DE102004023037A1 - Ribbed heat sink structure for cooling computer etc., has heat conducting medium in passages in baseplate, and radiating fins - Google Patents
Ribbed heat sink structure for cooling computer etc., has heat conducting medium in passages in baseplate, and radiating fins Download PDFInfo
- Publication number
- DE102004023037A1 DE102004023037A1 DE102004023037A DE102004023037A DE102004023037A1 DE 102004023037 A1 DE102004023037 A1 DE 102004023037A1 DE 102004023037 A DE102004023037 A DE 102004023037A DE 102004023037 A DE102004023037 A DE 102004023037A DE 102004023037 A1 DE102004023037 A1 DE 102004023037A1
- Authority
- DE
- Germany
- Prior art keywords
- passages
- heat
- base plate
- structure according
- rib
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title description 13
- 238000001125 extrusion Methods 0.000 claims abstract description 16
- 239000007788 liquid Substances 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 7
- 238000005242 forging Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 description 18
- 238000009826 distribution Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000009466 transformation Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 238000004883 computer application Methods 0.000 description 1
- 125000004122 cyclic group Chemical class 0.000 description 1
- 239000007792 gaseous phase Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2220/00—Closure means, e.g. end caps on header boxes or plugs on conduits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Bereich der ErfindungField of invention
Die vorliegende Erfindung bezieht sich auf eine Rippenkühlkörperstruktur, die so angepasst ist, dass sie für PCs oder Notebook-Rechner, Projektoren oder Plasma-Fernseher und entsprechende Peripheriegeräte davon genutzt werden kann.The The present invention relates to a rib heat sink structure, which is adapted for PCs or notebook computers, projectors or plasma televisions and corresponding peripherals of which can be used.
Hintergrund der Erfindungbackground the invention
Heutzutage werden Computeranwendungen in unterschiedlichen Formen in nahezu jedem Bereich des täglichen menschlichen Bedarfes eingesetzt. Dadurch, dass die Bearbeitungsgeschwindigkeit der Computer konstant erhöht wird, wird die Hitze, die die Computer abgeben ebenfalls gesteigert. Die Echtzeit-Hitzeverteilung ist eine Aufgabe geworden, die zufrieden stellend gelöst werden muss, um eine normale Nutzung des Computers zu ermöglichen. Die Kühlkörper für die bekannten PCs oder Notebook-Computer umfassen in der Regel eine Basisplatte mit einer Vielzahl von Kühlrippen, die auf ihnen in aufrechter Form angeordnet sind. Die untere Seite der Basisplatte ist als glatte Oberfläche ausgebildet. Zur Installation wird der Kühler mit dem hitzegenerierenden Element des Computers durch einen exzentrischen Clip befestigt, um die untere flache Oberfläche mit dem hitzegenerierenden Element in dichte Verbindung zu bringen. Ein Lüfter ist über den Kühlrippen angeordnet. Sobald der Computer seine Funktion aufnimmt, wird gemäß den Hitzetransferprinzipien die Hitze, die durch das Computerelement erzeugt wird, über die flache Kontaktoberfläche des Radiators zur Basisplatte und den Kühlrippen des Radiators transferiert, wobei der Lüfter einen Luftstrom erzeugt, um die Hitze ab zu transportieren. Eine solche Hitzeverteilungsmethode basiert auf der bekannten Metallhitzeleitfähigkeit. Die Hitzeableitung und ihre Effizienz hängt von der Hitzeleitfähigkeit des Materials ab, das den Kühler bildet. Da eine feste Substanz eine limitierte Hitzetransferfähigkeit besitzt, ist der Ableitungseffekt von konventionellen Kühlern bzw. Radiatoren ebenfalls limitiert.nowadays Computer applications in various forms are almost in every area of the daily used for human needs. Because of the processing speed the computer is constantly increasing The heat that the computers give off is also increased. The Real-time heat distribution has become a task that satisfied solved solved must be in order to allow normal use of the computer. The heat sink for the known PCs or notebook computers usually include a base plate with a variety of cooling fins, which are arranged in an upright position on them. The lower side of the Base plate is designed as a smooth surface. For installation becomes the radiator with the heat-generating element of the computer by an eccentric Clip attached to the bottom flat surface with the heat-generating To connect the element tightly. A fan is located above the cooling fins. As soon as The computer takes up its function according to the heat transfer principles the heat generated by the computer element over the flat contact surface the radiator transferred to the base plate and the radiator fins, being the fan generates a flow of air to remove the heat. A Such heat distribution method is based on the known metal heat conductivity. The heat dissipation and its efficiency depends on the heat conductivity of the material that is the radiator forms. Because a solid substance has limited heat transfer ability has the derivative effect of conventional coolers or Radiators also limited.
Zusammenfassung der ErfindungSummary the invention
In Anbetracht der vorgenannten Nachteile, die durch die konventionellen Kühler entstehen, welche eine limitierte Hitzeableitungsfähigkeit besitzen, zielt die vorliegende Erfindung darauf ab, eine Rippenkühlkörperstruktur bereitzustellen, um den Hitzeableitungseffekt bzw. Verteilungseffekt zu verbessern. Die Rippenkühlkörperstruktur gemäß der vorliegenden Erfindung umfasst eine Basisplatte und Kühlrippen, die integriert durch Extrusion, Pressen, Schmieden oder durch Schweißen ausgebildet sind. Die Basisplatte weist Passagen auf, die durch eine mechanische Bearbeitung bzw. durch Verspannungstechnik entstanden sind. Die Passagen nehmen kapillare Mittel auf, die integral ausgeformt sind, um einen doppellagigen Passagenkreislauf entstehen zu lassen. Nachdem diese vakuumverschlossen sind, wird der Kreislauf mit einem Hitzeverteilungsmedium (gasförmig oder flüssig) in einer Menge von 50% bis 90% der internen Volumenkapazität der Passagen aufgefüllt. Hierdurch kann die Hitze auf dem Hitzeabsorptionsende konzentriert werden, das auf der Basisplatte ausgebildet ist, und kann durch die Kühlrippen geleitet werden und kann dann durch den Lüfter verteilt werden, um ein Hitzeableitungseffekt zu erreichen.In Considering the aforementioned disadvantages caused by the conventional cooler arise, which has a limited heat dissipation ability The present invention aims to provide a rib heat sink structure to provide the heat dissipation effect to improve. The rib heat sink structure according to the present The invention comprises a base plate and cooling fins integrated by Extrusion, pressing, forging or by welding are formed. The base plate has passages that are mechanically processed or caused by tensioning technology. The passages take capillary Means that are integrally formed to a double-layered Passage cycle to arise. After these are vacuum-sealed, is the circuit with a heat distribution medium (gaseous or liquid) in an amount of 50% to 90% of the internal volume capacity of the passages refilled. This allows the heat to be concentrated on the heat absorption end which is formed on the base plate, and can by the cooling fins can be routed and then distributed by the fan to one Heat dissipation effect to achieve.
Im Vergleich zu konventionellen Kühlsystemen kann die Erfindung eine Reihe von Vorteilen aufweisen, insbesondere: Die Basisplatte hat an ihrem unteren Ende der Kühlrippen einen Kreislauf, der aus doppellagigen Passagen besteht, die kapillare Mittel aufweisen, die integral durch eine Extrusion ausgeformt sind, wobei zusätzlich ein hitzeableitendes Medium in den Kreislauf gefüllt wird. Das hitzeableitende Medium kann sich dabei von der flüssigen Phase in die gasförmige Phase und zurück in die flüssige Phase transformieren. Und während dieser zyklischen Phasentransformation kann das hitzeverteilende Medium die Hitze aufnehmen und die Hitze abgeben, sowie die Hitze erneut aufnehmen. Die Kontaktfläche der Basisplatte der Abstrahlungsrippen kann die Arbeitshitze der Computerelemente absorbieren und die Hitze an die Abstrahlungsrippen wiederum abgeben. Somit wird die konventionelle Hitzeableitungsmethode, die im Wesentlichen auf der metallischen Hitzeleitung basiert, verändert. Hierdurch wird die Hitzeableitungsfähigkeit der Kühlrippen verbessert und der Hitzeableitungseffizienz der Kühlrippen gesteigert.in the Comparison to conventional cooling systems the invention may have a number of advantages, in particular: The base plate has at its lower end the cooling fins a cycle, the consists of two-ply passages that have capillary means, which are integrally formed by an extrusion, wherein additionally a heat dissipating medium is filled in the circulation. The heat-dissipating medium may be different from the liquid Phase into the gaseous Phase and back in the liquid Transform phase. And while This cyclic phase transformation can be the heat-distributing Medium absorb the heat and give off the heat, as well as the heat record again. The contact surface of the Base plate of the radiation fins can be the working heat of the computer elements absorb and release the heat to the radiating ribs again. Thus, the conventional heat dissipation method, which is essentially based on the metallic heat conduction, changed. This becomes the heat dissipation ability the cooling fins improves and the heat dissipation efficiency of the cooling fins increased.
Das Vorgenannte sowie weitere Ziele, Merkmale und Vorteile der vorliegenden Erfindung werden im Wesentlichen durch die folgende detaillierte Beschreibung verdeutlicht, die auf die beiliegenden Zeichnungen Bezug nimmt.The The foregoing and other objects, features and advantages of the present invention Invention are essentially detailed by the following Description is made in the attached drawings Refers.
Kurze Beschreibung der ZeichnungenShort description the drawings
Detaillierte Beschreibung der bevorzugten Ausführungsformendetailed Description of the Preferred Embodiments
Die
Die
Basisplatte
Die
Kühlrippen
Die
kapillaren Mittel
Wie
die
Die
Rippenkühlkörperstruktur
Aus
der
Die
Die
Die
Die
Die
Die
Die
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004023037A DE102004023037B4 (en) | 2004-05-06 | 2004-05-06 | Heat sink with integrated heat pipe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004023037A DE102004023037B4 (en) | 2004-05-06 | 2004-05-06 | Heat sink with integrated heat pipe |
Publications (2)
Publication Number | Publication Date |
---|---|
DE102004023037A1 true DE102004023037A1 (en) | 2005-11-24 |
DE102004023037B4 DE102004023037B4 (en) | 2008-08-21 |
Family
ID=35220037
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102004023037A Expired - Fee Related DE102004023037B4 (en) | 2004-05-06 | 2004-05-06 | Heat sink with integrated heat pipe |
Country Status (1)
Country | Link |
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DE (1) | DE102004023037B4 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008052145A1 (en) * | 2008-10-20 | 2010-04-22 | Sew-Eurodrive Gmbh & Co. Kg | Cooling arrangement for cooling agent and electric device, has heat producing component, particularly electrical or electronic construction unit or module that is cooled |
DE102009030068A1 (en) * | 2009-06-22 | 2010-12-30 | Mdexx Gmbh | Cooling element for a throttle or a transformer and inductor and transformer with such a cooling element |
EP2383779A1 (en) * | 2010-04-29 | 2011-11-02 | ABB Oy | Mounting base |
CN110429483A (en) * | 2019-08-09 | 2019-11-08 | 童浩峥 | A kind of energy-saving power distribution cabinet |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010017300B4 (en) * | 2010-06-09 | 2013-07-04 | Tsung-Hsien Huang | cooler unit |
DE102010039676B4 (en) * | 2010-08-24 | 2016-06-09 | Mahle International Gmbh | Cooling system for cooling electronic components |
DE102022100756A1 (en) | 2022-01-13 | 2023-07-13 | Rittal Gmbh & Co. Kg | Heat sink with heat pipe for an electronic component and a corresponding arrangement |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03108747A (en) * | 1989-09-22 | 1991-05-08 | Furukawa Electric Co Ltd:The | Heat pipe type radiator |
DE3825981C2 (en) * | 1988-07-27 | 1991-11-21 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt, De | |
DE69301906T2 (en) * | 1992-12-16 | 1996-08-08 | Alcatel Telspace | System for heat dissipation for an electronic component and a closed housing in such a system |
DE19514548C1 (en) * | 1995-04-20 | 1996-10-02 | Daimler Benz Ag | Method of manufacturing a micro cooler |
DE20305193U1 (en) * | 2003-03-31 | 2003-05-28 | Chenming Industrial Corp., Taipeh/T'ai-Pei | Cooling body for CPU installed on edge of baseplate has heat conductor bodies and heat absorbing body under baseplate and additional fins and cooling fan may be fitted |
US20030183372A1 (en) * | 2002-03-29 | 2003-10-02 | Cheng-Tien Lai | Heat pipe incorporating outer and inner pipes |
DE20314715U1 (en) * | 2003-09-23 | 2004-02-19 | Glacialtech, Inc., Junghe | Cooling system has closed fluid vessel in which fluid vaporises and condenses on under side of finned heat sink |
-
2004
- 2004-05-06 DE DE102004023037A patent/DE102004023037B4/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3825981C2 (en) * | 1988-07-27 | 1991-11-21 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt, De | |
JPH03108747A (en) * | 1989-09-22 | 1991-05-08 | Furukawa Electric Co Ltd:The | Heat pipe type radiator |
DE69301906T2 (en) * | 1992-12-16 | 1996-08-08 | Alcatel Telspace | System for heat dissipation for an electronic component and a closed housing in such a system |
DE19514548C1 (en) * | 1995-04-20 | 1996-10-02 | Daimler Benz Ag | Method of manufacturing a micro cooler |
US20030183372A1 (en) * | 2002-03-29 | 2003-10-02 | Cheng-Tien Lai | Heat pipe incorporating outer and inner pipes |
DE20305193U1 (en) * | 2003-03-31 | 2003-05-28 | Chenming Industrial Corp., Taipeh/T'ai-Pei | Cooling body for CPU installed on edge of baseplate has heat conductor bodies and heat absorbing body under baseplate and additional fins and cooling fan may be fitted |
DE20314715U1 (en) * | 2003-09-23 | 2004-02-19 | Glacialtech, Inc., Junghe | Cooling system has closed fluid vessel in which fluid vaporises and condenses on under side of finned heat sink |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008052145A1 (en) * | 2008-10-20 | 2010-04-22 | Sew-Eurodrive Gmbh & Co. Kg | Cooling arrangement for cooling agent and electric device, has heat producing component, particularly electrical or electronic construction unit or module that is cooled |
DE102008052145B4 (en) * | 2008-10-20 | 2011-01-20 | Sew-Eurodrive Gmbh & Co. Kg | Arrangement for tempering an electrical component and electrical appliance with it |
DE102009030068A1 (en) * | 2009-06-22 | 2010-12-30 | Mdexx Gmbh | Cooling element for a throttle or a transformer and inductor and transformer with such a cooling element |
EP2383779A1 (en) * | 2010-04-29 | 2011-11-02 | ABB Oy | Mounting base |
CN102237322A (en) * | 2010-04-29 | 2011-11-09 | Abb公司 | Mounting base |
CN110429483A (en) * | 2019-08-09 | 2019-11-08 | 童浩峥 | A kind of energy-saving power distribution cabinet |
Also Published As
Publication number | Publication date |
---|---|
DE102004023037B4 (en) | 2008-08-21 |
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OP8 | Request for examination as to paragraph 44 patent law | ||
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: 2K PATENTANWAELTE BLASBERG KEWITZ & REICHEL, PARTN |
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8327 | Change in the person/name/address of the patent owner |
Owner name: THERMASOL TECHNOLOGY CO., LTD., TAINAN, TW |
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8381 | Inventor (new situation) |
Inventor name: I-MING, LIU, TAINAN COUNTY, TW |
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8339 | Ceased/non-payment of the annual fee |