DE102004033440A1 - Microstructured device and method for its production - Google Patents

Abstract

To produce a microstructured device, a microstructured first substrate (11) with at least one raised region (12) is provided. An adhesive is then applied to a support to create an adhesive layer there. The adhesive layer is then transferred on the carrier to the at least one raised region (12) of the microstructured substrate (11). Thereafter, a second, optionally microstructured substrate (15) is positioned on the first substrate (11), so that with its contact surface (16) with the at least one raised region (12) of the first substrate (14) provided with the adhesive layer (14). 11) comes into contact. Thereafter, the adhesive layer (14) is cured (Fig. 1).

Description

The The present invention relates to a microstructured device, with at least one cavity surrounded by walls on all sides or Microchannel, wherein at least one wall over its contact surface with glued to a raised area of the rest of the device, and methods of making a microstructured device and an adhesive tool for implementation of the procedure.

such Microstructured devices and process for their preparation are widely known from the prior art.

The known microstructured devices are used, for example, as microfluidic systems, where they are used for the manipulation of small volumes of liquid, as required, for example, in chemical or biochemical analysis. The known devices are used for example for the manipulation of and for the measurement of biological cells, as in the DE 197 12 309 is described.

Other application examples of such microstructured devices are printheads of inkjet printers, as shown for example in US Pat US 5,855,713 is described.

Also the DE 41 28 964 A1 describes microstructured microvoid devices used in the field of micromechanics and integrated sensor technology.

An example of fluidic microsystems made by patterning silicon or layers deposited on silicon is known from US Pat DE 197 39 717 A1 known.

Also WO 98/45693 describes microchannel structures for microfluidic Manipulations.

The known devices have dimensions of a few millimeters to a few centimeters, with the microstructuring itself in the Micrometer range is. The existing in the known ago devices microchannels For example, have thicknesses of 5 to 50 microns and widths of 50 to 2000 microns, wherein the length the microchannels can be in the millimeter range.

at the production of such microstructured devices so the production of channels, cavities etc. required, which is generally using planar technology methods he follows. There are two substrates by lithography and etching with trenches structured and subsequently interconnected, so that one closed cavity or channel structure is formed.

In dependence of the material of the substrates are the through the two substrates formed halves the device connected by various methods. A common one Process is the so-called anodic bonding, however is not applicable if the substrate is made of a polymer or a is provided with temperature-sensitive coating provided with glass or silicon. In addition, the achievable accuracy in anodic bonding by the associated thermal expansions is limited.

Therefore So-called Klebebondingverfahren have prevailed, as they For example, from the aforementioned WO 98/45693 are known. In the known method, an adhesive by stamping, rolling, spraying, Doctoring or similar steps applied flat on a substrate, whereupon this substrate is then positioned on the second substrate which is provided on the sublime areas through which then the cavities or microchannels be formed. The cavities or microchannels thus formed are of three walls surrounded by the substrate material and by a fourth wall, the is provided with the adhesive layer.

such However, devices have a number of disadvantages, the channel walls can, for example not completely chemically functionalized, ie with biomolecules or a protein-repellent coating, because the surface chemistry in the cavity or microchannel is seen over all four walls not homogeneous. About that can out the wetting properties of the adhesive layer differently the properties of the rest channel surface be, whereby the fluidic properties of the known device be negatively influenced.

Furthermore it is not excluded in the known method that excess adhesive in the cavities or microchannels gets into it, leaving more pages with an unwanted Coating are provided and possibly even the inside width of the cavities or Microchannels reduced being, being the most unfavorable Case the microchannels even clog. This is particularly a problem when devices with microstructures in the micrometer range to be produced.

From the DE 41 28 964 A1 a method is known in which initially a two-dimensional adhesive layer is applied, which is photo-patternable. After appropriate exposure and etching procedures are then only on the desired raised areas of the first substrate adhesive regions with which the contact surfaces of the second substrate are bonded. However, in the known method it is disadvantageous that it requires many method steps, wherein in particular the structuring of the adhesive layer requires a precise alignment between the shadow mask and the substrate having the raised areas.

In front In this background, the present invention has the object underlying the known methods in such a way that at faster and easier as well as reproducible performing microstructured Devices without the above mentioned Disadvantages can be produced.

• a) Bereitstellen eines mikrostrukturierten ersten Substrates mit zumindest einem erhabenen Bereich,
• b) Auftragen eines Klebstoffs auf einem Träger, um dort eine Klebstoffschicht zu erzeugen,
• c) Übertragen der Klebstoffschicht von dem Träger auf den zumindest einen erhabenen Bereich des mikrostrukturierten Substrates,
• d) Positionieren eines zweiten, ggf. mikrostrukturierten Substrates auf dem ersten Substrat, so dass es mit seiner Kontaktfläche mit dem zumindest einen mit der Klebstoffschicht versehenen erhabenen Bereich des ersten Substrates in Anlage gelangt, und
• e) Aushärten der Klebstoffschicht.

In the method mentioned in the introduction, this object is achieved according to the invention by the steps:

• a) providing a microstructured first substrate having at least one raised area,
• b) applying an adhesive to a carrier to produce an adhesive layer thereon,
• c) transferring the adhesive layer from the carrier to the at least one raised region of the microstructured substrate,
• d) positioning a second, optionally microstructured substrate on the first substrate, so that it comes into contact with its contact surface with the at least one provided with the adhesive layer raised portion of the first substrate, and
• e) curing the adhesive layer.

at The known microstructured device is this task solved by that the at least one raised area completely coated with adhesive is and the walls on their free surfaces are adhesive-free.

The The object underlying the invention is complete in this way solved.

The Namely, inventors of the present application have recognized that it is contrary the expectation of the professional world and deviating from all in the prior art described method possible is the raised areas of the microstructured first substrate Completely to cover with the adhesive layer, but these adhesive layers such that upon mating with the second substrate no glue in the microchannels or cavities flows, but still the contact surfaces the entire surface of the second substrate glued to the raised areas. This leads to, that the microchannels and cavities in the device produced by the new method on all sides of adhesive-free surfaces However, on the other hand, the two substrates are very strong connected to each other.

there it is preferred if in step b) an adhesive with a dynamic viscosity is applied, which is less than 1000 mPa s, preferably at 200 to 500 mPa s, more preferably about 300 mPa s.

The Inventors of the present application have recognized that an adhesive having such a dynamic viscosity on the carrier in one sufficiently thin Layer can be applied, wherein when transferring the adhesive layer from the carrier Ensuring that the adhesive is on the raised areas sticking only on the raised areas and neither during transfer the adhesive layer still during the subsequent pressing of the second substrate in the channels and cavities flows into it. With In other words, the adhesive either wets the raised areas or remains on the carrier, for example, be pressed directly onto the first substrate can, so only the raised areas by imprinting with an adhesive layer be provided.

there it is further preferred if in step b) an adhesive layer with a thickness of less than 10 μm, preferably less than 5 μm, more preferably less than 3 μm is produced.

The Inventors have further recognized that with such a thickness of the Adhesive layer prevents it from transferring the adhesive layer on the raised areas and / or during pressing form the second substrate adhesive beads, which in the cavities or microchannels get in and close this partially or completely.

In an embodiment For example, an adhesive with a viscosity of 300 mPa s and a thickness of the adhesive layer of 1 to 3 microns used. As an adhesive, for example, under the trade name "Vitralit 1558" sold adhesive the company Panacol-Elosol GmbH in 61440 Oberursel proven.

Further it is preferred if in step e) the curing of the adhesive by suitable Activities, preferably by pressure and / or temperature treatment and / or UV irradiation supported becomes.

at this measure It is advantageous that the adhesive is defined in a manner known per se hardened so that a secure and firm connection is created.

For example, when the above-mentioned adhesive Vitralit 1558 is used, it can be cured by irradiation with UV light in the spectral range 320-370 nm for 300 seconds with a radiation power of 10 mW / cm ² .

Generally it is preferred if in step b) the adhesive to a planar surface is applied.

Here It is an advantage that the new procedure is very quick and easy carried out can be. The thin one Adhesive layer must first on the planar surface of the carrier to be spun on, whereby they are then imprinted on the microstructured transferred first substrate becomes. Due to the properties of the adhesive and the thickness of the adhesive layer In this case, only the raised areas of the first substrate are wetted.

alternative can the adhesive layer with an intermediate punch of the carrier removed and transferred to the substrate become.

on the other hand it is preferred if in step b) the adhesive is applied to a curved surface becomes.

at this measure is an advantage that a large-scale contact with the surface to be wetted what is being avoided is what is being avoided the full-surface transmission with the intermediate punch or directly to the planar carrier one strong adhesion and too high forces when peeling off the adhesive layer avoids the microstructured substrate.

there For example, it is particularly preferred if the support is flexible so that it preferably bulged in step c) and on the raised portion of the first substrate rolled can be.

These measure combines the above mentioned Advantages, because the adhesive layer can first by known methods applied to the planar support whereupon the carrier then bulging and is rolled on the first substrate, so that a defined transmission the adhesive layer is ensured only on the raised areas is.

In another embodiment it is preferred if in step b) the adhesive is at least a roller is applied.

These Roller can be curved area in the sense of the above statements be regarded, so that the already mentioned advantage of the small contact surface between the adhesive layer and the microstructured device, when the roller on the at least one raised portion of the first Substrate is unrolled.

In In a further development, it is preferred if in step b) the adhesive applied to two adjoining rollers and in step c) the adhesive layer by turning the two rolls in opposite directions is generated, preferably in step c) a between the two rolls forming adhesive bead as an adhesive reservoir serves or alternatively can be removed, wherein the adhesive layer if necessary, homogenize by turning the two rolls again in opposite directions becomes. Preferably, the removal of adhesive bead and homogenization repeated by adhesive layer until no or none noticeable bead of adhesive forms more.

at this measure It is advantageous that a very defined adhesive layer is formed and further dosing the adhesive for reproducibility plays a decisive role in the new procedure. It must just make sure that at least that much glue on the rollers are applied, as for the formation of homogeneous adhesive layers sufficient thickness is required on both rollers. An overdose is harmless, because then forms between the oppositely rotating rolls one Adhesive bead, which either serves as an adhesive reservoir, ie serves to "fill in" the adhesive layer, transferred from the bottom of one of the two rollers on the substrate is, or removed, for example, can be stripped. The inventors of the present application have found that this way creates an adhesive layer that is so thin that also during the transfer no beading on the microstructured substrate and accordingly no contamination of the channels with Adhesive can occur.

there it is preferred if the at least one roller has microcavities on its surface, which serve as an adhesive reservoir.

Here it is advantageous that when applying the adhesive and forming the adhesive layer, adhesive is introduced into the microcavities, which can be arranged in a high lateral density. The microcavities then serve as a kind of adhesive reservoir, so that the amount of adhesive on the roller can be adjusted reproducibly and defined. The microstructuring has the further advantage that when rolling the roller on the raised areas of the substrate no bead of adhesive is produced in front of the roller, which could fill the microstructuring partially or completely. Instead, it is ensured that adhesive is transferred from the thus microstructured roll only to the raised portions of the substrate, which rolls with the rolling Contact roller and wetted by the adhesive.

Of course it is it is possible the method also perform with more than two rolls, wherein to transfer the adhesive layer on the first substrate one or more of used rollers can be used.

It is possible, too, merely to provide a roll with the microstructuring and the other roller or rollers for homogenized introduction to use the adhesive in the microstructuring.

In general, it is preferred if in step c) the adhesive layer is transferred under pressure to the at least one raised region, wherein the pressure is preferably greater than 1 × 10 ⁵ Pa, preferably greater than 3 × 10 ⁵ Pa.

tries The inventors have shown that in this pressure, in particular in Related to the above Adhesive Vitralit 1558 a very well reproducible, sufficient thin and the raised areas after the carryover completely covering Adhesive layer is produced when pressing the second substrate not in the cavities or microchannels penetrates.

Further, it is preferable that, in step d), the second substrate is positioned under pressure on the first substrate, which pressure is in the range of 0 to 20 × 10 ⁵ Pa.

Here is advantageous that at this pressure range on the one hand a very good bond between the two substrates produced on the other hand, it is prevented that adhesive in the cavities or microchannels gets into it.

It It is understood that the viscosity the adhesive, the thickness of the adhesive layer and the pressure, with which the adhesive layer transferred to the raised areas is, as well as the pressure with which the second substrate on the first Substrate is pressed on, set in dependence on each other Need to become. At lower viscosity For example, is a smaller thickness of the adhesive layer and a lower pressure during carryover and joining together required while at a slightly higher level viscosity the thickness and the pressure can respectively be greater. In any case, however, must be ensured that both the transfer of the adhesive layer as well as when joining together the two substrates does not form an adhesive bead, which as an impurity in the cavities or microchannels can get.

In front In this background, the present invention further relates to Adhesive tool for implementation of the new method, with a holder on which a holding area for microstructured Substrates is provided, with a first roller which is rotatable on the Holder is mounted, and with at least a second roller, the is rotatably mounted and adjustable on the holder, that they are arranged both with the first roller and with one in the holding area Substrate is brought into contact, wherein preferably at least one the rollers on their surface microcavities has, which serve as an adhesive reservoir.

Further Advantages will be apparent from the description and the accompanying drawings.

It it is understood that the above and the following yet to be explained features not only in the specified combinations, but also can be used in other combinations or in isolation, without departing from the scope of the present invention.

embodiments The invention are illustrated in the drawings and in the following description explained. Show it:

1 the production of a microstructured device in which the walls surrounding a cavity are free of adhesive at their free surfaces;

2 an intermediate punch for transferring an adhesive layer from a carrier to raised areas of the device 1 ;

3 a flexible carrier for transferring an adhesive layer to raised areas of the device according to 1 ;

4 two oppositely rotating rollers for producing an adhesive layer, which on the raised portions of the device according to 1 is transmitted; and

5 an adhesive tool for producing an adhesive layer and for applying the adhesive layer to the raised areas of the device 1 ,

In 1 is the production of a microstructured device 10 shown in three steps.

Top in 1 is a substrate 11 provided, which may for example consist of glass or silicon. On the substrate 11 are exemplary three raised areas 12 arranged by Ab Standhalter are formed from a suitable polymer.

On the sublime areas 12 is according to the middle picture in 1 one adhesive layer each 14 applied to the raised areas 12 almost completely cover.

On the first substrate 11 is down in 1 a second substrate 15 so applied to it with its contact surfaces 16 on the sublime areas 12 comes to rest, leaving the two substrates 11 and 15 through the adhesive layers 14 be firmly connected with each other.

On the first substrate 11 to be pointing are on the second substrate 15 two more 17 indicated microelectrodes arranged in the thus formed microchannels 18 protrude.

The microchannels 18 are surrounded by four walls, passing through the first and second substrate 11 . 15 as well as the raised areas 12 be formed. On the second substrate 15 , the first substrate 11 as well as the sublime areas 12 are free spaces 19 . 21 respectively. 22 provided due to the special application of the adhesive layer 14 are adhesive-free, so all four are the micro-channels 18 surrounding walls have the same wettability as well as surface chemistry.

It should be noted that the device 10 out 1 a microstructured device is the raised areas 12 have for example a height of 20 microns and a width of 50 microns, wherein they have a distance of 100 microns to each other. The microchannels 18 accordingly have a width of 100 microns and a height of 20 microns.

The figures are to be understood as exemplary only, wherein the representation of the 1 furthermore not to scale.

The adhesive layer 14 is formed by an adhesive having a viscosity of 300 mPa s, as for example in the case of the adhesive Vitralit 1558 of Panacol-Elosol GmbH, 61440 Oberursel.

The adhesive layer has a thickness of 1 to 3 microns, which thickness among other things by the quality of the planarity of the raised areas 12 as well as the contact surfaces 16 is determined.

After the two substrates 11 and 15 were put together like this in 1 is shown, the adhesive layer is cured by irradiating for 300 sec with UV light in the spectral range 320-370 nm, the irradiation power is about 10 mW / cm ² , wherein the substrates 11 and 15 be joined together with a pressure of less than 10 ⁵ Pa.

Like applying the adhesive layer 14 will now be explained with reference to the following figures.

In 2 is a carrier 24 shown having a planar surface on which an adhesive layer 25 Spun in a conventional manner. This adhesive layer 25 has, for example, a thickness of 3 μm.

With the help of a schematically indicated intermediate punch 26 becomes the adhesive layer 25 now from the carrier 24 removed and on the raised areas 12 of the substrate 11 out 1 stamped on top. Due to the viscosity of the adhesive in the adhesive layer 25 and the thickness of the adhesive layer 25 and the pressure with which the intermediate punch on the first substrate 11 is imprinted in this way only in the area of the raised areas 12 the adhesive layer 25 on the raised areas 12 transfer where they get the glue layer 14 form. The pressure used in this transfer is, for example, in the range of 0.1 to 5 × 10 ⁵ Pa.

In 3 is a flexible carrier 28 shown on which an adhesive layer 29 was applied in a conventional manner. Under the carrier 28 there is a holder 31 on which the first substrate 11 out 1 is arranged. Due to the size differences, the substrate is 11 merely exemplified, the 3 is as true to scale as the 1 and 2 ,

Because the substrate 28 Flexible, it can be in level condition with the adhesive layer 29 be provided, whereupon it is then bulged as in 3 you can see. The carrier 28 will then be on the substrate 11 passed, what an arrow 32 is hinted at. In this way, the contact area between the substrate 11 as well as the carrier 28 relatively low, resulting in the transfer of the adhesive layer 29 on the substrate 11 supports the desired effect, namely only in the area of the raised areas 12 out 1 an adhesive layer 14 is trained.

Instead of a flexible carrier 28 Also, a roller can be used as a carrier, as now based on the 4 and 5 is discussed.

In 4 are two counter-rotating rollers 34 . 35 of which at least one on its surface with a at 36 indicated microstructuring is provided by micro cavities. The microcavities serve to pick up adhesive on the rollers 34 . 35 is applied.

It is sufficient if one of the two rolls 34 . 35 the microstructuring 36 For example, the other roller may have a smooth surface. The adhesive layer is then formed on the microstructured roll and, as will be described, on the raised areas 12 of the first substrate 11 transfer.

The microcavities have transverse dimensions which range from 0.1 μm × 0.1 μm to 50 μm × 50 μm, wherein the microcavities do not necessarily have to be square. In the embodiment shown, the microcavities have dimensions of 5 μm × 5 μm. The number of microcavities per mm ² is in the range of 10 ¹⁰ to 400, with a number density of 40,000 / mm ^{2 being} preferred. The volume of the individual microcavities is then in the range of 1 nl (in the case of dimensions of 50 μm × 50 μm) to 1 attoliter (in the case of dimensions of 0.1 μm × 0.1 μm).

The microcavities can even or statistical be distributed, you can also be designed as porosity.

After applying the glue, the rollers become 34 . 35 rotated in opposite directions so that the adhesive forms a homogeneous layer on at least one of the two rollers 34 . 35 forms and in the microstructuring 36 is pressed into it.

At the beginning, glue is applied in excess to the rollers 34 . 35 applied so that between them one at 37 indicated adhesive bead which serves as an adhesive reservoir. For example, on the roller 34 formed adhesive layer 38 gets from the bottom to the raised areas 12 of the substrate 11 transferred, with the further opposite rotation of the two rollers 34 . 35 from the glue bead 37 the adhesive layer 38 replenished, so to speak.

On the other hand, it is also possible, the bead of glue 37 remove and the rollers 34 . 35 to turn again in opposite directions, so that the adhesive layer 38 distributed homogeneously. Should it again an adhesive bead 37 form, it is stripped off again. This process is repeated until turning the rollers in opposite directions 34 . 35 no new glue bead 37 forms, so on the rollers 34 . 35 a thin, homogeneous layer of adhesive 38 is formed on the surface of the rollers 34 . 35 and / or in the serving as an adhesive reservoir microcavities 36 is trained.

When unrolling, for example, the roller 34 on the substrate 11 becomes the adhesive layer 38 then in the area of the raised areas 12 transferred and forms there the adhesive layer 14 ,

For this purpose, an in 5 at 41 schematically illustrated adhesive tool provided with a holder 42 includes, at the 43 a holding area for the substrate 11 is provided.

On the holder 42 is a longitudinally movable block 44 Arranged in the direction of an arrow 45 to the substrate 11 back and can be moved away from this again. Swiveling on the buck 44 is an arm 46 mounted, the rotatable at its outer end of the roller 34 stores and in the direction of an arrow 47 can be pivoted so that the roller 34 in 5 either left or right of the buck 44 on the holder 42 rests.

On the holder 42 is still a buck 48 arranged, on which rotatably the roller 35 is stored.

This glue tool 41 will now be as follows for applying the adhesive layer 14 on the raised areas 12 of the substrate 11 out 1 used.

First, the arm 46 in the direction of the arrow 47 swung to the right, leaving the rollers 34 and 35 to lie side by side like this 4 is shown. Then glue is applied to the rollers 34 . 35 applied and the adhesive layer according to the method described above 38 on the rollers 34 . 35 educated.

After that, the arm becomes 46 in the in 5 swung position shown and at the same time the buck 44 in 5 move to the left, leaving the roller 35 on the substrate 11 to come to rest. When moving the buck further 44 in 5 to the left rolls the roller 34 then on the substrate 11 from, with the adhesive layer 38 on the raised areas 12 of the substrate 11 out 1 is transferred and there the adhesive layer 14 forms.

For a sufficient transfer of the adhesive layer 38 on the raised areas 12 to cause the roller 34 with a pressure of 5 × 10 ⁵ Pa on the substrate 11 pressed.

Claims (22)

Method for producing a microstructured device ( 10 ), comprising the steps of: a) providing a microstructured first substrate ( 11 ) with at least one raised area ( 12 b) applying an adhesive to a carrier ( 24 . 28 . 34 ), to there an adhesive layer ( 25 . 29 . 38 ), c) transfer of the adhesive layer ( 25 . 29 . 38 ) of the carrier ( 24 . 28 . 34 ) on the at least one raised area ( 12 ) of the microstructured Subst rates ( 11 ), d) positioning a second, possibly microstructured substrate ( 15 ) on the first substrate ( 11 ), so that it with its contact surface ( 16 ) with the at least one with the adhesive layer ( 14 ) provided with a raised area ( 12 ) of the first substrate ( 11 ) and e) curing the adhesive layer ( 14 ). Method according to claim 1, characterized in that that in step b) applied an adhesive with a dynamic viscosity is less than 1000 mPa s, preferably 200 to 500 mPa s, more preferably about 300 mPa s. Method according to claim 1 or 2, characterized in step b), an adhesive layer having a thickness of less than 10 μm, preferably less than 5 μm, more preferably less than about 3 microns is generated. Method according to one of claims 1 to 3, characterized in step e) curing the adhesive by suitable measures, preferably by Pressure and / or temperature treatment and / or UV irradiation is supported. Method according to one of claims 1 to 4, characterized in that in step b) the adhesive on a planar surface ( 23 ) is applied. Method according to one of claims 1 to 4, characterized in that in step b) the adhesive on a curved surface ( 27 ) is applied. Method according to claim 5 or 6, characterized in that the carrier ( 28 ) is flexible. A method according to claim 7, characterized in that in step c) the carrier ( 28 ) and on the raised area ( 12 ) of the first substrate ( 11 ) is passed. A method according to claim 5, characterized in that in step c) the adhesive layer ( 25 ) with an intermediate stamp ( 26 ) of the carrier ( 24 ) and applied to the substrate ( 11 ) is transmitted. Method according to claim 6, characterized in that in step b) the adhesive is applied to at least one roller ( 34 . 35 ) is applied. A method according to claim 10, characterized in that in step c) the roller ( 34 ) on the at least one raised area ( 12 ) of the first substrate ( 11 ) is unrolled. A method according to claim 10 or 11, characterized in that in step b) the adhesive is applied to two adjoining rollers ( 34 . 35 ) and in step c) the adhesive layer ( 38 ) by oppositely rotating the two rollers ( 34 . 35 ) is produced. A method according to claim 12, characterized in that in step c) a between the two rollers ( 34 . 35 ) forming adhesive bead ( 37 ) is used or removed as an adhesive reservoir, the adhesive layer ( 38 ) if necessary by renewed rotation of the two rolls ( 34 . 35 ) is homogenized. A method according to claim 13, characterized in that the removal of adhesive bead ( 37 ) and homogenizing of adhesive layer ( 38 ) is repeated several times until no or no noticeable bead of adhesive ( 37 ) trains more. Method according to one of claims 10 to 14, characterized in that the at least one roller ( 34 . 35 ) on their surface microcavities ( 36 ), which serve as an adhesive reservoir. Method according to one of claims 1 to 15, characterized in that in step c) the adhesive layer ( 25 . 29 . 38 ) under pressure on the at least one raised area ( 12 ) is transmitted. A method according to claim 16, characterized in that the pressure is greater than 1 × 10 ⁵ Pa, preferably greater than 3 × 10 ⁵ Pa. Method according to one of claims 1 to 17, characterized in that in step d) the second substrate ( 15 ) under pressure on the first substrate ( 11 ) is positioned. A method according to claim 18, characterized in that the pressure is in the range of 0 to 20 × 10 ⁵ Pa. Adhesive tool for carrying out the method according to one of claims 1 to 19, with a holder ( 42 ), on which a holding area ( 43 ) for microstructured substrates ( 11 ) is provided, with a first roller ( 35 ) rotatably mounted on the holder ( 42 ) is mounted, and with at least one second roller ( 34 ) which is rotatable and so adjustable on the holder ( 42 ) is mounted so that it is both with the first roller ( 35 ) as well as with one in the holding area ( 43 ) arranged substrate ( 11 ) can be brought into contact. Adhesive tool according to claim 20, characterized in that at least one of the two rollers ( 34 . 35 ) on their surface microcavities ( 36 ), which serve as an adhesive reservoir. Microstructured device, with at least one side of walls ( 11 . 12 . 15 ) surrounded cavity or microchannel ( 18 ), wherein at least one wall ( 15 ) over their contact area ( 16 ) with a raised area ( 12 ) is glued to the rest of the device, characterized in that the at least one raised area ( 12 ) completely with an adhesive layer ( 14 ) and the walls ( 11 . 12 . 15 ) on their free surfaces ( 19 . 21 . 22 ) are adhesive-free.