DE102004010013A1 - Contacting chip module outside of card body, with sections of conductor exposed and raised out of card body, by spot welding - Google Patents

Abstract

Chip module (60) is contacted with section of conductor (30) held by hook device (50) outside of card body. Conductor is in form of pull out wire loop contact section (20), uncovered and gripped by hook (52) to extract conductor wire from cavity (40). Chip module is spot welded to conductor. An independent claim is included for a device to attach a conductor wire and chip module.

Description

The invention relates to a method for contacting a chip module with one installed on or in a card base body Conductor track according to the preamble of claim 1.

Chip cards with laid in the basic card body Antenna tracks belong to the state of the art. These chip cards are used, for example contactless Data transfer between a reading terminal and one for Card used for identification purposes. In general such cards contain one in a cavity, preferably one of one Plastic Card base body fixed chip module, the installed conductor track as an antenna device is being used. Chip module and conductor track are electrical with each other contacted. The contacting is usually carried out in such a way that the chip module into the cavity of the map body used and and here or subsequently connected to the conductor track becomes.

For these contacts are different contact methods applied. For example, the connection can be made electrically conductive Adhesive can be realized. With this procedure there is the Risk of oxidation of exposed sections, preferably made of copper existing conductor track with contacting problems between the chip module and trace can go along. Such conductive adhesive connections have also proven to be often as insufficiently resistant to bending loads. So come it relatively often to break the adhesive bond or to detach the Glue point from the chip module or the corresponding section of the Trace.

When contacting between The conductor track and chip module by means of a soldered connection arises process monitoring while the soldering process, in particular the warranty sufficient warming the solder joints, out as problematic. So under certain circumstances "cold" solder joints generates an insufficient Establish electrical contact between the chip module and the conductor track and often fail after a period of time. In the event of overheating the solder joint can melt the surrounding material of the card body and the chip card become unusable.

It is therefore an object of the invention specify a method with which an electrical safe, well-monitored in the process of the contacting process, mechanically stable and not negatively influencing the basic card body Connection between chip module and conductor track can be realized can.

This task is done with a procedure for contacting a chip module according to the features of the claim 1 solved, being the subclaims expedient embodiments of the procedure included.

According to the invention, the chip module is outside of the map body with from the map body exposed and lifted sections of the conductor track contacted.

In contrast to those according to the status of technology Contacting method in which the chip module is first inserted into the card base and then contacted with the conductor track, sections or Ends of the conductor exposed and pulled out of the basic card body, so these sections are outside the map body are located. With these outside lying sections, the chip module is contacted. Thus takes place the electrical contact takes place completely outside the main body of the card and lets thus the basic map body unchanged.

In particular, the contacting carried out by the following process steps. First, the conductor track in the Area of the chip module to be attached in the form of a pull-out Contacting section, in particular a wire loop, in the map body laid. The contacting section is subsequently exposed. For this purpose, the contacting section is provided with a mechanical gripping device captured and pulled out. Finally, the chip module with connected to the pulled-out contacting section.

Can advantageously be connected or a function test immediately after the contacting process take place, after contacting the functional test Chip module in the cavity of the map body is used and fixed. This configuration of the contacting process it is achieved that the functionality of the contact is checked, before the chip module unsolvable connected to the map body and the entire chip card may result in one failed contacting must be discarded.

The one that occurs outside the map body Contacting made possible it in particular, the chip module and the contacting section below Use a welded joint to contact. In connection with this there is also stripping of the contacting section. The welding process is particularly suitable for a very firm and permanent contact of the usual contacting sections consisting of copper with the essentially contacts of the chip modules made of copper, nickel or gold. The one during the welding process developing heat damages not the map body and is therefore unproblematic.

A device for executing the contacting method is connected to a chip module by a mechanical gripping device which detects an exposed contacting section arranged on a card body tendency positioning device and a contacting device for contacting the contacting section and chip module.

The contact between conductor track and chip module is thus complete mechanical and automatic executed the chip module being precisely position-adjustable by the positioning device is.

The contacting section will preferably carried out in the form of a wire loop. This wire loop can be easy to grip and handle mechanically.

The mechanical gripping device is convenient formed in the form of a hook device. This shows a number of hooks for pulling out and for convenient positioning of the wire loop for the Contacting. The hook device thus grips the wire loop and holds until the contact is made in the required position.

The contacting device can preferably be designed as a spot welding device. With such a device is an accurate and clean contact individual points of the wire loop with the chip module or the contact areas of the chip module possible.

Likewise, the use of a soldering device possible as a contacting device.

The method according to the invention is to be explained in more detail below on the basis of exemplary embodiments. The serve to clarify 1 to 6 , The same reference numerals are used for identical or equivalent parts. Here show:

1 1 shows an exemplary representation of a chip card blank with a card base body, a wire loop, a conductor track and a cavity in a plan view,

2 exemplary sectional representations of a chip card blank with a closed or open cavity,

3 an exemplary representation of the chip card blank 2 in connection with a hook device and a contacting device in a starting position,

4 an exemplary representation of the hook and contacting device after 3 while grasping the wire loop,

5 1 shows an exemplary representation of a wire loop which is grasped by the hook device and pulled out of the cavity,

6 an exemplary representation of a chip module held and supplied by a positioning device during a contacting process and

7 an exemplary representation of an insertion of the contacted chip module in the card body of the chip card blank.

An exemplary embodiment of a chip card blank is shown in 1 shown in a top view. The chip card blank generally has a card base body consisting of a plastic material 10 on. There is a conductor track in the basic card body 30 who laid a wire loop 20 inside a cavity 40 of the material of the card body. The conductor track 30 can for example be part of an antenna provided for contactless signal transmission. In this exemplary embodiment, it consists of an insulated copper wire which has been introduced into the card base body using a laying method which is customary for the production of such chip cards.

For example, the map body 10 consist of an upper and lower layer, between which the copper wire of the conductor track is laid and arranged in a sandwich-like manner, the copper wire of the conductor track being fixed immovably between the sandwich halves of the card base body.

In contrast to the rest of the conductor track 30 becomes the wire loop 20 loosely between the sandwich halves of the card body 10 arranged so that it can be moved in principle. This can be achieved, for example, by applying no adhesive, adhesive or similar fastening means to the area of the wire loop. It is also possible that the sandwich halves of the card base body have a cavity 40 train in which the wire loop 20 loosely recorded.

2 shows two exemplary sectional views of a further embodiment of a card base body with laid conductor track 30 , The top illustration from 2 shows the wire loop 20 in the cavity still closed by the sandwich halves of the basic card body 40 , As already in connection with 1 is explained, the conductor track 30 inside the map body 10 immobilized while the wire loop 20 inside the cavity 40 is free and flexible.

In the illustration below 2 is the cavity 40 on the top of the card body 10 opened in a preparatory step. The wire loop 20 is therefore free, can be captured and out of the cavity 40 be pulled out.

The 3 to 6 continuously show an exemplary hook device 50 and contacting device 80 in connection with an exemplary process flow of a contacting process. The in 2 shown, with wire loop 20 , Conductor track 30 and cavity 40 provided card body 10 is under the hook device 50 inserted. This has an arrangement of two or more hooks 51 on that at their towards the wire loop 20 pointing ends with eyelets 52 can be provided. Depending on the shape, size and shape of the wire loop 20 or the cavity 40 can do the number, arrangement and size of the hooks as part of professional action 51 or the eyelets 52 from the representation in 3 from be softened.

How out 4 can be seen, the hook device 50 towards the wire loop 20 lowered so far that the eyelets 52 at the lower ends of the hooks 51 in the cavity 40 are located. The hooks 51 are then moved outward, with wire sections of the wire loop 20 in the eyes 52 slide in and the wire loop 20 thus from the hook device 50 is captured and excited.

As in 5 shown, the hook device 50 subsequently raised, taking off the hook 51 detected wire loop 20 out of the cavity 40 is pulled out and then above the level of the map body 10 located. The way of pulling out the wire loop 20 , especially the required height, depends on the size of the wire loop 20 , the size of the cavity 40 and the dimensions of the contacting device 80 and can be easily adapted to specific operating conditions as part of professional action.

How out 6 can be seen, the wire loop 20 then for proper contacting in relation to the contacting device 80 positioned. In the embodiment shown in the figure, this is done by rotating the entire hook device vertically 50 , with the in the eyelets 52 held wire loop 20 is moved. If necessary, this rotation can also be omitted. The contacting device 80 can in another embodiment, not shown in the figure, horizontally below that of the hook device 50 held wire loop are inserted, provided the present form of the wire loop 20 and their connection with that in the basic map body 10 misplaced conductor track 30 this allows.

A the chip module 60 load-bearing positioning device 70 then moves the chip module to be contacted into a position suitable for contacting. The chip module can be, for example, a dual interface module that is customary for chip cards provided with antenna devices. According to the representation 6 the positioning is done by placing it on a holding plate 72 Chip module mechanically held and supported on the back 60 by a sliding bolt 71 through a feed channel of the hook device 50 through towards the wire loop 20 moved and positioned in close proximity to the wire loop.

The contacting device then moves 80 towards the whole from wire loop 20 and chip module 60 , being a series of spot weld contacts 81 the sections of the wire loop intended for contacting 20 on contact surfaces of the chip module 60 press. Applying a voltage and a current flow caused thereby, which in the 6 illustrated embodiment by the sliding bolt 71 and the holding plate 60 via the chip module 60 and the wire loop 20 to the spot weld contacts 81 the wire loop is spot-welded to the chip module by active welding. In connection with this, the copper wire of the wire loop in the contact area may be stripped of local insulation.

Alternatively, the contacting device 80 also be in the form of a soldering device. In this case, the spot weld contacts 81 replaced by solder feed devices which deposit a quantity of solder prepared in the contacting device at the contact points between the wire loop and chip module and form solder joints by local heating.

The unit from the hook device 50 , Positioning device 60 and contacting device 80 can also be used to check the contact connection between the wire loop 20 and chip module 60 be used. For example, it is possible to use a test signal following the spot welding pulse or a test voltage between individual spot welding contacts 81 and thus the current flow within the contacted wire loop 20 measure between the individual contact points and determine whether the contact between the chip module 60 and wire loop 20 or properly executed and especially the wire loop 20 is never broken by the contacting process.

Test voltages between the holding plate can also be used 72 and individual spot welding contacts 81 applied and the current flow between the holding plate and the spot welding contacts can be measured through the generated contact. Within the framework of professional action, it is also easily possible to combine both test methods or to use other test devices not shown in the figure in a suitable manner.

Then the contacted chip module 60 into the cavity 40 of the map body 10 used. How out 7 can be seen by way of example, this is done using the hook device 50 and the positioning device 70 executed. For this, the hook device 50 vertically to the starting position 3 turned back so that the surface of the contacted chip module is substantially parallel to the surface of the card body 10 or the bottom of the cavity 40 located. Next is the positioning device 70 towards the cavity 40 shifted downwards. Due to elastic bending of the eyelets 52 on the hook 51 the wire loop slips 20 by the downward movement of the positioning device 70 out and becomes together with the chip module 60 on the bottom of the cavity 40 placed.

The positioning device 70 , in particular the holding plate 72 , finally gives the chip module 60 free and will eventually move up again. In connection with this also take the hooks 51 the hook device 50 their starting position after 3 and move into their starting position.

The map body 10 is used together with the contacted chip module 60 moved by a conveyor not shown in the figure. Next, another card base body can be fed into the device and the sequence of the in the 3 to 7 described contacting procedure can be restarted on another chip card blank.

It should be noted that this is based on of embodiments Contacting procedure described in connection with the here shown devices in the context of professional action and under Use of additions, Extensions and omissions can be changed without the Field of the basic idea of the invention to leave. Other embodiments result from the subclaims.

10

Card base

20

wire loop

30

conductor path

40

cavity

50

hook device

51

hook

52

hook eye

60

chip module

70

positioning

71

sliding bolts

72

retaining plate

80

contacting

81

Spot welding Contact

Claims (9)

Method for contacting a chip module with a conductor track laid on or in a card base body, characterized in that the chip module is contacted outside the card base body with raised portions of the conductor track exposed from the card base body. A method according to claim 1, characterized in that the conductor track in the area of the chip module to be fastened in Form of a pull-out contacting section, in particular a wire loop in which the card body is laid, whereby - below the contacting section is exposed, - the contacting section is gripped and pulled out with a mechanical gripping device, - the chip module with that from the cavity pulled contacting section is electrically connected. A method according to claim 1 or 2, characterized in that that in connection with or contacting immediately following a functional test of the chip module contacted with the conductor track is carried out, in which - to At the end of the function test, the contacted chip module is inserted into the card base and is attached. Method according to one of the preceding claims, characterized characterized in that the contacting of the chip module and the contacting section in connection with stripping the contacting section through a solder or welded joint he follows. Device for executing a method according to one of claims 1 to 4, characterized by an exposed on a card base body ( 10 ) arranged contacting section ( 20 ) a conductor track ( 30 ) gripping mechanical gripping device ( 50 ) in connection with a chip module ( 60 ) holding positioning device ( 70 ) and a contacting device ( 80 ) for contacting the contacting section and the chip module. Apparatus according to claim 5, characterized in that the contacting section ( 20 ) is designed in the form of a wire loop. Apparatus according to claim 5 and 6, characterized in that the mechanical gripping device in the form of a hook device ( 50 ) is formed, the hook device being a series of hooks ( 51 ) suitable for pulling out and for contacting positioning of the wire loop ( 20 ) having. Device according to one of claims 5 to 7, characterized in that the contacting device ( 80 ) is designed as a spot welding device. Device according to one of claims 5 to 8, characterized in that the contacting device ( 80 ) is a soldering device.