DE102004063135A1 - Printed circuit board for equipping with electrical and / or electronic components - Google Patents

Abstract

The invention relates to printed circuit boards, which are interconnected by flexible tracks or jumpers. It is desirable to solder the jumpers in a soldering process and in one step along with other SMD and other components on the circuit boards in a reflow soldering oven. DOLLAR A For this purpose, in the circuit board according to the invention (10), which usually has a plurality of inner layers (11) and inner conductor tracks (12) and outer conductor tracks (13), in the end face (18) side openings (17) are mounted, which are preferably metallized , After application or application of solder paste there inserted solder pins or connecting wires (16) of a jumper (15) can be soldered together with other components on the circuit board (10) in a reflow soldering oven.

Description

The The invention relates to a printed circuit board for equipping with electrical and / or electronic components. The invention particularly relates to such printed circuit boards, equipped with SMD components and in a reflow soldering oven soldered become.

Under the term "printed circuit board" is hereafter a carrier plate understood with tracks made of a relatively rigid material consists.

It are various applications with such conventional printed circuit boards known where two circuit boards over a relatively flexible connection electrically connected together be because the circuit boards, for example, in different Positions should be arranged to each other. Such a connection is easiest by a cable with a connector as releasable To realize connection of the printed circuit boards; however, it requires on at least one circuit board and / or the cable an additional Component. In other cases, where a non-releasable Connection of printed circuit boards desired becomes, become frequent flexible strip conductors or short ribbon cables, so-called jumpers, used.

Under the term "flexible Ladder "is usually an arrangement of several metal tracks on a flexible support material Under the term "jumpers" are commonly used thin strands, which are enclosed by an insulation made of paper or plastic, Understood. Jumpers are usually placed directly on or one of the component sides soldered the circuit boards. Combinations are also conceivable for the flexible strip conductors. wherein the flexible conductor tracks soldered to a circuit board and at its other end are provided with a plug in a corresponding Plug socket is inserted on the other circuit board.

at PCB manufacturers today are also printed circuit boards through flexible interconnects are interconnected, as finished products available. at For example, all such products are initially connected to each other Printed circuit boards constructed into a single multilayer plate, wherein the flexible strip conductors integrated as an inner layer for the entire plate become. After that, in the places where only the flexible traces stand still, the rigid substrate of the circuit boards removed down to the flexible tracks. What is left are individual ones Printed circuit boards connected to each other by flexible interconnects are. Such printed circuit board assemblies are also known by the term "rigid-flex circuit boards". You can with SMD components fitted and in a soldering machine, for example, a reflow soldering oven, brazed become. The disadvantage, however, is that when bending the flexible Tracks, because the circuit boards in a certain way to each other be aligned, certain minimum bending radii of the flexible Conductor tracks must not be fallen below. Otherwise you can become the actual metallic interconnects of the flexible carrier material replace and / or break.

Should in the mentioned connection of printed circuit boards, the flexible Conductors but also survive very small bending radii can, this leaves only connections with jumpers, whereby, as usual, their Soldered strands on both circuit boards or glued with conductive adhesive become. Here, however, soldering or gluing of jumpers additionally to the other equipment and soldering process of the printed circuit boards executed in a separate step. This is not only time consuming but also expensive.

Advantageous would it be however, if the described connections of the circuit boards with each other through flexible interconnects or jumpers in one step with the soldering process for the SMD and other components on the circuit boards in a reflow soldering oven could be produced at acceptable prices. Inexpensive jumpers, in particular however, those with paper isolations hold the high, for one soldering in the reflow soldering oven required temperatures not stand. Jumper with high temperature resistant sheathing, which also resists the high temperature peaks in the reflow soldering oven, on the other hand very expensive.

Of the Invention is therefore based on the object, while avoiding the above-mentioned disadvantages to provide a printed circuit board, with the or in a simple and cost-effective way, a connection between this and another PCB too create.

These Task is solved by a circuit board according to the invention for equipping with electrical and / or electronic components, wherein the circuit board in a front side at least one lateral opening for receiving a wire, terminal pins or a stranded wire and this opening is metallized.

A particularly preferred embodiment the circuit board according to the invention provides that the opening through Drilling or milling will be produced.

Again, another embodiment the circuit board according to the invention, the opening is made by a laser process.

A another embodiment the circuit board according to the invention provides that the opening through a plasma etching process will be produced.

Yet another embodiment the circuit board according to the invention is composed of several layers.

at another embodiment the printed circuit board according to the invention, the opening of a recess formed at least one inner layer of the circuit board.

at yet another embodiment the circuit board according to the invention is the recess of the inner layer during assembly of the Layers filled to the circuit board by a later removable material.

Further embodiments the circuit board according to the invention relate to different forms of the opening as a socket or out at least one slot.

at yet another embodiment the printed circuit board according to the invention, the opening has a Lotzuführung, which can also be metallized in a special embodiment.

Yet another preferred embodiment The invention relates to a benefit of a plurality of printed circuit boards according to the invention.

The The above object is also achieved by the invention a first variant of an arrangement of at least two of the above printed circuit boards described by jumpers or flexible interconnects are connected, the connection pins or Strands in the side openings the printed circuit boards are used and soldered there.

The This task is also called solved by another variant of an arrangement of at least two of the above described printed circuit boards according to the invention also solved with in the side openings soldered terminal pins or connecting wires of a Jumpers for connecting the circuit boards.

at other, special embodiments a circuit board according to the invention is in the lateral opening a connection pin or connecting wire a light-emitting diode (LED) or, in the case of several lateral openings, terminal pins soldered to a power strip or socket strip.

at again another embodiment of a Printed circuit board according to the invention is in the lateral opening of the PCB soldered to a metallic sleeve.

at still further embodiments a printed circuit board according to the invention are a plurality of lateral openings with different size or diameter or provided at different distances from each other, whereby a coding is effected, which is a positionally correct placement of Plugs in the sleeves allows.

Of the Invention is based essentially on the idea of conventional Printed circuit boards by a lateral arrangement of connection openings for connection pins or Improve connection wires. By making these connection openings from the actual component pages the printed circuit board on the lateral edges or in the faces displaced become space on the component pages the board won or saved. In a particular embodiment the method according to the invention This gives the possibility To connect multiple boards of a utility with jumpers, the not in a separate soldering process but soldered together with SMD components during the soldering process in the reflow soldering oven, which saves considerable costs.

The Invention points above There is another big one Advantage on: The side openings in the face of a circuit board according to the invention can not only strands or connecting wires of Can record jumpers, but also can for the lateral connection of serve other wired components to the circuit board. So can in the lateral openings the circuit board, for example, connecting wires or connection pins of Soldered LEDs or power strips become. It is also possible, the side openings in the frontal area a PCB by soldered Metal sleeves too stabilize and use as jacks. Are these jacks with usually test points provided on printed circuit boards for testing the ready assembled and soldered PCB connected, so can Test pens or for testing pin plug used directly into the side sockets. In principle, you can with it test pads and checkpoints on the component pages the circuit board can be saved.

One Another particular advantage of the invention has already been made above described. The side openings in the frontal area the circuit board allow by a variation of diameters and distance to each other a simple coding and simplify a correct position placement of jumpers or plugs in the openings.

The Invention will be explained and described in more detail below, wherein on various and shown in the accompanying drawings embodiments is referenced. Showing:

1 a schematic representation of a conventional circuit board with conventional jumper connections;

2 a schematic representation of a first embodiment of a circuit board according to the invention;

3 a schematic representation of a second embodiment of a printed circuit board according to the invention;

4 a sectional view of the circuit board after 3 along an in 3 by "IV-IV" marked cutting line;

5 a schematic representation of two inner layers for a third embodiment of a printed circuit board according to the invention;

6 a schematic sectional view of the third embodiment of a circuit board according to the invention;

7 a schematic sectional view of a fourth embodiment of a printed circuit board according to the invention;

8th a schematic sectional view of a fifth embodiment of a circuit board according to the invention;

9a a schematic sectional view of the circuit board after 8th with applied solder paste;

9b a schematic sectional view of the circuit board after 9 after a soldering process in a reflow soldering oven;

10a a schematic representation of two interconnected by a thermally uncritical jumper printed circuit boards after 8th after a soldering process in a reflow soldering oven;

10b a schematic representation of two interconnected by a thermally critical jumper PCB after 8th after a soldering process in a reflow soldering oven;

11 a schematic representation of the circuit board after 6 with a side connector strip;

12 a schematic representation of the circuit board after 7 with a side LED;

13 a schematic representation of the circuit board after 6 with a metal sleeve to be inserted in the side opening;

Where it seems appropriate are for simplicity in the drawing and in the accompanying description same reference numerals for the same Elements or modules of the printed circuit board according to the invention and of the method according to the invention used.

The hereinafter described printed circuit boards or arrangements of such Printed circuit boards according to the invention are like conventional printed circuit boards as well usually with a variety of electrical or electronic components and components populated. For reasons the clarity and to simplify the drawing was based on a representation of various SMD or leaded components on the assembly or soldering sides or areas the PCB omitted. Since these other electrical or electronic components and components on the printed circuit boards according to the invention in the same way as on the conventional circuit boards equipped and soldered The use of such components and components is on the circuit boards according to the invention for the expert without problems clear and easy to realize.

By way of illustration is in 1 a conventional circuit board 1 shown, which consists of several inner layers 2 is composed. As usual, between or on the individual inner layers of insulating material conductive layers, such as copper laminations, brought, from which strip conductors 3 are worked out in different levels. For connecting two such circuit boards 1 become jumpers today 4a and 4b used, which are usually nothing more than thin and flexible ribbon cables, so usually strands, which are surrounded by insulation and summarized. Nowadays jumper depending on their attachment and contact with the circuit board 1 in so-called THT jumpers 4a and so-called SMD jumpers distinguished. With the THT jumpers 4a (Through Hole Technique), the connection pins or connecting wires in connection holes 5a soldered, the cross-cutting the PCB. With the THT jumpers 4a (Surface-mounted device) are the connection pins or connecting wires on specially provided pads 5b on the circuit board 1 usually glued with conductive adhesive. Soldering the THT jumper 4a Nowadays it is not done in a reflow soldering furnace but in a wave soldering bath or they are soldered by hand. SMD jumper 4b Usually after all other solderable components have been soldered to the circuit board are, in an additional step on the circuit board 1 glued.

In 2 In contrast, a first embodiment of a printed circuit board 10 illustrated according to the invention, which is similar to the circuit board 1 to 1 several inner layers 11 , inner tracks 12 and outer tracks 13 having. Compared to the conventional circuit board 1 to 1 has the circuit board according to the invention 10 on her in 2 shown component side 14 neither connection holes 5a for the connection pins or connecting wires 16 a jumper 15 on specially designed pads 5b (see 1 ). In the circuit board according to the invention 10 to 2 become the connection pins or connecting wires 16 the jumper 15 in lateral openings 17 soldered in a face 18 the circuit board 10 are provided. The production of a printed circuit board according to the invention, their assembly and soldering will be described in more detail below.

In the 3 and 4 is a second embodiment of a printed circuit board 20 shown schematically according to the invention. In this circuit board 20 , of which only a small part is shown here for the sake of simplicity, the lateral opening (see FIG 2 ) from a first slot 22 in their component side 21 and a second slot 23 in one of the component side 21 opposite side of the circuit board 20 educated. As 4 illustrates, penetrates neither of the two slots 22 . 23 for itself the circuit board 20 , Both slots 22 . 23 only about half of the board thickness is enough. They cover each other so that they are in a connection area 24 a passage is formed between the two, which is in 4 is shown in section. This is also in 4 shown. To the first slot 22 around is a pad 26 provided, with other, here only indicated illustrated, inner and outer conductor tracks 25 the circuit board 20 electrically connected.

The lateral opening (see also 2 ) forming slots 22 . 23 are preferably metallized, which is in 4 through a metallization sleeve 27 is illustrated. For the 4 was chosen a representation that a circuit board according to the invention 20 shows, which was prepared for soldering. In the second slot 23 became a connection pin 28 a THT component, not shown here, for example, a jumper inserted, because of the connection area 24 in which are the slots 22 . 23 cover, also protruding into the first slot. About the first slot 22 that is to the component side 21 the circuit board 10 opens, is already solder in the form of solder paste 29 been applied. The solder paste 29 gets on the pad 26 preferably applied by a printing process, in one operation together with the solder paste for not shown here SMD components of this component side 21 , In a subsequent soldering process, the terminal pin 28 soldered together with the SMD components in a reflow soldering oven.

In the 5 and 6 is a third embodiment of a printed circuit board 30 shown schematically according to the invention. A first inner layer 31 and a second inner layer 32 are for this embodiment to a circuit board 30 together. Preferably, in each of the inner layers 31 and 32 a groove-like recess 34 introduced, wherein the recesses 34 in each case in the respective inner layer 31 . 32 are arranged that they when assembling the inner layers 31 . 32 come to cover and form a kind of blind hole.

6 is a schematic sectional view of the in 5 illustrated third embodiment of the circuit board 30 according to the invention and illustrates in particular, in which form two recesses 34 in the inner layers 31 . 32 (see also 5 ) a side opening and a connecting hole 35 form for a lead pin or lead wire of a leaded component. It is clear to the person skilled in the art how he, with the aid of conventional techniques, the inner layers 31 . 32 must fit together and as he between the inner layers 31 . 32 arranged conductor track structures and those outside on the inner layers 31 . 32 realized. If several such connection holes 35 needed is twice the number of recesses 34 in the inner layers 31 . 32 provided.

As the 5 and 6 will show for each connection hole 35 from one of the component sides of the printed circuit board 30 Her also drilled a blind hole in the connection hole 35 leads and the as Lotzuführung 36 acts. Preferably, after a loading of the connection holes 35 the circuit board 30 with the appropriate connection pins or connecting wires of the desired wired components or jumpers 15 (see also 2 ) Solder paste on the solder leads 35 Applied, as for example 9a illustrated for another variant of the circuit board according to the invention. The application of the solder paste can be carried out in the same step, with which the solder paste for the usually also present on the circuit board SMD components is applied. This is preferably done by printing the solder paste. The solder paste can also be applied in individual cases with a so-called dispenser.

The connection holes 35 as well as the Lotzuführungen 35 are preferably metallized, which is in 6 through a metallization sleeve 37 veran The light is shining with a pad 38 around the Lotzuführungen 35 connected around. The pad is in communication with inner and outer traces which, together with further metallized holes in the printed circuit board 30 to complete in 6 to shown but not specified.

In 7 is a fourth embodiment of a printed circuit board 40 shown schematically according to the invention. This circuit board 40 includes three inner layers 41 . 42 and 43 usually arranged in between, here unspecified conductive layers. On a surface of the first inner layer 41 is for clarity a conductor track 41a shown. In the second inner layer 42 is before joining the inner layers 41 . 42 . 43 a recess 44 , for example, through the inner layer 42 passing slot or a corresponding cutout, has been attached. After joining the inner layers 41 . 42 . 43 forms the recess 44 a side opening for a connection pin or connecting wire of a wired component similar to the connection bore 17 the circuit board 14 to 2 , The expert is familiar, as he the inner layers 41 - 43 must fit together and as he between the inner layers 41 - 43 arranged conductor track structures and those outside on the inner layers 41 - 43 realized. To prevent that when assembling the inner layers 41 - 43 the outer inner layers 41 and 43 into the recess 44 the inner layer 42 penetrate and close it, is the recess 44 with a filling 49 Mistake. Such a completion 49 preferably consists of a fusible material, which projects the joining of the inner layers, but then out of the recess 44 can be melted out. Examples of suitable substances are resins but also tin or a tin alloy.

After joining the inner layers 41 - 43 to the circuit board 40 will fill out the recess 44 brought out and then by one of the outer inner layers, in the example shown here, the inner layer 41 , a hole drilled in the recess 44 empties. The hole serves as solder supply 46 (see also " 55 " in 9a ). Both, both the recess 44 as well as the hole for the solder feed 46 are preferably metallized, resulting in 7 through a metallization sleeve 47 is illustrated. Such a metallization sleeve 47 is usefully again with a Lotzuführung 46 surrounding pad 48 connected.

The solder feeder 46 allows application of solder paste to the solder feed 46 with the same work step, with the solder paste for the SMD components on the assembly side of the circuit board 40 is applied, since the solder feeding 47 opens into this component side.

The 8th - 10 are schematic representations of a fifth embodiment of a printed circuit board 50 according to the invention. This circuit board 50 includes similar to the circuit board 40 to 7 three inner layers 51 . 52 and 53 with usually arranged therebetween, here unspecified conductive layers in which interconnect structures are realized.

In the embodiments of the printed circuit boards described above 30 after the 5 and 6 and the circuit board 40 to 7 become the recesses 34 respectively. 44 mounted in the inner layers of the circuit boards before the inner layers to the actual circuit board 30 respectively. 40 be joined together. After joining the inner layers, these recesses form the lateral openings for receiving connection pins or connecting wires of THT components. In contrast, the inner layers 51 . 52 and 53 first to the circuit board 50 to 8th joined together, and then a recess in the side of the circuit board 50 Drilled or milled together with another hole through the first inner layer 51 through into the recess. After the recess and the additional hole have been metallized, they form a lateral opening 54 the circuit board 50 for receiving a connection pin or connecting wire of a THT component, wherein the additional bore is a solder supply 55 forms, as already in the description text to 7 for the solder feeding 46 was described and how they are in the 9a and 9b is shown.

The metallization of the lateral opening 54 and the solder feeder 55 the circuit board 50 be in the 8th - 10 through a metallization sleeve 56 illustrates, which makes sense again with a soldering around the 55 around arranged Lötauge 57 connected is.

In particular, in the 9a the circuit board 50 to 8th shown on the solder supply 55 already solder paste 58 was applied. Again, the application of solder paste happens 58 preferably again with the same operation with which the solder paste was applied for those SMD components on the component side of the circuit board 50 are to be fitted, in which the Lotzuführung 55 empties. Applying the solder paste 58 is preferably carried out by a conventional method, such as printing, but can also be done with a dispenser. In the side connection opening 54 here is already a connection pin 16 a jumper 15 (see also 2 ), and can be soldered in the next operation. The jumper 15 is to be regarded as an example of any THT component. if it this is a thermal-uncritical jumper, the soldering process can be performed in a reflow soldering oven. If the jumper is a thermal critical device that can not withstand the soldering temperatures in a reflow soldering oven, the jumper should be as in 10b shown and explained in this context, be shielded from direct heat in the reflow soldering oven.

For completeness is in 9b the soldered connection pin 16 in the lateral connection opening 54 the circuit board 50 after the 8th and 9a shown. The solder of the solder paste 58 is from the top of the circuit board 50 in the reflow soldering oven through the solder feed 55 in the lateral connection opening 54 flowed and there has the connection pin 16 with the metallization sleeve 56 soldered.

The skilled person is quite clear that connecting pins or connecting wires of THT components not only in lateral connection openings 54 after the 8th . 9a and 9b let solder but also in the corresponding way in the lateral openings 22 . 23 the circuit board 20 after the 3 and 4 , in the side connection holes 35 the circuit board 30 to 6 and in the side connection holes 45 the circuit board 40 to 7 ,

10a is a schematic and exemplary illustration of two by a definitely thermally uncritical jumper 15 (see 2 and the associated description) interconnected circuit boards 50a . 50b to 8th after a soldering process in a reflow soldering oven. The solder of the solder paste 58 is from the tops of the circuit boards 50a . 50b in the reflow soldering oven through the solder feeders 55 in the side connection openings 54 flowed and there has the connection pins 16a . 16b the jumper 15 with the respective metallization sleeve 56a . 56b soldered. The jumper is 15 is shown only slightly bent to illustrate its position in the reflow soldering oven. Much of the jumper 15 can be exposed to the effect of soldering heat in the reflow soldering oven.

For a thermally critical jumper 15 ' as he is in 10b is shown, however, is to provide an arrangement in the reflow soldering oven, wherein the jumper 15 ' For the most part of the action of the soldering heat in the reflow soldering furnace is shielded. The circuit boards 50a . 50b must be brought closer together, as in the 10b is shown. The jumper 15 ' , at about the same length as the jumper 15 in 10a , then under the circuit boards 50a . 50b bent and shielded from them as far as possible against the soldering heat. It has been shown that so cheap, but thermally critical jumpers 15 ' solder with non-temperature resistant insulation material in the reflow soldering oven.

The 11 to 13 illustrate further advantageous applications of the circuit board according to the invention with the lateral connection openings on the example of the embodiment of the circuit board 30 to 6 (see also there).

As already described several times, the circuit board according to the invention is suitable 30 not just for connection of connection pins 82 and connecting wires of THT components or jumpers 15 (see the 2 . 10a . 10b ) in the lateral connection openings 35 but also offers the possibility of a suitable power strip 71 to use as in 11 is shown by way of example. A housing 72 such a connector strip 71 is as possible as possible, it is the front page 764 the circuit board 30 grabs and stabilizes, but then the solder feeder 36 leaves free. It makes sense to a power strip 71 with angled connector pins 73 used, the end to be soldered, ie the terminal pins, respectively in the lateral connection openings 35 plugged and soldered there.

Another application for the circuit board according to the invention 30 (see also 6 and the corresponding description) is in 12 illustrated. In this case, connection pins 82 an LED 81 in the side connection openings 35 the circuit board 30 plugged and soldered there. Due to the selected form of representation, only a single pin is used 82 in 12 shown.

A particular embodiment of the circuit board according to the invention, here the example of the circuit board 30 to 6 , is in 13 shown. In this case, the circuit board 30 from the inner layers 31 . 32 and the side opening as a connection bore 35 two in the inner layers 31 . 32 prior to joining attached two recesses 34 (see also 5 ). As 6 can be clarified in the connection hole 35 instead of a connection pin of a wired component and a prefabricated used and soldered. With appropriate dimensioning of the circuit board 30 and in particular the thickness of the inner layers 31 . 32 can also have several connection holes 35 with soldered metallic sleeves 91 be realized, without affecting the mechanical strength of the circuit board 30 is lowered excessively.

The metallic sleeve may serve, for example, as a socket for a pin, for example on a jumper, so that detachable connections of printed circuit boards can be made. The metallic sleeve can also ver with predetermined test points of the circuit on the circuit board ver and can pick up a plug pin of a test plug.

The invention enables many different and advantageous embodiments. In particular, in the embodiment with inserted into lateral openings and soldered there pods (see also 13 ) allows a simplified final test of the respective pre-assembled and soldered circuit boards. The lateral connections can be designed as plug sockets for test plugs and allow a simple and quick final inspection of the circuit board, which can be saved on the or the assembly sides of the circuit board corresponding and usually space-consuming test pads.

Yet another advantage is the printed circuit boards whose lateral connection openings with pods equipped and connected. In this Case can connect two circuit boards together jumpered with plug pins. Such a connector is solvable and thus facilitates service work on the individual plates the separability of the respective circuit boards from each other. The separate printed circuit boards can if necessary, repaired individually or simply exchanged, without complicated soldering become necessary. It is even conceivable, several circuit boards according to the invention with the described sleeves in the side connection openings directly connected by plug pins rigidly together.

a another particular advantage of the invention in printed circuit boards, the for various similar, but different applications have been designed. In such a case, the various applications can be through an appropriately coded wired passive or active Component that the respective desired application corresponds and is soldered into the lateral connection openings, to adjust.

The lateral openings or connecting bores 35 . 45 . 54 at the in the 6 - 12 illustrated embodiments of the circuit boards 30 . 40 . 50 according to the invention provide with their metallization formed by the metallization 37 . 47 . 56 itself already a kind of socket for the there to be soldered connecting wires or connection pins available. A metallic sleeve 91 as in the case of 13 illustrated embodiment of the circuit board 30 is required in cases where socket-like connection holes 35 . 45 . 54 not yet guarantee the required or desired stability.

Although hitherto in all embodiments of the invention described here according to the 3 to 13 Often only one side connection opening the speech was clear to the expert that he can also provide more than such a connection opening in one or both faces of the circuit boards according to the invention, precisely the number that he for the connection pins or connecting wires required THT components needed.

Claims (18)

Printed circuit board for equipping with electrical and / or electronic components, characterized in that it is in an end face ( 18 ; 764 ) of the printed circuit board ( 10 ; 20 ; 30 ; 40 ; 50 ) at least one lateral opening ( 17 ; 54 ) for receiving a wire, connecting pins ( 16 ; 73 ; 82 ) or a strand and that this opening ( 17 ; 54 ) is metallized. Printed circuit board according to claim 1, characterized in that the opening ( 17 ; 54 ) is produced by drilling or milling. Printed circuit board according to claim 1, characterized in that the opening ( 17 ; 54 ) is produced by a laser process. Printed circuit board according to claim 1, characterized in that the opening ( 17 ; 54 ) is produced by a plasma etching process. Printed circuit board according to one of Claims 1-4, characterized in that it consists of several layers ( 31 . 32 ; 41 . 42 . 43 ; 51 . 52 . 53 ) is composed. Printed circuit board according to Claim 5, characterized in that the opening consists of a recess ( 22 . 23 ; 34 ; 44 ; 54 ) at least one inner layer ( 31 . 32 ; 41 . 42 . 43 ; 51 . 52 . 53 ) of the printed circuit board ( 10 ; 20 ; 30 ; 40 ; 50 ) is formed. Printed circuit board according to claim 6, characterized in that the recess ( 44 ) of the inner layer during the assembly of the layers to the printed circuit board ( 40 ) by a later removable material ( 49 ) is completed. Printed circuit board according to one of Claims 1-7, characterized that the opening one Socket forms. Printed circuit board according to one of Claims 1-7, characterized in that the opening consists of at least one slot ( 22 . 23 ) is formed. Printed circuit board according to one of Claims 1 to 9, characterized in that the opening is a solder feed ( 36 ; 46 ; 55 ) having. Printed circuit board according to claim 10, characterized in that the solder feed ( 36 ; 46 ; 55 me is tallisiert. Use of several printed circuit boards according to one of the previous claims 1 to 11. Arrangement of at least two printed circuit boards according to one of Claims 1 to 11, characterized in that the printed circuit boards ( 50a . 50b ) by jumpers ( 15 ; 15 ' ) or flexible interconnects are connected, the connection pins (( 16a . 16b ) or strands in the lateral openings of the printed circuit boards ( 50a . 50b ) are used and soldered there. Printed circuit board according to one of Claims 1 to 11, having a connection pin soldered into the lateral opening ( 82 ) or connecting wire of a light-emitting diode ( 81 ). Printed circuit board according to one of Claims 1 to 11 with one in the side opening soldered metallic sleeve. Printed circuit board according to claim 15, having a plurality of lateral openings with different size or Diameter, wherein by means of the different size or Diameter of a coding is effected, which is a correct position placement of plugs in the sleeves allows. Printed circuit board according to one of claims 15 or 16 with several side openings with different distances from each other, wherein by means of different Distance a coding is effected, which is a positionally correct placement of plugs in the sleeves allows. Printed circuit board according to one of Claims 1 to 11, having a plurality of lateral openings and connecting pins soldered therein ( 73 ) a connector strip ( 71 ) or female connector.