated process.

The Seal is preferably as an annular flat or profile seal formed with a flattening of the otherwise round ring shape. The flattening is in particular in the manner of a secant formed the otherwise round ring shape running. This will provided a seal that conforms to the usual Molds of semiconductor wafers, which are also round with a flattening are trained, adapt and thus complete and Reliable sealing of the semiconductor wafer allows the closure.

The Seal is preferably elastic and deformable, on the one hand ensure a reliable seal too can, on the other hand possibly occurring surface irregularities or to compensate for semiconductor wafer thickness tolerances.

According to one particularly preferred embodiment of the invention the seal arranged in a in the inner circumference of the closure Grooved arranged. The arrangement is preferably such that the wedge-shaped lip protrudes from the groove, leaving over the lip of the seal seals between the lock and the semiconductor wafer he can be enough, when releasing the connection Pull out between the shutter and the back plate the seal from the groove, which in adhesion of the seal to the Semiconductor wafer when the seal is arranged in one of the semiconductor wafers facing surface of the closure would be possible is avoided by the radially aligned groove.

In an advantageous embodiment of the invention, the holder Recesses in particular on its outer circumference, in which a gripper during an automated process can intervene to handle the bracket. Especially preferred represent these recesses simultaneously the coding, for example the number of recesses and the arrangement of the recesses relative to each other information about the arranged in the holder Semiconductor wafer or the orientation of the semiconductor wafer arranged in the holder can give.

According to one particularly preferred embodiment of the invention the holder for different sizes the semiconductor wafer can be used, wherein the outer dimensions stay the same in each case. That's the way it is It is possible to use different sizes of semiconductor wafers by the same for the automated process competent To be able to handle plants.

According to one particularly preferred embodiment of the invention the closure on a front ring and a lock ring. there the seal is arranged in particular in the front ring while preferably the closure function via the locking ring is realized. Such a dichotomy makes it possible the wafer first between the back plate and the front ring to fix, be already on the seal achieved the seal between the front ring and the back plate while then the lock ring connects the front ring with the back plate, without the Seal must be rotated relative to the wafer. In this way be reliable damage the semiconductor wafer avoided.

preferably, the front ring has at least two, preferably eight Frontringnasen on, which point radially outwards and an engagement below Locking ring lugs allow which of the locking ring pointing radially inwards. In this way, the shutter function becomes realized as simply as possible.

In order to the semiconductor wafer in the holder reliably against Fluid media is preferably between the back plate and the closure a rear seal arranged, which the back plate against the closure seals. For the same reason is preferably also between the Front ring and the locking ring a front sealing ring arranged which seals the front ring against the lock ring.

Preferably is in the back plate in a recess on one of the Rear of the semiconductor wafer facing side radially a positioning pin is arranged outside the semiconductor wafer, in a facing in one of the front side of the semiconductor wafer Surface of the closure arranged recess engages. Such a positioning on the one hand allows the correct alignment between the shutter and the back plate. On the other hand, this positioning prevents, however, if the Recess is arranged in the front ring of the closure, a relative rotation between the front ring and the back plate, so that a relative movement between the sealing ring and the semiconductor wafer also reliably avoided.

The wedge-shaped seal is particularly be Preferably designed such that it is possible that during the assembly of the holder, the seal is first in line contact with an inner edge on the front side of the semiconductor wafer and subsequently, when the closure is closed, can be applied flatly to the front side of the semiconductor wafer, in order to achieve this and that To achieve a reliable seal and to keep the contact surface between the seal and the semiconductor wafer as low as possible during the closing process.

in the The invention will be described below with reference to a drawing Embodiment explained in more detail. Show it

1a a top view of an embodiment of a holder,

1b a side view of the holder according to 1a .

1c a section along the line AA according to 1a .

2 a section along the line BB according to 1a .

3 an excerpt from 1c .

4 a perspective view of the holder according to 1a .

5a a plan view of the seal of the holder according to 1a .

5b and a side view of the seal according to 5a .

6 an excerpt from 5b .

7a a perspective view of the front ring of the holder according to 1a .

7b another perspective view of the front ring according to 7a .

8a a perspective view of the locking ring of the holder according to 1a and

8b a further perspective view of the closure ring according to 8a ,

The 1 to 4 show different views of a bracket 1 with a back plate 30 one from a front ring 20 and a lock ring 40 formed seal and a seal 60 , where the seal 60 in different views in the 5a . 5b and 6 , the front ring 20 in different views in the 7a and 7b as well as the locking ring in different views in the 8a and 8b are shown in more detail again. The same parts are designated by the same reference numerals, for the sake of clarity, not all reference numerals are listed in all drawings.

In the holder 1 becomes a semiconductor wafer 10 used, which is a back 12 , a front side 14 and which are substantially circular with a flattening 16 is trained. The flattening 16 is formed by the fact that a circular cap is missing from the circular semiconductor wafer, and allows a clear orientation of the semiconductor wafer 10 ,

The back plate 30 is essentially formed as a circular disk and has an outer side 30a and an inside 30b on. One of the outside 30a facing part of the back plate 30 is essentially cylindrical with a smaller diameter than one of the inside 30b facing part of the back plate 30 formed, whereby on the outer periphery of the back plate 30 a circumferential projection 35 is formed. The inside 30b the back plate 30 is either directly or via a support ring 34 at the back 12 the semiconductor wafer 10 on, causing the semiconductor wafer 10 is supported.

The lock ring 40 is annular with a through hole 41 formed, being in the opening 41 the back plate 30 with her the outside 30a the back plate 30 facing cylindrical part can be used approximately positively. About the lead 36 is the back plate 30 against falling out in the axial direction in the direction of the outside 30a the back plate 30 secured. To seal the opening 41 of the lock ring 40 against the outer periphery of the back plate 30 is in the outside 30a the back plate 30 facing cylindrical part of the back plate 30 a circumferential groove 38 arranged, in which a rear sealing ring 32 is used. This rear sealing ring 32 caused by stiction in addition, that the back plate 30 not readily against the lock ring 40 is rotatable. The lock ring 40 has a top 40a and a bottom 40b on, with inserted back plate 30 in the lock ring 40 the bottom 40b essentially flush with the outside 30a the backplate te 30 connects, so that a substantially flat, streamlined back 1a the holder 1 is formed.

The semiconductor wafer 10 will be in the holder 1 between the back plate 30 and in the front ring 20 held seal 60 held clamped.

The seal 60 is designed as an annular flat or profile seal. The seal 60 is annular with a substantially rectangular cross-section, an upper surface 72 and a lower surface 74 formed, with the upper surface 72 and the bottom surface 74 substantially parallel to one another with a distance 702 are arranged. The inner circumference of the annular seal 60 is as a wedge-shaped lip 620 , which is arranged circumferentially formed. The lip 620 has a top 622 and a bottom 623 which are arranged at a lip angle β relative to each other, wherein the top 622 to the upper surface 72 and the bottom 623 to the lower surface 74 followed. The wedge-shaped lip 620 is arranged such that the bisector of the lip angle β is at an angle to the plane in the upper surface 72 is arranged so that the top 622 at an angle α to the upper surface 72 which is greater than an angle γ, in which the underside 623 the lip 620 to the lower surface 74 runs. The circumferential edge of the wedge-shaped lip 620 forms an inner edge 62 the seal 60 , which in the axial direction outside of the area, passing through two through the upper surface 72 or the lower surface 74 extending levels is limited, is arranged (see. 6 ). In this way comes in relative approach in the axial direction between the front ring 20 and the semiconductor wafer 10 first the inner edge 62 in linear contact with the front 14 the semiconductor disc 10 , Because the seal 60 is made of an elastic, deformable material is, upon further approach between the semiconductor wafer 10 and the front ring 20 the lip 620 so bent or deformed that the underside 623 the lip 620 in flat contact with the front 14 the semiconductor wafer 10 comes.

The front ring 20 is formed as an annular element, so that through the inner circumference of the front ring an opening 21 is formed. The front ring 20 becomes so relative to the semiconductor wafer 10 positioned that through the opening 21 at least a part of an inner surface of the front side 14 is accessible. The front ring 20 Covered with its inner wall, however, the outer edge of the semiconductor wafer 10 , causing the semiconductor wafer 10 between the front ring 20 and the back plate 30 about the seal 60 can be fixed. Starting from a top 20a of the front ring 20 indicates the front ring 20 a chamfer 21a on whose inner edge the opening 21 limited. Axial below the chamfer 21a is on the inner circumference of the front ring 20 a circumferential groove 26 formed, in which the seal 60 can be used from radially inside. This is due to the seal 60 on the outer circumference of an insert ring 630 formed with a substantially rectangular cross section, which has an insert ring height 632 which is smaller than the distance 702 between the upper surface 72 and the lower surface 74 the seal 60 , The insert ring 630 is essentially form-fitting in the groove 26 of the front ring 20 used. Preferably, the chamfering closes 21a of the front ring 20 to the top 622 the lip 620 the seal 60 in order to create a streamlined transition between the opening in this way 21 of the front ring 20 and the seal 60 to build. Due to the fact that the seal 60 not in an axially aligned groove, but in the radially aligned groove 26 is used, the seal can 60 even if they are in the treatment with the front 14 the semiconductor wafer 10 should be glued, yet be pulled off axially, leaving no residue on the semiconductor wafer 10 remain.

To a twist between the front ring 20 and the back plate 30 to prevent is at the back plate 30 at least one axially aligned positioning pin 50 arranged, which in a corresponding recess of the front ring 20 engages axially.

Between the front ring 20 and the lock ring 40 a locking mechanism is realized. The front ring 20 has at least two, in particular eight, distributed over the circumference Frontringnasen 24 which point radially outwards (cf. 7a ) while on the lock ring 40 pointing radially inward a corresponding number of locking ring lugs 42 is arranged (see. 8b ), under which the front nose can engage, the front ring 20 initially rotated by a few degrees with respect to the locking ring 40 is placed and the engagement of the front ring tabs under the locking ring lugs only after rotation between the front ring 20 and the lock ring 40 he follows. Between the front ring 20 and the lock ring 40 Various types of closure mechanisms can be realized, in particular also in the manner of a bayonet closure.

To get a seal between the front ring 20 and the lock ring 40 to achieve fluid media is on the outer circumference 29 of the front ring 20 a circumferential groove 28 arranged, in which a front sealing ring 22 is used.

Are the front ring 20 and the lock ring 40 over the front nose 24 and the lock ring noses 42 joined together, the top closes 20a of the front ring 20 essentially flush with the top 40a of the lock ring 40 at. In this way, a streamlined outside of the holder 1 reached. The lock ring 40 also has an outer circumference 47 on, which is designed such that starting from the top 40a a chamfer 45 and starting from the bottom 40b a chamfer 46 is arranged so that the outer circumference 47 is formed substantially wedge-shaped, whereby turbulence in the bath flow can be avoided. Overall, the chamfers 45 . 46 , as well as the chamfering 21a the opening 21 of the front ring 20 and the wedge-shaped shape of the lip 620 the seal 60 a streamlined shape of the holder 1 reached. The streamlined shape further contributes to the fact that the locking mechanism is located in-between the front ring 20 and the lock ring 40 is realized.

The semiconductor wafer 10 is in the holder in the following manner 1 used: First, the front ring lies 20 such on a support that the top 20a points down and the inner edge 62a the seal 60 points upwards. Axially from above becomes the semiconductor wafer 10 with the front 14 down on the seal 60 placed so that the inner edge 62 in linear contact with the front 14 the semiconductor wafer 10 comes. This can either be the semiconductor wafer 10 directly on the seal 60 be hung up. Alternatively, through the opening 21 of the front ring 20 a stamp can be positioned such that upon application of the semiconductor wafer 10 the front 14 first comes to rest on the stamp and the same when lowering the semiconductor wafer 10 on the seal 60 to come to rest. The back plate 30 is separately first in the lock ring 40 used as described above, whereupon the locking ring 40 so gripped that the top 40a pointing down and thus the locking ring 40 with inserted back plate 30 on the front ring 20 can be lowered. At first, the locking ring lugs engage 42 through gaps between the front lugs 24 therethrough. Subsequently, the lock ring 40 with inserted back plate 30 rotated by an angular degree of, for example, about 15 °, to engage the locking ring lugs 42 under the front nose 24 to achieve.

The main advantage of such a loading of the holder 1 with a semiconductor wafer 10 is that when opening and closing no relative movement between the seal 60 and the semiconductor wafer 10 must be made so that the surface of the semiconductor wafer 10 not damaged. In addition, only a small vertical contact pressure is required, so that a seal of the front ring 20 over the semiconductor wafer 10 Already achievable with comparatively small forces.

Thus, such insertion of the semiconductor wafer 10 in the holder 1 automated is possible are on the outer circumference 47 of the lock ring 40 several recesses 44 arranged. On the one hand, a gripper of an automation device in these recesses 44 engage to securely grasp the locking ring and opposite the front ring 40 to be able to turn. Furthermore, the recesses 44 define the position of the locking ring relative to the gripper. Finally, the recesses 44 represent a coding such that, for example, the number of recesses 44 in a certain peripheral portion information about what type of semiconductor wafer in the so gekennzeichne th holder 1 can be arranged. To get a good grip of the gripper on the bracket 1 to be able to ensure, are preferably three each at the same angular distance from each other arranged recesses 44 on the outer circumference 47 of the lock ring 40 available.

Due to different dimensions of the front ring 20 and optionally the back plate 30 can in the holder 1 differently dimensioned semiconductor wafers, in particular semiconductor wafers 10 be arranged with a diameter of 150 mm to 200 mm, with the brackets 1 However, can be handled by the same automation equipment. For example, therefore, an encoding is conceivable such that in spatial proximity one of the recesses 44 in which the gripper engages to the holder 1 to handle, in addition two further recesses 44 are arranged, if in the holder 1 a semiconductor wafer 10 is arranged with a small diameter, while in the arrangement of a large semiconductor wafer 10 these additional recesses 44 absence.

1

bracket

1a

back

10

Semiconductor wafer

12

back

14

front

16

flattening

20

front ring

20a

top

21

opening

21a

chamfer

22

front seal

24

Bezel nose

26

groove

28

groove

29

outer periphery

30

backplate

30a

outside

30b

inside

32

rear seal

34

Support ring

36

head Start

38

groove

40

lock ring

40a

top

40b

bottom

41

opening

42

Lock ring nose

44

recess

45

chamfer

46

chamfer

47

outer periphery

50

positioning

60

poetry

62

inner edge

64

flattening

72

upper area

74

lower area

620

lip

622

top

623

bottom

630

insert ring

632

Insert ring height

702

distance

α

angle

β

lip angle

γ

angle

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• US 2006/0046499 A1 [0004]

Claims (19)

Bracket ( 1 ) for a semiconductor wafer ( 10 ), which has a front side ( 14 ) and a back ( 12 ), for one-sided sealing of the semiconductor wafer ( 10 ) with: - one parallel to the semiconductor wafer ( 10 ), the rear side ( 12 ) facing back plate ( 30 ), - a closure for securing the semiconductor wafer ( 10 ) on the back plate ( 30 ), with the closure the front ( 14 ) on an outer edge of the semiconductor wafer ( 10 ) and an opening ( 21 ), through which at least a part of an inner surface of the front side ( 14 ), and - a seal ( 60 ), which the front ( 14 ) seals against the closure with respect to fluid media, characterized in that the seal ( 60 ) is annular and has a radially inwardly disposed, wedge-shaped lip ( 620 ) having. Bracket ( 1 ) for a semiconductor wafer ( 10 ), which has a front side ( 14 ) and a back ( 12 ), for one-sided sealing of the semiconductor wafer ( 10 ) with: - one parallel to the semiconductor wafer ( 10 ), the rear side ( 12 ) facing back plate ( 30 ), - a closure for securing the semiconductor wafer ( 10 ) on the back plate ( 30 ), with the closure the front ( 14 ) on an outer edge of the semiconductor wafer ( 10 ) and an opening ( 21 ), through which at least a part of an inner surface of the front side ( 14 ), and - a seal ( 60 ), which the front ( 14 ) seals against the closure with respect to fluid media, characterized in that the holder ( 1 ) has an encoding. Bracket ( 1 ) for a semiconductor wafer ( 10 ), which has a front side ( 14 ) and a back ( 12 ), for one-sided sealing of the semiconductor wafer ( 10 ) with: - one parallel to the semiconductor wafer ( 10 ), the rear side ( 12 ) facing back plate ( 30 ), - a closure for securing the semiconductor wafer ( 10 ) on the back plate ( 30 ), with the closure the front ( 14 ) on an outer edge of the semiconductor wafer ( 10 ) and an opening ( 21 ), through which at least a part of an inner surface of the front side ( 14 ), and - a seal ( 60 ), which the front ( 14 ) seals against the closure with respect to fluid media, characterized in that - the holder ( 1 ) Bevels ( 45 . 46 . 21a ) having. Holder characterized in that it has the features of claims 1 and / or 2 and / or 3. Holder according to one of the preceding claims, characterized in that the closure a seal against the front ( 14 ) by means of the seal ( 60 ) via positive and non-positive connection to the semiconductor wafer ( 10 ) realized vertical forces. Holder according to one of the previous Claims, characterized in that the closure as Bayonet lock is executed. Holder according to one of the preceding claims, characterized in that the seal ( 60 ) an annular flat or profile seal with a flattening ( 64 ) is the otherwise round ring shape. Holder according to one of the preceding claims, characterized in that the seal ( 60 ) is elastic and deformable. Holder according to one of the preceding claims, characterized in that the seal ( 60 ) in a groove arranged in the inner circumference of the closure ( 26 ) is arranged. Holder according to one of the preceding claims, characterized in that the holder recesses ( 44 ) having. Holder according to claim 2 and 10, characterized in that the coding by the recesses ( 44 ) is executed. Holder according to one of the preceding claims, characterized in that the holder ( 1 ) for different sizes of the semiconductor wafer ( 10 ) and the outer dimensions of the holder ( 1 ) stay the same. Holder according to one of the preceding claims, characterized in that the closure has a front ring ( 20 ) and a locking ring ( 40 ) having. Holder according to claim 13, characterized in that the front ring ( 20 ) at least two, preferably eight, front lugs ( 24 ) which point radially outwards and engage under locking ring tabs (US Pat. 42 ), which of the lock ring ( 40 ) pointing radially inwards. Holder according to claim 13 or 14, characterized in that the front ring ( 20 ) in a groove ( 28 ) at its periphery ( 29 ) a front sealing ring ( 22 ), which has a gap to the locking ring ( 40 ) seals. Holder according to one of the preceding claims, characterized in that the opening ( 21 ) of the closure a chamfer ( 21a ), which to the seal ( 60 ). Holder according to one of the preceding claims, characterized in that the back plate ( 30 ) in a groove ( 28 ) at its periphery a rear sealing ring ( 32 ) which seals a gap to the closure. Holder according to one of the preceding claims, characterized in that the back plate ( 30 ) in a recess on a first side, the back ( 12 ), radially outside the semiconductor wafer ( 10 ) a positioning pin ( 50 ), which in one in the front ( 14 ) facing the surface of the closure recess engages. Holder according to one of the preceding claims, characterized in that the seal ( 60 ) during closure by means of the closure initially with an inner edge ( 62 ) on the front side ( 14 ) can be brought into linear contact and then flat to the front ( 14 ) can be applied.