DE102006049625A1 - Ultraschallbonder - Google Patents

Ultraschallbonder Download PDF

Info

Publication number
DE102006049625A1
DE102006049625A1 DE102006049625A DE102006049625A DE102006049625A1 DE 102006049625 A1 DE102006049625 A1 DE 102006049625A1 DE 102006049625 A DE102006049625 A DE 102006049625A DE 102006049625 A DE102006049625 A DE 102006049625A DE 102006049625 A1 DE102006049625 A1 DE 102006049625A1
Authority
DE
Germany
Prior art keywords
cutting device
ultrasonic bonder
wire
bonder according
separate drive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102006049625A
Other languages
German (de)
English (en)
Inventor
Hans-Jürgen Dr. Hesse
Frank Dipl.-Ing. Walther
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hesse GmbH
Original Assignee
Hesse and Knipps GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hesse and Knipps GmbH filed Critical Hesse and Knipps GmbH
Priority to DE102006049625A priority Critical patent/DE102006049625A1/de
Priority to TW096138093A priority patent/TWI376073B/zh
Priority to PCT/DE2007/001832 priority patent/WO2008046397A1/de
Publication of DE102006049625A1 publication Critical patent/DE102006049625A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/26—Auxiliary equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
DE102006049625A 2006-10-20 2006-10-20 Ultraschallbonder Withdrawn DE102006049625A1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE102006049625A DE102006049625A1 (de) 2006-10-20 2006-10-20 Ultraschallbonder
TW096138093A TWI376073B (en) 2006-10-20 2007-10-12 Ultraschallbonder
PCT/DE2007/001832 WO2008046397A1 (de) 2006-10-20 2007-10-16 Ultraschallbonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102006049625A DE102006049625A1 (de) 2006-10-20 2006-10-20 Ultraschallbonder

Publications (1)

Publication Number Publication Date
DE102006049625A1 true DE102006049625A1 (de) 2008-04-24

Family

ID=39015725

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102006049625A Withdrawn DE102006049625A1 (de) 2006-10-20 2006-10-20 Ultraschallbonder

Country Status (3)

Country Link
DE (1) DE102006049625A1 (zh)
TW (1) TWI376073B (zh)
WO (1) WO2008046397A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2189235A1 (en) * 2008-11-21 2010-05-26 ASM Assembly Automation Ltd. Bond head for heavy wire bonder with first module and second lockable/unlockabe module

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007063588A1 (de) * 2007-12-21 2009-06-25 Hesse & Knipps Gmbh Bondvorrichtung und Verfahren zur Herstellung elektrisch leitfähiger Verbindungen
US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
TWI803877B (zh) * 2021-05-31 2023-06-01 漢鼎智慧科技股份有限公司 超音波加工裝置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4976392A (en) * 1989-08-11 1990-12-11 Orthodyne Electronics Corporation Ultrasonic wire bonder wire formation and cutter system
US6439448B1 (en) * 1999-11-05 2002-08-27 Orthodyne Electronics Corporation Large wire bonder head
DE50211351D1 (de) * 2002-04-12 2008-01-24 F & K Delvotek Bondtechnik Bonddraht-Schneidvorrichtung
DE10357822A1 (de) * 2003-12-09 2005-07-07 Hesse & Knipps Gmbh Schneidvorrichtung
DE502004005212D1 (de) * 2004-08-11 2007-11-22 F & K Delvotec Bondtech Gmbh Drahtbonder mit einer Kamera, einer Bildverarbeitungseinrichtung, Speichermittel und Vergleichermittel und Verfahren zum Betrieb eines solchen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2189235A1 (en) * 2008-11-21 2010-05-26 ASM Assembly Automation Ltd. Bond head for heavy wire bonder with first module and second lockable/unlockabe module

Also Published As

Publication number Publication date
WO2008046397A1 (de) 2008-04-24
TW200838063A (en) 2008-09-16
TWI376073B (en) 2012-11-01

Similar Documents

Publication Publication Date Title
DE10207498B4 (de) Bondkopf für dicken Draht
EP0144915B1 (de) Verfahren zum Anheften eines dünnen elektrisch leitenden Drahtes an elektronischen Bauteilen, insbesondere Halbleiterbauelementen
DE102012102463A1 (de) Punktschweißvorrichtung und Punktschweißverfahren
DE102005003370A1 (de) Verfahren zur durchgehenden Verlegung eines Leitungsdrahtes auf einer Leiterplatte und Vorrichtung zur Durchführung des Verfahrens
EP1352701B1 (de) Bonddraht-Schneidvorrichtung
DE102007023017A1 (de) Vorrichtung zum Herstellen von Tailored Blanks
DE102006049625A1 (de) Ultraschallbonder
EP4117837B1 (de) Biegemaschine
DE2108064B2 (de) Blechschere
DE102012112667A1 (de) Verfahren und Vorrichtung zum Ausbilden eines Nagelbondhügels
EP0649701B1 (de) Vorrichtung und Verfahren zum Drahtbonden
DE102010053199A1 (de) Vorrichtung und Verfahren zur Bearbeitung einer fortlaufenden Materialbahn
DE19625638A1 (de) Drahtbondingverfahren und -kopf
DE3920825A1 (de) Vorrichtung zum beschneiden und stumpfschweissen von baendern oder in ihren abmessungen begrenzten blechen
DE3644756C2 (zh)
DE4326478C2 (de) Bondkopf für Ultraschall-Bonden
WO2007131573A2 (de) Vorrichtung zum verschweissen einer folienbahn
AT396210B (de) Gitterschweissmaschine
DE19981030B4 (de) Vorschubeinheit zum Bewegen von Bauteilen
EP2173513B1 (de) Schweissvorrichtung mit mechanischem nahtverfolgungssystem
DE102007006115A1 (de) Vorrichtung zum Fügen von Werkstückteilen mittels Lichtbogen mit einer Nahtführungseinrichtung
DE102007063588A1 (de) Bondvorrichtung und Verfahren zur Herstellung elektrisch leitfähiger Verbindungen
DE3608194C2 (zh)
DE3519594A1 (de) Bondkopf
DE102019102404A1 (de) Vorrichtung und Verfahren zum Schneiden eines mit einem Verstärkungselement versehenen Schlauchs

Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
R016 Response to examination communication
R016 Response to examination communication
R082 Change of representative

Representative=s name: WICKORD, WIRO, M.SC. (USA) DIPL.-ING. DR.-ING., DE

R082 Change of representative

Representative=s name: WICKORD, WIRO, M.SC. (USA) DIPL.-ING. DR.-ING., DE

R081 Change of applicant/patentee

Owner name: HESSE GMBH, DE

Free format text: FORMER OWNER: HESSE & KNIPPS GMBH, 33100 PADERBORN, DE

Effective date: 20130213

R082 Change of representative

Representative=s name: WICKORD, WIRO, M.SC. (USA) DIPL.-ING. DR.-ING., DE

Effective date: 20130213

Representative=s name: WICKORD, WIRO, M.SC. (USA) DIPL.-ING. DR.-ING., DE

Effective date: 20111208

Representative=s name: TARVENKORN & WICKORD PATENTANWAELTE PARTNERSCH, DE

Effective date: 20130213

Representative=s name: TARVENKORN & WICKORD PATENTANWAELTE PARTNERSCH, DE

Effective date: 20111208

R082 Change of representative

Representative=s name: TARVENKORN & WICKORD PATENTANWAELTE PARTNERSCH, DE

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee