DE102004029694B3 - Manufacturing process for optoelectronic building block involves first gripper lowering deflector block into cutout with UV-hardening adhesive and second gripper positioning transmitter/receiver block - Google Patents

Manufacturing process for optoelectronic building block involves first gripper lowering deflector block into cutout with UV-hardening adhesive and second gripper positioning transmitter/receiver block Download PDF

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Publication number
DE102004029694B3
DE102004029694B3 DE200410029694 DE102004029694A DE102004029694B3 DE 102004029694 B3 DE102004029694 B3 DE 102004029694B3 DE 200410029694 DE200410029694 DE 200410029694 DE 102004029694 A DE102004029694 A DE 102004029694A DE 102004029694 B3 DE102004029694 B3 DE 102004029694B3
Authority
DE
Germany
Prior art keywords
block
gripper
cutout
optoelectronic
manufacturing process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE200410029694
Other languages
German (de)
Inventor
Martin Franke
Klaus-Peter Galuschki
Tobias Happel
Heinz Pilz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE200410029694 priority Critical patent/DE102004029694B3/en
Application granted granted Critical
Publication of DE102004029694B3 publication Critical patent/DE102004029694B3/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

The optoelectronic building block (24) acts as a transmitter/receiver unit. Manufacture of the optoelectronic assembly involves a first gripper lowering an optical deflector block (11) into a cutout in an optical conductor plate (18) with a light guide (19). The optical deflector block is bedded in a transparent UV-hardening adhesive (22). A second gripper lowers the optoelectronic building block onto electrodes (15) with an adhesive (17) on metalized layers (14) on top of the defector block. The electrodes are surrounded by a transparent filler layer (28).
DE200410029694 2004-06-14 2004-06-14 Manufacturing process for optoelectronic building block involves first gripper lowering deflector block into cutout with UV-hardening adhesive and second gripper positioning transmitter/receiver block Expired - Fee Related DE102004029694B3 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE200410029694 DE102004029694B3 (en) 2004-06-14 2004-06-14 Manufacturing process for optoelectronic building block involves first gripper lowering deflector block into cutout with UV-hardening adhesive and second gripper positioning transmitter/receiver block

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200410029694 DE102004029694B3 (en) 2004-06-14 2004-06-14 Manufacturing process for optoelectronic building block involves first gripper lowering deflector block into cutout with UV-hardening adhesive and second gripper positioning transmitter/receiver block

Publications (1)

Publication Number Publication Date
DE102004029694B3 true DE102004029694B3 (en) 2005-10-20

Family

ID=35034345

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200410029694 Expired - Fee Related DE102004029694B3 (en) 2004-06-14 2004-06-14 Manufacturing process for optoelectronic building block involves first gripper lowering deflector block into cutout with UV-hardening adhesive and second gripper positioning transmitter/receiver block

Country Status (1)

Country Link
DE (1) DE102004029694B3 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018046216A1 (en) * 2016-09-06 2018-03-15 Siemens Aktiengesellschaft Optocoupler having an optical transmission link and electrical connections, and electronic module in which such an optocoupler is installed

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19845227A1 (en) * 1998-10-01 2000-04-06 Daimler Chrysler Ag Arrangement for adjusting optical components
DE19851265A1 (en) * 1998-11-06 2000-05-18 Harting Elektrooptische Bauteile Gmbh & Co Kg Integrated optical module has micro-structured alignment piece on circuit board for positioning optical element
WO2002031562A1 (en) * 2000-10-09 2002-04-18 Siemens Aktiengesellschaft Position fixing in printed circuit boards

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19845227A1 (en) * 1998-10-01 2000-04-06 Daimler Chrysler Ag Arrangement for adjusting optical components
DE19851265A1 (en) * 1998-11-06 2000-05-18 Harting Elektrooptische Bauteile Gmbh & Co Kg Integrated optical module has micro-structured alignment piece on circuit board for positioning optical element
WO2002031562A1 (en) * 2000-10-09 2002-04-18 Siemens Aktiengesellschaft Position fixing in printed circuit boards

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018046216A1 (en) * 2016-09-06 2018-03-15 Siemens Aktiengesellschaft Optocoupler having an optical transmission link and electrical connections, and electronic module in which such an optocoupler is installed

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Legal Events

Date Code Title Description
8100 Publication of the examined application without publication of unexamined application
8364 No opposition during term of opposition
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee