DE102007045377A8 - Optical processing at selective depth - Google Patents
Optical processing at selective depth Download PDFInfo
- Publication number
- DE102007045377A8 DE102007045377A8 DE102007045377A DE102007045377A DE102007045377A8 DE 102007045377 A8 DE102007045377 A8 DE 102007045377A8 DE 102007045377 A DE102007045377 A DE 102007045377A DE 102007045377 A DE102007045377 A DE 102007045377A DE 102007045377 A8 DE102007045377 A8 DE 102007045377A8
- Authority
- DE
- Germany
- Prior art keywords
- optical processing
- selective depth
- selective
- depth
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- High Energy & Nuclear Physics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/679,633 | 2007-02-27 | ||
US11/679,633 US20080206897A1 (en) | 2007-02-27 | 2007-02-27 | Selective Depth Optical Processing |
Publications (2)
Publication Number | Publication Date |
---|---|
DE102007045377A1 DE102007045377A1 (en) | 2008-08-28 |
DE102007045377A8 true DE102007045377A8 (en) | 2008-12-24 |
Family
ID=39646166
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102007045377A Ceased DE102007045377A1 (en) | 2007-02-27 | 2007-09-22 | Optical processing at selective depth |
Country Status (5)
Country | Link |
---|---|
US (1) | US20080206897A1 (en) |
JP (1) | JP2008211177A (en) |
KR (1) | KR20080079573A (en) |
DE (1) | DE102007045377A1 (en) |
NL (1) | NL1035031C2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2913843A4 (en) * | 2012-10-23 | 2016-06-29 | Fuji Electric Co Ltd | Semiconductor device manufacturing method |
CN110945028B (en) | 2017-07-10 | 2023-09-08 | 国际药物发展生物技术公司 | Treatment of B cell malignancies with non-fucosylated pro-apoptotic anti-CD 19 antibodies in combination with anti-CD 20 antibodies or chemotherapeutic agents |
FR3095152B1 (en) * | 2019-04-16 | 2021-12-17 | Safran Aircraft Engines | Process for dealing with an internal defect in a part |
JP2023536376A (en) * | 2021-07-06 | 2023-08-25 | エーピーエス リサーチ コーポレーション | LASER HEAT TREATMENT APPARATUS AND LASER HEAT TREATMENT METHOD |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60216561A (en) * | 1984-04-12 | 1985-10-30 | Fuji Electric Corp Res & Dev Ltd | Heat-treating method |
JPH05206053A (en) * | 1992-01-30 | 1993-08-13 | Matsushita Electric Ind Co Ltd | Crystal damage remover |
JPH0541359A (en) * | 1991-08-05 | 1993-02-19 | Nippon Telegr & Teleph Corp <Ntt> | Removal method of ion shock damage |
US5581346A (en) * | 1993-05-10 | 1996-12-03 | Midwest Research Institute | System for characterizing semiconductor materials and photovoltaic device |
JPH11101624A (en) * | 1997-09-29 | 1999-04-13 | Hitachi Ltd | Flaw evaluating device, its method, and manufacture of semiconductor |
US6177984B1 (en) * | 1998-01-23 | 2001-01-23 | Providence Health System | Video imaging of superficial biological tissue layers using polarized light |
JP4250822B2 (en) * | 1999-09-14 | 2009-04-08 | 株式会社デンソー | Method for manufacturing silicon carbide semiconductor device |
TWI520269B (en) * | 2002-12-03 | 2016-02-01 | Hamamatsu Photonics Kk | Cutting method of semiconductor substrate |
JP4408361B2 (en) * | 2003-09-26 | 2010-02-03 | 株式会社ディスコ | Wafer division method |
US7098155B2 (en) * | 2003-09-29 | 2006-08-29 | Ultratech, Inc. | Laser thermal annealing of lightly doped silicon substrates |
JP4251054B2 (en) * | 2003-10-01 | 2009-04-08 | 株式会社デンソー | Manufacturing method of semiconductor device |
TWI297521B (en) * | 2004-01-22 | 2008-06-01 | Ultratech Inc | Laser thermal annealing of lightly doped silicon substrates |
JP5078239B2 (en) * | 2004-06-18 | 2012-11-21 | 株式会社半導体エネルギー研究所 | Laser irradiation method, laser irradiation apparatus, method for crystallizing non-single crystal, and method for manufacturing semiconductor device |
US8148211B2 (en) * | 2004-06-18 | 2012-04-03 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously |
JP2006295068A (en) * | 2005-04-14 | 2006-10-26 | Sony Corp | Irradiator |
US7599048B2 (en) * | 2007-02-09 | 2009-10-06 | Wafermasters, Inc. | Optical emission spectroscopy process monitoring and material characterization |
-
2007
- 2007-02-27 US US11/679,633 patent/US20080206897A1/en not_active Abandoned
- 2007-09-11 KR KR1020070092110A patent/KR20080079573A/en not_active Application Discontinuation
- 2007-09-22 DE DE102007045377A patent/DE102007045377A1/en not_active Ceased
- 2007-12-26 JP JP2007333726A patent/JP2008211177A/en active Pending
-
2008
- 2008-02-15 NL NL1035031A patent/NL1035031C2/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE102007045377A1 (en) | 2008-08-28 |
NL1035031A1 (en) | 2008-08-28 |
US20080206897A1 (en) | 2008-08-28 |
KR20080079573A (en) | 2008-09-01 |
NL1035031C2 (en) | 2011-03-28 |
JP2008211177A (en) | 2008-09-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8196 | Reprint of faulty title page (publication) german patentblatt: part 1a6 | ||
OP8 | Request for examination as to paragraph 44 patent law | ||
8131 | Rejection |